JPH01117313A - Chip-like solid electrolytic capacitor with fuse and manufacture thereof - Google Patents
Chip-like solid electrolytic capacitor with fuse and manufacture thereofInfo
- Publication number
- JPH01117313A JPH01117313A JP62276379A JP27637987A JPH01117313A JP H01117313 A JPH01117313 A JP H01117313A JP 62276379 A JP62276379 A JP 62276379A JP 27637987 A JP27637987 A JP 27637987A JP H01117313 A JPH01117313 A JP H01117313A
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- lead terminal
- fuse wire
- cathode lead
- insulating resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 51
- 239000007787 solid Substances 0.000 title claims description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 229920005989 resin Polymers 0.000 claims abstract description 37
- 239000011347 resin Substances 0.000 claims abstract description 37
- 238000000034 method Methods 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 238000007664 blowing Methods 0.000 abstract description 7
- 239000003822 epoxy resin Substances 0.000 abstract description 6
- 229920000647 polyepoxide Polymers 0.000 abstract description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 5
- 229920002799 BoPET Polymers 0.000 abstract description 3
- 229910052709 silver Inorganic materials 0.000 abstract description 3
- 239000004332 silver Substances 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- 238000005253 cladding Methods 0.000 abstract 1
- 230000006641 stabilisation Effects 0.000 abstract 1
- 238000011105 stabilization Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Fuses (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はヒユーズ付きチップ状固体電解コンデンサおよ
びその製造方法に関し、特にヒユーズ接続部の構造及び
製造方法に関する
〔従来の技術〕
従来タンタル（Ｔａ）、ニオブ（Ｎｂ）、アルミニウム
（Ａｅ）等の弁作用を有する固体電解コンデンサは種々
の電子回路に使用されており、故障率が小さいことが利
点とされているが、−旦故障が発生した場合のの故障モ
ードは短絡故障が多く、大きな短絡電流が流れるため、
コンデンサ素子が発熱し、遂には焼損に至ることがある
。このような過度の短絡故障による故障発生の際は、他
の回路構成素子を保護するため、故障モードを短絡から
開放にする必要がある。この対策としては、一般にヒユ
ーズが用いられており、従来の技術としては実開昭５３
−１５７８４７号、実開昭５９−１１９０２９号等があ
る。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a chip-shaped solid electrolytic capacitor with a fuse and a manufacturing method thereof, and particularly relates to the structure and manufacturing method of a fuse connection part [Prior Art] Conventional tantalum (Ta) Solid electrolytic capacitors with valve action such as niobium (Nb), aluminum (Ae), etc. are used in various electronic circuits and have the advantage of having a low failure rate. Most of the failure modes are short-circuit failures, and large short-circuit currents flow.
The capacitor element may generate heat and eventually burn out. When a failure occurs due to such an excessive short circuit failure, it is necessary to change the failure mode from short circuit to protect other circuit components. As a countermeasure against this, a fuse is generally used, and the conventional technology is
-157847, Utility Model Application Publication No. 59-119029, etc.
実開昭５３−１５７８４７号に開示されているヒユーズ
付き固体電解コンデンサは、第４図に示すように、陰極
リード端子５をコンデンサ素子１に絶縁性の接着剤９に
より固定し、その陰極リード端子５とコンデンサ素子１
間にヒユーズ線８を配置接続して構成される。なお２は
陽極リード、４は陽極リードに接続された陽極リード端
子、１１はモールド外装樹脂である。The solid electrolytic capacitor with a fuse disclosed in Japanese Utility Model Application Publication No. 157847/1984 has a cathode lead terminal 5 fixed to a capacitor element 1 with an insulating adhesive 9, as shown in FIG. 5 and capacitor element 1
A fuse wire 8 is arranged and connected between them. Note that 2 is an anode lead, 4 is an anode lead terminal connected to the anode lead, and 11 is a mold exterior resin.
