JPH0576082U - Chip parts removal device - Google Patents

Abstract

(57) [Abstract] [Purpose] Chip component 14 mounted on a printed wiring board
It is a device that makes it easy to remove. [Structure] The chip component 14 from which the printed wiring board 11 is to be removed is placed on the pedestal 1 with its mounting surface facing upward. Next, the soldering iron portion 10 is attached to the dimension between the electrodes 15 of the chip component 14.
Adjust the adjustment handle 9 so that a and 10b are aligned,
When they match, the solder 16 of one chip component 14 is melted collectively by the heat transmitted from the heater 7, and the chip component 14 is sandwiched between the soldering iron parts 10a and 10b and the printed wiring board on the pedestal 1 is fixed. The roller 18 on the pedestal 1 is moved to an arbitrary position so as to be displaced from the mounting position of the chip component 14. According to the present invention, the chip component 14 can be easily removed regardless of the dimension between the electrodes 15 of the chip component 14.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a chip component removing device that simplifies the work by using the device when removing chip components mounted on a printed wiring board.

[0002]

[Prior Art]

 FIG. 3 is an external view showing a state in which a chip component is mounted on a conventional surface mount printed wiring board by soldering. In the figure, 11 is a printed wiring board, 14 is a chip component, 15 is an electrode, and 16 is a solder. , 17 are pads. In order to remove the chip component 14, the solder 16 is melted with a soldering iron or the like for each electrode 15 of the chip component 14, and a dropper-shaped jig for sucking the melted solder 16 is used. A general method is to remove 16 and remove the chip component 14 and the electrode 15. In addition, if you use a soldering iron with a soldering iron tip shaped to match the positions of the two rows of electrodes 15 of the chip component 14, you can remove them all at once. There are also examples.

[0003]

[Problems to be solved by the device]

 However, in the case of the above method, when the inter-electrode dimension of the chip component is different, it is necessary to prepare a soldering iron having a tip corresponding to each inter-electrode dimension. Generally, the dimension between electrodes of a chip component having two rows of electrodes is, for example, 2.2 mm, 3. 2 mm, 3.4 mm, 5.6 mm, etc., and it is difficult for a conventional soldering iron with a trowel to match the positions of two rows of electrodes, to accommodate the variety of dimensions between electrodes. .. The present invention has been made to solve the above problems, and an object thereof is to easily remove a chip component from a printed wiring board on which chip components having different interelectrode dimensions are mounted. ..

[0004]

In a chip component removing device according to the present invention, a soldering portion 16 of a chip component 14 to be removed, which is formed in an electrode shape of a code plug and mounted on a printed wiring board 11, is heated. The soldering iron portions 10a and 10b that have the function of melting and sandwiching the electrode 15 of the chip component 14 and the soldering iron portions 10a and 10b are moved in parallel according to the dimension between the electrodes 15 of the chip component 14. Openable opening / closing mechanism section 8, heater 7 for heating the soldering iron sections 10a, 10b, and a support column arranged above the heater 7 for holding the opening / closing mechanism section 8 and the soldering iron sections 10a, 10b. 3, an L-shaped arm 2 that supports the column 3 so that the column 3 can move up and down, and one end surface of the arm 2 must be vertically fixed and removed. Equipped with a pedestal 1 for receiving the printed wiring board 11 on which the chip parts 14 are mounted, and a roller 18 for moving the printed wiring board 11 received in the pedestal 1 to an arbitrary position 12 There is something.

[0005]

[Action]

 The soldering iron parts 10a, 10b held by the support column 3 are lowered to the vicinity of the upper part of the chip component 14 to be removed, and the soldering iron parts 10a, 10b are slid to match the dimension between the electrodes 15 of the chip component 14, When the soldering portions 16 of the row are received into the soldering iron portions 10a and 10b and are melted together, and when the melting of the solder is confirmed, the chip component 14 is sandwiched between the soldering iron portions 10a and 10b, and the soldering portions 16 are placed on the pedestal 1. The chip component 14 and the electrode 15 can be removed by moving 12 the lint wiring board 11 to an arbitrary position so as to shift it from the mounting position.

