JPH0584948A - Production of thermal head - Google Patents

Production of thermal head

Info

Publication number
JPH0584948A
JPH0584948A JP24546191A JP24546191A JPH0584948A JP H0584948 A JPH0584948 A JP H0584948A JP 24546191 A JP24546191 A JP 24546191A JP 24546191 A JP24546191 A JP 24546191A JP H0584948 A JPH0584948 A JP H0584948A
Authority
JP
Japan
Prior art keywords
layer
protective layer
heating resistor
glass
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24546191A
Other languages
Japanese (ja)
Other versions
JP3176097B2 (en
Inventor
Tetsuharu Hyodo
徹治 兵頭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP24546191A priority Critical patent/JP3176097B2/en
Publication of JPH0584948A publication Critical patent/JPH0584948A/en
Application granted granted Critical
Publication of JP3176097B2 publication Critical patent/JP3176097B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PURPOSE:To prevent the corrosion of a heating resistor layer and a pair of conductive layers due to the contact of moisture in the atmosphere with said layers. CONSTITUTION:In a thermal head wherein a heating resistor layer 3 and a pair of conductive layers 4a, 4b are formed to the upper surface of an electric insulating substrate 1 and covered with a protective layer 5, an alkoxide glass solution with a viscosity of 3cps or less and surface tension of 25 dyn.s/cm<2> or less is applied to the surface of the protective layer 5 and subjected to polycondensation under heating to deposit a glass layer 6. The alkoxide glass solution well penetrates in the film fault 5a of the protective layer 5 by a capillary phenomenon and the glass layer 6 is formed to the upper surface of the protective layer 5 in such a state that part thereof is received in the film fault 5a.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はワードプロセッサやファ
クシミリ等のプリンタ機構として組み込まれるサーマル
ヘッドの製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a thermal head incorporated as a printer mechanism such as a word processor or a facsimile.

【0002】[0002]

【従来技術及びその問題点】従来、ワードプロセッサや
ファクシミリ等のプリンタ機構として組み込まれるサー
マルヘッドは図2に示す如く、アルミナ等の電気絶縁性
材料から成る基板11上にガラス等から成る蓄熱層12
と、窒化タンタル等から成る発熱抵抗体層13とアルミ
ニウム等から成る一対の導電層14a、14bとを被着
させるとともに該発熱抵抗体層13及び一対の導電層1
4a、14bの表面を窒化珪素等から成る保護層15で
被覆した構造を有しており、前記一対の導電層14aと
14bの間に所定の電力を印加し、発熱抵抗体層13を
印字画像を形成するに必要な温度にジュール発熱させる
とともに該発熱した熱を感熱紙17等に伝導させ、感熱
紙17等に印字画像を形成することによってサーマルヘ
ッドとして機能する。
2. Description of the Related Art Conventionally, as shown in FIG. 2, a thermal head incorporated as a printer mechanism for a word processor, a facsimile or the like has a heat storage layer 12 made of glass or the like on a substrate 11 made of an electrically insulating material such as alumina.
A heating resistor layer 13 made of tantalum nitride or the like and a pair of conductive layers 14a, 14b made of aluminum or the like, and the heating resistor layer 13 and the pair of conductive layers 1 are attached.
It has a structure in which the surface of 4a, 14b is covered with a protective layer 15 made of silicon nitride or the like, a predetermined electric power is applied between the pair of conductive layers 14a and 14b, and the heating resistor layer 13 is printed as an image. The Joule heat is generated to a temperature required to form the heat transfer sheet, and the generated heat is conducted to the thermal paper 17 or the like to form a print image on the thermal paper 17 or the like, thereby functioning as a thermal head.

【0003】尚、前記発熱抵抗体層13及び一対の導電
層14a、14bが感熱紙等の摺動によって摩耗するの
を防止したり、大気中の水分や感熱紙等に含まれる塩素
イオン、ナトリウムイオン等が発熱抵抗体層13等に接
触し、発熱抵抗体層13等に腐食を発生するのを防止す
るためのものである。
It is to be noted that the heating resistor layer 13 and the pair of conductive layers 14a and 14b are prevented from being abraded by sliding of thermal paper or the like, or moisture in the atmosphere or chlorine ions or sodium contained in the thermal paper or the like. This is for preventing ions and the like from coming into contact with the heating resistor layer 13 and the like and causing corrosion in the heating resistor layer 13 and the like.