一方、実開昭５９−１１９０２９に開示されて゛いるヒ
ユーズ付き固体電解コンデンサは、第５図に示すように
、コンデンサ素子１の陰極層の一部を残して表面に絶縁
性樹脂９を塗布し、その絶縁性樹脂上に陰極リード線５
を固定し、ヒユーズ線８を絶縁性樹脂膜の塗布されてい
ない陰極層と陰極リード端子５に接続し、モールド外装
樹脂１２により外装することにより形成されていた。On the other hand, a solid electrolytic capacitor with a fuse disclosed in Japanese Utility Model Application No. 59-119029 has an insulating resin 9 coated on the surface of the capacitor element 1, leaving a part of the cathode layer as shown in FIG. Cathode lead wire 5 is placed on the insulating resin.
is fixed, the fuse wire 8 is connected to the cathode layer not coated with the insulating resin film and the cathode lead terminal 5, and the molded exterior resin 12 is used to cover the fuse wire 8 with the cathode lead terminal 5.
なお、陰極リード端子へのヒユーズ線の接続は陰極リー
ド端子をコンデンサ素子に接続固定する前に行うのが一
般的である。Note that the fuse wire is generally connected to the cathode lead terminal before the cathode lead terminal is connected and fixed to the capacitor element.
上述した従来のヒユーズ付きチップ状固体電解コンデン
サにおいては、ヒユーズ線８と、陰極リード端子５の接
続位置が一定しないこと、およびヒユーズ線８とコンデ
ンサ素子１との接続位置が一定せず、ヒユーズ線８の長
さがバラつくという欠点があった。In the conventional chip-shaped solid electrolytic capacitor with a fuse described above, the connection position between the fuse wire 8 and the cathode lead terminal 5 is not constant, and the connection position between the fuse wire 8 and the capacitor element 1 is not constant, and the fuse wire The disadvantage was that the lengths of the 8's varied.
ヒユーズ線８の溶断電力（Ｐ）は、そのヒユーズ線の抵
抗値（Ｒ）とそのヒユーズ線に流れる電流値（Ｉ）によ
って決まりＰ＝’Ｉ２ ・Ｒで表わされる。ここでヒユ
ーズ線の抵抗値（Ｒ）はＲ＝Ａ、Ｌ／Ｓ （Ａ：ヒユー
ズ線の材質により定まる定数、Ｌ：ヒユーズ線の流さ、
Ｓ：ヒユーズ線の断面積）であり、前記ヒユーズ線の溶
断電力（Ｐ）はＰ＝Ｉ２ ・Ｒ＝Ａ−Ｉ２ ・Ｌ／
Ｓと書き直すことができる。この式から明らかなように
ヒユーズ線の溶断電力（Ｐ）はヒユーズ線の長さに正比
例するもので、このヒユーズ線の長さがバラついた場合
、溶断電流特性もバラつくという相関関係がある。例え
ば、ヒユーズ線の長さが短くなった場合、ヒユーズ線の
溶断に要する電流は非常に大きな値となり、極端な場合
、この電流によりヒユーズ線が溶断する前にコンデンサ
素子が焼損するといった不具合が発生するという欠点も
あった。The blowing power (P) of the fuse wire 8 is determined by the resistance value (R) of the fuse wire and the current value (I) flowing through the fuse wire and is expressed as P='I2.R. Here, the resistance value (R) of the fuse wire is R=A, L/S (A: constant determined by the material of the fuse wire, L: flow rate of the fuse wire,
S: cross-sectional area of the fuse wire), and the blowing power (P) of the fuse wire is P=I2 ・R=A−I2 ・L/
It can be rewritten as S. As is clear from this equation, the blowing power (P) of a fuse wire is directly proportional to the length of the fuse wire, and if the length of the fuse wire varies, there is a correlation that the blowing current characteristics also vary. . For example, if the length of the fuse wire becomes short, the current required to blow the fuse wire becomes extremely large, and in extreme cases, this current may cause problems such as burning out the capacitor element before the fuse wire blows. There was also the drawback of doing so.
本発明の目的は、ヒユーズ線の長さのバラツキを減らし
、常に所定の長さのヒユーズ線を接続するようなヒユー
ズ接続部の構造を有し、これにより、従来ヒユーズ線の
長さがバラつくことにより、同様にバラついていたヒユ
ーズ溶断特性をバラつきの少ない安定した特性のヒユー
ズ付きチップ状固体電解コンデンサおよびその製造方法
を提供することにある。An object of the present invention is to reduce variations in the length of fuse wires, and to have a structure of a fuse connection part that always connects fuse wires of a predetermined length. In this way, it is an object of the present invention to provide a chip-shaped solid electrolytic capacitor with a fuse and a method for manufacturing the same, which have stable characteristics with little variation in the fuse blowing characteristics, which have been similarly variable.