[0006]

【Example】

 Example 1. An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an overall external view, and FIG. 2 is a partial cross-sectional view. In the figure, 1 is a pedestal, which receives a printed wiring board 11, 2 is an arm, and one end surface on the pedestal 1 Is fixed vertically. Further, 3 is a column, which penetrates near the other end surface of the arm 2 and is held so as to be vertically movable with respect to the receiving base 1. Next, 4 is a stopper receiving port, 5 is a stopper, and the stopper receiving port 4 is arranged in the column 3, and when the column 3 is moved up and down while being in contact with the stopper 5 attached to the arm 2. Is fixed and fine adjustment of vertical movement is performed. A heater 7 is attached to the tip of the column 3. Reference numeral 6 is a stop screw for fixing the heater 7 to the column 3. Further, 10a and 10b are soldering iron portions for heating and melting the soldering portion 16 of the chip component 14 mounted on the printed wiring board 11. Next, 8 is an opening / closing mechanism part, which enables adjustment of the distance between the soldering iron parts 10a and 10b which are connected to the lower part of the heater 7 and which are formed in the shape of the electrode of the cord plug, and 9 is an adjusting handle. The distance between the iron pieces 10a and 10b is adjusted, and the vertical movement of the column 3 is operated. Further, 12 is a moving direction for moving the printed wiring board 11 received by the pedestal 1 to an arbitrary position.

Next, in the embodiment of the present invention, in order to remove the mounted chip component 14 and the electrode 15, the chip component 14 mounting surface of the printed wiring board 11 is placed on the top and placed on the pedestal 1. The heater 7 is in a heated state. Next, the chip component 14 to be removed on the printed wiring board 11 is moved in the moving direction 12 on the roller 18 mounted on the pedestal 1 so as to be almost directly under the soldering iron portions 10a and 10b on the pedestal 1. It is moved 12 and the column 3 is gradually lowered while holding the adjustment handle 9. FIG. 2A shows this state. Further, the soldering iron portions 10a and 10b are adjusted with the adjusting handle 9 to the dimension between the electrodes 15 of the chip component 14 to be removed so as to match the dimension between the electrodes 15 of the chip component 14, and when they match, the soldering iron 10 The heat transferred to the parts 10a and 10b melts the solder 16 of one chip component 14 in a lump, and when the melting of the solder is confirmed, the chip component 14 is received by the soldering iron parts 10a and 10b while being sandwiched. The printed wiring board 11 on the base 1 is moved in the movement direction 12 to an arbitrary position on the roller 18 attached to the receiving base 1 so as to be displaced from the mounting position. By performing the above procedure, the chip component 14 and the electrode 15 can be removed.

[0008]

[Effects of the Invention] As described above, according to the present invention, it is possible to easily remove a chip component regardless of the size of the electrode between the chip components, which has the effect of significantly improving workability. is doing.

[Brief description of drawings]

FIG. 1 is an external view showing a chip part removing device according to the present invention.

FIG. 2 is a sectional view showing an embodiment according to the present invention.

FIG. 3 is a cross-sectional view illustrating a conventional chip component removing method.

[Explanation of Codes] 1 Cradle 2 Arm 3 Strut 4 Stopper socket 5 Stopper 6 Set screw 7 Heater 8 Opening / closing mechanism part 9 Adjustment handle 10a Soldering iron part 10b Soldering iron part 11 Printed wiring board 12 Moving direction 13 Heater fixing part 14 Chip parts 15 Electrodes 16 Solder 17 Pads 18 Rollers 19 Roller holding brackets

Claims (1)

[Scope of utility model registration request] 1. A soldering iron portion which is formed in the shape of an electrode of a code plug and has a function of heating and melting a soldering portion of a chip component mounted on a printed wiring board to be removed and sandwiching the electrode of the chip component. An opening / closing mechanism that enables parallel movement of the soldering iron part according to the dimension between electrodes of a chip component, a heater that heats the soldering iron part, and a heater that is arranged above the heater, and the opening and closing mechanism part and solder A print on which a column for holding the iron part, an L-shaped arm for supporting the column so as to be movable up and down, one end face of the arm are vertically fixed, and a chip component to be removed is mounted. A device for removing chip parts, comprising a pedestal for receiving a wiring board.