JPH0586474A - Vapor deposition plating equipment - Google Patents

Abstract

PURPOSE:To make a vapor deposition plated layer to high quality and to enhance maintenance by sliding and arranging the vapor deposition plating chambers provided up and down in the horizontal direction in the case of providing the independent vapor deposition plating chambers up and down in order to perform vapor deposition plating on the surface and the rear of the bandlike material to be plated. CONSTITUTION:A band steel 1 is sent into a vapor deposition plating chamber 4A of the downside via a vacuum seal device 2A. A raw material in a tank 5 is heated, vaporized and stuck on the single surface of the band steel 1. Then, this band steel 1 is sent into a vapor deposition plating chamber 4B of the upside via the deflector rolls 3, 3. The raw material in the tank 5 is heated, vaporized and stuck on the other surface of the band steel 1. This band steel 1 is taken out via a vacuum seal device 2B. At this time, the vapor deposition plating chambers 4A, 4B so as to be provided up and down are horizontally slid back and forth in the traveling direction of the band steel 1. Thereby the constitutional member of the inside of the vapor deposition plating chamber 4A is easily hung up by an overhead crane. Moreover, the plated layer is prevented from being marred by the deflector rolls 3, 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum vapor deposition plating facility for performing single-layer plating or multi-layer plating on both front and back surfaces of a strip-shaped material to be plated, and more specifically, it can effectively form a high-quality vapor-deposited plating layer. In addition, the present invention relates to a vapor deposition plating facility having excellent maintainability.

[0002]

2. Description of the Related Art A plated material such as a strip-shaped metal plate or a synthetic resin film is continuously run, and aluminum, copper, titanium, zinc, their alloy materials or ceramics are vacuum-deposited on both front and back surfaces of the plated material. The plating technology has been put to practical use.

FIG. 6 is a side view showing an example of plating equipment used for vacuum vapor deposition plating. Two vapor deposition plating chambers 4A and 4B are vertically arranged side by side, vacuum sealing devices 2A and 2B are disposed on the inlet side and the outlet side of the strip steel 1, and the vapor deposition plating chambers 4A and 4B are kept in a vacuum atmosphere. To be done. Raw material tanks (crucibles) 5 and 5 are provided in the vapor deposition plating chambers 4A and 4B, and the raw material in the raw material tank 5 is heated and evaporated by an electron beam, arc discharge, or the like, on one side of the strip steel 1, and then on the other side. Attach the plating material to. When alloy plating is performed, two or more raw material tanks 5 and 5 are provided in one vapor deposition plating chamber as shown in the figure. In addition, two vapor deposition plating chambers 4A and 4B
Is connected via deflector rolls 3 that guide the strip steel 1, and the strip steel 1 is vapor-deposited on each side. That is, the strip steel 1 sequentially passes through the vacuum seal device 2A, the vapor deposition plating chambers 4A and 4B, and the vacuum seal device 2B to continuously form vapor deposition plating layers on both front and back surfaces of the strip steel 1.

[0004]

By the way, the metal vapor evaporated in the vapor deposition plating chambers 4A, 4B is the strip steel 1
Although a plating layer is formed by adhering to the lower surface side of, the part of the metal vapor diffuses into the plating chamber and adheres and deposits on the side wall and the ceiling surface. This deposited metal will be removed manually by periodically interrupting the plating process, but this removal work is hard work, and in the case of highly oxidizable metals such as magnesium, it may ignite or explode. It was a dangerous and dangerous work.

Further, if the amount of the adhered deposits becomes too large, it may be peeled off from the ceiling surface or the like and fall to adhere to the strip steel 1 or scratch it, which causes the quality of the plated strip steel to be remarkably deteriorated. It was Therefore, in order to prevent such quality deterioration, the removal work must be frequently performed, which is a major factor that hinders the continuous operation of the plating process.

On the other hand, since the raw material in the raw material tank 5 is consumed in the plating process, it is necessary to supply the raw material so that the upper surface level of the raw material is constant in order to continuously obtain stable steam. That is, if the upper surface of the raw material changes significantly,
The amount of evaporation and the evaporation pattern are not stable, so that the amount of plating adhered fluctuates, and not only the surface appearance but also the surface quality is impaired. If the level of the surface of the raw material molten bath becomes large, a splash phenomenon occurs in which the raw material for plating is scattered from the surface of the molten bath, which causes a defective plating layer.

Therefore, from the viewpoint of maintaining the surface of the raw material bath in the raw material tank in a vacuum atmosphere at a constant level, means for continuously supplying the raw material has been studied, and a raw material processed into a wire shape is provided in the atmosphere. The apparatus employs a means for continuously feeding the material into a raw material tank through a feeder pipe. However, since this wire-shaped raw material is wound into a roll and the roll is replaced each time it is consumed,
At the time of this replacement, the supply of the wire-shaped raw material to the vapor deposition raw material tank is stopped, which causes the above-mentioned inconvenience due to the lowered bath surface level.

