JPH0582012A - Overcurrent protection element - Google Patents
Overcurrent protection elementInfo
- Publication number
- JPH0582012A JPH0582012A JP26911391A JP26911391A JPH0582012A JP H0582012 A JPH0582012 A JP H0582012A JP 26911391 A JP26911391 A JP 26911391A JP 26911391 A JP26911391 A JP 26911391A JP H0582012 A JPH0582012 A JP H0582012A
- Authority
- JP
- Japan
- Prior art keywords
- acid
- dopant
- overcurrent protection
- carboxylic acid
- protection element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、ドーパント含有導電性
高分子化合物からなる過電流保護素子に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an overcurrent protection device composed of a conductive polymer compound containing a dopant.
【0002】[0002]
【従来の技術】ドーパント含有導電性高分子化合物から
なる過電流保護素子は特開昭59−134523号公報により公
知であり、ドーパントとしては塩酸、硫酸、硝酸、過塩
素酸、ホウフッ酸等が知られている。また、特開昭59−
134523号公報にはピクリン酸をドーパントとして用いる
過電流保護素子が記載されている。2. Description of the Related Art An overcurrent protection device made of a conductive polymer compound containing a dopant is known from JP-A-59-134523, and as the dopant, hydrochloric acid, sulfuric acid, nitric acid, perchloric acid, borofluoric acid, etc. are known. Has been. In addition, JP-A-59-
Japanese Patent No. 134523 describes an overcurrent protection device using picric acid as a dopant.
【0003】[0003]
【発明が解決しようとする課題】しかし、塩酸、硫酸、
硝酸、過塩素酸、ホウフッ酸等は金属に対して腐食性を
有するため、回路用の過電流保護素子としては使用する
ことができなかった。また、ピクリン酸は爆発性がある
ためこれを含有する素子の製造、保存、運搬等に火災の
危険が伴う。[Problems to be Solved by the Invention] However, hydrochloric acid, sulfuric acid,
Since nitric acid, perchloric acid, borofluoric acid, etc. are corrosive to metals, they cannot be used as an overcurrent protection element for circuits. Further, since picric acid is explosive, a risk of fire accompanies production, storage, transportation, etc. of an element containing it.
【0004】また、塩酸等をドーパントとする導電性高
分子においては、温度上昇に伴う抵抗の上昇は空気中の
酸素による酸化によるところが大きいので、空気に触れ
る外側部分の抵抗が先に上昇し内部の抵抗上昇は遅れ
る。すると、素子が動作し始めると内部に電流が集中す
ることになる。このため、素子の耐電圧等の向上に限界
がある。また、絶縁のために酸素非透過性の被覆を設け
たり、酸素のない環境下で使用すると、抵抗の上昇が著
しく遅れるので過電流保護素子として適切に機能しな
い。In a conductive polymer having hydrochloric acid as a dopant, the increase in resistance with temperature rise is largely due to oxidation by oxygen in the air. The rise in resistance is delayed. Then, when the element starts to operate, current concentrates inside. Therefore, there is a limit in improving the withstand voltage of the device. Further, if an oxygen impermeable coating is provided for insulation, or if it is used in an oxygen-free environment, the increase in resistance is significantly delayed, so that it does not function properly as an overcurrent protection element.
【0005】そこで、本発明の課題は、金属に対する腐
食性や火災の危険性がなく安全であり、かつ使用環境に
左右されずに適切に動作するドーパント含有過電流保護
素子を提供することにある。Therefore, an object of the present invention is to provide a dopant-containing overcurrent protection device which is safe without corrosiveness to metals or danger of fire and which operates properly regardless of the use environment. ..
【0006】[0006]
【課題を解決するための手段】本発明は、かかる課題を
達成するものとして、ドーパントを含有する導電性高分
子からなる過電流保護素子において、ドーパントがカル
ボン酸であることを特徴とする過電流保護素子を提供す
る。Means for Solving the Problems The present invention is achieved in order to achieve the above object, in an overcurrent protection device comprising a conductive polymer containing a dopant, wherein the dopant is a carboxylic acid. Provide a protection element.
【0007】カルボン酸 ドーパントとして使用されるカルボン酸としては、例え
ばギ酸、酢酸、プロピオン酸等の一価のカルボン酸;シ
ュウ酸、マロン酸、コハク酸、フマル酸、マレイン酸等
の二価のカルボン酸;ピルビン酸等のケトカルボン酸;
グルタミン酸等のアミノ酸;フタル酸、ピコリン酸等の
芳香族カルボン酸などが挙げられる。これらの中でも、
過電流保護素子の温度が動作温度に到ると抵抗が急激に
上昇し、瞬時に電流の遮断が行われる点で、シュウ酸が
特に好ましい。Examples of the carboxylic acid used as a carboxylic acid dopant include monovalent carboxylic acids such as formic acid, acetic acid and propionic acid; divalent carboxylic acids such as oxalic acid, malonic acid, succinic acid, fumaric acid and maleic acid. Acid; ketocarboxylic acid such as pyruvic acid;
Amino acids such as glutamic acid; aromatic carboxylic acids such as phthalic acid and picolinic acid. Among these,
Oxalic acid is particularly preferable because the resistance sharply rises when the temperature of the overcurrent protection element reaches the operating temperature and the current is instantaneously cut off.
