JPH0574540A - Soldering device for electronic part - Google Patents

Abstract

PURPOSE:To surely connect an electronic part without deteriorating the characteristic of the electronic part by preventing the floating of a fuse wire from a solid electrolytic capacitor, i.e., the electronic part, and surely soldering the fuse wire to be fitted to the electronic part. CONSTITUTION:Electrodes 1a, 1b pressing a fuse wire 16 to be fitted to a solid electrolytic capacitor 15, i.e., an electronic part, and feeding a current to the fuse wire 16 are provided, the preliminary solder 18a fitted in advance is melted, and the fuse wire 16 is soldered to the solid electrolytic capacitor 15.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component soldering apparatus, and more particularly to an electronic component soldering apparatus (hereinafter simply referred to as a soldering apparatus) for connecting a functional element, which is a component to be mounted, to an outer shell of an electronic component by soldering. ) Concerning.

[0002]

2. Description of the Related Art Generally, some electronic components are individually mounted on a printed circuit board, and some electronic components are additionally mounted. For example, some solid electrolytic capacitors have fuse lines for protection attached to themselves. In the case of assembling such an electronic part, the solid electrolytic capacitor completed as a single body is soldered with the fuse tip completed as a single body to the outer shell.

FIG. 2 is a perspective view showing an example of a conventional soldering apparatus, and FIG. 3 is a view showing a part of the electronic component and the soldering apparatus of FIG. As shown in FIG. 2, this soldering apparatus includes a head 7 fixed to a base 13, a near-infrared lamp 8 and a reflecting mirror 6 attached to the head 7, a jig 11 for mounting an object to be welded, and a jig. Holding 11 and belt 12
And a slide base 10 that is moved by a motor 14,
It had this slide base 10 and the shaft 11 which slides.

Using this soldering device, for example,
When attaching the fuse wire to the solid electrolytic capacitor, first, as shown in FIG. 3, the fuse wire 16 is placed on the solid electrolytic capacitors 15 mounted side by side on the lead frame 17 and mounted on the jig 11. Next, the slide base is moved in one direction at a predetermined speed. When the fuse wire 16 and the solid electrolytic capacitor 15 mounted on the jig 1 pass under the near infrared lamp 8, the preliminary solder 18 on the surface of the solid electrolytic capacitor 15 is melted by the heat of the collected near infrared light, The fuse wire 16 is soldered to the solid electrolytic capacitor 15. Thus, conventionally,
By reflowing the preliminary solder, other functional components were soldered to the electronic components. Further, since the fuse wire 16 is small, it has been carried out without placing a weight for applying a pressing force to the fuse wire 16.

[0005]

In the above-described conventional soldering apparatus, the fuse wires are joined by melting the solder by the heat of the focused near infrared rays. However, the fuse wires often float and the fuse wires rise. Poor connection or defective fuse wire exposure after resin coating occurred. Also,
There are problems that the preliminary solder is not melted because it is easily affected by the temperature condition of the jig and the atmosphere and that the preliminary solder does not melt, and that unnecessary components are heated, and the characteristics of the electronic component element deteriorate.

[0006] An object of the present invention is to provide a soldering device capable of surely performing solder connection without deteriorating the characteristics of electronic parts in order to solve such a problem.

[0007]

A soldering apparatus of the present invention is a jig for arranging a plurality of electronic components to be pre-soldered side by side in advance and mounting attached components on these electronic parts to hold the electronic components. And a feed mechanism that intermittently moves the jig in one direction, and an electrode pair that abuts the attached portion and applies a current.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

1 (a) and 1 (b) show a soldering apparatus according to an embodiment of the present invention, (a) is a perspective view of a main part, and (b) is a partially enlarged view. is there. As shown in FIG. 1, this soldering apparatus includes a head 3 that moves up and down by an elevating mechanism 4, two support plates 2 that are attached to the head 3 and flow an electric current, and a tip of the support plate 2. Two electrodes 1a and 1b which are attached at a predetermined gap apart from each other, a jig 11a which moves under the electrodes 1a and 1b and mounts the solid electrolytic capacitor 15 and the fuse wire 16, and a jig 11a and a shaft 9a. It has a belt 12a and a motor 14a that slide and move intermittently.

That is, unlike the conventional reflow type soldering apparatus, the fuse wire 16 is pressed and an electric current is passed through the fuse wire 16, and the preliminary solder is melted by the resistance heat of the fuse wire itself to fuse the fuse wire 16 and the solid electrolytic capacitor. 15 is soldered.

Next, the operation of this soldering device will be described. First, the lead frame 17 to which a large number of solid electrolytic capacitors 15 to which pre-solder has been applied in advance is arranged and attached is attached according to the guide pins on the jig 11a. Next, by pressing the start button (not shown),
The jig 11 is driven by the motor 14a via the belt 12a.
a moves below the electrodes 1a and 1b. Next, when the head 3 is lowered by the elevating mechanism 4 and the electrodes 1a and 1b come into contact with the fuse wire 16, a current set by the power source flows between the electrodes 1a and 1b, thereby causing the solid electrolytic capacitor 15 to flow. The pre-deposited preliminary solder 18a is melted,
The fuse wire 16 is soldered.

After soldering, the current stops, the head 3 rises, and the jig 9 moves one pitch. By repeating this operation, the solid electrolytic capacitor 15 and the fuse wire 16 are soldered one after another. When all the solid electrolytic capacitors 15 and the fuse wires 16 are soldered, the jig 9 returns to its original position.

As described above, by pressing the fuse wire 16 with the electrodes 1a and 1b, the conventional floating is eliminated and a current is passed through the fuse wire 16 to heat it, so that the temperature rise of the other solid electrolytic capacitors is minimized. You can do it.

Further, since the electrodes are suspended independently, the fuse wire 16 can be soldered even if the surface roughness is a little, and the interval between the electrodes can be freely adjusted, so that appropriate welding conditions can be obtained. Can be set.

In this embodiment, one electrode pair has been described, but a plurality of pairs of electrodes may be arranged. This has the advantage that a plurality of fuse wires can be soldered at the same time and the processing capacity is further improved.

[0016]

As described above, in the soldering apparatus of the present invention, the mounted parts are prevented from floating and the electronic parts are securely lifted by providing the electrode pair for pressing the mounted parts and passing the current through the mounted parts. There is an effect that the mounted component can be soldered to the component. Also, it is possible to control the temperature rise of electronic parts by only heating the attached parts,
There is also an effect that the characteristics of the electronic component are not deteriorated.

[Brief description of drawings]

1A and 1B show a soldering device according to an embodiment of the present invention, FIG. 1A is a perspective view showing a main part, and FIG. 1B is a partially enlarged view.

FIG. 2 is a perspective view of a soldering device showing a conventional example.

FIG. 3 is a diagram showing a part of FIG. 2;

[Explanation of symbols]

 1a, 1b Electrode 2 Support plate 3, 7 Head 4 Lifting mechanism 6 Reflecting mirror 8 Near infrared lamp 9, 9a Shaft 10 Slide base 11, 11a Jig 12, 12a Belt 13 Base 14, 14a Motor 15 Solid electrolytic capacitor 16 Fuse wire 17 Lead frame 18, 18a Pre-solder

Claims (1)

[Claims] 1. A jig for arranging a plurality of electronic parts to be pre-soldered side by side in advance, and mounting electronic parts on these electronic parts to hold the electronic parts, and the jig intermittently in one direction. An electronic component soldering device, comprising: a feed mechanism for moving the electrode;