JPH0581613A - Thin film magnetic head and production thereof - Google Patents
Thin film magnetic head and production thereofInfo
- Publication number
- JPH0581613A JPH0581613A JP27048091A JP27048091A JPH0581613A JP H0581613 A JPH0581613 A JP H0581613A JP 27048091 A JP27048091 A JP 27048091A JP 27048091 A JP27048091 A JP 27048091A JP H0581613 A JPH0581613 A JP H0581613A
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- magnetic body
- lower magnetic
- thin film
- magnetic head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Magnetic Heads (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えば磁気テープや磁
気ディスク或いはハードディスクに対して情報信号の書
込み或いは読出しをするのに好適な薄膜磁気ヘッド及び
その製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film magnetic head suitable for writing or reading an information signal on, for example, a magnetic tape, a magnetic disk or a hard disk, and a method of manufacturing the thin film magnetic head.
【０００２】[0002]
【従来の技術】一般に、薄膜磁気ヘッドは、磁気回路部
を構成する磁性体膜や導体コイルが真空薄膜形成技術に
より形成されるため、狭トラック化や狭ギャップ化等の
微細寸法化が容易でしかも高分解能記録が可能であると
いう特徴を有しており、高密度記録化に対応した磁気ヘ
ッドとして注目され、実際にビデオテープレコーダやハ
ードディスク・ドライブ装置等に使用されている。2. Description of the Related Art Generally, in a thin film magnetic head, since a magnetic film and a conductor coil forming a magnetic circuit portion are formed by a vacuum thin film forming technique, it is easy to make a fine dimension such as a narrow track or a narrow gap. In addition, it has a feature that high-resolution recording is possible, and it is attracting attention as a magnetic head compatible with high-density recording, and is actually used in video tape recorders, hard disk drive devices, and the like.
【０００３】通常、この種の薄膜磁気ヘッドにおいて
は、例えばＡｌ2 Ｏ3 −ＴｉＣ等からなる基板上に下層
磁性体を形成した後、この上に絶縁層を介して導体コイ
ルをスパイラル状に形成し、さらにこの上に絶縁層を介
して上層磁性体を積層して磁気回路部を構成してなって
いる。Usually, in a thin film magnetic head of this type, a lower layer magnetic material is formed on a substrate made of, for example, Al 2 O 3 --TiC, and then a conductor coil is spirally formed on the lower magnetic material via an insulating layer. Further, an upper layer magnetic body is further laminated on this via an insulating layer to form a magnetic circuit section.
【０００４】ところで、下層磁性体上に絶縁層を介して
導体コイルを形成したのでは、当該下層磁性体の膜厚分
の段差によって基板と下層磁性体との間に跨がって形成
される導体コイルが断線しやすい。このため、さらに従
来においては、基板上に形成した下層磁性体を埋め込む
ようにして基板上に平坦化用のＡｌ2Ｏ3 等よりなる絶
縁膜を成膜した後、これら下層磁性体と絶縁膜を共に機
械加工によって平面研磨し平坦化を図る手法が採られて
いる。このようにすれば、下層磁性体の表面がこの下磁
性体を取り囲んで設けられる絶縁膜の表面と面一とな
り、導体コイルが平坦面上に形成されることになる。By the way, when the conductor coil is formed on the lower magnetic body via the insulating layer, the conductor coil is formed so as to extend between the substrate and the lower magnetic body due to the step difference corresponding to the film thickness of the lower magnetic body. The conductor coil is easy to break. For this reason, further conventionally, an insulating film made of Al 2 O 3 or the like for flattening is formed on the substrate so as to embed the lower magnetic substance formed on the substrate, and then the lower magnetic substance and the insulating film are formed. A method is adopted in which both of them are machined to be planar-polished to achieve flatness. By doing so, the surface of the lower magnetic material is flush with the surface of the insulating film surrounding the lower magnetic material, and the conductor coil is formed on a flat surface.
