JPH0575008B2 - - Google Patents
Info
- Publication number
- JPH0575008B2 JPH0575008B2 JP63073512A JP7351288A JPH0575008B2 JP H0575008 B2 JPH0575008 B2 JP H0575008B2 JP 63073512 A JP63073512 A JP 63073512A JP 7351288 A JP7351288 A JP 7351288A JP H0575008 B2 JPH0575008 B2 JP H0575008B2
- Authority
- JP
- Japan
- Prior art keywords
- vinyl chloride
- weight
- chloride resin
- film
- acrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011347 resin Substances 0.000 claims description 40
- 229920005989 resin Polymers 0.000 claims description 40
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 37
- 238000000576 coating method Methods 0.000 claims description 21
- 229920000178 Acrylic resin Polymers 0.000 claims description 17
- 239000004925 Acrylic resin Substances 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 14
- 229920000642 polymer Polymers 0.000 claims description 14
- 229910000077 silane Inorganic materials 0.000 claims description 13
- -1 vinyl compound Chemical class 0.000 claims description 13
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 12
- 239000008199 coating composition Substances 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 8
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000178 monomer Substances 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 229920002554 vinyl polymer Polymers 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- 150000007934 α,β-unsaturated carboxylic acids Chemical group 0.000 claims description 2
- 238000000034 method Methods 0.000 description 27
- 239000004014 plasticizer Substances 0.000 description 24
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 15
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 238000013508 migration Methods 0.000 description 7
- 230000005012 migration Effects 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000011109 contamination Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 239000002585 base Substances 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000004342 Benzoyl peroxide Substances 0.000 description 4
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 4
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Chemical compound CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 235000019400 benzoyl peroxide Nutrition 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000004800 polyvinyl chloride Substances 0.000 description 4
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- MSXVEPNJUHWQHW-UHFFFAOYSA-N 2-methylbutan-2-ol Chemical compound CCC(C)(C)O MSXVEPNJUHWQHW-UHFFFAOYSA-N 0.000 description 3
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 235000019439 ethyl acetate Nutrition 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- HXVNBWAKAOHACI-UHFFFAOYSA-N 2,4-dimethyl-3-pentanone Chemical compound CC(C)C(=O)C(C)C HXVNBWAKAOHACI-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 2
- IEVADDDOVGMCSI-UHFFFAOYSA-N 2-hydroxybutyl 2-methylprop-2-enoate Chemical compound CCC(O)COC(=O)C(C)=C IEVADDDOVGMCSI-UHFFFAOYSA-N 0.000 description 2
- HCFAJYNVAYBARA-UHFFFAOYSA-N 4-heptanone Chemical compound CCCC(=O)CCC HCFAJYNVAYBARA-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- ZFOZVQLOBQUTQQ-UHFFFAOYSA-N Tributyl citrate Chemical compound CCCCOC(=O)CC(O)(C(=O)OCCCC)CC(=O)OCCCC ZFOZVQLOBQUTQQ-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 2
- WQAQPCDUOCURKW-UHFFFAOYSA-N butanethiol Chemical compound CCCCS WQAQPCDUOCURKW-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000009408 flooring Methods 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 238000007602 hot air drying Methods 0.000 description 2
- 238000007603 infrared drying Methods 0.000 description 2
- PHTQWCKDNZKARW-UHFFFAOYSA-N isoamylol Chemical compound CC(C)CCO PHTQWCKDNZKARW-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 235000012424 soybean oil Nutrition 0.000 description 2
- 239000003549 soybean oil Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- 239000001124 (E)-prop-1-ene-1,2,3-tricarboxylic acid Substances 0.000 description 1
- ULPMRIXXHGUZFA-UHFFFAOYSA-N (R)-4-Methyl-3-hexanone Natural products CCC(C)C(=O)CC ULPMRIXXHGUZFA-UHFFFAOYSA-N 0.000 description 1
- PGTWKVZJMDBYEQ-UHFFFAOYSA-N 2,2-dimethylpropyl trimethyl silicate Chemical compound CO[Si](OC)(OC)OCC(C)(C)C PGTWKVZJMDBYEQ-UHFFFAOYSA-N 0.000 description 1
- YAJYJWXEWKRTPO-UHFFFAOYSA-N 2,3,3,4,4,5-hexamethylhexane-2-thiol Chemical compound CC(C)C(C)(C)C(C)(C)C(C)(C)S YAJYJWXEWKRTPO-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- DZMBJYYGSSZIBI-UHFFFAOYSA-N 2-butoxyprop-2-enamide Chemical compound CCCCOC(=C)C(N)=O DZMBJYYGSSZIBI-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- NJRHMGPRPPEGQL-UHFFFAOYSA-N 2-hydroxybutyl prop-2-enoate Chemical compound CCC(O)COC(=O)C=C NJRHMGPRPPEGQL-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- ZWMJUBVSXUPLKD-UHFFFAOYSA-N 2-hydroxypentyl 2-methylprop-2-enoate Chemical compound CCCC(O)COC(=O)C(C)=C ZWMJUBVSXUPLKD-UHFFFAOYSA-N 0.000 description 1
