JPH05877B2 - - Google Patents

Info

Publication number
JPH05877B2
JPH05877B2 JP55030395A JP3039580A JPH05877B2 JP H05877 B2 JPH05877 B2 JP H05877B2 JP 55030395 A JP55030395 A JP 55030395A JP 3039580 A JP3039580 A JP 3039580A JP H05877 B2 JPH05877 B2 JP H05877B2
Authority
JP
Japan
Prior art keywords
multilayer printed
circuit board
video signal
printed circuit
guide mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP55030395A
Other languages
Japanese (ja)
Other versions
JPS56126999A (en
Inventor
Kazuo Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3039580A priority Critical patent/JPS56126999A/en
Publication of JPS56126999A publication Critical patent/JPS56126999A/en
Publication of JPH05877B2 publication Critical patent/JPH05877B2/ja
Granted legal-status Critical Current

Links

Description

【発明の詳細な説明】 本発明は、多層プリント基板等の内部層に於け
るマーク位置を自動検出する方法に関するもので
ある。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for automatically detecting a mark position in an internal layer of a multilayer printed circuit board or the like.

一般に、内装出荷用としての多層プリント基板
(銅板1、内装銅板2、透光紙4からなる。)に
は、第1図のように内装銅板2上のパターンの基
準位置を示す穴あけ用基準ガイドマーク3(テー
プ)が埋込まれており、出荷時には、多層プリン
ト基板の上部から、このガイドマーク位置に基準
となる穴あけ加工を旋している。加工の工程は第
2図のように、作業者が内部層に埋込まれたマー
カパターンを上部層から推量、目視して、ガイド
マーク位置に座ぐりを入れて穴あけ加工を行なつ
ている。
Generally, a multilayer printed circuit board (consisting of a copper plate 1, an interior copper plate 2, and a transparent paper 4) for interior shipping is provided with a hole-drilling reference guide that indicates the reference position of the pattern on the interior copper plate 2, as shown in Figure 1. Mark 3 (tape) is embedded, and at the time of shipment, holes are drilled from the top of the multilayer printed circuit board at the position of this guide mark to serve as a reference. As shown in FIG. 2, the machining process involves an operator estimating and visually observing the marker pattern embedded in the inner layer from the upper layer, placing a counterbore at the position of the guide mark, and drilling the hole.

この方法によると、作業者が穴あけ用カイドマ
ークを探すための座ぐりが必要となり、1回〜数
回の座ぐり及び座ぐり後のドリル等の交替に要す
る時間が多少なりとも生じ、作業能率が低下しや
すい不具合があつた。
According to this method, the operator needs to counterbore in order to find the guide mark for drilling, and it takes some time to counterbore one to several times and change the drill etc. after counterboring, which reduces work efficiency. There was a problem that caused it to deteriorate easily.

本発明の目的は、上記した従来技術に鑑みてな
されたもので、目視では正確に見つけることので
きない内部層のパターン位置を自動的に精度よく
認識し穴あけ作業の能率向上を図りうる多層プリ
ント基板等の内部層内の基準パターン位置自動検
出方法を提供するにある。
The object of the present invention has been made in view of the above-mentioned prior art, and the object of the present invention is to provide a multilayer printed circuit board that can automatically and precisely recognize the pattern position of an internal layer that cannot be accurately detected visually, thereby improving the efficiency of drilling work. An object of the present invention is to provide a method for automatically detecting the position of a reference pattern in an internal layer.

この目的を達成する為に、本発明はX線用
ITVカメラを用いて、X線画像の強調を行ない、
内層基準パターン位置を精度よく認識すると共に
基準パターン位置の座標を出力することを特徴と
するものである。
To achieve this objective, the present invention
The ITV camera is used to enhance the X-ray image,
The present invention is characterized by accurately recognizing the inner layer reference pattern position and outputting the coordinates of the reference pattern position.

以下、本発明の多層プリント基板等のパターン
位置検出方法を図に基づいて説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The method for detecting the position of a pattern on a multilayer printed circuit board or the like according to the present invention will be described below with reference to the drawings.

