JPH0580001U - High frequency bandpass filter - Google Patents

Abstract

(57) [Abstract] [Purpose] It is an object of the present invention to provide a high-frequency bandpass filter that is easy to assemble and process, easy to adjust, and highly reliable. [Structure] A plate 11 in which a resonator, a screw hole for position adjustment, a screw hole for mounting a connector, and a signal extraction hole are integrally formed.
And two lids 20 and 21 for sandwiching the plate 11.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a high frequency band pass filter, and more particularly, to a structure of a high frequency band pass filter.

[0002]

[Prior Art]

 FIG. 7 is a partially broken configuration diagram of a combline type bandpass filter which is a conventional high frequency bandpass filter. In the figure, 1 is a connector, 2 is a thin metal plate impedance converter, 3 is a thin metal plate resonator, and 4 is a screw for finely adjusting the resonator 3.

The impedance converter 2 and the resonator 3 are sandwiched by the lids 7 and 8 via the spacers 5 and 6, and are integrated.

[0004]

[Problems to be solved by the device]

 However, the above configuration has the following problems. The connector 1 and the screw 4 must be formed after brazing the lid 7, the spacer 5, the impedance converter 2, the resonator 3, the spacer 6 and the lid 8, respectively, and the assembly and processing are complicated and difficult. ..

Since the resonator 3 is a thin metal plate, when the screw 4 is rotated to perform the adjustment, the resonator 3 may be deformed, and a skill is required for the adjustment. The impedance converter 2 and the resonator 3 require highly accurate position adjustment, which requires man-hours.

The vicinity of the orthogonal plane (the portion A in FIG. 7) formed by the spacers 5 and 6 and the lids 7 and 8 is a portion where the electric field is concentrated. The pass band loss of the pass filter deteriorates.

The present invention has been made in view of the above problems, and an object thereof is to provide a high-frequency bandpass filter that is easy to assemble and process, easy to adjust, and highly reliable.

[0008]

[Means for Solving the Problems]

 The invention according to claim 1 for solving the above-mentioned problems is a plate integrally formed with a resonator, a position adjusting screw hole, a connector attaching screw hole and a signal extracting hole, and two plates for sandwiching the plate. And a lid.

Next, the invention according to claim 2 sandwiches the plate with a plate integrally formed with a resonator, an impedance converter, a screw hole for position adjustment, a screw hole for attaching a connector and a hole for extracting a signal. It is provided with two lids.

[0010]

[Action]

 In the high frequency bandpass filter according to the first aspect of the invention, the resonator, the position adjusting screw hole, and the connector mounting hole are integrally formed in the plate, so that assembly and processing are easy, adjustment is easy, and reliability is high. It is highly likely.

In the high frequency bandpass filter according to the second aspect of the present invention, the resonator, the impedance converter, the screw hole for position adjustment, and the connector mounting hole are integrally formed on the plate, so that assembly and processing are easy. It is easy to adjust and has high reliability.

[0012]

【Example】

 Next, an embodiment of the present invention will be described with reference to the drawings. 1 is a partially cutaway configuration diagram for explaining a first embodiment of the present invention, FIG. 2 is a plan view of a plate in FIG. 1, FIG. 3 is a plan view of a lid in FIG. 1, and FIG. 4 is a right side view in FIG. 5 is a block diagram for explaining a second embodiment of the present invention, and FIG. 6 is a block diagram for explaining a third embodiment of the present invention.

First, a first embodiment of the present invention will be described with reference to FIGS. 1 to 4. In these figures, 11 is a plate. On one long side of this plate 11, a resonance part 12 whose length is set so as to resonate at a predetermined frequency is formed, and on the other surface, an impedance conversion part 13 is formed. A position adjusting screw hole 14 into which a screw for finely adjusting the resonance part 12 is screwed is formed on one side, and a connector mounting screw hole 15 and a connector signal extracting hole 16 are formed on the other long side. There is. Here, in order to obtain an appropriate coupling coefficient for the distance between the resonance part 12 and the impedance conversion part 13, in this embodiment, a high-precision processing machine such as a wire processing machine or a laser processing machine is used. It was processed.

Reference numeral 17 denotes a connector which is mounted in the connector mounting screw hole 15 by using a screw 18. Further, a screw 19 for adjusting an electric capacity between the resonance portion 12 and the screw hole 14 is screwed into the position adjusting screw hole 14.