- FQLZCZIQXBTZGB-UHFFFAOYSA-N 2-hydroxypentyl prop-2-enoate Chemical compound CCCC(O)COC(=O)C=C FQLZCZIQXBTZGB-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- GOLYTOVWWJCSJM-UHFFFAOYSA-N 3-butoxy-2-methylprop-2-enamide Chemical compound CCCCOC=C(C)C(N)=O GOLYTOVWWJCSJM-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- PFCHFHIRKBAQGU-UHFFFAOYSA-N 3-hexanone Chemical compound CCCC(=O)CC PFCHFHIRKBAQGU-UHFFFAOYSA-N 0.000 description 1
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 description 1
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- VVAAYFMMXYRORI-UHFFFAOYSA-N 4-butoxy-2-methylidene-4-oxobutanoic acid Chemical compound CCCCOC(=O)CC(=C)C(O)=O VVAAYFMMXYRORI-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- ZPQAKYPOZRXKFA-UHFFFAOYSA-N 6-Undecanone Chemical compound CCCCCC(=O)CCCCC ZPQAKYPOZRXKFA-UHFFFAOYSA-N 0.000 description 1
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 1
- XFOFBPRPOAWWPA-UHFFFAOYSA-N 6-hydroxyhexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCO XFOFBPRPOAWWPA-UHFFFAOYSA-N 0.000 description 1
- OCIFJWVZZUDMRL-UHFFFAOYSA-N 6-hydroxyhexyl prop-2-enoate Chemical compound OCCCCCCOC(=O)C=C OCIFJWVZZUDMRL-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 239000004803 Di-2ethylhexylphthalate Substances 0.000 description 1
- XTJFFFGAUHQWII-UHFFFAOYSA-N Dibutyl adipate Chemical compound CCCCOC(=O)CCCCC(=O)OCCCC XTJFFFGAUHQWII-UHFFFAOYSA-N 0.000 description 1
- ZVFDTKUVRCTHQE-UHFFFAOYSA-N Diisodecyl phthalate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC(C)C ZVFDTKUVRCTHQE-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- RQVFGTYFBUVGOP-UHFFFAOYSA-N [acetyloxy(dimethyl)silyl] acetate Chemical compound CC(=O)O[Si](C)(C)OC(C)=O RQVFGTYFBUVGOP-UHFFFAOYSA-N 0.000 description 1
- TVJPBVNWVPUZBM-UHFFFAOYSA-N [diacetyloxy(methyl)silyl] acetate Chemical compound CC(=O)O[Si](C)(OC(C)=O)OC(C)=O TVJPBVNWVPUZBM-UHFFFAOYSA-N 0.000 description 1
- RMKZLFMHXZAGTM-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl prop-2-enoate Chemical compound CCC[Si](OC)(OC)OCOC(=O)C=C RMKZLFMHXZAGTM-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229940091181 aconitic acid Drugs 0.000 description 1
- 150000001253 acrylic acids Chemical class 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 150000001278 adipic acid derivatives Chemical class 0.000 description 1
- 239000012773 agricultural material Substances 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- SHLNMHIRQGRGOL-UHFFFAOYSA-N barium zinc Chemical compound [Zn].[Ba] SHLNMHIRQGRGOL-UHFFFAOYSA-N 0.000 description 1
- AGXUVMPSUKZYDT-UHFFFAOYSA-L barium(2+);octadecanoate Chemical compound [Ba+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O AGXUVMPSUKZYDT-UHFFFAOYSA-L 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- CQMMOPRVVGWRJK-UHFFFAOYSA-N bis(2,2-dimethylpropyl) dimethyl silicate Chemical compound CC(C)(C)CO[Si](OC)(OC)OCC(C)(C)C CQMMOPRVVGWRJK-UHFFFAOYSA-N 0.000 description 1
- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- GTZCVFVGUGFEME-IWQZZHSRSA-N cis-aconitic acid Chemical compound OC(=O)C\C(C(O)=O)=C\C(O)=O GTZCVFVGUGFEME-IWQZZHSRSA-N 0.000 description 1
- 150000001860 citric acid derivatives Chemical class 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- GTBGXKPAKVYEKJ-UHFFFAOYSA-N decyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C(C)=C GTBGXKPAKVYEKJ-UHFFFAOYSA-N 0.000 description 1
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 1
- UCVPKAZCQPRWAY-UHFFFAOYSA-N dibenzyl benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC=2C=CC=CC=2)C=1C(=O)OCC1=CC=CC=C1 UCVPKAZCQPRWAY-UHFFFAOYSA-N 0.000 description 1
- JBSLOWBPDRZSMB-FPLPWBNLSA-N dibutyl (z)-but-2-enedioate Chemical compound CCCCOC(=O)\C=C/C(=O)OCCCC JBSLOWBPDRZSMB-FPLPWBNLSA-N 0.000 description 1
- PUFGCEQWYLJYNJ-UHFFFAOYSA-N didodecyl benzene-1,2-dicarboxylate Chemical compound CCCCCCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCCCCCC PUFGCEQWYLJYNJ-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- SLQTWNAJXFHMHM-UHFFFAOYSA-N dimethoxy-methyl-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](C)(OC)OC)CCC2OC21 SLQTWNAJXFHMHM-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 208000028659 discharge Diseases 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- QQVHEQUEHCEAKS-UHFFFAOYSA-N diundecyl benzene-1,2-dicarboxylate Chemical compound CCCCCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCCCCC QQVHEQUEHCEAKS-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- MASNVFNHVJIXLL-UHFFFAOYSA-N ethenyl(ethoxy)silicon Chemical compound CCO[Si]C=C MASNVFNHVJIXLL-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920005669 high impact polystyrene Polymers 0.000 description 1
- 239000004797 high-impact polystyrene Substances 0.000 description 1
- 230000036571 hydration Effects 0.000 description 1
- 238000006703 hydration reaction Methods 0.000 description 1
- UACSZOWTRIJIFU-UHFFFAOYSA-N hydroxymethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCO UACSZOWTRIJIFU-UHFFFAOYSA-N 0.000 description 1
