JPH0576170B2 - - Google Patents
Info
- Publication number
- JPH0576170B2 JPH0576170B2 JP62276379A JP27637987A JPH0576170B2 JP H0576170 B2 JPH0576170 B2 JP H0576170B2 JP 62276379 A JP62276379 A JP 62276379A JP 27637987 A JP27637987 A JP 27637987A JP H0576170 B2 JPH0576170 B2 JP H0576170B2
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- fuse wire
- lead terminal
- insulating resin
- capacitor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003990 capacitor Substances 0.000 claims description 49
- 229920005989 resin Polymers 0.000 claims description 35
- 239000011347 resin Substances 0.000 claims description 35
- 239000007787 solid Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 238000007664 blowing Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Fuses (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はヒユーズ付きチツプ状固体電解コンデ
ンサおよびその製造方法に関し、特にヒユーズ接
続部の構造及び製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a chip-shaped solid electrolytic capacitor with a fuse and a method of manufacturing the same, and particularly to a structure of a fuse connection portion and a method of manufacturing the same.
従来タンタル（Ta）、ニオブ（Nb）、アルミニ
ウム（Al）等の弁作用を有する固体電解コンデ
ンサは種々の電子回路に使用されており、故障率
が小さいことが利点とされているが、一旦故障が
発生した場合のの故障モードは短絡故障が多く、
大きな短絡電流が流れるため、コンデンサ素子が
発熱し、遂には焼損に至ることがある。このよう
な過度の短絡故障による故障発生の際は、他の回
路構成素子を保護するため、故障モードを短絡か
ら開放にする必要がある。この対策としては、一
般にヒユーズが用いられており、従来の技術とし
ては実開昭53−157847号、実開昭59−119029号等
がある。
Traditionally, solid electrolytic capacitors with valve action such as tantalum (Ta), niobium (Nb), and aluminum (Al) have been used in various electronic circuits, and have the advantage of having a low failure rate. When this occurs, the failure mode is often short-circuit failure.
Because a large short-circuit current flows, the capacitor element generates heat, which may eventually lead to burnout. When a failure occurs due to such an excessive short circuit failure, it is necessary to change the failure mode from short circuit to protect other circuit components. As a countermeasure against this, a fuse is generally used, and conventional techniques include Utility Model Application No. 53-157847 and Utility Model Application No. 59-119029.
実開昭53−157847号に開示されているヒユーズ
付き固体電解コンデンサは、第４図に示すよう
に、陰極リード端子５をコンデンサ素子１に絶縁
性の接着剤９により固定し、その陰極リード端子
５とコンデンサ素子１間にヒユーズ線８を配置接
続して構成される。なお２は陽極リード、４は陽
極リードに接続された陽極リード端子、１１はモ
ールド外装樹脂である。 The solid electrolytic capacitor with a fuse disclosed in Utility Model Application Publication No. 53-157847 has a cathode lead terminal 5 fixed to a capacitor element 1 with an insulating adhesive 9, as shown in FIG. A fuse wire 8 is arranged and connected between the capacitor element 5 and the capacitor element 1. Note that 2 is an anode lead, 4 is an anode lead terminal connected to the anode lead, and 11 is a mold exterior resin.
一方、実開昭59−119029に開示されているヒユ
ーズ付き固体電解コンデンサは、第５図に示すよ
うに、コンデンサ素子１の陰極層の一部を残して
表面に絶縁性樹脂９を塗布し、その絶縁性樹脂上
に陰極リード線５を固定し、ヒユーズ線８を絶縁
性樹脂膜の塗布されていない陰極層と陰極リード
端子５に接続し、モールド外装樹脂１１により外
装することにより形成されていた。 On the other hand, in the solid electrolytic capacitor with a fuse disclosed in Utility Model Application No. 59-119029, as shown in FIG. It is formed by fixing the cathode lead wire 5 on the insulating resin, connecting the fuse wire 8 to the cathode layer not coated with the insulating resin film and the cathode lead terminal 5, and covering it with a molded exterior resin 11. Ta.