第3図は、本発明の方法を実施する装置の一実
施例を示す構成図である。第4図はaは、内装プ
リント基板上に添付される穴あけ用基準カイドマ
ークの一例を示した図であり、第4図bは多層プ
リント基板中のガイドマークを第3図に示すX線
用ITVカメラにより見たビデオ信号の水平中央
部の走査波形である。第5図はa〜cは各々第3
図に示す回路から出力される信号波形を示した
図、第6図aは基準ガイドマークの位置座標の出
力例を示す図であり、第6図bは、基準座標を求
める時に使用する基準パターンの一例である。第
7図は第3図の画像切出メモリ基準パターンメモ
リ、比較回路を具体的に示した図である。ところ
で7は多層プリント基板8にX線を照射するX線
発生器、9は上記多層プリント基板8のガイドマ
ーク3を透つた透過光のパターン画像を撮像する
X線用ITVカメラ、10はX線防護カバー、1
1はX線用ITVカメラから得られる映像信号2
3(第5図aに示す。)を増幅する映像増幅器、
12は映像増幅器11から出力される映像信号2
3を所定の閾値でクリツプして第5図bに示す映
像信号24を出力するクリツパ回路、13はクリ
ツパ回路12から出力される映像信号24と映像
増幅器11から出力される映像信号23とをアナ
ログ掛算して強調処理を施すアナログ掛算器、1
4は該アナログ掛算器13から出力される信号を
所定の閾値でクリツプして第5図cに示す映像信
号25を出力するクリツパー回路、15はクリツ
パー回路14から出力される映像信号25を所定
の閾値で2値化すると共にクロツクパルス信号で
サンプリングして絵素化する2値化回路、16は
該2値化回路から出力された2値絵素化信号を1
ラスタ分メモリするシフトレジスタ群16aとそ
のシフトレジスタから出力された信号を8×8ビ
ツトで切出すメモリ16bとからなる画像切出メ
モリ、17は辞書となる基準パターンを8×8の
ビツトとしてメモリした基準パターンメモリ、1
8は画像切出メモリ16と基準パターンメモリ1
7の絵素同志を排他的論理和で比較する比較回
路、19は該比較回路18から出力される信号
(一致した信号)を加算する加算回路、20はク
ロツク信号を計数し、水平同期信号Hsyncでリセ
ツトされ、x座標値を出力するカウンタ、21は
水平同期信号Hsyncを計数し、垂直同期信号
Hsyncでリセツトされ、y座標値を出力するカウ
ンタ、22は加算回路19から出力される値の
内、最大値を示す上記x座標値xc及びy座標値
ycを出力する最大値検出回路である。
FIG. 3 is a block diagram showing an embodiment of an apparatus for carrying out the method of the present invention. Fig. 4a shows an example of a reference guide mark for drilling attached to an internal printed circuit board, and Fig. 4b shows an example of a guide mark in a multilayer printed board attached to an X-ray ITV shown in Fig. 3. 2 is a scanning waveform of the horizontal center portion of the video signal as seen by the camera. In Figure 5, a to c are the third
Figure 6a is a diagram showing an example of the output of the position coordinates of a reference guide mark, and Figure 6b is a diagram showing a reference pattern used when determining the reference coordinates. This is an example. FIG. 7 is a diagram specifically showing the image cutout memory reference pattern memory and comparison circuit of FIG. 3. By the way, 7 is an X-ray generator that irradiates the multilayer printed circuit board 8 with X-rays, 9 is an X-ray ITV camera that captures a pattern image of transmitted light that has passed through the guide mark 3 of the multilayer printed circuit board 8, and 10 is an X-ray Protective cover, 1
1 is the video signal 2 obtained from the X-ray ITV camera
3 (shown in Figure 5a);
12 is a video signal 2 output from the video amplifier 11
A clipper circuit 13 clips the video signal 24 outputted from the clipper circuit 12 and the video signal 23 outputted from the video amplifier 11 by analog clipping the video signal 24 shown in FIG. Analog multiplier that performs multiplication and emphasis processing, 1
Reference numeral 4 denotes a clipper circuit which clips the signal output from the analog multiplier 13 using a predetermined threshold value and outputs the video signal 25 shown in FIG. A binarization circuit 16 converts the binary pixel signal outputted from the binarization circuit into pixels by sampling it with a clock pulse signal.
An image cutting memory consisting of a shift register group 16a for storing raster data and a memory 16b for cutting out the signal output from the shift register into 8 x 8 bits; 17 is a memory for storing a reference pattern serving as a dictionary in 8 x 8 bits; reference pattern memory, 1
8 is an image cutting memory 16 and a reference pattern memory 1
A comparison circuit 19 compares picture elements No. 7 with exclusive OR; an addition circuit 19 adds the signals (matched signals) output from the comparison circuit 18; and an addition circuit 20 that counts clock signals and outputs a horizontal synchronization signal Hsync. The counter 21 counts the horizontal synchronization signal Hsync and outputs the x-coordinate value.
A counter that is reset by Hsync and outputs the y-coordinate value, 22 is the above-mentioned x-coordinate value xc and y-coordinate value indicating the maximum value among the values output from the adding circuit 19.
This is a maximum value detection circuit that outputs yc.