- GJIDOLBZYSCZRX-UHFFFAOYSA-N hydroxymethyl prop-2-enoate Chemical compound OCOC(=O)C=C GJIDOLBZYSCZRX-UHFFFAOYSA-N 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 150000002531 isophthalic acids Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 150000002688 maleic acid derivatives Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- CSNJSTXFSLBBPX-UHFFFAOYSA-N n'-(trimethoxysilylmethyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CNCCN CSNJSTXFSLBBPX-UHFFFAOYSA-N 0.000 description 1
- XFFPIAQRIDTSIZ-UHFFFAOYSA-N n'-[3-(dimethoxymethylsilyl)propyl]ethane-1,2-diamine Chemical compound COC(OC)[SiH2]CCCNCCN XFFPIAQRIDTSIZ-UHFFFAOYSA-N 0.000 description 1
- WIBFFTLQMKKBLZ-SEYXRHQNSA-N n-butyl oleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCCCC WIBFFTLQMKKBLZ-SEYXRHQNSA-N 0.000 description 1
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 description 1
- 150000002888 oleic acid derivatives Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 150000003021 phthalic acid derivatives Chemical class 0.000 description 1
- JQCXWCOOWVGKMT-UHFFFAOYSA-N phthalic acid diheptyl ester Natural products CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC JQCXWCOOWVGKMT-UHFFFAOYSA-N 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007763 reverse roll coating Methods 0.000 description 1
- WBHHMMIMDMUBKC-XLNAKTSKSA-N ricinelaidic acid Chemical class CCCCCC[C@@H](O)C\C=C\CCCCCCCC(O)=O WBHHMMIMDMUBKC-XLNAKTSKSA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- GTZCVFVGUGFEME-UHFFFAOYSA-N trans-aconitic acid Natural products OC(=O)CC(C(O)=O)=CC(O)=O GTZCVFVGUGFEME-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- KEROTHRUZYBWCY-UHFFFAOYSA-N tridecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)C(C)=C KEROTHRUZYBWCY-UHFFFAOYSA-N 0.000 description 1
- XOALFFJGWSCQEO-UHFFFAOYSA-N tridecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)C=C XOALFFJGWSCQEO-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- ROWWCTUMLAVVQB-UHFFFAOYSA-N triethoxysilylmethanamine Chemical compound CCO[Si](CN)(OCC)OCC ROWWCTUMLAVVQB-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Laminated Bodies (AREA)
- Paints Or Removers (AREA)
Description
「産業上の利用分野」
本発明は、塩化ビニル系樹脂成形品に関する。
さらに詳しくは、可塑剤などの表面移行を防止
し、成形品表面の汚染を防止した塩化ビニル系樹
脂成形品に係わるものである。
「従来の技術」
塩化ビニル系樹脂は、比較的安価で、化学的変
化をおこしにくく、可塑剤をその量を変えて配合
することにより、硬質から軟質まで広範囲に性質
を変えることができる。そしして例えば硬質のパ
イプ、床材、シート、フイルム、軟質のビニルク
ロス、繊維、壁材、シート、フイルム、日用品雑
貨等、硬軟ともに多くの用途がある。
しかし、可塑剤を配合した塩化ビニル系樹脂成
形品は、長期間経過すると、可塑剤が成形品表面
にブリード・アウトし、他の物質に移行したり、
水や溶剤などに抽出されるなどして、好ましくな
い現象を呈するという欠点がある。
例えば、ABS樹脂、耐衝撃性ポリスチレン又
は一般用ポリスチレン等のスチレン系樹脂よりな
るテレビジヨン、ビデオデツキ、パーソナルコン
ピユーター等の電気製品のハウジングに軟質塩化
ビニル系樹脂成形品が接触すると、ハウジングに
可塑剤が移行る。この移行により、ハウジングに
は汚染斑が生じたり、亀裂が生じたりして美観を
損ね、商品価値を著しく低下させ、場合によつて
は機能を低下させることもある。
また、塩化ビニル系樹脂よりなる成形品が、床
材、壁材などの内装材料、テントなどの屋外で使
用されるものである場合は、成形品表面にブリー
ド・アウトした可塑剤に、塵埃が付着して汚染さ
れるという欠点がある。成形品が包装用に使用さ
れるフイルムである場合には、ブリード・アウト
した可塑剤がフイルムへの印刷性を低下させた
り、ヒートシール法によつて接着した部分の強度
を低下させる。
これらの問題を解決する方法として塩化ビニル
系樹脂成形品の表面を、特定の樹脂や塗料で被覆
する手法が提案されている。例えば特公昭46−
29639号公報、特公昭50−28117号公報等には、塩
化ビニル系樹脂成形品の表面に、アクリル系樹脂
を塗布する方法が提案されている。更に、特公昭
52−6214号公報には、官能基を有するビニルモノ
マー共重合体の溶剤溶液に、イソシアネートまた
はメラミン樹脂を架橋剤として加え、ポリ塩化ビ
ニルフイルムに塗布し、フイルム上で部分架橋さ
せる方法が提案されている。
しかしながら、上記改良法に従つて成形品表面
に形成される被膜は、いずれも熱可塑性樹脂を主
体としたものであるため、使用時または使用前の
保管の際の雰囲気温度が高い場合には、可塑剤等
の成形品表面へのブリード・アウトを防止するの
に充分でなく、所望の性能を発揮し得ないという
欠点があつた。
これらの欠点を改良するために、例えば特開昭
55−161826号公報には、塩化ビニル系樹脂成形品
の表面に、エネルギー線照射により重合するエポ
キシ樹脂組成物に由来する被膜を形成する方法が
提案されている。また、特開昭56−53070号公報
には、ポリ塩化ビニルフイルムの片面または両面
に、光または電子線で硬化しうるα,β−不飽和
基を有するカルボン酸誘導体を塗布して、この塗
布液に由来する被膜を形成する方法が記載されて
いる。
しかしながら、これらの改良法によつても、成
形品表面への可塑剤ブリード・アウトを防止し、
成形品表面の汚染を防止するには、充分ではない
というのが実状である。
「発明が解決しようとする問題点」
本発明者らは、かかる状況にあつて、塩化ビニ
ル系樹脂成形品に配合される諸添加剤、特に可塑
剤の表面移行を防止し、成形品表面の汚染を防止
した塩化ビニル系樹脂成形品を提供することを目
的として、鋭意検討た結果、本発明を完成するに
至つたものである。
「問題点を解決するための手段」
上記の問題点は本発明に係わる塩化ビニル系樹
脂成形品を使用することにより解決される。すな
わち、本発明の要旨とするところは、塩化ビニル
系樹脂成形品表面に、珪素原子に直結する加水分
解性基を有するシラン重合体あるいはその加水分
解物を、特定のアクリル系樹脂に混合した被覆組
成物に由来する被膜が形成されてなることを特徴
とする塩化ビニル系樹脂成形品に存する。
以下、本発明を詳細に説明する。
本発明において塩化ビニル系樹脂とは、ポリ塩
化ビニルのほか、塩化ビニルが主成分を占める共
重合体を含む。塩化ビニルと共重合しうる単量体
化合物としては、塩化ビニリデン、エチレン、プ
ロピレン、アクリロニトリル、マレイン酸、イタ
コン酸、アクリル酸、メタクリル酸、酢酸ビニル
等があげられる。これら塩化ビニル系樹脂は、乳
化重合法、懸濁重合法、溶液重合法、塊状重合法
等の従来公知の製造法のうち、いずれの方法によ
つて製造されたものであつてもよい。
上記基体となる塩化ビニル系樹脂には、柔軟性
を付与するために、この樹脂100重量部に対して、
1重量部以上、好ましくは20〜60重量部の可塑剤
が配合される。可塑剤の配合量を上記範囲とする
ことにより、目的の軟質塩化ビニル成形品に、す
ぐれた柔軟性と機械的性質を付与させることがで
きる。
可塑剤としては、例えば、ジ−n−オクチルフ
タレート、ジ−2−エチルヘキシルフタレート、
ジベンジルフタレート、ジイソデシルフタレー
ト、ジドデシルフタレート、ジウンデシルフタレ
ート等のフタル酸誘導体;ジオクチルフタレート
等のイソフタル酸誘導体;ジ−n−ブチルアジペ
ート、ジオクチルアジペート等のアジピン酸誘導
体;ジ−n−ブチルマレート等のマレイン酸誘導
体;トリ−n−ブチルシトレート等のクエン酸誘
導体;モノブチルイタコネート等のイタコン酸誘
導体;ブチルオレエート等のオレイン酸誘導体;
グリセリンモノシノレート等のリシノール酸誘導
体;その他、トリクレジルホスフエート、トリキ
シレニルホスフエート等のリン酸エステル系可塑
剤、エポキシ化大豆油、エポキシ樹脂系可塑剤等
があげられる。
上記塩化ビニル系樹脂には、前記可塑剤のほか
に、必要に応じて、成形用の合成樹脂に通常配合
される公知の樹脂添加物、例えば、熱安定剤、酸
化防止剤、滑剤、帯電防止剤、界面活性剤、紫外
線吸収剤、光安定剤、顔料、染料等を配合するこ
とができる。しかして、可塑剤を含め、その他公
知の樹脂添加物を配合し、成形用の塩化ビニル系
樹脂配合組成物とするには、通常の配合、混合技
術、例えばリボンブレンダー、バンバリーミキサ
ー、スーパーミキサーその他の配合機、混合機を
使用する方法を採用することができる。
塩化ビニル系樹脂配合組成物を成形して、本発
明の軟質塩化ビニル系樹脂成形品にする場合の形
状については特に制限はない。しかし、被覆を形
成する工程の容易さからシート状、フイルム状、
板状、あるいは管状の形態のものが適している。
これらの成形法としては、通常行われる、例えば
カレンダー成形法、押出成形法、インフレーシヨ
ン成形法、射出成形法等のなかから適宜採用され
る。
本発明で使用する、珪素原子に直結する加水分
解性基を有するシラン重合体としてては具体的に
は、アミノメチルトリエトキシシラン、N−β−
アミノエチルアミノメチルトリメトキシシラン、
γ−アミノプロピルトリメトキシシラン、N−
(トリメトキシシリルプロピル)−エチレンジアミ
ン、N−(ジメトキシメチルシリルプロピル)−エ
チレンジアミン等のアミノアルキルアルコキシシ