Further, as shown in FIG. 6, when the strip steel 1 is counter-transferred from the upper vapor deposition plating chamber 4A to the lower vapor deposition plating chamber 4B, a strip steel surface vapor-deposited in the vapor deposition plating chamber 4A Since the deflector rolls 3 and 3 were brought into direct contact with each other, the vapor-deposited plating surface was peeled off, and the plating metal adhered on the rolls 3 and 3 to cause a defect such as a scratch on the surface of the plated steel strip. ..

On the other hand, as shown in FIG. 2, the vapor deposition plating chambers 4A and 4B are composed of a first member 41 and a second member 42 and are separable in the left and right directions intersecting the running direction of the strip steel 1, Many things are easy to maintain inside. However, as shown in FIG. 6, the vapor deposition plating chamber 4A,
When 4B overlaps vertically, the lower evaporation plating chamber 4B
It is very difficult to lift the second member 42 and the like of the first member 41 by an overhead crane or the like, and when the first member 41 is moved in the horizontal direction, the upper and lower first members 41 and 41 are positioned so as to overlap each other. Therefore, for example, it is dangerous to perform the work of exchanging the raw materials in parallel at the same time, and there is a problem that workability is deteriorated because the work cannot be performed in parallel. Therefore, a main object of the present invention is to provide equipment capable of easily performing maintenance and management work of a vapor deposition plating chamber arranged in the vertical direction.

[0010]

The present invention, which has achieved the above-mentioned object, has a gist in that the vapor deposition plating chambers arranged above and below are horizontally displaced from each other.

[0011]

FIG. 1 is an explanatory view showing a typical embodiment of the present invention, in which the strip steel 1 is supplied from the lower side, plated on one side, and then goes out upward. 1 along the traveling path of the vacuum seal device 2A, vapor deposition plating chamber 4A, 4
B and the vacuum sealing device 2B are configured. The vapor deposition plating chambers 4A and 4B are arranged horizontally offset in the front-rear direction of the strip steel 1. For example, the second member 42 shown in FIG. When raising, the other vapor deposition plating chamber 4B does not become an obstacle and the workability is not deteriorated.
Even when the first member 41 (see FIG. 2) in A and 4B is displaced to the left and right in the running direction of the strip steel and the raw materials in the raw material tank 5 are simultaneously exchanged, these raw material tanks 5 and 5 are directly above or below. Since they are not arranged, the replacement work can be smoothly performed.

Deflector rolls 3 are provided on the outlet side of the vapor deposition plating chamber 4A and on the inlet side of the vapor deposition plating chamber 4B so as to be in contact with one surface of the vapor deposition plating chamber 4A opposite to the plating-treated surface. Then, the vertical postures of the front and back surfaces of the steel strip 1 are changed by reversing them through the deflector rolls 3 and 3, and the steel strip 1 is fed to the vapor deposition plating chamber 4B. Therefore, since the plated surface in the vapor deposition plating chamber 4A does not directly contact the deflector rolls 3 and 3, it is possible to prevent the plating layer from being damaged or the coating amount to be uneven.

2 is a side sectional view showing an example of the structure of the vapor deposition plating chambers 4A and 4B, FIG. 3 is a sectional view taken along the line III--III of FIG. 2, and FIG. 4 is a sectional view taken along the line IV--IV of FIG. It is an arrow view. The vapor deposition plating chambers 4A, 4B include a first member 41 having traveling rollers 41a, 41a ... And a second member 42 forming a ceiling portion, a side wall portion and a bottom portion of the vapor deposition plating chamber. with the pedestal 41a for placing the material tank 5 is provided, is movable in the arrow K ₁ -K ₂ direction, the packing P is interposed to the first member 41 abutting portions of the second member 42 The airtightness of the vapor deposition plating chamber is secured. Reference numeral 47 indicates an electron gun for irradiating the upper surface of the raw material in the evaporation raw material tank 5 with an electron beam, reference numerals 43 and 44 indicate deflection coils for scanning the electron beam, and reference numeral 48 stops running of the steel strip. Occasionally, it shows an anti-shatter shutter that blocks vapor adhesion to the steel strip.

A collecting plate 45 having an inverted concave cross section is arranged on the upper part of the first member 41 so as to protect the ceiling of the vapor deposition plating chamber from below. It is desirable to provide, for example, a cooling mechanism for passing cooling water inside the collection plate 45 so that even if a part of the metal vapor adheres to the latent heat and sensible heat, it is not abnormally heated. Keep it. Therefore, a part of the metal vapor not vapor-deposited on the steel strip 1 is contained in the second member 42.
The first member 41 is attached to the lower surface of the collecting plate 45 without adhering to the ceiling of the first member 41 when the attached amount exceeds a predetermined value.
Move in _two directions, replace the whole or part of the collecting plate 45 with a new one, and carry out the attached metal etc. to another place to remove it.