【０００５】[0005]
【発明が解決しようとする課題】ところで、下層磁性体
の平坦化は、回転する錫や銅等の定盤の表面にダイヤモ
ンド砥粒を供給し、この定盤の表面に下層磁性体と絶縁
膜が形成されたウエハーを押し付けて平面研磨するポリ
ッシュ加工によって行われている。ところが、ダイヤモ
ンド砥粒による力学的除去効果を利用した機械加工のみ
では、硬度の高いＡｌ2 Ｏ3 （ビッカース硬度７００〜
８００）等よりなる絶縁膜に対して硬度の比較的低いＮ
ｉ−Ｆｅ（ビッカース硬度２００〜３００）等よりなる
下層磁性体がより多く削れてしまう。この結果、下層磁
性体と絶縁膜の境界部分に大きな段差、例えば１００〜
２００ｎｍ程度の段差が生じ、この上に形成される導体
コイルに亀裂が生じる等の事故が起こる虞れがある。By the way, in order to flatten the lower magnetic layer, diamond abrasive grains are supplied to the surface of a rotating platen such as tin or copper, and the lower magnetic layer and the insulating film are formed on the surface of the platen. It is carried out by a polishing process in which the wafer on which is formed is pressed and the surface is polished. However, Al 2 O 3 having a high hardness (Vickers hardness of 700 to
N), which has a relatively low hardness relative to the insulating film made of 800) or the like.
The lower layer magnetic body made of i-Fe (Vickers hardness 200 to 300) or the like is scraped more. As a result, a large step, for example 100 to 100, is formed at the boundary between the lower magnetic layer and the insulating film.
There is a risk that a step of about 200 nm will occur and an accident such as cracks in the conductor coil formed thereon will occur.
【０００６】そこで本発明は、上述の技術的な課題に鑑
みて提案されたものであって、下層磁性体と絶縁膜の段
差の少ない信頼性の高い薄膜磁気ヘッドを提供すること
を目的とする。さらに本発明は、下層磁性体と絶縁膜の
段差が低減できる薄膜磁気ヘッドの製造方法を提供する
ことを目的とする。Therefore, the present invention has been proposed in view of the above technical problems, and an object of the present invention is to provide a highly reliable thin film magnetic head having a small difference in level between the lower magnetic layer and the insulating film. .. Another object of the present invention is to provide a method of manufacturing a thin film magnetic head capable of reducing the step difference between the lower magnetic layer and the insulating film.
【０００７】[0007]
【課題を解決するための手段】上述の目的を達成するた
めに、本発明は、基板上に形成される下層磁性体が絶縁
膜により平坦化され、上記下層磁性体上に導体コイル及
び上層磁性体が形成されて磁気回路部が構成されてなる
薄膜磁気ヘッドにおいて、上記基板上の下層磁性体と絶
縁膜の段差が３０ｎｍ以下であることを特徴とするもの
である。In order to achieve the above-mentioned object, the present invention provides a lower layer magnetic body formed on a substrate with an insulating film for flattening, and a conductor coil and an upper layer magnetic body on the lower layer magnetic body. A thin-film magnetic head having a body formed to form a magnetic circuit section is characterized in that a step between the lower magnetic body on the substrate and the insulating film is 30 nm or less.
【０００８】一方、本発明の薄膜磁気ヘッドの製造方法
は、少なくとも基板上に形成した下層磁性体の外周囲に
絶縁膜を成膜した後、これら下層磁性体及び絶縁膜を機
械的に平面研磨し、次いでメカノケミカルポリッシュに
より研磨することを特徴とするものである。On the other hand, in the method of manufacturing a thin film magnetic head of the present invention, an insulating film is formed at least on the outer periphery of the lower magnetic body formed on the substrate, and then the lower magnetic body and the insulating film are mechanically planar-polished. And then polished with mechanochemical polish.
【０００９】[0009]
【作用】本発明にかかる薄膜磁気ヘッドにおいては、基
板上に形成される下層磁性体と絶縁膜の段差が３０ｎｍ
以下と極めて小さくされているので、この上に形成され
る導体コイルは上記段差によって断線するようなことが
ない。In the thin film magnetic head according to the present invention, the step difference between the lower magnetic layer and the insulating film formed on the substrate is 30 nm.
Since it is made extremely small as follows, the conductor coil formed thereon will not be disconnected due to the step.