なお、陰極リード端子へのヒユーズ線の接続は
陰極リード端子をコンデンサ素子に接続固定する
前に行うのが一般的である。 Note that the fuse wire is generally connected to the cathode lead terminal before the cathode lead terminal is connected and fixed to the capacitor element.
上述した従来のヒユーズ付きチツプ状固体電解
コンデンサにおいては、ヒユーズ線８と、陰極リ
ード端子５の接続位置が一定しないこと、および
ヒユーズ線８とコンデンサ素子１との接続位置が
一定せず、ヒユーズ線８の長さがバラつくという
欠点があつた。
In the conventional chip-shaped solid electrolytic capacitor with a fuse described above, the connection position between the fuse wire 8 and the cathode lead terminal 5 is not constant, and the connection position between the fuse wire 8 and the capacitor element 1 is not constant, and the fuse wire The drawback was that the lengths of the 8's varied.
ヒユーズ線８の溶断電力Ｐは、そのヒユーズ線
の抵抗値Ｒとそのヒユーズ線に流れる電流値Ｉに
よつて決まりＰ＝I2・Ｒで表わされる。ここでヒ
ユーズ線の抵抗値ＲはＲ＝A.L／Ｓ（Ａ：ヒユー
ズ線の材質により定まる定数，Ｌ：ヒユーズ線の
長さ，Ｓ：ヒユーズ線の断面積）であり、前記ヒ
ユーズ線の溶断電力ＰはＰ＝I2・Ｒ＝Ａ・I2・
Ｌ／Ｓと書き直すことができる。この式から明ら
かなようにヒユーズ線の溶断電力Ｐはヒユーズ線
の長さに正比例するもので、このヒユーズ線の長
さがバラついた場合、溶断電流特性もバラつくと
いう相関関係がある。例えば、ヒユーズ線の長さ
が短くなつた場合、ヒユーズ線の溶断に要する電
流は非常に大きな値となり、極端な場合、この電
流によりヒユーズ線が溶断する前にコンデンサ素
子が焼損するといつた不具合が発生するとう欠点
もあつた。 The blowing power P of the fuse wire 8 is determined by the resistance value R of the fuse wire and the current value I flowing through the fuse wire and is expressed as P=I 2 ·R. Here, the resistance value R of the fuse wire is R=AL/S (A: constant determined by the material of the fuse wire, L: length of the fuse wire, S: cross-sectional area of the fuse wire), and the fusing power of the fuse wire is P is P=I 2・R=A・I 2・
It can be rewritten as L/S. As is clear from this equation, the blowing power P of the fuse wire is directly proportional to the length of the fuse wire, and there is a correlation that if the length of the fuse wire varies, the blowing current characteristics also vary. For example, if the length of the fuse wire becomes shorter, the current required to blow the fuse wire becomes extremely large, and in extreme cases, this current may cause problems such as burning out the capacitor element before the fuse wire blows. There were also some drawbacks.
本発明の目的は、ヒユーズ線の長さのバラツキ
を減らし、常に所定の長さのヒユーズ線を接続す
るようなヒユーズ接続部の構造を有し、これによ
り、従来ヒユーズ線の長さがバラつくことによ
り、同様にバラついていたビユーズ溶断特性をバ
ラつきの少ない安定した特性のヒユーズ付きチツ
プ状固体電解コンデンサおよびその製造方法を提
供することにある。 An object of the present invention is to reduce variations in the length of fuse wires, and to have a structure of a fuse connection part that always connects fuse wires of a predetermined length. In this way, it is an object of the present invention to provide a chip-shaped solid electrolytic capacitor with a fuse and a method for manufacturing the same, which have stable characteristics with little variation in the fuse blowout characteristics, which have similarly varied.