本発明の第１の発明のヒユーズ付きチップ状固体電解コ
ンデンサは、コンデンサ素子に陽極リード端子およびヒ
ユーズ線を介して陰極リードが接続し、樹脂外装して成
るヒユーズ付きチップ状固体電解コンデンサにおいて、
前記陰極リード端子が前記ヒユーズ線との接続部を除き
、絶縁性樹脂で被覆され、前記陰極リード端子のヒユー
ズ接続部とコンデンサ素子がヒーユーズ線で接続されて
いることを特徴として構成される。A chip-shaped solid electrolytic capacitor with a fuse according to a first aspect of the present invention is a chip-shaped solid electrolytic capacitor with a fuse, which has a cathode lead connected to a capacitor element via an anode lead terminal and a fuse wire, and is coated with resin.
The cathode lead terminal is coated with an insulating resin except for the connection part with the fuse wire, and the fuse connection part of the cathode lead terminal and the capacitor element are connected by the fuse wire.
また、本発明の第２の発明のヒユーズ付き固体電解コン
デンサの製造方法は、コンデンサ素子に陽極リード端子
およびヒユーズ線を介して陰極リード端子を接続した後
樹脂外装して成るヒユーズ付きチップ状固体電解コンデ
ンサの製造方法において、前記陰極リード端子のヒユー
ズ接続部と外部接続部を除き絶縁性樹脂を塗布する工程
と、前記絶縁性樹脂を塗布しないで残したヒユーズ接続
用の金属部にヒユーズ線の一端を接続し、ヒユーズ線を
前記絶縁性樹脂上に添わせて配置する工程と、前記ヒユ
ーズ線のもう一方の端をコンデンサ素子に接続する工程
とを含んで構成される。Further, the method for manufacturing a solid electrolytic capacitor with a fuse according to the second aspect of the present invention includes a chip-shaped solid electrolytic capacitor with a fuse, which is formed by connecting a cathode lead terminal to a capacitor element via an anode lead terminal and a fuse wire, and then covering the capacitor with a resin. In the method for manufacturing a capacitor, a step of applying an insulating resin to the cathode lead terminal excluding the fuse connection part and the external connection part, and a step of applying an insulating resin to the metal part for the fuse connection which is left without applying the insulating resin is applied to one end of the fuse wire. and arranging the fuse wire on the insulating resin, and connecting the other end of the fuse wire to the capacitor element.
次に、本発明について図面を参照して説明する。第１図
は、本発明のヒユーズ付きチップ状固体電解コンデンサ
の一実施例の内部構造を示す斜視図である。Next, the present invention will be explained with reference to the drawings. FIG. 1 is a perspective view showing the internal structure of an embodiment of a chip-shaped solid electrolytic capacitor with a fuse according to the present invention.
まず、陰極リードフレームらの上面の一部分に耐熱、耐
溶剤性のマイラーテープを貼り付けておき、次に陰極リ
ード端子５のコンデンサ素子１と接続されるＬ字形に曲
げ加工された部分に絶縁性のエポキシ樹脂またはシリコ
ーン樹脂７を表裏および端面のすべてにへケあるいはデ
ィッピングにより塗布する。この絶縁性樹脂７を加熱乾
燥後、前記マイラーテープを引剥し、陰極リード端子５
上面に金属部１０を露出させる。次にこの露出した金属
部１０にヒユーズ線８をはんだ付けあるいは導電性銀ペ
ースト６により接続する。この時ヒユーズ線８の他端は
陰極リード端子５の先端より約０．５〜１．０龍出る程
度の長さに切断しておく。First, heat-resistant and solvent-resistant mylar tape is pasted on a part of the upper surface of the cathode lead frame, and then insulation is applied to the L-shaped bent part of the cathode lead terminal 5 that is connected to the capacitor element 1. The epoxy resin or silicone resin 7 is applied to all the front and back surfaces and end surfaces by brushing or dipping. After heating and drying the insulating resin 7, the Mylar tape is peeled off and the cathode lead terminal 5 is removed.
The metal part 10 is exposed on the upper surface. Next, a fuse wire 8 is connected to this exposed metal portion 10 by soldering or by using conductive silver paste 6. At this time, the other end of the fuse wire 8 is cut to a length that extends approximately 0.5 to 1.0 length from the tip of the cathode lead terminal 5.