ラン;γ−グリシドキプロピルトリメトキシシラ
ン、γ−グリシドキシプロピルメチルジメトキシ
シラン、β−(3,4−エポキシシクロヘキシル)
エチルトリメトキシシラン、β−(3,4−エポ
キシシクロヘキシル)エチルメチルジメトキシシ
ラン等のエポキシアルキルアルコキシシラン;γ
−メルカプトプロピルトリメトキシシラン、γ−
メルカプトプロピルメチルジメトキシシラン等の
メルカプトアルキルアルコキシシラン;テトラメ
トキシシラン、テトラエトキシシラン、テトラブ
トキシシラン、トリメトキシネオペントキシシラ
ン、ジメトキシジネオペントキシシラン等のテト
ラアルコキシシラン;メチルトリメトキシシラ
ン、メチルトリエトキシシラン、エチルトリメト
キシシラン、エチルトリエトキシシラン等のアル
キルトリアルコキシシラン;ジメチルジメトキシ
シラン、ジメチルジエトキシシラン等のジアルキ
ルアルコキシシラン;γ−クロロプロピルトリメ
トキシシラン、3,3,3−トリクロロプロピル
トリメトキシシラン等のハロゲン化アルキルアル
コキシシラン;メチルトリアセトキシシラン、ジ
メチルジアセトキシシラン等のアルキルアシロキ
シシラン;トリメトキシシラン、トリエトキシシ
ラン等にヒドロシラン化合物;ビニルトリメトキ
シシラン、ビニルエトキシシラン、ビニルトリス
(β−メトキシエトキシ)シラン、アリルトリエ
トキシシラン、γ−(メタ)アクリロキシプロピ
ルトリメトキシシラン、γ−(メタ)アクリロキ
シプロピルトリエトキシシラン、γ−(メタ)ア
クリロキシプロピルメチルジメトキシシラン等の
不飽和基含有シラン化合物の重合体等を挙げるこ
とができる。本発明においてはさらに加水分解物
を使用する事ができる。加水分解物は例えば酸な
いしアルカリ触媒存在下、加水分解性基を有する
シラン重合体にアルコール併用系にて水を添加す
ることによつて合成されるものであつて、加水分
解性基を有するシラン重合体に対して当量以上の
水を添加すると完全に加水分解したアルコール性
のシリカゲルないしシリカゾル、シロキサン系複
合物が得られ、当量に満たない水を添加した場合
には、その比率に応じた加水分解物が調製され
る。これら珪素原子に直結する加水分解性基を有
するシラン重合体の中で、特にテトラアルコキシ
シランの重合体あるいはその加水分解物が好まし
い。又これらは併用しても差支えない。
本発明においてアクリル系樹脂とは、ヒドロキ
シアルキル(メタ)アクリレート5〜40重量%、
分子内に1個もしくは2個以上のカルボキシル基
を含むα,β−不飽和カルボン酸0〜20重量%及
びこれら化合物と共重合可能な他のビニル系化合
物とを共重合して得られる重合体をいう。
ここでいうヒドロキシアルキル(メタ)アクリ
レートとはヒドロキシアルキルアクリレート又は
ヒドロキシアルキルメタクリレートを意味する。
ヒドロキシアルキル(メタ)アクリレート類と
しては、ヒドロキシメチルアクリレート、ヒドロ
キシメチルメタクリレート、2−ヒドロキシエチ
ルアクリレート、2−ヒドロキシエチルメタクリ
レート、2−ヒドロキシプロピルアクリレート、
2−ヒドロキシプロピルメタクリレート、3−ヒ
ドロキシプロピルアクリレート、3−ヒドロキシ
プロピルメタクリレート、2−ヒドロキシブチル
アクリレート、2−ヒドロキシブチルメタクリレ
ート、4−ヒドロキシブチルアクリレート、4−
ヒドロキシブチルメタクリレート、2−ヒドロキ
シペンチルアクリレート、2−ヒドロキシペンチ
ルメタクリレート、6−ヒドロキシヘキシルアク
リレート、6−ヒドロキシヘキシルメタクリレー
ト等があげられる。
このヒドロキシアルキル(メタ)アクリリレー
ト類のアクリル系樹脂中で占める割合が5重量%
より少ない場合は、有機溶媒との溶解性、基体成
形品との密着性及び可塑剤移行抑制効果を充分に
発揮し得ないので好ましくない。他方、40重量%
より多い場合にはコスト高となりコスト上昇に較
べて得られる効果は大きくないので好ましくな
い。
分子内に1個もしくは2個以上のカルボキシル
基を含むα,β−不飽和カルボン酸化合物として
は、アクリル酸、メタクリル酸、イタコン酸、マ
レイン酸、アコニツト酸、クロトン酸等があげら
れる。これら化合物を、前記ヒドロキシアルキル
(メタ)アクリレート類と併用すると、アクリル
樹脂に前記シラン化合物を混合した被覆組成物と
塩化ビニル系樹脂基体フイルムとの密着性が向上
し、フイルム同士が付着し合う(ブロツキングす
る)性質を抑制する効果を発揮する。これら化合
物の使用量は、20重量%までである。これ以上で
あると、フイルムが水分で漏れているときにフイ
ルム同士が付着し合う性質(湿潤時のブロツキン
グ性)が強化されるので、好ましくない。
残部を構成する前記化合物と共重合可能な他の
ビニル系化合物としては、メチルアクリレート、
エチルアクリレート、n−プロピルアクリレー
ト、iso−プロピルアクリレート、n−ブチルア
クリレート、iso−ブチルアクリレート、シクロ
ヘキシルアクリレート、2−エチルヘキシルアク
リレート、デシルアクリレート、ドデシルアクリ
レート、トリデシルアクリレート、ステアリルア
クリレート等のようなアクリル酸のC1〜C22のア
ルキルエステル類:メチルメタクリレート、エチ
ルメタクリレート、n−プロピルメタクリレー
ト、iso−プロピルメタクリレート、n−ブチル
メタクリレート、iso−ブチルメタクリレート、
シクロヘキシルメタクリレート、2−エチルヘキ
シルメタクリレート、デシルメタクリレート、ド
デシルメタクリレート、トリデシルメタクリレー
ト、ステアリルメタクリレート等のようなメタク
リル酸のC1〜C22のアルキルエステル類:スチレ
ン、アクリロニトリル、メタクリロニトリル、酢
酸ビニル、プロピオン酸ビニル、アクリルアミ
ド、メタクリルアミド、n−ブトキシアクリルア
ミド、n−ブトキシメタクリルアミド等をあげる
ことができる。
アクリル系樹脂は、上記単量体の2種以上を所
定量組も合せて有機溶媒とともに重合缶に仕込
み、重合開始剤、必要に応じて分子量調節剤を加
えて、攪拌しつつ加熱し、重合する。この際、使
用しうる重合開始剤としては、α,α−アゾビス
イソブチロニトリル、ベンゾイルパーオキサイ
ド、クメンハイドロパーオキサイド等のラジカル
生成触媒があげられ、分子量調節剤としてはブチ
ルメルカプタン、n−ドデシルメルカプタン、
tert−ドデシルメルカプタン、β−メルカプトエ
タノール等があげられる。
重合に用いる有機溶媒としては、メタノール、
エタノール、n−プロパノール、イソプロパノー
ル、n−ブタノール、sec−ブタノール、tert−
ブタノール、n−アミルアルコール、イソアミル
アルコール、tert−アミルアルコール、n−ヘキ
シルアルコール、シクロヘキサノール等のアルコ
ール類;ベンゼン、トルエン、キシレン等の芳香
族炭化水素類;酢酸エチル、酢酸ブチル等の酢酸
エステル類;アセトン、メチルエチルケトン、メ
チル−n−プロピルケトン、メチルイソブチルケ
トン、ジエチルケトン、2−ヘキサノン、3−ヘ
キサノン、ジ−n−プロピルケトン、ジイソプロ
ピルケトン、ジ−n−アミルケトン、シクロヘキ
サノン等のケトン類;テトラヒドロフラン等があ
り、これらは1種もしくは2種以上混合して使用
することができる。
上記シラン重合体アクリル系樹脂との配合割合
は、固形分重量比で前者が1〜90対後者が99〜10
(両者の合計量を100とする。)の割合がよく、特
に好ましいのは、5〜80対95〜20である。前者の
配合割合がこれより少ないと、形成される被膜の
可塑剤等の移行防止性、耐汚染性の効果が充分で
なく、又逆にこれよりも多いと形成される被膜が
べたつき易く、好ましくない。
上記被覆組成物は有機溶媒に溶解して用いるこ
とができる。
有機溶媒としては、メタノール、エタノール、
イソプロピルアルコール等のアルコール類、ヘプ
タン、シクロヘキサン等の脂肪族炭化水素類、ベ
ンゼン、トルエン、キシレン等の芳香族炭化水素
類、アセトン、メチルエチルケトン、メチルイソ
ブチルケトン等のケトン類、酢酸エチル、酢酸n
−ブチル等の酢酸エステル類等を単独もしくは2
種以上の併用で使うことができる。
上記被覆組成物には、これら成分の他に、補助
的な成分、例えば酸化防止剤、中和剤、紫外線吸
収剤、光安定剤、帯電防止剤、顔料、染料、滑剤
等を配合することができる。
上記被覆組成物を塗布し塩化ビニル系樹脂成形
品表面に被膜を形成するには、成形品の形状に応
じて公知の各種方法が適用される。例えば、溶液
状態で被膜を形成する場合は、ドクターブレード
コート法、グラビアロールコート法、エヤナイフ
コート法、リバースロールコート法、デイプコー
ト法、カーテンロールコート法、スプレイコート
法、ロツドコート法等の塗布方法が用いられる。
また、溶液状態とせず上記被覆組成物を単独の被
膜として形成する場合は、共押出し法、押出しコ
ーテイング法、押出しラミネート法、ラミネート
法が用いられる。
被膜形成法として、塗布方式を用いた場合の溶
剤の乾燥方法としては、例えば自然乾燥法、熱風
乾燥法、赤外線乾燥法、遠赤外線乾燥法等がある
が、乾燥速度、安全性を勘案すれば熱風乾燥法が
有利である。この場合の温度条件は50〜150℃の
範囲とし、時間は10秒〜15分の間で選ぶのがよ
い。
上記被覆組成物を塩化ビニル系樹脂成形品の表
面に塗布して被膜とする場合の塗布量は、塗布方
式で、乾燥固化後の量として、0.1g/m2〜10
g/m2の範囲とするのが好ましい。0.1g/m2よ
り少ないと、塩化ビニル系樹脂成形品中の可塑剤
の表面移行を防止する効果が不充分である。ま
た、10g/m2以上であると、被膜量が多過ぎて、
経済的に不利となり、特に被膜される塩化ビニル
系樹脂成形品がフイルム状の構造物である場合
は、その機械的強度が低下することがある。した
がつて、通常は、0.5g/m2〜5g/m2の範囲が
最も好ましい。なお、上記被覆組成物を被覆する
前に、塩化ビニル系樹脂成形品の表面を予め、ア
ルコールまたは水で洗浄したり、プラズマ放電処
理、あるいはコロナ放電処理したり、他の塗料あ
るいはプライマーを下塗りする等の前処理を施し
ておいてもよい。
「発明の効果」及び「作用」
本発明に係わる塩化ビニル系樹脂成形品は、そ
の表面に特定の被膜が形成されており、この被膜
が成形品に配合された可塑剤等の各種樹脂添加物
の滲み出しを防止するので耐汚染性に優れるもの
である。従つて本発明の塩化ビニル系樹脂成形品
は美麗な外観を長く維持することができ、電機器
具、内装材、農業用資材等、様々な分野で利用で
き、その産業上の利用価値は大きい。
「実施例」
以下、本発明を実施例にもとづいて詳細に説明
するが、本発明はその要旨を超えない限り、以下
の例に限定されるものではない。
実施例1〜6、比較例1〜3
基体フイルムの調製
ポリ塩化ビニル(=1400) 100重量部
ジオクチルフタレート 50 〃
エポキシ化大豆油 3 〃
バリウム−亜鉛系複合液状安定剤 1.5 〃
ステアリン酸バリウム 0.2 〃
ステアリン酸亜鉛 0.4 〃
よりなる樹脂組成物を準備し、これをスーパーミ
キサーで10分間混合したのち、180℃に加温した
ミルロール上で混練し、厚さ0.3mmの軟質塩化ビ
ニル系樹脂フイルムを調製した。
アクリル系樹脂の調製
A 温度計、攪拌機、還流冷却器および仕込用ノ
ズルを備えた反応器に、2−ヒドロキシエチル
メタクリレート15重量部、アクリル酸5重量
部、メチルメタクリレート45重量部、n−ブチ
ルアクリレート35重量部、ベンゾイルパーオキ
サイド1重量部、メチルエチルケトン200重量
部を仕込み、窒素ガス気流中で攪拌しつつ、80
℃で7時間反応させ、アクリル系樹脂溶液を得
た。これをアクリル系樹脂(A)とする。
B A項に記載した例で使用したのと同じ反応器