〔問題点を解決するための手段〕
本発明の第１の発明のヒユーズ付きチツプ状固
体電解コンデンサは、コンデンサ素子に陽極リー
ド端子およびヒユーズ線を介して陰極リードが接
続し、樹脂外装して成るヒユーズ付きチツプ状固
体電解コンデンサにおいて、前記陰極リード端子
が前記ヒユーズ線との接続部を除き、絶縁性樹脂
で被覆され、前記陰極リード端子のヒユーズ接続
部とコンデンサ素子がヒユーズ線で接続されてい
ることを特徴として構成される。[Means for Solving the Problems] A chip-shaped solid electrolytic capacitor with a fuse according to the first aspect of the present invention has a cathode lead connected to a capacitor element via an anode lead terminal and a fuse wire, and is coated with resin. In the chip-shaped solid electrolytic capacitor with a fuse, the cathode lead terminal is coated with an insulating resin except for the connection part with the fuse wire, and the fuse connection part of the cathode lead terminal and the capacitor element are connected by the fuse wire. It is composed of the following characteristics.
また、本発明の第２の発明のヒユーズ付き固体
電解コンデンサの製造方法は、コンデンサ素子に
陽極リード端子およびヒユーズ線を介して陰極リ
ード端子を接続した後樹脂外装して成るヒユーズ
付きチツプ状固体電解コンデンサの製造方法にお
いて、前記陰極リード端子のヒユーズ接続部と外
部接続部を除き絶縁性樹脂を塗布する工程と、前
記絶縁性樹脂を塗布しないで残したヒユーズ接続
用の金属部にヒユーズ線の一端を接続し、ヒユー
ズ線を前記絶縁性樹脂上に添わせて配置する工程
と、前記ヒユーズ線のもう一方の端をコンデンサ
素子に接続する工程とを含んで構成される。 Further, the method for manufacturing a solid electrolytic capacitor with a fuse according to the second aspect of the present invention includes a chip-shaped solid electrolytic capacitor with a fuse, which is formed by connecting a cathode lead terminal to a capacitor element via an anode lead terminal and a fuse wire, and then covering the capacitor with a resin. In the method for manufacturing a capacitor, a step of applying an insulating resin to the cathode lead terminal excluding the fuse connection part and the external connection part, and a step of applying an insulating resin to the metal part for the fuse connection which is left without applying the insulating resin is applied to one end of the fuse wire. and arranging the fuse wire on the insulating resin, and connecting the other end of the fuse wire to the capacitor element.
次に、本発明について図面を参照して説明す
る。第１図は、本発明のヒユーズ付きチツプ状固
体電解コンデンサの一実施例の内部構造を示す斜
視図である。
Next, the present invention will be explained with reference to the drawings. FIG. 1 is a perspective view showing the internal structure of an embodiment of a chip-shaped solid electrolytic capacitor with a fuse according to the present invention.
まず、陰極リリードフレーム５の上面の一部分
に耐熱，耐溶剤性のマイラーテープを貼り付けて
おき、次に陰極リード端子５のコンデンサ素子１
と接続されるＬ字形に曲げ加工された部分に絶縁
性のエポキシ樹脂またはシリコーン樹脂７を表裏
および端面のすべてにハケあるいはデイツピング
により塗布する。この絶縁性樹脂７を加熱乾燥
後、前記マイラーテープを引剥し、陰極リード端
子５上面に金属部１０を露出させる。次にこの露
出した金属部１０にヒユーズ線８をはんだ付けあ
るいは導電性銀ペースト６により接続する。この
時ヒユーズ線８の他端は陰極リード端子５の先端
より約0.5〜1.0mm出る程度の長さに切断してお
く。 First, heat-resistant and solvent-resistant Mylar tape is pasted on a part of the upper surface of the cathode lead frame 5, and then the capacitor element 1 of the cathode lead terminal 5 is pasted.
An insulating epoxy resin or silicone resin 7 is applied to the L-shaped bent portion to be connected to the front, back, and end surfaces by brushing or dipping. After drying the insulating resin 7 by heating, the mylar tape is peeled off to expose the metal portion 10 on the upper surface of the cathode lead terminal 5. Next, a fuse wire 8 is connected to this exposed metal portion 10 by soldering or by using conductive silver paste 6. At this time, the other end of the fuse wire 8 is cut to a length that extends approximately 0.5 to 1.0 mm from the tip of the cathode lead terminal 5.