次に、コンデンサ素子１より植立された陽極リード２を
陽極リード端子４に溶接により接続する。次にコンデン
サ素子１と陰極リード端子５をエポキシ樹脂等の絶縁性
樹脂９により接続する。Next, the anode lead 2 erected from the capacitor element 1 is connected to the anode lead terminal 4 by welding. Next, the capacitor element 1 and the cathode lead terminal 5 are connected with an insulating resin 9 such as epoxy resin.
その後、前記ヒユーズ線８の他端とコンデンサ素子１の
表面部の陰極層３をはんだ付けまたは導電性銀ペースト
６により接続する。最後にエポキシ樹脂またはシリコー
ン樹脂によりモールド外装置１を行なった後、陽極リー
ド端子４および陰極リード端子５をコ形に成形し完成す
る。Thereafter, the other end of the fuse wire 8 and the cathode layer 3 on the surface of the capacitor element 1 are connected by soldering or by conductive silver paste 6. Finally, after molding the device 1 using epoxy resin or silicone resin, the anode lead terminal 4 and the cathode lead terminal 5 are molded into a U-shape to complete the process.
ここで、前記陰極リード端子５上面の露出した金属部１
０の位置はヒユーズ線８の溶断特性に応じて決定される
が、銀入り鉛線（直径０．１５）を使用した場合、陰極
リード端子５先端より約１．０〜１．５＋ｕ＋の位置が
良い。これによりヒユーズ線８の実効長は約１．０〜２
．０ｍ＋ａとなる。Here, the exposed metal portion 1 on the upper surface of the cathode lead terminal 5
The position of 0 is determined depending on the fusing characteristics of the fuse wire 8, but if a silver-filled lead wire (diameter 0.15) is used, the position of 0 is approximately 1.0 to 1.5+u+ from the tip of the cathode lead terminal 5. good. As a result, the effective length of the fuse wire 8 is approximately 1.0 to 2
．． It becomes 0m+a.
第２図は本発明の第２の実施例の斜視図である。第２図
において、ヒユーズ線８上にもう一層絶縁性樹脂１２を
塗布したものである。このようにヒユーズ線８上に絶縁
性樹脂１２を塗布することによりヒユーズ線の機械的保
護の効果が得られる。FIG. 2 is a perspective view of a second embodiment of the invention. In FIG. 2, another layer of insulating resin 12 is coated on the fuse wire 8. By coating the insulating resin 12 on the fuse wire 8 in this manner, the effect of mechanically protecting the fuse wire can be obtained.
第３図は本発明の第３の実施例要部の斜視図である。第
３図において、ヒユーズ線８の接続を陰極リード端子５
の下面すなわちコンデンサ素子１と接続される面に行な
ったもので、この場合は第。FIG. 3 is a perspective view of main parts of a third embodiment of the present invention. In Figure 3, the fuse wire 8 is connected to the cathode lead terminal 5.
This is done on the lower surface of the capacitor element 1, that is, the surface connected to the capacitor element 1, in this case.
２図の実施例のようにヒユーズ線８の上を絶縁性樹脂１
２で覆う必要がある。As shown in the embodiment shown in Figure 2, insulating resin 1 is placed over the fuse wire 8.
It is necessary to cover it with 2.
以上説明したように本発明の第１の発明は、コンデンサ
素子に陽極リード端子およびヒユーズ線を介して陰極リ
ード端子が接続され樹脂外装して成るヒユーズ付きチッ
プ状固体電解コンデンサにおいて、前記陰極リード端子
の前記ヒユーズ線との接続部および外部との接続部を除
き絶縁性樹脂で被覆され、前記陰極リード端子のヒユー
ズ線接続部とコンデンサ素子がヒユーズ線で接続される
構造を有しているのでヒユーズ接続部と陰極リード端子
の先端までの長さが一定となりその結果接続したヒユー
ズ線の長さが一定となりヒユーズ溶断特性のバラつきの
少ない安定した特性のヒユーズ付きチップ状固体電解コ
ンデンサが得られる。As explained above, the first aspect of the present invention is a fuse-equipped chip solid electrolytic capacitor in which a cathode lead terminal is connected to a capacitor element via an anode lead terminal and a fuse wire, and the cathode lead terminal is The structure is such that the fuse wire connection portion of the cathode lead terminal and the capacitor element are connected by the fuse wire, so that the fuse wire connection portion of the cathode lead terminal and the capacitor element are connected with an insulating resin. The length from the connecting portion to the tip of the cathode lead terminal is constant, and as a result, the length of the connected fuse wire is constant, resulting in a chip-shaped solid electrolytic capacitor with a fuse having stable characteristics with little variation in fuse blowing characteristics.