【0004】しかしながら、この従来のサーマルヘッド
においては、前記保護層15が、通常、スパッタリング
法等の薄膜形成技術によって被着形成されており、この
とき、該保護層15にはピンホールやクラック等の成膜
欠陥15aが多量に形成されて発熱抵抗体層13及び一
対の導電層14a、14bの表面を完全に被覆すること
がでない。そのため、大気中の水分や感熱紙等に含まれ
る塩素イオン、ナトリウムイオン等は前記成膜欠陥15
aを介して発熱抵抗体層13や一対の導電層14a、1
4bに接触し、該発熱抵抗体層13等に腐食を発生して
発熱抵抗体層13や一対の導電層14a、14bに断線
を生じさせたり、或いはこれらの導電抵抗にばらつきを
生じさせるなどしてサーマルヘッドとしての機能が喪失
されるという欠点を有していた。
However, in this conventional thermal head, the protective layer 15 is usually deposited by a thin film forming technique such as sputtering, and at this time, the protective layer 15 has pinholes, cracks and the like. The large number of film-forming defects 15a are not formed so as to completely cover the surfaces of the heating resistor layer 13 and the pair of conductive layers 14a and 14b. Therefore, moisture in the atmosphere and chlorine ions, sodium ions, etc., contained in the thermal paper, etc., may cause the film-forming defects 15 to occur.
via the heating resistor layer 13 and the pair of conductive layers 14a, 1
4b to cause corrosion in the heating resistor layer 13 or the like to cause disconnection in the heating resistor layer 13 or the pair of conductive layers 14a and 14b, or to cause variations in these conductive resistances. Therefore, the function as a thermal head is lost.

【0005】そこで上記欠点を解消するため、図3に示
す如く、保護層15の上面に樹脂やガラス等から成るオ
ーバーコート層16を被着させ、保護層15に形成され
ている成膜欠陥15aの上部をオーバーコート層16で
塞ぐことが考えられる。
In order to solve the above-mentioned drawbacks, therefore, as shown in FIG. 3, an overcoat layer 16 made of resin, glass or the like is deposited on the upper surface of the protective layer 15 to form a film-forming defect 15a formed in the protective layer 15. It is conceivable to cover the upper part of the with an overcoat layer 16.

【0006】しかしながら、このサーマルヘッドは保護
層15に形成された成膜欠陥15aの上部をただ単にオ
ーバーコート層16で塞いだだけであるため、初期にお
いては大気中の水分や感熱紙等に含まれる塩素イオン、
ナトリウムイオン等が発熱抵抗体層13や一対の導電層
14a、14bに接触することは無く、サーマルヘッド
を正常に作動させることができるもののサーマルヘッド
を繰り返し作動させ、感熱紙等に印字画像を形成した場
合、オーバーコート層16が感熱紙17等の摺動によっ
て摩耗され、その結果、短期間で保護層15に形成され
た成膜欠陥15aが開口され前述した欠点が再発してし
まうという問題を有していた。
However, since this thermal head only covers the upper portion of the film-forming defect 15a formed in the protective layer 15 with the overcoat layer 16, it is initially contained in the atmospheric moisture or thermal paper. Chloride ion,
Although the sodium ion or the like does not contact the heating resistor layer 13 or the pair of conductive layers 14a and 14b, the thermal head can be normally operated, but the thermal head is repeatedly operated to form a printed image on thermal paper or the like. In this case, the overcoat layer 16 is abraded by the sliding of the thermal paper 17 or the like, and as a result, the film forming defect 15a formed on the protective layer 15 is opened in a short period of time, and the above-mentioned defects reoccur. I had.

【0007】[0007]

【問題を解決するための手段】本発明のサーマルヘッド
の製造方法は、電気絶縁性基板の上面に発熱抵抗体層と
一対の導電層を被着させるとともに該発熱抵抗体層及び
一対の導電層を保護層で被覆して成るサーマルヘッドで
あって、前記保護層表面に粘度3cps以下、表面張力
25dyn・s/cm2 以下のアルコキシドガラス溶液
を塗布するとともにこれを加熱縮重合させることによっ
てガラス層を被着させることを特徴とする。
According to the method of manufacturing a thermal head of the present invention, a heating resistor layer and a pair of conductive layers are deposited on the upper surface of an electrically insulating substrate, and the heating resistor layer and the pair of conductive layers are formed. Which is coated with a protective layer on the surface of the protective layer, the alkoxide glass solution having a viscosity of 3 cps or less and a surface tension of 25 dyn · s / cm 2 or less is applied and the glass layer is heated and polycondensed. Is characterized by being attached.