次に、コンデンサ素子１より植立された陽極リ
ード２を陽極リード端子４に溶接により接続す
る。次にコンデンサ素子１と陰極リード端子５を
エポキシ樹脂等の絶縁性樹脂９により接続する。
その後、前記ヒユーズ線８の他端とコンデンサ素
子１の表面部の陰極層３をはんだ付けまたは導電
性銀ペースト６により接続する。最後にエポキシ
樹脂またはシリコーン樹脂によりモールド外装１
１を行なつた後、陽極リード端子４および陰極リ
ード端子５をコ形に成形し完成する。 Next, the anode lead 2 erected from the capacitor element 1 is connected to the anode lead terminal 4 by welding. Next, the capacitor element 1 and the cathode lead terminal 5 are connected with an insulating resin 9 such as epoxy resin.
Thereafter, the other end of the fuse wire 8 and the cathode layer 3 on the surface of the capacitor element 1 are connected by soldering or by conductive silver paste 6. Finally, mold exterior 1 with epoxy resin or silicone resin.
After carrying out step 1, the anode lead terminal 4 and the cathode lead terminal 5 are formed into a U-shape and completed.
ここで、前記陰極リード端子５上面の露出した
金属部１０の位置はヒユーズ線８の溶断特性に応
じて決定されるが、銀入り鉛線（直径0.15）を使
用した場合、陰極リード端子５先端より約1.0〜
1.5mmの位置が良い。これによりヒユーズ線８の
実効長は約1.0〜2.0mmとなる。 Here, the position of the exposed metal part 10 on the upper surface of the cathode lead terminal 5 is determined according to the fusing characteristics of the fuse wire 8, but if a silver-containing lead wire (diameter 0.15) is used, the tip of the cathode lead terminal 5 Approximately 1.0~
A position of 1.5mm is good. As a result, the effective length of the fuse wire 8 is approximately 1.0 to 2.0 mm.
第２図は本発明の第２の実施例の斜視図であ
る。第２図において、ヒユーズ線８上にもう一層
絶縁性樹脂１２を塗布したものである。このよう
にヒユーズ線８上に絶縁性樹脂１２を塗布するこ
とによりヒユーズ線の機械的保護の効果が得られ
る。 FIG. 2 is a perspective view of a second embodiment of the invention. In FIG. 2, another layer of insulating resin 12 is coated on the fuse wire 8. By coating the insulating resin 12 on the fuse wire 8 in this manner, the effect of mechanically protecting the fuse wire can be obtained.
第３図は本発明の第３の実施例要部の斜視図で
ある。第３図において、ヒユーズ線８の接続を陰
極リード端子５の下面すなわちコンデンサ素子１
と接続される面に行なつたもので、この場合は第
２図の実施例のようにヒユーズ線８の上を絶縁性
樹脂１２で覆う必要がある。 FIG. 3 is a perspective view of main parts of a third embodiment of the present invention. In FIG. 3, the fuse wire 8 is connected to the lower surface of the cathode lead terminal 5, that is, to the capacitor element 1.
In this case, it is necessary to cover the fuse wire 8 with an insulating resin 12 as in the embodiment shown in FIG.
以上説明したように本発明の第１の発明は、コ
ンデンサ素子に陽極リード端子およびヒユーズ線
を介して陰極リード端子が接続され樹脂外装して
成るヒユーズ付きチツプ状固体電解コンデンサに
おいて、前記陰極リード端子の前記ヒユーズ線と
の接続部および外部との接続部を除き絶縁性樹脂
で被覆され、前記陰極リード端子のヒユーズ線接
続部とコンデンサ素子がヒユーズ線で接続される
構造を有しているのでヒユーズ接続部と陰極リー
ド端子の先端までの長さが一定となりその結果接
続したヒユーズ線の長さが一定となりヒユーズ溶
断特性のバラつきの少ない安定した特性のヒユー
ズ付きチツプ状固体電解コンデンサが得られる。
As explained above, the first aspect of the present invention provides a chip-shaped solid electrolytic capacitor with a fuse, in which a cathode lead terminal is connected to a capacitor element via an anode lead terminal and a fuse wire and is sheathed with resin. The structure is such that the fuse wire connection portion of the cathode lead terminal and the capacitor element are connected by the fuse wire, so that the fuse wire connection portion of the cathode lead terminal and the capacitor element are connected with an insulating resin. The length from the connecting portion to the tip of the cathode lead terminal is constant, and as a result, the length of the connected fuse wire is constant, resulting in a chip-shaped solid electrolytic capacitor with a fuse having stable characteristics with little variation in fuse blowing characteristics.