【0008】ドーパントのドーピング量は、通常、それ
がドープされる高分子を構成する単量体単位の20〜50モ
ル%でよい。ドーピングの方法は特に制限されず、例え
ば化学ドーピング法、電気化学的方法等が挙げられる。The doping amount of the dopant may usually be 20 to 50 mol% of the monomer units constituting the polymer to which it is doped. The doping method is not particularly limited, and examples thereof include a chemical doping method and an electrochemical method.
【0009】導電性高分子 使用される導電性高分子としては、例えばポリアニリ
ン、ポリピロール、ポリアセチレン、ポリチオフェン等
が挙げられる。 Conductive Polymer Examples of the conductive polymer used include polyaniline, polypyrrole, polyacetylene, polythiophene and the like.
【0010】素子の製造 本発明の素子は、上記のドーパント含有導電性高分子化
合物を適当な形状に成形して製造する。形状としては、
例えば円筒状、円板状、シート状などが挙げられる。代
表的な素子の形状は円筒状であり、上下の円状端部に後
述する電極を設けて使用される。 Manufacture of Device The device of the present invention is manufactured by molding the above-mentioned conductive polymer compound containing a dopant into an appropriate shape. As for the shape,
For example, a cylindrical shape, a disk shape, a sheet shape, etc. may be mentioned. A typical element has a cylindrical shape and is used by providing electrodes, which will be described later, at the upper and lower circular end portions.
【0011】過電流保護素子は、通常、使用時には、例
えば2個の電極で挟まれた状態で使用される。この電極
の材料としては、例えば金、銀、銅、ニッケル、クロ
ム、アルミニウム、インジウムなどの各種金属、及びカ
ーボンなどがある。これらの電極材料の選択において
は、使用する導電性高分子に対してオーミック接触が得
られるようなものを用いる。また、このような電極を取
り付ける方法としては、例えば、焼付、蒸着、無電解メ
ッキ、導電性ペースト塗布などの物理的又は化学的方
法、二個の金属製電極で機械的に締めつけて挟持する方
法などが挙げられる。The overcurrent protection element is usually used, for example, in a state of being sandwiched between two electrodes at the time of use. Examples of the material of this electrode include various metals such as gold, silver, copper, nickel, chromium, aluminum and indium, and carbon. In selecting these electrode materials, a material that allows ohmic contact with the conductive polymer to be used is used. As a method of attaching such an electrode, for example, a physical or chemical method such as baking, vapor deposition, electroless plating, conductive paste application, or a method of mechanically clamping and sandwiching two metal electrodes And so on.
【0012】本発明の素子は、製造および販売に際して
は前記の電極は必ずしも設けられる必要はない。例えば
上記のように使用に際して器具に予め設けられた所定の
電極などで機械的に締めつけ挟持される場合に電極を予
め素子に設けて置く必要がないからである。In the device of the present invention, the electrodes described above do not necessarily have to be provided at the time of manufacture and sale. This is because, for example, when the device is mechanically clamped and clamped by a predetermined electrode or the like provided in advance in use as described above, it is not necessary to previously provide and place the electrode on the element.
【0013】[0013]
【作用】塩酸、硝酸等は過電流保護素子が加熱されて動
作する際に蒸発し周囲の電子部品に損傷を与えるが、カ
ルボン酸の中で例えばシュウ酸、マロン酸、マレイン酸
などは動作温度で分解して H2 O , CO2 , CO等の電子部
品には損傷を与える恐れのない生成物になる。また、例
えば酢酸などの分解温度が高いカルボン酸は分解せずに
蒸気の状態で揮散していくが、従来の塩酸等に比較する
と電子部品に対する影響は軽微である。動作温度で分解
する前者のタイプのカルボン酸をドーパントに使用した
場合に抵抗が特に急激に上昇するのは、これらドーパン
トが分解して素子全体が急激に絶縁化するためである。[Function] Hydrochloric acid, nitric acid, etc. evaporate when the overcurrent protection element is heated and operate, and damage the surrounding electronic parts. For example, among carboxylic acids, oxalic acid, malonic acid, maleic acid, etc. Decomposes into H 2 O, CO 2, CO and other electronic components that are not likely to damage electronic components. Further, for example, a carboxylic acid such as acetic acid having a high decomposition temperature is vaporized in a vapor state without being decomposed, but its influence on electronic parts is minor as compared with conventional hydrochloric acid or the like. When the former type of carboxylic acid, which decomposes at the operating temperature, is used as the dopant, the resistance rises particularly rapidly because these dopants decompose and the entire device is rapidly insulated.