The plate 11 is sandwiched between the two lids 20 and 21, assembled by brazing, screws, etc., and the lids 20 and 21 are electrically connected. As shown in FIGS. 3 and 4, the lids 20 and 21 are provided with recesses 20a and 21a using a milling cutter, an end mill, or the like in order to secure a space.

Next, the operation of the above configuration will be described. The electrical signal input from one connector 17 propagates through the electrically connected plate 11 and is transmitted to the other connector 17 to obtain a characteristic as a bandpass filter.

According to the above configuration, the assembly is completed by stacking the plate 11 and the lids 20 and 21 and screwing or brazing, so that the assembly is easier than in the past. Since the resonance part 12 is formed as a thick plate on the plate 11, the resonance part 12 does not deform even when the screw 19 is turned.

Since the resonance part 12 and the impedance conversion part 13 perform processing on the same plate 11 using a high-precision processing machine such as a wire processing machine or a laser processing machine, high accuracy can be easily obtained. In addition, it requires less man-hours.

By forming the recesses 20a and 21a in the lids 20 and 21, it is not necessary to perform brazing with resistance at the corners, so that the pass band loss of the band pass filter is not deteriorated.

Next, a second embodiment of the present invention will be described with reference to FIG. In this embodiment, only the plate is different from the first embodiment, and the description of other parts will be omitted. The plate 31 has a resonance part 32 formed on one long side and a position adjusting screw hole 34 formed on the other long side to which a screw for finely adjusting the resonance part 32 is screwed. A screw hole 35 for mounting a connector and a hole 36 for extracting a signal of the connector are formed on the side.

According to the above configuration, a high-frequency bandpass filter that is easy to assemble and process, easy to adjust, and highly reliable can be obtained as in the first embodiment. Next, a third embodiment of the present invention will be described with reference to FIG. Incidentally, also in this embodiment, since the only part different from the first embodiment is the plate, the description of the other parts will be omitted.

Resonant parts 42 are alternately formed on both long sides of the plate 41, and an impedance conversion part 43 is formed on one long side so as to sandwich these resonant parts 42.

Further, a position adjusting screw hole 44 into which a screw for finely adjusting the resonance portion 42 is screwed is provided on both long sides, and a connector mounting screw hole 45 and a signal of the connector are provided on the other long side. An extraction hole 46 is formed. Here, in order to obtain an appropriate coupling coefficient between the resonance part 42 and the impedance conversion part 43, in this embodiment, a high-precision processing machine such as a wire processing machine or a laser processing machine is used. It was processed.

According to the above configuration, a high-frequency bandpass filter that is easy to assemble and process, easy to adjust, and highly reliable can be obtained as in the first embodiment.

[0025]

[Effect of the device]

 As described above, according to the present invention, it is possible to provide a high-frequency bandpass filter that is easy to assemble and process, easy to adjust, and highly reliable.

[Brief description of drawings]

FIG. 1 is a partially cutaway configuration diagram illustrating a first embodiment of the present invention.

2 is a plan view of the plate in FIG. 1. FIG.

3 is a plan view of the lid in FIG. 1. FIG.

FIG. 4 is a right side view of FIG.

FIG. 5 is a configuration diagram illustrating a second embodiment of the present invention.

FIG. 6 is a configuration diagram illustrating a third embodiment of the present invention.

FIG. 7 is a partially cutaway configuration diagram of a combline type bandpass filter which is a conventional high frequency bandpass filter.

[Explanation of symbols]

 11, 31, 41 Plate 12, 32, 42 Resonance part 13, 43 Impedance conversion part 14, 34, 44 Position adjustment screw hole 15, 35 Connector mounting screw hole 16, 36 Signal extraction hole 20, 21 Lid 20a, 21a recess

Claims (2)

[Scope of utility model registration request] 1. A plate (11) integrally formed with a resonator, a position adjusting screw hole, a connector mounting screw hole, and a signal extracting hole, and two lids (20, 20) sandwiching the plate (11). 21)
And a high-frequency bandpass filter comprising: 2. A plate comprising a resonator, an impedance converter, a screw hole for position adjustment, a screw hole for mounting a connector, and a hole for extracting a signal, and two lids for sandwiching the plate. A high-frequency bandpass filter characterized in that