また、本発明の第２の発明は、陰極リード端子
のヒユーズ接続部と外部との接続部を除き絶縁性
樹脂を塗布する工程と、前記絶縁性樹脂を塗布し
ないで残したヒユーズ接続用の金属部にヒユーズ
線の一部を接続し、ヒユーズ線を前記絶縁性樹脂
上に添わせて配置する工程と、前記ヒユーズ線の
もう一方の端をコンデンサ素子に接続する工程を
有しているので簡単な操作で常に接続したヒユー
ズ線の長さを一定にしたヒユーズ付きチツプ状固
体電解コンデンサを製造することができる。 A second aspect of the present invention also includes a step of applying an insulating resin except for the fuse connection portion of the cathode lead terminal and the connection portion with the outside, and a step of applying an insulating resin to the fuse connection portion remaining without applying the insulating resin. It is simple because it has the steps of connecting a part of the fuse wire to the section, placing the fuse wire along with the insulating resin, and connecting the other end of the fuse wire to the capacitor element. Through simple operations, it is possible to manufacture a chip-shaped solid electrolytic capacitor with a fuse in which the length of the connected fuse wire is always constant.
第１図は本発明の一実施例の内部構造を示す斜
視図、第２図は本発明の第２の実施例のヒユーズ
接続部の拡大斜視図、第３図は本発明の第３の実
施例のヒユーズ接続部の拡大斜視図、第４図，第
５図は何れも従来のヒユーズ付き固体電解コンデ
ンサの縦断面図である。
１……コンデンサ素子、２……陽極リード端
子、３……陰極層、４……陽極リード端子、５…
…陰極リード端子、６……はんだ、７……絶縁性
樹脂、８……ヒユーズ線、９……絶縁性樹脂、１
０……露出した金属部、１１……モールド外装樹
脂、１２……絶縁性樹脂。
Fig. 1 is a perspective view showing the internal structure of an embodiment of the present invention, Fig. 2 is an enlarged perspective view of a fuse connection part of a second embodiment of the invention, and Fig. 3 is a third embodiment of the invention. The enlarged perspective view of the example fuse connection, FIGS. 4 and 5, are both longitudinal sectional views of a conventional solid electrolytic capacitor with a fuse. DESCRIPTION OF SYMBOLS 1... Capacitor element, 2... Anode lead terminal, 3... Cathode layer, 4... Anode lead terminal, 5...
... Cathode lead terminal, 6 ... Solder, 7 ... Insulating resin, 8 ... Fuse wire, 9 ... Insulating resin, 1
0...Exposed metal part, 11...Mold exterior resin, 12...Insulating resin.
