JPH0518105U - Card type band pass filter - Google Patents

Abstract

(57) [Summary] (Modified) [Purpose] Easy to process with a laser beam machine, etc., eliminating the need for position adjustment between the impedance converter and resonator during assembly, deterioration of the connection surface, dielectric loss and insulation. It is to realize a band-pass filter that improves the problem of resistance. [Structure] A module 102 in which an impedance converter 7, a resonator 8 and a lead-out line 9 for input / output signals are integrally formed from a thin metal plate, a lid 100 and a spacer 101 are formed,
The module 102 is sandwiched between the two sets of spacers 101, and the module 102 and the two sets of spacers 101 are sandwiched between the two lids 100, and the components are joined so as to make electrical contact.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a bandpass filter, and in particular, the resonator, the impedance converter, and the lead-out line of the input / output signal of the resonator or the impedance converter are integrally formed with a thin metal plate to improve workability, assemblability, and reliability. Related to filters that have made it possible to improve

[0002]

[Prior Art]

 FIG. 7 shows a conventional comb bandpass filter. FIG. 7A is a plan view and FIG. 7B is a sectional view taken along line A-A ′. Reference numeral 1 is a connector, 2 is a metal case for fixing the connector 1, 3 is an impedance converter for connecting with the center conductor of the connector 1, 4 is a resonator, 4 is a resonator, and 5 and 6 are These are an adjustment screw and a fine adjustment metal block for adjusting the characteristics of the bandpass filter by changing the capacitance between the resonator 4 and the metal case 2, respectively.

[0003]

[Problems to be solved by the device]

 In the configuration as shown in FIG. 7, the metal case 2 has to be machined in a complicated manner because the metal block has to be ground with a milling cutter or the like to form a square hole for embedding the impedance converter 3 and the resonator 4. At the time of assembly, it is necessary to embed the impedance converter 3 and the resonator 4 one by one in the square holes so that the lengths are as designed and further connect the core conductor of the connector 1 to the impedance converter 3. It is not easy to do, and this has the drawback of increasing the price. In addition, there is a problem of deterioration of the connection surface due to connecting the lead wire of the input / output signal to the impedance converter 3 with solder or the like, and when the lead wire is held by using a dielectric, dielectric loss is caused. There are also problems such as the occurrence of heat generation and the insulation resistance cannot be increased.

Therefore, an object of the present invention is that it can be easily processed by a laser beam machine or the like, does not require position adjustment between the impedance converter and the resonator at the time of assembly, and can reduce connection surface deterioration, dielectric loss and insulation resistance. It is to realize a bandpass filter that improves the problem.

[0005]

[Means for Solving the Problems]

 In order to achieve such an object, in the present invention, a module in which an impedance converter, a resonator and lead lines for input / output signals are integrally molded from a thin metal plate, a lid and a spacer are formed, and two modules are provided as spacers. Scissors, and the module and two spacers are sandwiched between two lids, and joined so that electrical contact is made between the respective parts.

[0006]

[Action]

 By making the module, lid and spacer from a thin metal plate, processing becomes easier, and since the impedance converter, resonator and lead wire for input / output signals are integrated, there is no problem of deterioration of the connection surface, The position adjustment between the impedance converter and the resonator becomes unnecessary. In addition, since the space between the I / O signal lead-out line and the ground plane that surrounds the lead-out line is filled with air, the insulation resistance can be increased compared to the configuration in which the lead-out line is held using a dielectric. Also, the dielectric loss can be reduced.

[0007]

【Example】

 Hereinafter, the present invention will be described in detail with reference to the drawings. 1 and 2 are a structural view and a sectional view showing a first embodiment of a bandpass filter according to the present invention. In FIGS. 1 (a), (b) and (c), reference numerals 100, 101 and 102 denote bands. Reference numeral 100 is a lid, 101 is a spacer, and 102 is a module in which an impedance converter, a resonator and lead lines for input / output signals are integrally formed. In the module 102, 7 is an impedance converter, 8 is a resonator, 9 is a lead wire for input / output signals, 10 is a groove indicating a fine adjustment screw hole opening position, 11 is a groove indicating a connector mounting hole opening position, and 12 is an assembly. It is a hole for positioning each part at the time. Further, in the lid 100, 13 is a screw hole for adjusting screw for matching the connector and the impedance converter.