【００１０】一方、本発明にかかる薄膜磁気ヘッドの製
造方法においては、先ず、基板上に形成した下層磁性体
と絶縁膜を機械的に平面研磨する。すると、この下層磁
性体と絶縁膜の境界部分に大きな段差が生ずる。そして
次に、弱アルカリ性の溶液中にダイヤモンド砥粒等を混
入した研磨液中で上記下層磁性体と絶縁膜を回転する定
盤に押し付けて研磨するメカノケミカルポリッシュを行
うと、上記弱アルカリ性の溶液による化学的除去効果に
より上記段差が小さなものとされる。On the other hand, in the method of manufacturing a thin film magnetic head according to the present invention, first, the lower magnetic body and the insulating film formed on the substrate are mechanically planar-polished. Then, a large step is generated at the boundary between the lower magnetic body and the insulating film. Then, when mechanochemical polishing is performed by polishing by pressing the lower magnetic material and the insulating film against a rotating platen in a polishing liquid in which diamond abrasive grains are mixed in a weakly alkaline solution, the weakly alkaline solution is obtained. The step is made small by the chemical removal effect of
【００１１】[0011]
【実施例】以下、本発明を適用した薄膜磁気ヘッド及び
その製造方法の具体的な実施例について図面を参照しな
がら詳細に説明する。なお本実施例では、薄膜磁気ヘッ
ドの具体的構造を明瞭なものとするために当該薄膜磁気
ヘッドの製造工程を順次追いながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments of a thin film magnetic head and a method of manufacturing the same according to the present invention will be described below in detail with reference to the drawings. In this embodiment, in order to clarify the specific structure of the thin film magnetic head, the manufacturing process of the thin film magnetic head will be sequentially described.
【００１２】薄膜磁気ヘッドを作製するには、先ず、図
１に示すように、Ａｌ2 Ｏ3 −ＴｉＣやチタン酸カリウ
ム等のセラミックス、結晶化ガラス、或いは非磁性のフ
ェライト等よりなる基板１上に所望形状の下層磁性体２
を形成する。なお、基板１にセラミックス等を用いた場
合には、その表面性を確保するために、当該基板１上に
Ａｌ2 Ｏ3 をスパッタリングした後、平面研磨してＡｌ
2 Ｏ3 層２を形成することが望ましい。In order to manufacture a thin film magnetic head, first, as shown in FIG. 1, a substrate 1 made of ceramics such as Al 2 O 3 -TiC or potassium titanate, crystallized glass, or non-magnetic ferrite is used. Lower magnetic layer 2 with desired shape
To form. When ceramics or the like is used for the substrate 1, Al 2 O 3 is sputtered on the substrate 1 in order to secure its surface property, and then flat-polished to form Al.
It is desirable to form the 2 O 3 layer 2.
【００１３】上記下層磁性体２は、例えばメッキ下地膜
を介してフレームメッキによって形成してもよく、或い
はスパッタリング等によって形成しても構わない。この
下層磁性体２には、高飽和磁束密度を有し且つ軟磁気特
性に優れた強磁性材料が用いられる。The lower magnetic body 2 may be formed by frame plating, for example, via a plating underlayer, or may be formed by sputtering or the like. For the lower magnetic body 2, a ferromagnetic material having a high saturation magnetic flux density and excellent soft magnetic characteristics is used.
【００１４】かかる強磁性材料としては、例えばＮｉ−
Ｆｅ系合金、Ｆｅ−Ａｌ系合金、Ｆｅ−Ａｌ−Ｓｉ系合
金、Ｆｅ−Ｓｉ−Ｃｏ系合金、Ｆｅ−Ａｌ−Ｇｅ系合
金、Ｆｅ−Ｇａ−Ｇｅ系合金、Ｆｅ−Ｓｉ−Ｇｅ系合
金、Ｆｅ−Ｃｏ−Ｓｉ−Ａｌ系合金等の強磁性金属材
料、或いはＦｅ−Ｇａ−Ｓｉ系合金、さらには上記Ｆｅ
−Ｇａ−Ｓｉ系合金の耐蝕性や耐摩耗性の一層の向上を
図るために、Ｆｅ，Ｇａ，Ｃｏ，（Ｆｅの一部をＣｏで
置換したものを含む。），Ｓｉを基本組成とする合金
に、Ｔｉ，Ｃｒ，Ｍｎ，Ｚｒ，Ｎｂ，Ｍｏ，Ｔａ，Ｗ，
Ｒｕ，Ｏｓ，Ｒｈ，Ｉｒ，Ｒｅ，Ｎｉ，Ｐｂ，Ｐｔ，Ｈ
ｆ，Ｖの少なくとも一種を添加したものであってもよ
い。特に、フレームメッキによって下層磁性体２を形成
する場合には、磁区のコントロールが容易な材料、例え
ばＮｉ−Ｆｅ系合金を使用することが望ましい。As such a ferromagnetic material, for example, Ni-
Fe-based alloy, Fe-Al-based alloy, Fe-Al-Si-based alloy, Fe-Si-Co-based alloy, Fe-Al-Ge-based alloy, Fe-Ga-Ge-based alloy, Fe-Si-Ge-based alloy, Ferromagnetic metal materials such as Fe-Co-Si-Al alloys, Fe-Ga-Si alloys, and Fe.