【0008】[0008]

【実施例】以下、添付図面に基づいて本発明の実施例を
説明する。
Embodiments of the present invention will be described below with reference to the accompanying drawings.

【0009】図1は本発明のサーマルヘッドの一実施例
を示す断面図であり、1は基板、2は蓄熱層、3a、3
bは一対の導電層、4は発熱抵抗体層、5は保護層、6
はガラス層である。
FIG. 1 is a sectional view showing an embodiment of a thermal head of the present invention, in which 1 is a substrate, 2 is a heat storage layer, 3a, 3
b is a pair of conductive layers, 4 is a heating resistor layer, 5 is a protective layer, 6
Is a glass layer.

【0010】前記基板1はアルミナセラミックス等の耐
熱性に優れた電気絶縁性材料から成り、その上面には蓄
熱層2が被着されている。
The substrate 1 is made of an electrically insulating material having excellent heat resistance such as alumina ceramics, and a heat storage layer 2 is attached to the upper surface thereof.

【0011】前記蓄熱層2はガラスやポリイミド樹脂等
から成り、発熱抵抗体層3の発する熱を蓄積及び放散す
ることによってサーマルヘッドの熱応答特性を良好に保
つ作用を為す。
The heat storage layer 2 is made of glass, polyimide resin or the like, and stores and dissipates the heat generated by the heating resistor layer 3 to keep the thermal response characteristics of the thermal head good.

【0012】また前記蓄熱層2の上面には発熱抵抗体層
3が被着されており、更に発熱抵抗体層3の上面には一
対の導電層4a、4bが間に一定の間隔をもって被着さ
れている。
A heating resistor layer 3 is deposited on the upper surface of the heat storage layer 2, and a pair of conductive layers 4a and 4b are deposited on the upper surface of the heating resistor layer 3 with a constant gap therebetween. Has been done.

【0013】前記発熱抵抗体層3は例えば窒化タンタル
等から成り、それ自体が所定の電気抵抗を有しているた
め、一対の導電層4a、4bを介して所定の電力が印加
されるとジュール発熱を起こし、印字画像を形成するに
必要な温度、例えば300〜450℃に発熱する。
The heating resistor layer 3 is made of, for example, tantalum nitride or the like, and has a predetermined electric resistance by itself. Therefore, when a predetermined electric power is applied through the pair of conductive layers 4a and 4b, the joule is formed. Heat is generated, and the temperature is required to form a printed image, for example, 300 to 450 ° C.

【0014】また、前記発熱抵抗体層3上に被着されて
いる一対の導電層4a、4bはアルミニウム等の金属か
ら成り、発熱抵抗体層3にジュール発熱を起こさせるた
めに必要な電力を印加する作用を為す。
The pair of conductive layers 4a and 4b deposited on the heating resistor layer 3 are made of a metal such as aluminum, and the power required to cause Joule heating in the heating resistor layer 3 is generated. It acts to apply.

【0015】前記発熱抵抗体層3及び一対の導電層4
a、4bの上面にはまた窒化珪素等の耐摩耗性に優れた
材料から成る保護層5が被着形成されており、これによ
って発熱抵抗体層3及び一対の導電層4a、4bを感熱
紙等との摺動による摩耗や大気中の水分、感熱紙等に含
まれる塩素イオン、ナトリウムイオン等の汚染物質によ
る腐食から保護している。
The heating resistor layer 3 and the pair of conductive layers 4
A protective layer 5 made of a material having excellent wear resistance, such as silicon nitride, is deposited on the upper surfaces of a and 4b, whereby the heating resistor layer 3 and the pair of conductive layers 4a and 4b are formed on the thermal paper. It protects against abrasion due to sliding with other materials, corrosion from moisture in the atmosphere, and contaminants such as chlorine ions and sodium ions contained in thermal paper.

【0016】尚、前記保護層5は従来周知のスパッタリ
ング法等によって発熱抵抗体層3及び一対の導電層4
a、4b上に被着形成され、このとき保護層5にはピン
ホールやクラック等の成膜欠陥5aが多量に形成された
ものとなっている。
The protective layer 5 is formed of a heating resistor layer 3 and a pair of conductive layers 4 by a conventionally known sputtering method or the like.
It is deposited on a and 4b, and at this time, a large number of film formation defects 5a such as pinholes and cracks are formed on the protective layer 5.

【0017】また前記成膜欠陥5aが形成された保護層
5の上面には、ガラス層6がその一部を成膜欠陥5a内
に充填させた状態で被着されている。
Further, a glass layer 6 is deposited on the upper surface of the protective layer 5 on which the film formation defect 5a is formed, with a part of the glass layer 6 being filled in the film formation defect 5a.