に、2−ヒドロキシエチルメタクリレート10重
量部、メタクリル酸3重量部、メチルメタクリ
レート60重量部、ブチルメタクリレート27重量
部、ベンゾイルパーオキサイド1重量部、メチ
ルエチルケトン200重量部を仕込み、A項に記
載したのと同様の手順で反応させ、アクリル系
樹脂溶液を得た。これをアクリル系樹脂(B)とす
る。
C A項に記載した例で使用したのと同じ反応器
にメチルメタクリレート55重量部、ブチルメタ
クリレート40重量部、ブチルアクリレート5重
量部、ベンゾイルパーオキサイド1重量部、メ
チルエチルケトン200重量部を仕込み、A項に
記載したのと同様の手順で反応させ、アクリル
系樹脂溶液を得た。これをアクリル系樹脂(C)と
する。
被膜の形成
第1表に示した種類及び量のシラン重合体とア
クリル系樹脂とを配合し、これに固形分が20重量
%となるようにイソプロピルアルコールを加え、
被覆組成物を得た。ただし、比較例2にあつては
シラン重合体を配合しなかつた。又、比較例3に
あつてはアクリル系樹脂を配合しなかつた。
前記の方法で調製した基体フイルムの片面に、
上記被覆組成物を、#5バーコーターを用いて、
各々塗布した。塗布したフイルムを130℃のオー
ブン中に1分間保持して、溶剤を揮散させた。得
られた各フイルムの被膜の量は約3g/m2であつ
た。ただし、比較例1にあつては被膜を形成しな
かつた。
フイルムの評価
以下の方法においてフイルムの性能を評価し、
その結果を第1表に示す。
耐汚染性
フイルムの被膜面に、各汚染物質を付着させ、
48時間室温に放置したのち、汚染物質を脱脂綿で
ふき取つて、痕跡を観察した。この評価基準は、
次のとおりである。
◎…痕跡が全く認められないもの。
〇…被膜の一部に、痕跡が認められるもの。
△…被膜の2/3以上に、痕跡が認められるもの。
×…被膜全面に、痕跡が認められるもの。
可塑剤移行試験
9種類のフイルムを、各々10cm×10cm角に切断
し、被膜が形成されている面に、厚さ0.5mmのポ
リスチレンシートを密着させた。この状態で、2
Kgの荷重をかけ、50℃に保持したオーブン内に、
48時間放置した。
ついでオーブンから取り出し、荷重をとり、ポ
リスチレンシートを剥離したのち、9種類のフイ
ルム各々の減量を測定した。
この減量は、数値が小さいほど、フイルム表面
からの可塑剤の移行が少ないことを示す。
剥離性(べたつき性)
9種類のフイルムを、各々幅5cm、長さ20cmに
切断し、長い方向に対して直角の方向に5cm間隔
で交互に折り返した。この状態で、上から2Kgの
荷重をかけ、50℃に保持したオーブン内に、1時
間放置した。そして、オーブンから取り出し、荷
重をとり、フイルムを引き剥がしその際の剥離性
を観察した。この評価基準は、次のとおりであ
る。
◎…全く抵抗がなく、容易に剥がれるもの。
△…やや抵抗があるもの。
×…非常に抵抗があり、剥剥がすのに力を要す
るもの。
"Industrial Application Field" The present invention relates to a vinyl chloride resin molded article.
More specifically, the present invention relates to a vinyl chloride resin molded product that prevents surface migration of plasticizers and the like and prevents contamination of the surface of the molded product. ``Prior Art'' Vinyl chloride resins are relatively inexpensive and difficult to undergo chemical changes, and their properties can be varied over a wide range from hard to soft by adding different amounts of plasticizer. Both hard and soft materials have many uses, such as hard pipes, flooring materials, sheets, films, soft vinyl cloth, fibers, wall materials, sheets, films, and daily necessities. However, over a long period of time in vinyl chloride resin molded products containing plasticizers, the plasticizer bleeds out onto the surface of the molded product and transfers to other substances.
It has the disadvantage of exhibiting undesirable phenomena such as being extracted by water or solvents. For example, if a soft vinyl chloride resin molded product comes into contact with the housing of an electrical product such as a television, video deck, or personal computer, which is made of styrene resin such as ABS resin, high-impact polystyrene, or general-use polystyrene, the housing may be exposed to plasticizer. Migrate. This migration can cause contamination spots and cracks on the housing, impairing its aesthetic appearance, significantly lowering its commercial value, and even lowering its functionality in some cases. In addition, if molded products made of vinyl chloride resin are used as flooring materials, interior materials such as wall materials, or outdoors such as tents, dust may accumulate on the plasticizer that bleeds out onto the surface of the molded product. It has the disadvantage of being contaminated due to adhesion. When the molded product is a film used for packaging, the bleed-out plasticizer reduces the printability of the film or reduces the strength of the parts bonded by heat sealing. As a method to solve these problems, a method has been proposed in which the surface of a vinyl chloride resin molded article is coated with a specific resin or paint. For example, special public service in 1977-
No. 29639, Japanese Patent Publication No. 50-28117, etc. propose a method of applying an acrylic resin to the surface of a vinyl chloride resin molded product. Furthermore, Tokko Akira
Publication No. 52-6214 proposes a method in which isocyanate or melamine resin is added as a crosslinking agent to a solvent solution of a vinyl monomer copolymer having a functional group, and the mixture is applied to a polyvinyl chloride film and partially crosslinked on the film. ing. However, since the coatings formed on the surfaces of molded products according to the improved method described above are mainly made of thermoplastic resin, if the ambient temperature is high during use or storage before use, It has the disadvantage that it is not sufficient to prevent plasticizers and the like from bleeding out onto the surface of the molded product, and the desired performance cannot be achieved. In order to improve these shortcomings, for example,
Japanese Patent No. 55-161826 proposes a method of forming a film derived from an epoxy resin composition that is polymerized by energy ray irradiation on the surface of a vinyl chloride resin molded article. Furthermore, JP-A No. 56-53070 discloses that a carboxylic acid derivative having an α,β-unsaturated group that can be cured by light or electron beam is coated on one or both sides of a polyvinyl chloride film. A method of forming a coating derived from a liquid is described. However, even with these improved methods, it is difficult to prevent plasticizer bleed out onto the surface of the molded product.