In order to further improve the corrosion resistance and wear resistance of the —Ga—Si alloy, Fe, Ga, Co, (including a part of Fe replaced by Co), and Si are used as the basic composition. Ti, Cr, Mn, Zr, Nb, Mo, Ta, W,
Ru, Os, Rh, Ir, Re, Ni, Pb, Pt, H
At least one of f and V may be added. In particular, when the lower magnetic layer 2 is formed by frame plating, it is desirable to use a material whose magnetic domain can be easily controlled, for example, a Ni—Fe alloy.
【００１５】次に、図２及び図３に示すように、上記下
層磁性体２を覆って当該下層磁性体２の膜厚より厚くな
るように平坦化のためのＡｌ2 Ｏ3 よりなる絶縁膜３を
基板１全面に亘って形成する。次いで、上記下層磁性体
２及び絶縁膜３を機械的手段によって平面研磨する。こ
こでの平面研磨は、例えば錫や銅等の円盤状の定盤の表
面にダイヤモンド砥粒を供給し、この定盤の表面に下層
磁性体と絶縁膜が形成された基板１を押し付けて当該定
盤を回転させることによって平面研磨するポリッシュ加
工による。Next, as shown in FIGS. 2 and 3, an insulating film made of Al 2 O 3 for flattening so as to cover the lower magnetic body 2 so that the thickness is larger than that of the lower magnetic body 2. 3 is formed over the entire surface of the substrate 1. Next, the lower magnetic body 2 and the insulating film 3 are surface-polished by a mechanical means. In the planar polishing here, for example, diamond abrasive grains are supplied to the surface of a disk-shaped surface plate made of tin, copper or the like, and the surface 1 of the surface plate is pressed against the substrate 1 on which the lower magnetic material and the insulating film are formed, Polished by polishing the surface by rotating the surface plate.
【００１６】この方法によれば、ダイヤモンド砥粒によ
る被削物の力学的除去効果により下層磁性体２と絶縁膜
３を削り取ることができる。しかしながら、力学的加工
によるため、下層磁性体２と絶縁膜３の硬度差により軟
らかい下層磁性体２のみがより多く削られ、図４に示す
ようにこれらの境界部に１００〜２００ｎｍ程度の大き
な段差が生ずる。According to this method, the lower magnetic layer 2 and the insulating film 3 can be scraped off due to the mechanical removal effect of the work piece by the diamond abrasive grains. However, because of the mechanical processing, only the soft lower magnetic layer 2 is more ablated due to the difference in hardness between the lower magnetic layer 2 and the insulating film 3, and as shown in FIG. Occurs.
【００１７】そこで、本実施例では、上記下層磁性体２
と絶縁膜３との境界部分に生じた段差を少なくするため
に、化学的加工を取り入れたメカノケミカルポリッシュ
加工によって行う。メカノケミカルポリッシュ加工と
は、例えば図５に示すように、錫等の金属を樹脂で固め
た高分子樹脂等からなる円盤状の研磨定盤４をアルミニ
ウム等よりなる槽５の中に設置し、この槽５内に弱アル
カリ性（ＰＨ９〜１０程度）の溶液中にアルミナやシリ
カ或いはダイヤモンド等の砥粒を適切な量加えた研磨液
６を溜め、その中で支持シャフト７の先端部に取付けら
れた基板保持部材８に上記基板２を保持させて、研磨定
盤４を回転させながら液中ポリッシュを行う方法であ
る。なお、弱アルカリ性溶液中に加える砥粒の粒径とし
ては、下層磁性体２の材料にもよるが、例えば０．０１
〜０．５μｍ程度のものが望ましい。Therefore, in this embodiment, the lower magnetic layer 2 is formed.