【0018】前記ガラス層6は保護層5に形成された成
膜欠陥5aを塞ぐことによって汚染物質による発熱抵抗
体層3等の腐食を防止する作用を為し、前記ガラス層6
はその一部が成膜欠陥5a内に充填された状態で保護層
5の上面に被着されていることから、印字時、感熱紙等
の摺動によってガラス層6が摩耗しても成膜欠陥5a内
に充填されたガラス層6は摩耗することは無く、常に成
膜欠陥5aを塞ぐことが可能となり、その結果、汚染物
質が成膜欠陥5aを介して発熱抵抗体層3や一対の導電
層4a、4bに接触し、腐食を発生させることは殆ど無
くなる。
The glass layer 6 has a function of preventing corrosion of the heating resistor layer 3 and the like due to contaminants by closing the film formation defect 5a formed in the protective layer 5, and the glass layer 6
Is partially deposited on the upper surface of the protective layer 5 in a state of being filled in the film forming defect 5a, and therefore, the film is formed even if the glass layer 6 is worn by sliding of thermal paper during printing. The glass layer 6 filled in the defect 5a does not wear, and it is possible to always close the film formation defect 5a. As a result, the contaminants can generate contaminants through the film formation defect 5a and the heating resistor layer 3 and a pair of layers. Almost no occurrence of corrosion due to contact with the conductive layers 4a and 4b.

【0019】尚、前記ガラス層6は保護層5の成膜欠陥
5a内に上面から0.5μm以上の深さまで充填させる
と汚染物質がガラス層6を透過して発熱抵抗体層3や一
対の導電層4a、4bを腐食するのが有効に防止され
る。従って、汚染物質による発熱抵抗体層3や一対の導
電層4a、4bの腐食をより有効に防止し、サーマルヘ
ッドを長期にわって安定且つ良好に機能させるにはガラ
ス層6の一部を保護層5に形成された成膜欠陥5a内に
上面から0.5μm以上の深さまで充填させておくこと
が好ましい。
When the glass layer 6 is filled into the film-forming defect 5a of the protective layer 5 to a depth of 0.5 μm or more from the top surface, contaminants penetrate the glass layer 6 and the heating resistor layer 3 and a pair of layers. Corrosion of the conductive layers 4a and 4b is effectively prevented. Therefore, in order to prevent the heat generating resistor layer 3 and the pair of conductive layers 4a and 4b from being corroded more effectively by the contaminants and to make the thermal head function stably and satisfactorily for a long period of time, a part of the glass layer 6 is protected. It is preferable to fill the film forming defects 5a formed in the layer 5 from the top surface to a depth of 0.5 μm or more.

【0020】かくして上述したサーマルヘッドは、外部
電気信号に対応させて一対の導電層4aと4bの間に電
力を印加し、発熱抵抗体層3を所定の温度にジュール発
熱抵抗体層させるとともに該発熱した熱を感熱紙等に伝
導させ、感熱紙等に印字画像を形成させることによって
サーマルヘッドとして機能する。
Thus, in the above-described thermal head, electric power is applied between the pair of conductive layers 4a and 4b in response to an external electric signal to cause the heating resistor layer 3 to have a Joule heating resistor layer at a predetermined temperature, and It functions as a thermal head by transmitting the generated heat to thermal paper or the like and forming a printed image on the thermal paper or the like.

【0021】次に、上述したサーマルヘッドの製造方法
について説明する。
Next, a method of manufacturing the above-mentioned thermal head will be described.

【0022】(1)先ずアルミナセラミックス等の電気
絶縁性材料から成る基板1を準備する。
(1) First, a substrate 1 made of an electrically insulating material such as alumina ceramics is prepared.

【0023】前記基板は例えばアルミナ、シリカ、マグ
ネシア等のセラミック材料粉末に適当な有機溶媒、溶剤
を添加混合して泥漿状と為すとともにこれを従来周知の
ドクターブレード法を採用することによってセラミック
グリーンシートを形成し、次に該セラミックグリーンシ
ートを所定形状に打ち抜き加工を施すとともに高温(約
1600℃)で焼成することによって製作される。
The substrate is made into a slurry by adding a suitable organic solvent or solvent to a ceramic material powder such as alumina, silica, magnesia, etc. to form a slurry, and by adopting a conventionally known doctor blade method, a ceramic green sheet. Is formed, and then the ceramic green sheet is punched into a predetermined shape and fired at a high temperature (about 1600 ° C.).