The reality is that this is not sufficient to prevent contamination of the molded product surface. "Problems to be Solved by the Invention" Under such circumstances, the present inventors have attempted to prevent the surface migration of various additives, especially plasticizers, blended into vinyl chloride resin molded products, and to improve the surface of the molded products. The present invention has been completed as a result of intensive studies aimed at providing a vinyl chloride resin molded product that prevents contamination. "Means for Solving the Problems" The above problems can be solved by using the vinyl chloride resin molded article according to the present invention. That is, the gist of the present invention is to coat the surface of a vinyl chloride resin molded article with a silane polymer having a hydrolyzable group directly bonded to a silicon atom or a hydrolyzate thereof mixed with a specific acrylic resin. The present invention relates to a vinyl chloride resin molded article, characterized in that it is formed with a coating derived from a composition. The present invention will be explained in detail below. In the present invention, the vinyl chloride resin includes not only polyvinyl chloride but also copolymers whose main component is vinyl chloride. Examples of monomer compounds copolymerizable with vinyl chloride include vinylidene chloride, ethylene, propylene, acrylonitrile, maleic acid, itaconic acid, acrylic acid, methacrylic acid, and vinyl acetate. These vinyl chloride resins may be produced by any of conventionally known production methods such as emulsion polymerization, suspension polymerization, solution polymerization, and bulk polymerization. In order to impart flexibility to the vinyl chloride resin that serves as the base, 100 parts by weight of this resin is added.
1 part by weight or more, preferably 20 to 60 parts by weight of plasticizer is blended. By controlling the blending amount of the plasticizer within the above range, it is possible to impart excellent flexibility and mechanical properties to the desired soft vinyl chloride molded product. Examples of the plasticizer include di-n-octyl phthalate, di-2-ethylhexyl phthalate,
Phthalic acid derivatives such as dibenzyl phthalate, diisodecyl phthalate, didodecyl phthalate, and diundecyl phthalate; Isophthalic acid derivatives such as dioctyl phthalate; Adipic acid derivatives such as di-n-butyl adipate and dioctyl adipate; Di-n-butyl maleate, etc. Maleic acid derivatives; citric acid derivatives such as tri-n-butyl citrate; itaconic acid derivatives such as monobutyl itaconate; oleic acid derivatives such as butyl oleate;
Ricinoleic acid derivatives such as glycerin monosinolate; other examples include phosphate ester plasticizers such as tricresyl phosphate and tricylenyl phosphate, epoxidized soybean oil, and epoxy resin plasticizers. In addition to the plasticizer, the vinyl chloride resin may contain, if necessary, known resin additives that are usually added to synthetic resins for molding, such as heat stabilizers, antioxidants, lubricants, and antistatic agents. Agents, surfactants, ultraviolet absorbers, light stabilizers, pigments, dyes, etc. can be blended. However, in order to formulate a vinyl chloride resin compound composition for molding by blending other known resin additives, including plasticizers, conventional blending and mixing techniques such as a ribbon blender, Banbury mixer, super mixer, etc. are used. A method using a blender or mixer can be adopted. There are no particular limitations on the shape of the soft vinyl chloride resin molded article of the present invention by molding the vinyl chloride resin blended composition. However, due to the ease of forming the coating, sheet-like, film-like,
A plate-like or tubular form is suitable.
These molding methods are appropriately selected from commonly used methods such as calendar molding, extrusion molding, inflation molding, and injection molding. Specifically, the silane polymer having a hydrolyzable group directly bonded to a silicon atom used in the present invention includes aminomethyltriethoxysilane, N-β-
aminoethylaminomethyltrimethoxysilane,
γ-aminopropyltrimethoxysilane, N-
Aminoalkylalkoxysilanes such as (trimethoxysilylpropyl)-ethylenediamine, N-(dimethoxymethylsilylpropyl)-ethylenediamine; γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, β-(3, 4-epoxycyclohexyl)
Epoxyalkylalkoxysilane such as ethyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethylmethyldimethoxysilane; γ
-Mercaptopropyltrimethoxysilane, γ-
Mercaptoalkylalkoxysilanes such as mercaptopropylmethyldimethoxysilane; Tetraalkoxysilanes such as tetramethoxysilane, tetraethoxysilane, tetrabutoxysilane, trimethoxyneopentoxysilane, dimethoxydineopentoxysilane; methyltrimethoxysilane, methyltrimethoxysilane; Alkyltrialkoxysilanes such as ethoxysilane, ethyltrimethoxysilane and ethyltriethoxysilane; Dialkylalkoxysilanes such as dimethyldimethoxysilane and dimethyldiethoxysilane; γ-chloropropyltrimethoxysilane, 3,3,3-trichloropropyltrisilane, etc. Halogenated alkyl alkoxysilanes such as methoxysilane; Alkylaciloxysilanes such as methyltriacetoxysilane and dimethyldiacetoxysilane; hydrosilane compounds such as trimethoxysilane and triethoxysilane; vinyltrimethoxysilane, vinylethoxysilane, vinyltris(β -Unsaturation such as methoxyethoxy)silane, allyltriethoxysilane, γ-(meth)acryloxypropyltrimethoxysilane, γ-(meth)acryloxypropyltriethoxysilane, γ-(meth)acryloxypropylmethyldimethoxysilane, etc. Examples include polymers of group-containing silane compounds. In the present invention, a hydrolyzate can further be used. The hydrolyzate is synthesized, for example, by adding water to a silane polymer having a hydrolyzable group in the presence of an acid or alkali catalyst in the presence of an alcohol-containing silane polymer. When more than an equivalent amount of water is added to the polymer, completely hydrolyzed alcoholic silica gel or silica sol, or a siloxane-based composite is obtained; if less than an equivalent amount of water is added, hydration is performed according to the ratio. A decomposition product is prepared. Among these silane polymers having a hydrolyzable group directly bonded to a silicon atom, tetraalkoxysilane polymers or hydrolysates thereof are particularly preferred. Moreover, these may be used together. In the present invention, the acrylic resin refers to 5 to 40% by weight of hydroxyalkyl (meth)acrylate,
A polymer obtained by copolymerizing 0 to 20% by weight of an α,β-unsaturated carboxylic acid containing one or more carboxyl groups in the molecule and another vinyl compound that can be copolymerized with these compounds. means. The term hydroxyalkyl (meth)acrylate as used herein means hydroxyalkyl acrylate or hydroxyalkyl methacrylate. Hydroxyalkyl (meth)acrylates include hydroxymethyl acrylate, hydroxymethyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate,
2-hydroxypropyl methacrylate, 3-hydroxypropyl acrylate, 3-hydroxypropyl methacrylate, 2-hydroxybutyl acrylate, 2-hydroxybutyl methacrylate, 4-hydroxybutyl acrylate, 4-
Examples include hydroxybutyl methacrylate, 2-hydroxypentyl acrylate, 2-hydroxypentyl methacrylate, 6-hydroxyhexyl acrylate, and 6-hydroxyhexyl methacrylate. The proportion of this hydroxyalkyl (meth)acrylate in the acrylic resin is 5% by weight.