2A and 2B are cross-sectional views taken along line BB ′ and CC ′ of FIG. 1C when the parts 100, 101 and 102 shown in FIG. 1 are assembled. Is. In FIG. 2 (a), the parts 100, 101, 102 are joined by welding, brazing, or a conductive adhesive 14 so as to make electrical contact with each other, and plating 15 is applied to reduce the electric resistance. .. In FIG. 2B, the lead-out line 9 for the input / output signal has a structure that floats from between the ground planes surrounding it.

FIG. 3A is a fine adjustment for adjusting the characteristics of the bandpass filter by changing the capacitance between the connector 17, the resonator 8 and the ground in the bandpass filter 200 composed of the components of FIG. The screws 18 are attached to the side walls of the bandpass filter 200 on the open end side of the resonator 8, respectively. Further, the matching screw 16 for matching the connector 17 and the impedance converter 7 by changing the capacity between the impedance converter 7 and the ground is located right above the position where the impedance converter 7 and the lead wire 9 intersect. It is a top view which shows the 1st Example completed by attaching to the lid 100 of FIG. FIG. 3B is a sectional view taken along the line D-D ′ of FIG. Reference numeral 19 denotes a central conductor of the connector 17, which is electrically connected by pressure by fitting the lead-out line 9 for input / output signals into the central conductor 19.

FIG. 4A shows a second embodiment in which a microstrip line 20 is attached instead of the connector 17 shown in the plan view of FIG. 3A. In FIG. 4B, which is a cross-sectional view taken along the line E-E ′ of FIG. 4A, 21 is brazing, 22 is a line portion of the microstrip line 20, 23 is the same substrate, and 24 is the same ground plane. In this case, the lead-out line 9 for the input / output signal and the line portion 22 are electrically connected by brazing 21 as shown in FIG. Further, as a difference in the structure of the module, FIG. 5 shows a third embodiment of a comb-type bandpass filter module in which the impedance converter 7 is not used, which is composed only of the resonator 8a and the lead wire 9a. In this case, the size can be reduced because the impedance converter 7 is not used. FIG. 6 shows a fourth embodiment of an interdigital bandpass filter module, which is composed of an impedance converter 7a, a resonator 8b and a lead wire 9b, and produces a bandpass filter other than the comb bandpass filter shown above. Is also possible.

[0011]

[Effect of the device]

 As is clear from the above description, the present invention has the following effects. Since the parts that compose the filter are made of thin metal plates, they can be easily processed by laser processing machines, press machines, castings, etc. By integrating the impedance converter, the resonator, and the input / output signal lead wires, it is not necessary to adjust the position between the impedance converter and the resonator during assembly, and the impedance converter and the input / output signal lead wires can be connected. Since it is unnecessary, the problem of deterioration of the connection surface has disappeared. This improved the reliability of the filter. Furthermore, since the space between the I / O signal lead-out line and the ground plane that surrounds the lead-out line is filled with air, the insulation resistance is higher than in the configuration in which the lead-out line is held using a dielectric. Also, the dielectric loss can be reduced. Further, the processability and the assemblability are improved, so that the cost can be reduced.

[Brief description of drawings]

FIG. 1 is a plan view showing components of a first embodiment of a bandpass filter according to the present invention.

FIG. 2 is a sectional view showing a first embodiment of the bandpass filter.

FIG. 3 is a plan view showing a first embodiment of the bandpass filter.

FIG. 4 is a plan view showing a second embodiment of the bandpass filter.

FIG. 5 is a plan view showing a third embodiment of the bandpass filter.

FIG. 6 is a plan view showing a fourth embodiment of the bandpass filter.

FIG. 7 is a plan view showing the structure of a conventional comb bandpass filter.

[Explanation of symbols]

 1,17 Connector 2 Case 3,7 Impedance converter 4,8 Resonator 5 Adjustment screw 6,18 Fine adjustment screw 9 Input / output signal lead wire 10 Fine adjustment screw hole opening position groove 11 Connector mounting hole opening position Groove 12 Alignment hole 13 Alignment screw hole 14 Adhesive 15 Plating 16 Alignment screw 19 Center conductor 20 Microstrip line 21 Brazing 22 Line part 23 Substrate 24 Ground plane 100 Lid 101 Spacer 102 Module 200 Bandpass filter

Claims (1)

[Scope of utility model registration request] 1. A module in which a resonator and a lead-out line for input / output signals are integrally formed by using a thin metal plate, a lid made by using the thin metal plate, and the lid and the module made by using the thin metal plate are separated from each other. A bandpass filter comprising a spacer.