また、本発明の第２の発明は、陰極リード端子のヒユー
ズ接続部と外部との接続部を除き絶縁性樹脂を塗布する
工程と、前記絶縁性樹脂を塗布しないで残したヒユーズ
接続用の金属部にヒユーズ線の一部を接続し、ヒユーズ
線を前記絶縁性樹脂上に添わせて配置する工程と、前記
ヒユーズ線のもう一方の端をコンデンサ素子に接続する
工程を有しているので簡単な操作で常に接続したヒユー
ズ線の長さを一定にしたヒユーズ付きチップ状固体電解
コンデンサを製造することができる。A second aspect of the present invention also includes a step of applying an insulating resin except for the fuse connection portion of the cathode lead terminal and the connection portion with the outside, and a step of applying an insulating resin to the fuse connection portion remaining without applying the insulating resin. It is simple because it has the steps of connecting a part of the fuse wire to the section, placing the fuse wire along with the insulating resin, and connecting the other end of the fuse wire to the capacitor element. Through simple operations, it is possible to manufacture a chip-shaped solid electrolytic capacitor with a fuse in which the length of the connected fuse wire is always constant.
第１図は本発明の一実施例の内部構造を示す斜視図、第
２図は本発明の第２の実施例のヒユーズ接続部の拡大斜
視図、第３図は本発明の第３の実施例のヒユーズ接続部
の拡大斜視図、第４図、第５図は何れも従来のヒユーズ
付き固体電解コンデ−ンサの縦断面図である。
１・・・コンデンサ素子、２・・・陽極リード端子、３
・・・陰極層、４・・・陽極リード端子、５・・・陰極
リード端子、６・・・はんだ、７・・・絶縁性樹脂、８
・・・ヒユーズ線１．９・・・絶縁性樹脂、１０・・・
露出した金属部、１１・・・モールド外装樹脂、１２・
・・絶縁性樹脂。Fig. 1 is a perspective view showing the internal structure of an embodiment of the present invention, Fig. 2 is an enlarged perspective view of a fuse connection part of a second embodiment of the invention, and Fig. 3 is a third embodiment of the invention. The enlarged perspective view of the example fuse connection, FIGS. 4 and 5, are both longitudinal sectional views of a conventional solid electrolytic capacitor with a fuse. 1... Capacitor element, 2... Anode lead terminal, 3
...Cathode layer, 4...Anode lead terminal, 5...Cathode lead terminal, 6...Solder, 7...Insulating resin, 8
...Fuse wire 1.9...Insulating resin, 10...
Exposed metal part, 11...Mold exterior resin, 12.
...Insulating resin.
Claims (2)
線を介して陰極リード端子が接続され、樹脂外装して成
るヒューズ付きチップ状固体電解コンデンサにおいて、
前記陰極リード端子が前記ヒューズ線との接続部および
外部との接続部を除き、絶縁性樹脂で被覆され、前記陰
極リード端子のヒューズ線接続部とコンデンサ素子がヒ
ューズ線で接続されていることを特徴とするヒューズ付
きチップ状固体電解コンデンサ。(1) A chip-shaped solid electrolytic capacitor with a fuse, in which a cathode lead terminal is connected to a capacitor element via an anode lead terminal and a fuse wire, and is coated with resin,
The cathode lead terminal is coated with an insulating resin except for the connection part with the fuse wire and the connection part with the outside, and the fuse wire connection part of the cathode lead terminal and the capacitor element are connected by the fuse wire. A chip-shaped solid electrolytic capacitor with a special feature.