Further, as shown in FIGS. 2 and 4, the vapor deposition plating chamber 4A
In (4B), the second steel plate 1 has a width almost the same as the width of the steel strip 1 just above the steel strip 1 and a receiving plate 46 immediately above the steel strip 1 along the longitudinal direction of the steel strip 1. Mounted on 42. As a result, even if a metal piece or the like that adheres and accumulates falls from the collecting plate 45, it prevents the metal piece from directly falling on the strip steel,
It prevents metal pieces from adhering to the plating layer or scratching the strip steel 1.

FIG. 5 is a cross-sectional explanatory view from above showing a preferable example of the raw material supply to the raw material tank 5, and one raw material tank 5 is provided with two raw material supply devices F, F in parallel. The raw material supply device F comprises a pinch roll 12, a feeder pipe 14 provided with a shutoff valve 13, and a wire tank 11. The raw material wire wound into a pack is stored in the wire tank 11, and the pinch roll 12 is used. Operation of the feeder pipe 14
The wire is continuously supplied into the molten raw material Y in the raw material tank 5 through the inside. By thus providing the two raw material supply devices F, F, for example, when the raw material wire in one raw material supply device F is exhausted, it is troublesome to replace the packed raw material wire in a batch process. However, if the raw material wire is supplied by the other raw material supply device F during that time, the bath surface level of the molten raw material Y in the raw material tank 5 can be prevented from lowering, and stable plating can be performed with the bath surface level kept constant. Processing operations can be performed. The raw material may be stored in a molten state or the sublimable material may be stored in a solid state.

The present invention is not limited to the above embodiments, but a plurality of vapor deposition plating chambers are provided adjacent to each other for performing multi-layer plating, or an Al plate or a synthetic resin film is used for a steel strip. Etc., and the type of plating raw material can be arbitrarily selected from Al, Zn, Cu, Ti and the like, alloys thereof, ceramics and the like.

[0018]

EFFECTS OF THE INVENTION Since the present invention is constructed as described above, it is possible to easily carry out maintenance work and the like of the vapor deposition plating chamber. Further, according to the structure of claim 2, the steam raw material that has not adhered to the strip steel can be collected off-line and removed off-line, and the work of removing the adhered deposits can be performed in a short time. It was also possible to eliminate the adverse effect on the plating process due to the fall of the deposited deposit. According to the structure of claim 3, the raw material can be continuously and stably supplied to the evaporation raw material tank. The structure of claim 4 can prevent the plating layer from being scratched or peeled off by the deflector roll.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a typical embodiment of the present invention.

FIG. 2 is a side sectional view showing a structural example of a vapor deposition plating chamber of the present invention.

3 is a sectional view taken along the line III-III of FIG.

4 is a sectional view taken along the line IV-IV of FIG.

FIG. 5 is a cross-sectional explanatory view seen from the top, showing another example of the vapor deposition plating chamber of the present invention.

FIG. 6 is an explanatory view showing an example of a conventional vacuum vapor deposition plating equipment.

[Explanation of symbols]

 1 strip steel 4A, 4B vapor deposition plating chamber 5 raw material tank 45 collection plate 46 receiving plate F raw material supply device

 ─────────────────────────────────────────────────── --- Continuation of the front page (72) Inventor Koji Irie 1012 Hiraoka-cho, Kakogawa-shi 1012 (72) Inventor Tota Ayabe 1001 Futamata Hiraoka-cho, Kakogawa-shi

Claims (4)

[Claims] 1. A vapor deposition plating facility in which two or more independent vapor deposition plating chambers for performing vapor deposition plating on both front and back sides of a strip-shaped material to be plated are respectively arranged above and below. The vapor deposition plating equipment is characterized in that the two are horizontally shifted. 2. A collecting plate for collecting raw material vapor is provided on a ceiling portion of each vapor deposition plating chamber according to claim 1,
Evaporative plating equipment with a receiving plate placed directly above the material to be plated. 3. A vapor deposition plating facility in which two or more raw material supply devices are provided in parallel in each raw material tank provided in each vapor deposition plating chamber according to claim 1. 4. The strip-shaped material to be plated is arranged such that one surface is plated in the lower evaporation plating chamber and then the opposite side is plated in the upper evaporation plating chamber, and the material to be plated is the lower evaporation plating chamber. The vapor deposition plating equipment according to claim 1, wherein the non-plated surface of the material to be plated in (1) comes into contact with the deflector roll to change its direction and then is fed to the upper vapor deposition plating chamber.