【0014】[0014]
【実施例】以下、本発明を実施例により具体的に説明す
る。EXAMPLES The present invention will be specifically described below with reference to examples.
【0015】実施例1 アニリン13.3g及び塩酸18mlに蒸留水を加えて全体を 1
50mlとしたのち、 200mlの三角フラスコに移し、0℃に
保った。別途、ペルオキソ二硫酸アンモニウム15.3gを
蒸留水25mlに溶かして調製した水溶液を、前記の三角フ
ラスコ内の水溶液に40分かけて滴下した。24時間攪拌し
ながら重合させた。得られた重合体を水洗後、アンモニ
ア水で処理してドーパントである塩酸を脱ドープした。
さらに水洗してドーパントを含まないポリアニリンを得
た。これを1Mシュウ酸に浸漬し、シュウ酸ドープポリ
アニリンを得た。これを乾燥後、プレス成形により直径
5mm、厚さ1mmの成形体とし、その両面に金ペーストで
電極を形成し過電流保護素子を作った。 Example 1 Distilled water was added to 13.3 g of aniline and 18 ml of hydrochloric acid to prepare 1
After making 50 ml, the mixture was transferred to a 200 ml Erlenmeyer flask and kept at 0 ° C. Separately, an aqueous solution prepared by dissolving 15.3 g of ammonium peroxodisulfate in 25 ml of distilled water was added dropwise to the aqueous solution in the Erlenmeyer flask over 40 minutes. Polymerization was carried out while stirring for 24 hours. The obtained polymer was washed with water and then treated with aqueous ammonia to dedope the dopant hydrochloric acid.
Further, it was washed with water to obtain a polyaniline containing no dopant. This was immersed in 1M oxalic acid to obtain oxalic acid-doped polyaniline. After this was dried, a molded body having a diameter of 5 mm and a thickness of 1 mm was formed by press molding, and electrodes were formed with gold paste on both surfaces of the molded body to prepare an overcurrent protection element.
【0016】実施例2〜8 実施例2〜8において、1Mシュウ酸の代わりに、マレ
イン酸の1Mエタノール溶液、ピルビン酸( 100%)、
1Mマロン酸、オルトフタル酸の1Mエタノール溶液、
酢酸( 100%)、α−ピコリン酸飽和水溶液、又はL−
グルタミン酸飽和水溶液をそれぞれ使用した以外は、実
施例1と同様にしてカルボン酸ドープポリアニリンから
なる過電流保護素子を製造した。 Examples 2-8 In Examples 2-8, instead of 1M oxalic acid, a 1M solution of maleic acid in ethanol, pyruvic acid (100%),
1M malonic acid, 1M ethanol solution of orthophthalic acid,
Acetic acid (100%), saturated aqueous solution of α-picolinic acid, or L-
An overcurrent protection element made of carboxylic acid-doped polyaniline was produced in the same manner as in Example 1 except that saturated aqueous solutions of glutamic acid were used.
【0017】比較例 アニリン13.3g及び塩酸18mlに蒸留水を加えて全体を 1
50mlとしたのち、 200mlの3角フラスコに移し、0℃に
保った。別途、ペルオキソ二硫酸アンモニウム15.3gを
蒸留水25mlに溶かして調製した水溶液を、前記の三角フ
ラスコ内の水溶液に40分かけて滴下した。24時間攪拌し
ながら重合させた。得られた塩酸ドープポリアニリンを
乾燥後、プレス成形により直径5mm、厚さ1mmの成形体
とし、その両面に金ペーストで電極を形成し過電流保護
素子を製造した。 Comparative Example Distilled water was added to 13.3 g of aniline and 18 ml of hydrochloric acid to make 1
After making 50 ml, the mixture was transferred to a 200 ml triangular flask and kept at 0 ° C. Separately, an aqueous solution prepared by dissolving 15.3 g of ammonium peroxodisulfate in 25 ml of distilled water was added dropwise to the aqueous solution in the Erlenmeyer flask over 40 minutes. Polymerization was carried out while stirring for 24 hours. The obtained hydrochloric acid-doped polyaniline was dried and then press-molded to form a molded body having a diameter of 5 mm and a thickness of 1 mm, and electrodes were formed on both sides of the molded body with a gold paste to manufacture an overcurrent protection device.