In order to reduce the step generated at the boundary between the insulating film 3 and the insulating film 3, a mechanochemical polishing process incorporating a chemical process is performed. Mechanochemical polishing is, for example, as shown in FIG. 5, a disk-shaped polishing platen 4 made of a polymer resin obtained by hardening a metal such as tin with a resin is placed in a tank 5 made of aluminum or the like, In this tank 5, a polishing solution 6 prepared by adding an appropriate amount of abrasive grains such as alumina, silica, or diamond to a weakly alkaline (pH 9 to 10) solution is stored, and is attached to the tip of the support shaft 7 therein. In this method, the substrate 2 is held by the substrate holding member 8 and polishing is performed in the liquid while rotating the polishing platen 4. The grain size of the abrasive grains added to the weak alkaline solution depends on the material of the lower magnetic body 2, but is 0.01
It is preferably about 0.5 μm.
【００１８】このメカノケミカルポリッシュ加工によれ
ば、弱アルカリ性の溶液によって硬度の高い絶縁膜３が
化学的に研磨され、アルミナやシリカ或いはダイヤモン
ド等の砥粒によって硬度の比較的低い下層磁性体２が力
学的に研磨されることになる。なお、弱アルカリ性溶液
によっては、パーマロイ等よりなる下層磁性体２は研磨
されない。したがって、メカノケミカルポリッシュ加工
では、硬度差のある材料に応じて弱アルカリ性溶液のＰ
Ｈを変化させることによって化学的研磨速度と、砥粒量
の増減によって力学的研磨速度のレートを同一のものと
することができる。また、メカノケミカルポリッシュ加
工では、研磨液６が随時加工界面に存在するため、下層
磁性体２及び絶縁膜３が直接研磨定盤４と接触せず、高
精度な表面粗さ（Ｒａ≦１ｎｍ）及び平坦度が得られ
る。According to this mechanochemical polishing process, the insulating film 3 having a high hardness is chemically polished by the weakly alkaline solution, and the lower magnetic layer 2 having a relatively low hardness is removed by the abrasive grains such as alumina, silica or diamond. It will be mechanically polished. Note that the lower magnetic layer 2 made of permalloy or the like is not polished by the weakly alkaline solution. Therefore, in the mechanochemical polishing process, P of weakly alkaline solution is used depending on the materials having different hardness.
By changing H, the chemical polishing rate and the mechanical polishing rate can be made the same by increasing or decreasing the amount of abrasive grains. Further, in the mechanochemical polishing process, since the polishing liquid 6 is always present at the processing interface, the lower magnetic body 2 and the insulating film 3 do not come into direct contact with the polishing platen 4 and highly accurate surface roughness (Ra ≦ 1 nm). And flatness are obtained.
【００１９】ここで、実際に高分子樹脂系の研磨定盤４
を用いて弱アルカリ性溶液中に粒径０．０５μｍのアル
ミナ砥粒を加えた研磨液６中で上記基板１をメカノケミ
カルポリッシュした。この結果、下層磁性体２と絶縁膜
３の表面状態を拡大して見ると、図６に示すように、こ
れら境界部分の段差が極めて少ないことがわかる。実際
の段差は、図７に示すように、１２．９ｎｍであった。Here, the polishing platen 4 of a polymer resin type is actually used.
The substrate 1 was mechanochemically polished in a polishing liquid 6 prepared by adding alumina abrasive grains having a particle diameter of 0.05 μm to a weak alkaline solution. As a result, when the surface states of the lower magnetic body 2 and the insulating film 3 are enlarged and seen, as shown in FIG. 6, it can be seen that the level difference between these boundary portions is extremely small. The actual step difference was 12.9 nm as shown in FIG. 7.
【００２０】これに対して、機械的手段のみによって研
磨を行った場合には、図１０に示すように下層磁性体２
と絶縁膜３との境界部分の段差が極めて大きく、このと
きの段差は図１１に示すように１６３ｎｍであった。On the other hand, when the polishing is carried out only by the mechanical means, as shown in FIG.
The difference in level between the insulating film 3 and the insulating film 3 was extremely large, and the level difference at this time was 163 nm as shown in FIG.
【００２１】次に、図８に示すように、下層磁性体２と
絶縁膜３が平坦化された平坦面上に電気的絶縁を取るた
めの絶縁層（図示は省略する。）を形成した後、導体コ
イル９をスパイラル状に形成する。このとき、導体コイ
ル９は、図９に示すように平坦化された平坦面上に形成
されるので、下層磁性体２と絶縁膜３の境界部分上に形
成される導体部に亀裂等が生ずることはない。したがっ
て、ハイピッチパターンとした高精度な導体コイル９を
形成することができ、ショート等の事故を未然に回避す
ることができる。Next, as shown in FIG. 8, after forming an insulating layer (not shown) for electrical insulation on the flattened flat surface of the lower magnetic body 2 and the insulating film 3. The conductor coil 9 is formed in a spiral shape. At this time, since the conductor coil 9 is formed on the flattened flat surface as shown in FIG. 9, a crack or the like occurs in the conductor portion formed on the boundary portion between the lower magnetic body 2 and the insulating film 3. There is no such thing. Therefore, the highly accurate conductor coil 9 having a high pitch pattern can be formed, and an accident such as a short circuit can be avoided.