然るに第3図に於て、多層プリント基板8の上
部からX線を照射し、ガイドマーク3を透つた透
過光のパターン画像をX線用ITVカメラ9によ
り検出し、映像増幅した信号は、第3図のように
コントラスト及びS/Nが悪く、このままでは認
識可能な2値化画像が得にくい為、クリツパー回
路12で自由に可変出来る閾値で信号をクリツプ
し、得られた第5図bに示すビデオ波形24及び
第5図aに示す原ビデオ波形23とをアナログ掛
算器13によりX線画像の強調処理を、各走査線
の全画面に渡つて施す。さらに、次段に独立に閾
値を可変出来るクリツプ回路14を設け、第5図
cに示す映像信号25を形成する。
However, in FIG. 3, X-rays are irradiated from the top of the multilayer printed circuit board 8, a pattern image of the transmitted light transmitted through the guide mark 3 is detected by the X-ray ITV camera 9, and the image amplified signal is As shown in Figure 3, the contrast and S/N are poor and it is difficult to obtain a recognizable binarized image in this state, so the signal is clipped with a freely variable threshold using the clipper circuit 12, and the resulting image in Figure 5b is The video waveform 24 shown in FIG. 5A and the original video waveform 23 shown in FIG. Furthermore, a clip circuit 14 whose threshold value can be independently varied is provided at the next stage to form a video signal 25 shown in FIG. 5c.

次に、このパターン画像を2値化回路15で2
値絵素化し、あらかじめ基準パターンメモリ17
に記憶させた基準ガイドマークの基準パターン例
えば、第5図bのような8×8ビツトの基準パタ
ーンと画像切出メモリ16により全画面から順次
8×8ビツトの絵素ごとに切出したパターンとを
各ビツトごとに対応をとつて比較回路18を構成
する排他的論理和で一致度を求め、それを加算回
路19で加算し、最大値検出回路22によつて全
画面内で一致度の最も高い絵素のパターンの中央
位置座標(xc,yc)を出力するものである。
Next, this pattern image is converted into two parts by the binarization circuit 15.
The value picture elements are converted into reference pattern memory 17 in advance.
For example, the reference pattern of the reference guide mark stored in the 8 x 8 bit reference pattern as shown in FIG. The correspondence is determined for each bit and the degree of coincidence is determined by the exclusive OR that constitutes the comparison circuit 18, and the results are added in the addition circuit 19. This outputs the center position coordinates (xc, yc) of the pattern of high picture elements.

尚、実際の供試多層基板上での座標位置(xc,
yc)は、上記の原点位置に対応した位置を原点
として、光学系の倍率により、例えば1絵素(1
ビツト)=5μmから、Xc=5xc、Yc=5ycにより
求められる。
In addition, the coordinate position (xc,
yc), for example, one picture element (1
From bit) = 5μm, it is determined by Xc = 5xc and Yc = 5yc.