【0024】(2)次に前記基板1上にガラス等から成
る蓄熱層2を被着させる。
(2) Next, the heat storage layer 2 made of glass or the like is deposited on the substrate 1.

【0025】前記蓄熱層2は、例えばガラス粉末に適当
な有機溶剤、溶媒を添加混合して得たガラスペーストを
基板1上に従来周知のスクリーン印刷法等を採用するこ
とによって印刷塗布し、しかる後、これを高温で焼き付
けることによって基板1上に被着される。
The heat storage layer 2 is formed by printing and applying a glass paste obtained by adding and mixing a suitable organic solvent or solvent to glass powder on the substrate 1 by employing a conventionally known screen printing method or the like. It is then deposited on the substrate 1 by baking it at high temperature.

【0026】(3)次に前記蓄熱層2上に窒化タンタル
等から成る発熱抵抗体層3及びアルミニウム等から成る
一対の導電層4a、4bを順次被着させる。
(3) Next, the heating resistor layer 3 made of tantalum nitride or the like and the pair of conductive layers 4a, 4b made of aluminum or the like are sequentially deposited on the heat storage layer 2.

【0027】前記発熱抵抗体層3及び一対の導電層4
a、4bは従来周知のスパッタリング法等を採用するこ
とによって前記蓄熱層2上に順次被着される。
The heating resistor layer 3 and the pair of conductive layers 4
A and 4b are sequentially deposited on the heat storage layer 2 by adopting a conventionally known sputtering method or the like.

【0028】(4)次に前記発熱抵抗体層3及び一対の
導電層4a、4bの上面に窒化珪素等から成る保護層5
を被着させる。
(4) Next, a protective layer 5 made of silicon nitride or the like is formed on the upper surfaces of the heating resistor layer 3 and the pair of conductive layers 4a and 4b.
Put on.

【0029】前記保護層5は窒化珪素等を従来周知のス
パッタリング法等を採用することによって前記発熱抵抗
体層3及び一対の導電層4a、4bの上面に被着形成さ
せる。
The protective layer 5 is formed by depositing silicon nitride or the like on the upper surfaces of the heating resistor layer 3 and the pair of conductive layers 4a and 4b by using a conventionally known sputtering method or the like.

【0030】(5)最後に前記保護層5の上面にガラス
層6を被着させ、これによってサーマルヘッドが完成す
る。
(5) Finally, the glass layer 6 is deposited on the upper surface of the protective layer 5 to complete the thermal head.

【0031】前記ガラス層6は、アルコキシドガラス
(例えば、珪素化合物:Rn Si(OH) 4-n ,nは正
数,Rは有機系の官能基を表す)に適当な有機溶剤、溶
媒(例えばメタノール等)を添加混合することによって
粘度を3cps以下、表面張力を25dyn・s/cm
2 以下と成したアルコキシドガラス溶液を作製し、次に
前記アルコキシドガラス溶液を従来周知のディップ法等
を採用することによって保護層5の上面に塗布するとと
もに約2分間放置し、しかる後、前記塗布したアルコキ
シドガラス溶液をオーブン等を用いて約1時間高温、例
えば500℃の温度で加熱し、アルコキシドガラスを加
熱縮重合させるとともに該加熱縮重合により解離した水
やアルコキシドガラス溶液中の有機溶剤、溶媒等を蒸発
させガラス層6と成して保護層5の上面に被着させる。
この場合、保護層5上に塗布したアルコキシドガラス溶
液は粘度が3cps以下、表面張力が25dyn・s/
cm2 以下であることから、アルコキシドガラス溶液を
保護層5の上面に塗布した際、アルコキシドガラス溶液
の一部が保護層5の成膜欠陥5a内に毛細管現象によっ
て良好に浸透し、その結果、前記アルコキシドガラス溶
液を高温で加熱して得られるガラス層6はその一部が成
膜欠陥5a内に該成膜欠陥5aを塞ぐようにして保護層
5上に被着される。
The glass layer 6 is made of an alkoxide glass (for example, a silicon compound: R n Si (OH) 4-n , n is a positive number, R is an organic functional group), and an appropriate organic solvent or solvent ( For example, by adding and mixing (for example, methanol), the viscosity is 3 cps or less and the surface tension is 25 dyn · s / cm.
An alkoxide glass solution having a ratio of 2 or less is prepared, and then the alkoxide glass solution is applied to the upper surface of the protective layer 5 by using a conventionally known dipping method or the like and left for about 2 minutes. The alkoxide glass solution is heated at a high temperature for about 1 hour using an oven, for example, at a temperature of 500 ° C. to heat-condensate the alkoxide glass, and water dissociated by the heat-condensation polymerization or an organic solvent or solvent in the alkoxide glass solution. Etc. are evaporated to form a glass layer 6 and deposited on the upper surface of the protective layer 5.
In this case, the alkoxide glass solution applied on the protective layer 5 has a viscosity of 3 cps or less and a surface tension of 25 dyn · s /
Since it is cm 2 or less, when the alkoxide glass solution is applied to the upper surface of the protective layer 5, a part of the alkoxide glass solution satisfactorily penetrates into the film formation defect 5a of the protective layer 5 due to the capillary phenomenon, and as a result, The glass layer 6 obtained by heating the alkoxide glass solution at a high temperature is deposited on the protective layer 5 so that a part of the glass layer 6 covers the film formation defect 5a.