【0018】特性試験 (1) 実施例1〜8及び比較例で製造した過電流保護素子
の素子抵抗を測定したところ、表1に示す結果が得られ
た。 (2) 実施例1、実施例4及び比較例で製造した導電性ポ
リアニリンについて、体積固有抵抗の温度依存性を測定
したところ、図1に示す結果が得られた。 (3) 実施例1〜4、6〜8及び比較例と同様に成形体を
製造し、電極を形成せずに銅板上に10日間室温で大気中
に放置し銅板の変化を調べた。結果を表2に示す。 Characteristic test (1) When the element resistances of the overcurrent protection elements produced in Examples 1 to 8 and Comparative Example were measured, the results shown in Table 1 were obtained. (2) The temperature dependence of the volume resistivity of the conductive polyaniline produced in Examples 1, 4 and Comparative Example was measured, and the results shown in FIG. 1 were obtained. (3) A molded body was manufactured in the same manner as in Examples 1 to 4, 6 to 8 and Comparative Example, and left on the copper plate without forming an electrode for 10 days at room temperature in the atmosphere to examine the change of the copper plate. The results are shown in Table 2.
【0019】[0019]
【表1】 [Table 1]
【0020】[0020]
【表2】 [Table 2]
【0021】[0021]
【発明の効果】本発明のドーパント含有過電流保護素子
はドーパントがカルボン酸であるため、金属に対する腐
食性が極めて弱いかあるいは無視しうるものであり、ま
た爆発性などの危険性もなく、回路用の過電流保護素子
としても使用することができる。EFFECT OF THE INVENTION Since the dopant-containing overcurrent protection device of the present invention has a carboxylic acid as a dopant, it has very weak or negligible corrosiveness to metals, and has no risk of explosiveness. It can also be used as an overcurrent protection device.
【0022】また、特に動作温度で分解するシュウ酸等
をドーパントとする態様では、酸素による酸化を必要と
する従来塩酸等をドーパントとする素子と異なり、素子
の抵抗上昇がドーパントの自己分解のより起こるため、
素子全体の抵抗上昇がほぼ均一に起こる。したがって、
電流が局部的に集中することがない。また酸素の有無に
かかわらず各種の雰囲気中で高い信頼性を有する。In particular, in the embodiment using oxalic acid or the like which decomposes at the operating temperature as a dopant, unlike the conventional device using hydrochloric acid or the like which requires oxidation by oxygen as a dopant, an increase in resistance of the device is caused by self-decomposition of the dopant. Because it happens
The resistance increase of the entire device occurs almost uniformly. Therefore,
The current does not concentrate locally. It also has high reliability in various atmospheres regardless of the presence or absence of oxygen.
【図1】実施例1、2及び6、並びに比較例で製造した
導電性ポリアニリンについて、体積固有抵抗の温度依存
性を示す。FIG. 1 shows the temperature dependence of volume resistivity for conductive polyaniline produced in Examples 1, 2 and 6, and Comparative Example.
Claims (3)
なる過電流保護素子において、ドーパントがカルボン酸
であることを特徴とする過電流保護素子。1. An overcurrent protection device comprising a conductive polymer containing a dopant, wherein the dopant is a carboxylic acid.
記の導電性高分子がポリアニリンである過電流保護素
子。2. The overcurrent protection device according to claim 1, wherein the conductive polymer is polyaniline.
て、前記のカルボン酸がシュウ酸である過電流保護素
子。3. The overcurrent protection element according to claim 1 or 2, wherein the carboxylic acid is oxalic acid.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26911391A JPH0582012A (en) | 1991-09-20 | 1991-09-20 | Overcurrent protection element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26911391A JPH0582012A (en) | 1991-09-20 | 1991-09-20 | Overcurrent protection element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0582012A true JPH0582012A (en) | 1993-04-02 |
Family
ID=17467856
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26911391A Pending JPH0582012A (en) | 1991-09-20 | 1991-09-20 | Overcurrent protection element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0582012A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007326097A (en) * | 2006-05-12 | 2007-12-20 | Yuken Industry Co Ltd | Film forming method of high anti-corrosive film containing dope conductive polymer |
JP2014043502A (en) * | 2012-08-24 | 2014-03-13 | Tosoh Corp | Polythiophene composition comprising phenol derivative, and conductive coating made of the same |
-
1991
- 1991-09-20 JP JP26911391A patent/JPH0582012A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007326097A (en) * | 2006-05-12 | 2007-12-20 | Yuken Industry Co Ltd | Film forming method of high anti-corrosive film containing dope conductive polymer |
JP2014043502A (en) * | 2012-08-24 | 2014-03-13 | Tosoh Corp | Polythiophene composition comprising phenol derivative, and conductive coating made of the same |
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