以上述べたように、本発明の多層プリント基板
のパターン位置検出方法を用いれば、従来作業者
がほとんど勘に頼つて座ぐりをしていた作業を全
面的に廃止できる。また、本発明の検出方法によ
り検出された基準ガイドマークの位置情報を穴あ
け電動工具等にフイードバツクしてNC制御を行
なうことができるので、迅速かつ正確に基板の加
工を行なうことが出来る。
As described above, by using the pattern position detection method for a multilayer printed circuit board according to the present invention, it is possible to completely eliminate the counterboring work that conventional workers had to do, relying mostly on their intuition. Further, since the positional information of the reference guide mark detected by the detection method of the present invention can be fed back to a drilling power tool or the like for NC control, it is possible to process the board quickly and accurately.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は多層プリント基板の構成例を示す図、
第2図は従来の多層プリント基板に形成されたガ
イドマークを露出するために行なわれていた穴あ
け加工の工程を示す。第3図は本発明の多層プリ
ント基板等の内部層内の基準パターン位置自動検
出方法を適用した装置の一実施例を示す概略構成
図、第4図aは内装銅板に形成された基準ガイド
マークを示す図、第4図bは基準ガイドマークを
X線を透してX線ITVカメラより検出して得ら
れる中央部の水平走査線の映像信号の波形を示す
図、第5図は第3図に示す回路より得られるビデ
オ信号を示す図、第6図aは本発明により求めら
れる基準ガイドマークの中央位置座標(xc,yc)
を示す図、第6図bは基準メモリにあらかじめ記
憶させておく基準パターンを示す図第7図は第3
図に示す画像切出メモリ、基準パターンメモリ、
比較回路を具体的に示した図である。 符号の説明、3……基準ガイドマーク、7……
X線発生器、8……多層プリント基板、9……X
線用ITVカメラ、15……2値化回路、16…
…画像切出メモリ、17……基準パターンメモ
リ、18……比較回路、22……最大値検出回
路。
FIG. 1 is a diagram showing an example of the configuration of a multilayer printed circuit board,
FIG. 2 shows a hole-drilling process that is performed to expose guide marks formed on a conventional multilayer printed circuit board. Fig. 3 is a schematic configuration diagram showing an embodiment of a device to which the method of automatically detecting the position of a reference pattern in an internal layer of a multilayer printed circuit board, etc. of the present invention is applied, and Fig. 4a shows a reference guide mark formed on an internal copper plate. Figure 4b is a diagram showing the waveform of the video signal of the central horizontal scanning line obtained by detecting the reference guide mark with an X-ray ITV camera through X-rays, and Figure 5 is a diagram showing the waveform of the video signal of the central horizontal scanning line. A diagram showing a video signal obtained from the circuit shown in the figure, FIG. 6a shows the center position coordinates (xc, yc) of the reference guide mark obtained by the present invention.
Figure 6b shows the reference pattern stored in the reference memory in advance.
Image cutting memory, reference pattern memory shown in the figure,
FIG. 3 is a diagram specifically showing a comparison circuit. Explanation of symbols, 3...Reference guide mark, 7...
X-ray generator, 8...Multilayer printed circuit board, 9...X
Line ITV camera, 15...binarization circuit, 16...
...Image cutting memory, 17...Reference pattern memory, 18...Comparison circuit, 22...Maximum value detection circuit.

Claims (1)

【特許請求の範囲】[Claims] 1 多層プリント基板等の内部層に添付された穴
明け用の基準ガイドマークをX線を透して、X線
用ITVカメラにより撮像し、前記撮像された映
像信号をクリツプし、前記映像信号と前記クリツ
プされた信号とを積算することで前記映像信号を
強調し、前記強調された映像信号を2値化し、前
記多層プリント基板等の内部に添付された穴明け
用の基準ガイドマークの位置を検出することを特
徴とする多層プリント基板等のパターン位置検出
方法。
1. A standard guide mark for drilling attached to an internal layer of a multilayer printed circuit board, etc. is imaged by an X-ray ITV camera through X-rays, the imaged video signal is clipped, and the image signal is combined with the video signal. The video signal is emphasized by integrating the clipped signal, the emphasized video signal is binarized, and the position of a reference guide mark for drilling attached to the inside of the multilayer printed circuit board, etc. is determined. A method for detecting a pattern position on a multilayer printed circuit board, etc.
JP3039580A 1980-03-12 1980-03-12 Reference pattern position automatic detecting system in internal layer of multilayer printed board or like Granted JPS56126999A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3039580A JPS56126999A (en) 1980-03-12 1980-03-12 Reference pattern position automatic detecting system in internal layer of multilayer printed board or like

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3039580A JPS56126999A (en) 1980-03-12 1980-03-12 Reference pattern position automatic detecting system in internal layer of multilayer printed board or like

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP23090992A Division JPH0719974B2 (en) 1992-08-31 1992-08-31 Multi-layer printed circuit board processing method

Publications (2)

Publication Number Publication Date
JPS56126999A JPS56126999A (en) 1981-10-05
JPH05877B2 true JPH05877B2 (en) 1993-01-06

Family

ID=12302730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3039580A Granted JPS56126999A (en) 1980-03-12 1980-03-12 Reference pattern position automatic detecting system in internal layer of multilayer printed board or like

Country Status (1)

Country Link
JP (1) JPS56126999A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61225894A (en) * 1985-03-29 1986-10-07 日立化成工業株式会社 Manufacture of multilayer printed interconnection board
JPS62136896A (en) * 1985-12-11 1987-06-19 日本電気株式会社 Alignment mark detection of high density multilayer board
JPH0288275U (en) * 1988-12-27 1990-07-12

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49128260A (en) * 1973-04-13 1974-12-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49128260A (en) * 1973-04-13 1974-12-09

Also Published As

Publication number Publication date
JPS56126999A (en) 1981-10-05

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