線を介して陰極リード端子を接続した後樹脂外装して成
るヒューズ付きチップ状固体電解コンデンサの製造方法
において、前記陰極リード端子のヒューズ接続部と外部
との接続部を除き絶縁性樹脂を塗布する工程と、前記絶
縁性樹脂をを塗布しないで残したヒューズ接続用の金属
部にヒューズ線の一端を接続し、ヒューズ線を前記絶縁
性樹脂上に添わせて配置する工程と、前記ヒューズ線の
もう一方の端をコンデンサ素子に接続する工程とを含む
ことを特徴とするヒューズ付きチップ状固体電解コンデ
ンサの製造方法。(2) In a method for manufacturing a chip-shaped solid electrolytic capacitor with a fuse, which is formed by connecting a cathode lead terminal to a capacitor element via an anode lead terminal and a fuse wire and then sheathing the capacitor with a resin, the fuse connection part of the cathode lead terminal is connected to the outside. a step of applying an insulating resin except for the connection part, and connecting one end of the fuse wire to the metal part for connecting the fuse that is left without applying the insulating resin, and attaching the fuse wire on the insulating resin. 1. A method for manufacturing a chip-shaped solid electrolytic capacitor with a fuse, the method comprising the steps of arranging the fuse wire and connecting the other end of the fuse wire to a capacitor element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62276379A JPH01117313A (en) | 1987-10-30 | 1987-10-30 | Chip-like solid electrolytic capacitor with fuse and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62276379A JPH01117313A (en) | 1987-10-30 | 1987-10-30 | Chip-like solid electrolytic capacitor with fuse and manufacture thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01117313A true JPH01117313A (en) | 1989-05-10 |
| JPH0576170B2 JPH0576170B2 (en) | 1993-10-22 |
Family
ID=17568605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62276379A Granted JPH01117313A (en) | 1987-10-30 | 1987-10-30 | Chip-like solid electrolytic capacitor with fuse and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01117313A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02306610A (en) * | 1989-05-22 | 1990-12-20 | Nec Corp | Chip type solid-state electrolytic capacitor provided with fuse |
| JPH051218U (en) * | 1991-06-21 | 1993-01-08 | 日本電気株式会社 | Chip type tantalum capacitor with built-in fuse |
| US5478965A (en) * | 1993-02-02 | 1995-12-26 | Nec Corporation | Fused chip-type solid electrolytic capacitor and fabrication method thereof |
| US20100246099A1 (en) * | 2009-03-25 | 2010-09-30 | Rohm Co., Ltd. | Electrolytic capacitor and method of making the same |
| CN110428981A (en) * | 2019-08-07 | 2019-11-08 | 哈尔滨师范大学 | A kind of sheet lamination all-solid-state supercapacitor and preparation method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5825037U (en) * | 1981-08-07 | 1983-02-17 | 松下電器産業株式会社 | solid electrolytic capacitor |
| JPS6315037U (en) * | 1986-07-11 | 1988-02-01 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5825037B2 (en) * | 1975-05-29 | 1983-05-25 | 東洋電機製造株式会社 | Armature reaction compensation method for commutatorless motor |
| JPS56147682A (en) * | 1980-04-15 | 1981-11-16 | Hiyougoken | Treatment for waste liquid containing mercury by activated copper |
-
1987
- 1987-10-30 JP JP62276379A patent/JPH01117313A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5825037U (en) * | 1981-08-07 | 1983-02-17 | 松下電器産業株式会社 | solid electrolytic capacitor |
| JPS6315037U (en) * | 1986-07-11 | 1988-02-01 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02306610A (en) * | 1989-05-22 | 1990-12-20 | Nec Corp | Chip type solid-state electrolytic capacitor provided with fuse |
| JPH051218U (en) * | 1991-06-21 | 1993-01-08 | 日本電気株式会社 | Chip type tantalum capacitor with built-in fuse |
| US5478965A (en) * | 1993-02-02 | 1995-12-26 | Nec Corporation | Fused chip-type solid electrolytic capacitor and fabrication method thereof |
| US20100246099A1 (en) * | 2009-03-25 | 2010-09-30 | Rohm Co., Ltd. | Electrolytic capacitor and method of making the same |
| CN110428981A (en) * | 2019-08-07 | 2019-11-08 | 哈尔滨师范大学 | A kind of sheet lamination all-solid-state supercapacitor and preparation method |
| CN110428981B (en) * | 2019-08-07 | 2021-02-26 | 哈尔滨师范大学 | Sheet-shaped laminated all-solid-state supercapacitor and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0576170B2 (en) | 1993-10-22 |
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