Claims (1)
ーズ線を介して陰極リード端子が接続され、樹脂
外装して成るヒユーズ付きチツプ状固体電解コン
デンサにおいて、前記陰極端子が前記ヒユーズ線
との接続部および外部との接続部を除き、絶縁樹
脂で被覆され、該陰極端子は絶縁性樹脂で前記コ
ンデンサ素子に接続固定され、前記陰極リード端
子のヒユーズ線接続部と前記コンデンサ素子が前
記陰極端子を覆う絶縁樹脂上に沿つて配置された
ヒユーズ線で接続されていることを特徴とするヒ
ユーズ付きチツプ状固体電解コンデンサ。 ２ コンデンサ素子に陽極リード端子およびヒユ
ーズ線を介して陽極リード端子を接続した後樹脂
外装して成るヒユーズ付きチツプ状固体電解コン
デンサの製造方法において、前記陰極リード端子
のヒユーズ接続部と外部との接続部を除き絶縁性
樹脂を塗布する工程と、前記絶縁性樹脂を塗布し
ないで残したヒユーズ接続用の金属部に前記ヒユ
ーズ線の一端を接続し、このヒユーズ線の一端が
接続された陰極端子を絶縁性樹脂により前記コン
デンサ素子に接続固定し、前記ヒユーズ線を前記
絶縁性樹脂上に添わせて配置する工程と、前記ヒ
ユーズ線のもう一方の端を前記コンデンサ素子に
接続する工程とを含むことを特徴とするヒユーズ
付きチツプ状固体電解コンデンサの製造方法。[Claims] 1. A chip-shaped solid electrolytic capacitor with a fuse, in which a cathode lead terminal is connected to a capacitor element via an anode lead terminal and a fuse wire, and the cathode lead terminal is connected to the fuse wire. The cathode terminal is connected and fixed to the capacitor element with the insulating resin, and the fuse wire connection part of the cathode lead terminal and the capacitor element are covered with an insulating resin, except for the part and the connection part with the outside. A chip-shaped solid electrolytic capacitor with a fuse, characterized in that it is connected by a fuse wire arranged along an insulating resin covering. 2. In a method for manufacturing a chip-shaped solid electrolytic capacitor with a fuse, which is formed by connecting an anode lead terminal to a capacitor element via an anode lead terminal and a fuse wire and then sheathing the capacitor with a resin, the connection between the fuse connection part of the cathode lead terminal and the outside is provided. A step of applying an insulating resin except for the insulating resin, and connecting one end of the fuse wire to the metal part for fuse connection that is left without applying the insulating resin, and connecting a cathode terminal to which one end of the fuse wire is connected. The method includes the steps of connecting and fixing to the capacitor element using an insulating resin, arranging the fuse wire along with the insulating resin, and connecting the other end of the fuse wire to the capacitor element. A method for manufacturing a chip-shaped solid electrolytic capacitor with a fuse, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62276379A JPH01117313A (en) | 1987-10-30 | 1987-10-30 | Chip-like solid electrolytic capacitor with fuse and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62276379A JPH01117313A (en) | 1987-10-30 | 1987-10-30 | Chip-like solid electrolytic capacitor with fuse and manufacture thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01117313A JPH01117313A (en) | 1989-05-10 |
| JPH0576170B2 true JPH0576170B2 (en) | 1993-10-22 |
Family
ID=17568605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62276379A Granted JPH01117313A (en) | 1987-10-30 | 1987-10-30 | Chip-like solid electrolytic capacitor with fuse and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01117313A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02306610A (en) * | 1989-05-22 | 1990-12-20 | Nec Corp | Chip type solid-state electrolytic capacitor provided with fuse |
| JPH051218U (en) * | 1991-06-21 | 1993-01-08 | 日本電気株式会社 | Chip type tantalum capacitor with built-in fuse |
| JPH06232014A (en) * | 1993-02-02 | 1994-08-19 | Nec Toyama Ltd | Chip type solid electrolytic capacitor with built-in fuse and its manufacture |
| JP2010251716A (en) * | 2009-03-25 | 2010-11-04 | Rohm Co Ltd | Solid electrolytic capacitor, and method of manufacturing the same |
| CN110428981B (en) * | 2019-08-07 | 2021-02-26 | 哈尔滨师范大学 | Sheet-shaped laminated all-solid-state supercapacitor and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5825037B2 (en) * | 1975-05-29 | 1983-05-25 | 東洋電機製造株式会社 | Armature reaction compensation method for commutatorless motor |
| JPS6315037B2 (en) * | 1980-04-15 | 1988-04-02 | Hyogoken |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5825037U (en) * | 1981-08-07 | 1983-02-17 | 松下電器産業株式会社 | solid electrolytic capacitor |
| JPS6315037U (en) * | 1986-07-11 | 1988-02-01 |
-
1987
- 1987-10-30 JP JP62276379A patent/JPH01117313A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5825037B2 (en) * | 1975-05-29 | 1983-05-25 | 東洋電機製造株式会社 | Armature reaction compensation method for commutatorless motor |
| JPS6315037B2 (en) * | 1980-04-15 | 1988-04-02 | Hyogoken |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01117313A (en) | 1989-05-10 |
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