【００２２】そして、以後は通常の工程に基づいて上層
磁性体（図示は省略する。）を積層して磁気回路部を形
成し、作動ギャップとして機能する磁気ギャップを構成
する。なお、必要に応じてこの磁気回路部を覆って保護
膜層を形成して薄膜磁気ヘッドを完成する。Then, thereafter, an upper magnetic body (not shown) is laminated on the basis of a normal process to form a magnetic circuit portion to form a magnetic gap functioning as an operating gap. If necessary, a protective film layer is formed to cover the magnetic circuit section to complete the thin film magnetic head.
【００２３】このようにして作製された薄膜磁気ヘッド
は、下層磁性体２と絶縁膜３との境界部分の段差が極め
て小さいので、この平坦面上に順次積層される導体コイ
ル９や上層磁性体等を高精度に形成することができ、電
磁変換特性の面で優れたものとなる。特に、下層磁性体
２と絶縁膜３との段差が３０ｎｍ以下であれば、導体コ
イル９に亀裂等が生じることがなく、ショート等の事故
を未然に防止することができる。なお、上記段差が３０
ｎｍを越えると、この段差部分上に形成される導体コイ
ルに亀裂等が生ずる。In the thin-film magnetic head thus manufactured, the level difference at the boundary between the lower magnetic body 2 and the insulating film 3 is extremely small. Therefore, the conductor coil 9 and the upper magnetic body sequentially laminated on this flat surface. Etc. can be formed with high precision, and the electromagnetic conversion characteristics are excellent. In particular, if the level difference between the lower magnetic body 2 and the insulating film 3 is 30 nm or less, cracks or the like do not occur in the conductor coil 9, and an accident such as a short circuit can be prevented in advance. The step is 30
When it exceeds nm, cracks or the like occur in the conductor coil formed on the step portion.
【００２４】[0024]
【発明の効果】以上の説明からも明らかなように、本発
明の薄膜磁気ヘッドによれば、基板上に形成される下層
磁性体と絶縁膜の段差が３０ｎｍ以下と極めて小さくさ
れているので、この上に形成される導体コイルには亀裂
等が入ることがない。したがって、ショート等の事故を
未然に回避することのできる信頼性の高い薄膜磁気ヘッ
ドを提供できる。As is clear from the above description, according to the thin film magnetic head of the present invention, the step difference between the lower magnetic material and the insulating film formed on the substrate is 30 nm or less, which is extremely small. The conductor coil formed on this will not be cracked or the like. Therefore, it is possible to provide a highly reliable thin film magnetic head capable of avoiding an accident such as a short circuit.
【００２５】また、本発明の薄膜磁気ヘッドの製造方法
によれば、機械的加工による平面研磨後、メカノケミカ
ルポリッシュ加工によって平面研磨を行うので、弱アル
カリ性溶液による化学的除去効果によって下層磁性体と
絶縁膜との段差を極めて小さなものとすることができ
る。Further, according to the method of manufacturing a thin film magnetic head of the present invention, after the surface is polished by mechanical processing, the surface is polished by mechanochemical polishing, so that the lower layer magnetic material is removed by the chemical removal effect of the weak alkaline solution. The step with the insulating film can be made extremely small.
【図１】本発明を適用した薄膜磁気ヘッドの製造工程を
順次示すもので、下層磁性体形成工程を示す斜視図であ
る。FIG. 1 is a perspective view showing a manufacturing process of a thin film magnetic head to which the present invention is applied in sequence, showing a lower magnetic body forming process.
【図２】絶縁膜形成工程を示す斜視図である。FIG. 2 is a perspective view showing an insulating film forming step.
【図３】図２のＡ−Ａ線における断面図である。3 is a cross-sectional view taken along the line AA of FIG.
【図４】機械的加工による平面研磨工程を示す断面図で
ある。FIG. 4 is a cross-sectional view showing a plane polishing step by mechanical processing.