【0032】尚、前記アルコキシドガラス溶液はその粘
度が3cpsを越え、かつ表面張力が25dyn・s/
cm2 を越えるとアルコキシドガラス溶液を保護層5表
面に塗布させる際、保護層5に形成されている成膜欠陥
5a内にアルコキシドガラス溶液が十分に浸透していか
なくなる。従って、保護層5表面にガラス層6をその一
部が保護層5に形成された成膜欠陥5a内に充填させた
状態で被着させるためには、アルコキシドガラス溶液の
粘度を3cps以下、表面張力を25dyn・s/cm
2 以下に特定する必要がある。
The alkoxide glass solution has a viscosity of more than 3 cps and a surface tension of 25 dyn · s /
When it exceeds cm 2 , when the alkoxide glass solution is applied to the surface of the protective layer 5, the alkoxide glass solution cannot sufficiently penetrate into the film formation defects 5a formed in the protective layer 5. Therefore, in order to deposit the glass layer 6 on the surface of the protective layer 5 while partially filling the film forming defects 5a formed in the protective layer 5, the alkoxide glass solution has a viscosity of 3 cps or less, Tension is 25 dyn · s / cm
2 Must be specified below.

【0033】次に本発明の作用効果を以下に述べる2つ
の実験例に基づいて説明する。
Next, the function and effect of the present invention will be described based on the two experimental examples described below.

【0034】(実験例1)先ず実験試料として、図1に
示す如く、基板の上面に複数個の発熱抵抗体層及び一対
の導電層を被着させるとともに該発熱抵抗体層を保護層
で被覆して成るサーマルヘッドにおいて、保護層の表面
に粘度を1cps、表面張力を22dyn・s/cm2
と成したアルコキシドガラス溶液を塗布し、しかる後、
これを高温で加熱して保護層の表面及び該保護層に形成
された成膜欠陥(径:0.1μm、深さ:3μm)内の
上面より40%の深さにまでガラス層を被着充填させた
本発明品と、保護層表面にガラス層を全く被着させてい
ない従来品を準備する。
Experimental Example 1 First, as an experimental sample, as shown in FIG. 1, a plurality of heating resistor layers and a pair of conductive layers were applied to the upper surface of a substrate, and the heating resistor layers were covered with a protective layer. In the thermal head formed by, the surface of the protective layer has a viscosity of 1 cps and a surface tension of 22 dyn · s / cm 2.
After applying the alkoxide glass solution made of
By heating this at a high temperature, a glass layer is deposited to a depth of 40% from the upper surface of the surface of the protective layer and the film-forming defects (diameter: 0.1 μm, depth: 3 μm) formed in the protective layer. A filled product of the present invention and a conventional product in which a glass layer is not attached to the surface of the protective layer are prepared.

【0035】次に前記各々の試料につき、温度が35
℃、湿度が85%の環境下において所定の印字待機状態
(サーマルヘッドの保護層に感熱紙を接触させるととも
に一対の導電層間に24Vの電圧を印加し発熱抵抗体層
を発熱させた状態)に設定し、腐食された発熱抵抗体層
の数が発熱抵抗体層全体のうち0.1%に達するまでの
時間(これを初期破壊時間と定義する)を調べた。
Next, for each of the above samples, the temperature was 35
In a predetermined print standby state (a state in which a thermal paper is brought into contact with the protective layer of the thermal head and a voltage of 24 V is applied between the pair of conductive layers to heat the heating resistor layer) in an environment of ℃ and humidity of 85% The time until the number of set and corroded heating resistor layers reached 0.1% of the entire heating resistor layers (this is defined as the initial breakdown time) was examined.