If the amount is less, it is not preferable because the solubility with the organic solvent, the adhesion with the base molded article, and the effect of inhibiting plasticizer migration cannot be sufficiently exhibited. On the other hand, 40% by weight
If the amount is larger than that, the cost will increase and the effect obtained will not be large compared to the increase in cost, which is not preferable. Examples of α,β-unsaturated carboxylic acid compounds containing one or more carboxyl groups in the molecule include acrylic acid, methacrylic acid, itaconic acid, maleic acid, aconitic acid, and crotonic acid. When these compounds are used in combination with the hydroxyalkyl (meth)acrylates, the adhesion between the coating composition, which is a mixture of the acrylic resin and the silane compound, and the vinyl chloride resin base film is improved, and the films adhere to each other ( It exhibits the effect of suppressing the blocking property. The amount of these compounds used is up to 20% by weight. If it is more than this, the property of films adhering to each other when they leak moisture (blocking property when wet) is strengthened, which is not preferable. Other vinyl compounds that can be copolymerized with the above compounds that make up the remainder include methyl acrylate,
Acrylic acids such as ethyl acrylate, n-propyl acrylate, iso-propyl acrylate, n-butyl acrylate, iso-butyl acrylate, cyclohexyl acrylate, 2-ethylhexyl acrylate, decyl acrylate, dodecyl acrylate, tridecyl acrylate, stearyl acrylate, etc. C1- C22 alkyl esters: methyl methacrylate, ethyl methacrylate, n - propyl methacrylate, iso-propyl methacrylate, n-butyl methacrylate, iso-butyl methacrylate,
C1- C22 alkyl esters of methacrylic acid such as cyclohexyl methacrylate, 2 - ethylhexyl methacrylate, decyl methacrylate, dodecyl methacrylate, tridecyl methacrylate, stearyl methacrylate, etc.: styrene, acrylonitrile, methacrylonitrile, vinyl acetate, propionic acid Examples include vinyl, acrylamide, methacrylamide, n-butoxyacrylamide, n-butoxymethacrylamide, and the like. Acrylic resin is prepared by combining a predetermined amount of two or more of the above monomers together with an organic solvent into a polymerization can, adding a polymerization initiator and, if necessary, a molecular weight regulator, and heating while stirring to polymerize. do. In this case, examples of polymerization initiators that can be used include radical-generating catalysts such as α,α-azobisisobutyronitrile, benzoyl peroxide, and cumene hydroperoxide, and examples of molecular weight regulators include butyl mercaptan and n- dodecyl mercaptan,
Examples include tert-dodecylmercaptan and β-mercaptoethanol. Organic solvents used for polymerization include methanol,
Ethanol, n-propanol, isopropanol, n-butanol, sec-butanol, tert-
Alcohols such as butanol, n-amyl alcohol, isoamyl alcohol, tert-amyl alcohol, n-hexyl alcohol, and cyclohexanol; Aromatic hydrocarbons such as benzene, toluene, and xylene; Acetic esters such as ethyl acetate and butyl acetate Ketones such as acetone, methyl ethyl ketone, methyl-n-propyl ketone, methyl isobutyl ketone, diethyl ketone, 2-hexanone, 3-hexanone, di-n-propyl ketone, diisopropyl ketone, di-n-amyl ketone, cyclohexanone; tetrahydrofuran These can be used alone or in combination of two or more. The mixing ratio of the above silane polymer and acrylic resin is 1 to 90 for the former and 99 to 10 for the latter in terms of solid content weight ratio.
(The total amount of both is 100.) The ratio is particularly preferably 5 to 80 to 95 to 20. If the blending ratio of the former is less than this, the effect of preventing migration of plasticizers etc. and stain resistance of the formed film will not be sufficient, and conversely, if it is more than this, the formed film will tend to be sticky, which is preferable. do not have. The above-mentioned coating composition can be used by dissolving it in an organic solvent. Examples of organic solvents include methanol, ethanol,
Alcohols such as isopropyl alcohol, aliphatic hydrocarbons such as heptane and cyclohexane, aromatic hydrocarbons such as benzene, toluene and xylene, ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone, ethyl acetate and acetic acid n
- Acetate esters such as butyl alone or in combination
Can be used in combination with more than one species. In addition to these components, the coating composition may contain auxiliary components such as antioxidants, neutralizers, ultraviolet absorbers, light stabilizers, antistatic agents, pigments, dyes, and lubricants. can. In order to apply the above-mentioned coating composition to form a film on the surface of a vinyl chloride resin molded article, various known methods can be applied depending on the shape of the molded article. For example, when forming a film in a solution state, coating methods such as doctor blade coating method, gravure roll coating method, air knife coating method, reverse roll coating method, dip coating method, curtain roll coating method, spray coating method, rod coating method, etc. is used.
In addition, when the coating composition is formed as a single film without being in a solution state, a coextrusion method, an extrusion coating method, an extrusion lamination method, and a lamination method are used. When a coating method is used as a film forming method, there are, for example, natural drying methods, hot air drying methods, infrared drying methods, far infrared drying methods, etc., but if drying speed and safety are taken into account, Hot air drying methods are advantageous. In this case, the temperature condition should be in the range of 50 to 150°C, and the time should be selected in the range of 10 seconds to 15 minutes. When applying the above-mentioned coating composition to the surface of a vinyl chloride resin molded article to form a film, the coating amount is 0.1 g/m 2 to 10 after drying and solidification, depending on the coating method.
A range of g/m 2 is preferred. If it is less than 0.1 g/m 2 , the effect of preventing the plasticizer from migrating to the surface of the vinyl chloride resin molded product is insufficient. In addition, if it is 10 g/m 2 or more, the amount of coating is too large,
This is economically disadvantageous, and especially when the vinyl chloride resin molded article to be coated is a film-like structure, its mechanical strength may decrease. Therefore, a range of 0.5 g/m 2 to 5 g/m 2 is usually most preferred. In addition, before coating with the above-mentioned coating composition, the surface of the vinyl chloride resin molded product is washed with alcohol or water, subjected to plasma discharge treatment or corona discharge treatment, or undercoated with other paint or primer. Pretreatment such as the following may be performed. "Effects of the Invention" and "Actions" The vinyl chloride resin molded product according to the present invention has a specific coating formed on its surface, and this coating can be used for various resin additives such as plasticizers blended into the molded product. It has excellent stain resistance because it prevents oozing out. Therefore, the vinyl chloride resin molded product of the present invention can maintain a beautiful appearance for a long time, and can be used in various fields such as electrical appliances, interior materials, agricultural materials, etc., and has great industrial value. "Examples" Hereinafter, the present invention will be explained in detail based on Examples, but the present invention is not limited to the following examples unless it exceeds the gist thereof. Examples 1 to 6, Comparative Examples 1 to 3 Preparation of base film Polyvinyl chloride (=1400) 100 parts by weight Dioctyl phthalate 50 Epoxidized soybean oil 3 Barium-zinc composite liquid stabilizer 1.5 Barium stearate 0.2 A resin composition consisting of 0.4 mm of zinc stearate was prepared, mixed for 10 minutes using a super mixer, and then kneaded on a mill roll heated to 180°C to prepare a soft vinyl chloride resin film with a thickness of 0.3 mm. did. Preparation of acrylic resin A: In a reactor equipped with a thermometer, stirrer, reflux condenser, and charging nozzle, add 15 parts by weight of 2-hydroxyethyl methacrylate, 5 parts by weight of acrylic acid, 45 parts by weight of methyl methacrylate, and n-butyl acrylate. 35 parts by weight, 1 part by weight of benzoyl peroxide, and 200 parts by weight of methyl ethyl ketone were added, and while stirring in a nitrogen gas stream,
The mixture was reacted at ℃ for 7 hours to obtain an acrylic resin solution. This is called acrylic resin (A). B Into the same reactor used in the example described in section A, 10 parts by weight of 2-hydroxyethyl methacrylate, 3 parts by weight of methacrylic acid, 60 parts by weight of methyl methacrylate, 27 parts by weight of butyl methacrylate, 1 part by weight of benzoyl peroxide. , 200 parts by weight of methyl ethyl ketone were charged and reacted in the same manner as described in Section A to obtain an acrylic resin solution. This is called acrylic resin (B). C Into the same reactor used in the example described in Section A, 55 parts by weight of methyl methacrylate, 40 parts by weight of butyl methacrylate, 5 parts by weight of butyl acrylate, 1 part by weight of benzoyl peroxide, and 200 parts by weight of methyl ethyl ketone were charged. The reaction was carried out in the same manner as described in , to obtain an acrylic resin solution. This is called acrylic resin (C). Formation of a film: Blend the silane polymer and acrylic resin in the type and amount shown in Table 1, add isopropyl alcohol to the solid content so that the solid content is 20% by weight,
A coating composition was obtained. However, in Comparative Example 2, no silane polymer was blended. Furthermore, in Comparative Example 3, no acrylic resin was blended. On one side of the base film prepared by the above method,
The above coating composition was applied using a #5 bar coater,
Each was applied. The coated film was kept in an oven at 130° C. for 1 minute to volatilize the solvent. The amount of coating on each film obtained was approximately 3 g/m 2 . However, in Comparative Example 1, no film was formed. Evaluation of the film The performance of the film was evaluated using the following methods.