【図５】メカノケミカルポリッシュ加工工程を示す断面
図である。FIG. 5 is a cross-sectional view showing a mechanochemical polishing processing step.
【図６】メカノケミカルポリッシュ加工後の下層磁性体
及び絶縁膜の表面を拡大して示す図である。FIG. 6 is an enlarged view showing surfaces of a lower magnetic body and an insulating film after mechanochemical polishing.
【図７】メカノケミカルポリッシュ加工後の表面段差寸
法を示す分布図である。FIG. 7 is a distribution diagram showing the surface step size after mechanochemical polishing.
【図８】導体コイル形成工程を示す斜視図である。FIG. 8 is a perspective view showing a conductor coil forming step.
【図９】図８のＢ−Ｂ線における断面図である。9 is a cross-sectional view taken along the line BB of FIG.
【図１０】機械的加工による平面研磨加工後の下層磁性
体及び絶縁膜の表面を拡大して示す図である。FIG. 10 is an enlarged view showing the surfaces of a lower magnetic body and an insulating film after planar polishing by mechanical processing.
【図１１】機械的加工による平面研磨加工後の表面段差
寸法を示す分布図である。FIG. 11 is a distribution diagram showing the surface step size after planar polishing by mechanical processing.
１・・・基板 ２・・・下層磁性体 ３・・・絶縁膜 ４・・・研磨定盤 ６・・・研磨液 ９・・・導体コイル 1 ... Substrate 2 ... Lower magnetic material 3 ... Insulating film 4 ... Polishing surface plate 6 ... Polishing liquid 9 ... Conductor coil
Claims (2)
により平坦化され、上記下層磁性体上に導体コイル及び
上層磁性体が形成されて磁気回路部が構成されてなる薄
膜磁気ヘッドにおいて、 上記基板上の下層磁性体と絶縁膜の段差が３０ｎｍ以下
であることを特徴とする薄膜磁気ヘッド。1. A thin film magnetic head comprising a lower layer magnetic body formed on a substrate, flattened by an insulating film, a conductor coil and an upper layer magnetic body formed on the lower layer magnetic body to form a magnetic circuit section. A thin film magnetic head characterized in that the step difference between the lower magnetic material and the insulating film on the substrate is 30 nm or less.
の外周囲に絶縁膜を成膜した後、これら下層磁性体及び
絶縁膜を機械的に平面研磨し、次いでメカノケミカルポ
リッシュにより研磨することを特徴とする薄膜磁気ヘッ
ドの製造方法。2. An insulating film is formed on at least the outer periphery of a lower magnetic body formed on a substrate, the lower magnetic body and the insulating film are mechanically planar-polished, and then polished by mechanochemical polishing. A method of manufacturing a thin film magnetic head having the characteristics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27048091A JPH0581613A (en) | 1991-09-24 | 1991-09-24 | Thin film magnetic head and production thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27048091A JPH0581613A (en) | 1991-09-24 | 1991-09-24 | Thin film magnetic head and production thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0581613A true JPH0581613A (en) | 1993-04-02 |
Family
ID=17486888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27048091A Pending JPH0581613A (en) | 1991-09-24 | 1991-09-24 | Thin film magnetic head and production thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0581613A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5872693A (en) * | 1993-08-10 | 1999-02-16 | Kabushiki Kaisha Toshiba | Thin-film magnetic head having a portion of the upper magnetic core coplanar with a portion of the lower magnetic core |
| US6198597B1 (en) | 1993-08-10 | 2001-03-06 | Kabushiki Kaisha Toshiba | Thin-film magnetic head having improved magnetic pole structure |
| US6554878B1 (en) | 1999-06-14 | 2003-04-29 | International Business Machines Corporation | Slurry for multi-material chemical mechanical polishing |
-
1991
- 1991-09-24 JP JP27048091A patent/JPH0581613A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5872693A (en) * | 1993-08-10 | 1999-02-16 | Kabushiki Kaisha Toshiba | Thin-film magnetic head having a portion of the upper magnetic core coplanar with a portion of the lower magnetic core |
| US6198597B1 (en) | 1993-08-10 | 2001-03-06 | Kabushiki Kaisha Toshiba | Thin-film magnetic head having improved magnetic pole structure |
| US6554878B1 (en) | 1999-06-14 | 2003-04-29 | International Business Machines Corporation | Slurry for multi-material chemical mechanical polishing |
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