【0036】かかる実験によれば、従来品ではその初期
破壊時間が約20時間であったのに対し、本発明品では
約100時間と、従来品の5倍の延命となり、サーマル
ヘッドの信頼性が向上されたことが判る。
According to such an experiment, in the conventional product, the initial breakdown time was about 20 hours, whereas in the product of the present invention, it was about 100 hours, which was five times as long as that of the conventional product, and the reliability of the thermal head was improved. It can be seen that is improved.

【0037】(実験例2)実験試料として、図1に示す
如く、基板の上面に複数個の発熱抵抗体層及び一対の導
電層を被着させるとともに該発熱抵抗体層を保護層で被
覆して成るサーマルヘッドにおいて、保護層の表面に粘
度を1cps、表面張力を22dyn・s/cm2 と成
したアルコキシドガラス溶液を塗布し、しかる後、これ
を高温で加熱して保護層の表面及び該保護層に形成され
た成膜欠陥(径:0.1μm、深さ:3μm)内の上面
より40%の深さにまでガラス層を被着充填させた本発
明品と、保護層表面に粘度を10cps、表面張力を3
0dyn・s/cm2 と成したアルコキシドガラス溶液
を塗布し、しかる後、これを高温で加熱することによっ
て保護層表面のみにガラス層を被着させた従来品を準備
する。
Experimental Example 2 As an experimental sample, as shown in FIG. 1, a plurality of heating resistor layers and a pair of conductive layers were applied to the upper surface of a substrate, and the heating resistor layers were covered with a protective layer. In the thermal head consisting of the above, an alkoxide glass solution having a viscosity of 1 cps and a surface tension of 22 dyn · s / cm 2 is applied to the surface of the protective layer, which is then heated at a high temperature and the surface of the protective layer and The product of the present invention in which a glass layer was adhered and filled to a depth of 40% from the upper surface in the film formation defect (diameter: 0.1 μm, depth: 3 μm) formed in the protective layer, and the viscosity on the surface of the protective layer. 10 cps, surface tension 3
An alkoxide glass solution of 0 dyn · s / cm 2 is applied, and then heated at a high temperature to prepare a conventional product in which a glass layer is adhered only to the surface of the protective layer.

【0038】次に前記各々の試料につき、常温常湿の環
境下において一対の導電層の間に所定の電力(電力:
0.2W/dot、印加周期:10.0msec、印加
時間:2.0msec)を印加するとともにサーマルヘ
ッドの保護層に高イオン含有量(ナトリウムイオン:2
000ppm以上)の感熱紙を摺動させ、発熱抵抗体層
に最初に腐食が発生したときの感熱紙の摺動距離を調べ
た。
Next, with respect to each of the above-mentioned samples, a predetermined electric power (electric power:
0.2 W / dot, application period: 10.0 msec, application time: 2.0 msec) and a high ion content (sodium ion: 2) in the protective layer of the thermal head.
000 ppm or more) of the thermal paper was slid to examine the sliding distance of the thermal paper when corrosion was first generated in the heating resistor layer.

【0039】この実験結果によれば、従来品では感熱紙
を約10km摺動させたところで最初の腐食を発生した
のに対し、本発明品では約30kmと、従来品の約3倍
の延命となり、サーマルヘッドの信頼性が向上されたこ
とが判る。
According to the results of this experiment, in the conventional product, the first corrosion occurred when the thermal paper was slid about 10 km, while in the product of the present invention, it was about 30 km, which is about three times as long as that of the conventional product. It can be seen that the reliability of the thermal head has been improved.

【0040】尚、本発明は上記実施例に限定されるもの
ではなく、本発明の要旨を逸脱しない範囲において、種
々の変更、改良等は何ら差し支えない。
The present invention is not limited to the above embodiments, and various modifications and improvements may be made without departing from the scope of the present invention.

【0041】[0041]

【発明の効果】本発明のサーマルヘッドの製造方法によ
れば、粘度を3cps以下、表面張力を25dyn・s
/cm2 以下と成したアルコキシドガラス溶液を保護層
上に塗布するとともにこれを加熱縮重合させることによ
ってガラス層と成すことから保護層上に印刷塗布された
アルコキシドガラス溶液は保護層の成膜欠陥内に毛細管
現象によって良好に浸透され、成膜欠陥が形成された保
護層の上面にはガラス層がその一部を充填させた状態で
成膜欠陥を塞ぐようにして被着される。
According to the method of manufacturing a thermal head of the present invention, the viscosity is 3 cps or less and the surface tension is 25 dyn · s.
/ Cm 2 or less is applied to the protective layer and the glass layer is formed by heat polycondensation of the alkoxide glass solution. Therefore, the alkoxide glass solution printed and applied on the protective layer is a film formation defect of the protective layer. A glass layer is deposited on the upper surface of the protective layer, which is well penetrated into the inside by a capillary phenomenon and in which a film-forming defect is formed, so as to close the film-forming defect in a state where the glass layer is partially filled.