The results are shown in Table 1. Contamination resistance Each contaminant is attached to the coating surface of the film,
After leaving it at room temperature for 48 hours, the contaminants were wiped off with absorbent cotton and the traces were observed. This evaluation criteria is
It is as follows. ◎…No traces found at all. 〇… Traces are observed on a part of the coating. △… Traces are observed on more than 2/3 of the coating. ×... Traces are observed on the entire surface of the coating. Plasticizer Migration Test Nine types of films were each cut into 10 cm x 10 cm squares, and a 0.5 mm thick polystyrene sheet was adhered to the surface on which the film was formed. In this state, 2
In an oven maintained at 50℃ with a load of kg,
It was left for 48 hours. The film was then removed from the oven, the load was removed, the polystyrene sheet was peeled off, and the weight loss of each of the nine types of films was measured. The lower the value, the less the plasticizer migrates from the film surface. Peelability (Tackiness) Nine types of films were each cut into pieces of 5 cm wide and 20 cm long, and folded back alternately at 5 cm intervals in a direction perpendicular to the long direction. In this state, a load of 2 kg was applied from above and the product was left in an oven maintained at 50° C. for 1 hour. Then, the film was taken out from the oven, the load was removed, and the film was peeled off, and the peelability at that time was observed. The evaluation criteria are as follows. ◎…It has no resistance at all and can be easily peeled off. △...There is some resistance. ×: Something that is extremely resistant and requires force to peel off.
【表】【table】
【表】
表1より、本発明による塩化ビニル系樹脂成形
品は、特に耐可塑剤移行性、耐汚染性に優れてい
るので成形品の表面の汚染、粉塵、塵芥等の付着
を防止することができ、美麗な外観を長期間維持
することができることがわかる。[Table] From Table 1, the vinyl chloride resin molded product according to the present invention has particularly excellent plasticizer migration resistance and stain resistance, so it can prevent contamination, dust, dirt, etc. from adhering to the surface of the molded product. It can be seen that it is possible to maintain a beautiful appearance for a long period of time.
Claims (1)
直結する加水分解性基を有するシラン重合体ある
いはその加水分解物を、5〜40重量%がヒドロキ
シアルキル(メタ)アクリレートモノマー、0〜
20重量%が分子内に1個もしくは2個以上のカル
ボキシル基を含むα,β−不飽和カルボン酸及び
残部がこれら化合物と共重合可能な他のビニル系
化合物からなるモノマー成分を共重合して得られ
たアクリル系樹脂に混合した被覆組成物に由来す
る被膜が形成されてなることを特徴とする塩化ビ
ニル系樹脂成形品。 2 珪素原子に直結する加水分解性基を有するシ
ラン重合体がテトラアルコキシシランの重合体で
ある特許請求の範囲第1項記載の塩化ビニル系樹
脂成形品。[Scope of Claims] 1. A silane polymer having a hydrolyzable group directly bonded to a silicon atom or a hydrolyzate thereof is applied to the surface of a vinyl chloride resin molded product, and 5 to 40% by weight of the silane polymer has a hydroxyalkyl (meth)acrylate monomer. , 0~
By copolymerizing a monomer component in which 20% by weight is an α,β-unsaturated carboxylic acid containing one or more carboxyl groups in the molecule, and the remainder is another vinyl compound that can be copolymerized with these compounds. A vinyl chloride resin molded article, characterized in that a coating derived from a coating composition mixed with the obtained acrylic resin is formed. 2. The vinyl chloride resin molded article according to claim 1, wherein the silane polymer having a hydrolyzable group directly bonded to a silicon atom is a polymer of tetraalkoxysilane.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63073512A JPH01131254A (en) | 1987-08-14 | 1988-03-28 | Molded vinyl chloride based resin product |
US07/229,424 US4957818A (en) | 1987-08-14 | 1988-08-08 | Molded synthetic resin product |
EP19880113178 EP0303297B1 (en) | 1987-08-14 | 1988-08-12 | Molded synthetic resin product |
DE3850317T DE3850317T2 (en) | 1987-08-14 | 1988-08-12 | Molding material made of synthetic resin. |
KR1019880010365A KR890003853A (en) | 1987-08-14 | 1988-08-13 | Synthetic Resin Molded Products |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20279087 | 1987-08-14 | ||
JP62-202790 | 1987-08-14 | ||
JP63073512A JPH01131254A (en) | 1987-08-14 | 1988-03-28 | Molded vinyl chloride based resin product |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01131254A JPH01131254A (en) | 1989-05-24 |
JPH0575008B2 true JPH0575008B2 (en) | 1993-10-19 |
Family
ID=16463237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63073512A Granted JPH01131254A (en) | 1987-08-14 | 1988-03-28 | Molded vinyl chloride based resin product |
Country Status (1)
Country | Link |
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JP (1) | JPH01131254A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2543295Y2 (en) * | 1989-08-23 | 1997-08-06 | 三菱化学エムケーブイ株式会社 | Desk mat |
JP6113588B2 (en) * | 2013-07-01 | 2017-04-12 | 東リ株式会社 | Flooring |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS505733A (en) * | 1973-05-23 | 1975-01-21 | ||
JPS5474291A (en) * | 1977-11-25 | 1979-06-14 | Japan Atom Energy Res Inst | Production of anit-clouding transparent composite |
JPS6178806A (en) * | 1984-09-25 | 1986-04-22 | Chisso Corp | Thermosetting acrylic resin composition for coating |
JPS63137934A (en) * | 1986-11-28 | 1988-06-09 | Honny Chem Ind Co Ltd | Coating composition |
JPH05148378A (en) * | 1991-11-27 | 1993-06-15 | Fujikura Kasei Co Ltd | Vinyl chloride resin film for agricultural use |
-
1988
- 1988-03-28 JP JP63073512A patent/JPH01131254A/en active Granted
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS505733A (en) * | 1973-05-23 | 1975-01-21 | ||
JPS5474291A (en) * | 1977-11-25 | 1979-06-14 | Japan Atom Energy Res Inst | Production of anit-clouding transparent composite |
JPS6178806A (en) * | 1984-09-25 | 1986-04-22 | Chisso Corp | Thermosetting acrylic resin composition for coating |
JPS63137934A (en) * | 1986-11-28 | 1988-06-09 | Honny Chem Ind Co Ltd | Coating composition |
JPH05148378A (en) * | 1991-11-27 | 1993-06-15 | Fujikura Kasei Co Ltd | Vinyl chloride resin film for agricultural use |
Also Published As
Publication number | Publication date |
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JPH01131254A (en) | 1989-05-24 |
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