【0042】そのため、このサーマルヘッドでは感熱紙
等の摺動によって保護層に形成された成膜欠陥が開口す
ることは一切無く、常に成膜欠陥をガラス層で塞ぐこと
ができ、その結果、発熱抵抗体層や一対の導電層に汚染
物質が接触して腐食を発生させるのが極小となり、サー
マルヘッドを長期にわたり良好に機能させることができ
る。
Therefore, in this thermal head, the film-forming defects formed in the protective layer are not opened by sliding of the thermal paper or the like, and the film-forming defects can always be closed by the glass layer, resulting in heat generation. Contamination of the resistor layer or the pair of conductive layers with a contaminant causes minimal corrosion, and the thermal head can function well for a long period of time.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の製造方法によって製作されたサーマル
ヘッドの一実施例を示す断面図である。
FIG. 1 is a cross-sectional view showing an example of a thermal head manufactured by a manufacturing method of the present invention.

【図2】従来の一実施例を示すサーマルヘッドの断面図
である。
FIG. 2 is a sectional view of a thermal head showing a conventional example.

【図3】従来の他の実施例を示すサーマルヘッドの断面
図である。
FIG. 3 is a sectional view of a thermal head showing another conventional example.

【符号の説明】[Explanation of symbols]

1・・・電気絶縁性基板 3・・・発熱抵抗体層 4a、4b・・・一対の導電層 5・・・保護層 5a・・・成膜欠陥 6・・・ガラス層 DESCRIPTION OF SYMBOLS 1 ... Electrically insulating substrate 3 ... Heating resistor layer 4a, 4b ... A pair of conductive layers 5 ... Protective layer 5a ... Deposition defect 6 ... Glass layer

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】電気絶縁性基板の上面に発熱抵抗体層と一
対の導電層を被着させるとともに該発熱抵抗体層及び一
対の導電層を保護層で被覆して成るサーマルヘッドであ
って、前記保護層表面に粘度3cps以下、表面張力2
5dyn・s/cm2 以下のアルコキシドガラス溶液を
塗布するとともにこれを加熱縮重合させることによって
ガラス層を被着させることを特徴とするサーマルヘッド
の製造方法。
1. A thermal head comprising a heating resistor layer and a pair of conductive layers deposited on the upper surface of an electrically insulating substrate, and the heating resistor layer and the pair of conductive layers being covered with a protective layer. The surface of the protective layer has a viscosity of 3 cps or less and a surface tension of 2
A method for manufacturing a thermal head, characterized in that a glass layer is deposited by applying an alkoxide glass solution of 5 dyn · s / cm 2 or less and subjecting this to heat condensation polymerization.
JP24546191A 1991-09-25 1991-09-25 Manufacturing method of thermal head Expired - Fee Related JP3176097B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24546191A JP3176097B2 (en) 1991-09-25 1991-09-25 Manufacturing method of thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24546191A JP3176097B2 (en) 1991-09-25 1991-09-25 Manufacturing method of thermal head

Publications (2)

Publication Number Publication Date
JPH0584948A true JPH0584948A (en) 1993-04-06
JP3176097B2 JP3176097B2 (en) 2001-06-11

Family

ID=17134010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24546191A Expired - Fee Related JP3176097B2 (en) 1991-09-25 1991-09-25 Manufacturing method of thermal head

Country Status (1)

Country Link
JP (1) JP3176097B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5907346A (en) * 1996-07-23 1999-05-25 Fuji Photo Film Co., Ltd. Method and apparatus for thermal recording
US7217407B2 (en) 2003-09-11 2007-05-15 E. I. Du Pont De Nemours And Company Plasma synthesis of metal oxide nanoparticles

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5907346A (en) * 1996-07-23 1999-05-25 Fuji Photo Film Co., Ltd. Method and apparatus for thermal recording
US7217407B2 (en) 2003-09-11 2007-05-15 E. I. Du Pont De Nemours And Company Plasma synthesis of metal oxide nanoparticles

Also Published As

Publication number Publication date
JP3176097B2 (en) 2001-06-11

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