JPH0572479B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Field of Application> The present invention relates to an electroplating tank in continuous electroplating equipment.

<Prior Art> In continuous electroplating equipment, in order to perform plating efficiently, a method is used to increase the current density by increasing the flow rate of the plating solution.

Conventional methods for increasing the flow rate of the plating solution generally involve arranging a nozzle at right angles to the direction in which the steel plate travels, and ejecting the plating solution in the opposite direction between the nozzle and the electrode.

FIG. 6 is a cross-sectional view of a conventional vertical plating tank as seen from the side. The steel plate 1 enters the plating tank 2 by a deflector roll 4, passes through a sink roll 5, and travels in the direction of the arrow on the deflector roll 4'. are doing. In the plating tank 2, electrodes 3 are arranged on the front and back sides of the steel plate 1 and are normally used as an anode, and the steel plate 1 is used as a cathode to perform plating.

The plating efficiency can be improved by increasing the flow rate of the plating liquid between the electrode 3 and the steel plate 1, so spray nozzles are installed separately on the front and back sides between the electrode 3 and the steel plate 1 above the liquid level of the plating tank 2. (not shown) is provided to spray the plating liquid downward (in the direction of the sink roll 5) to provide a flow velocity.

<Problems to be Solved by the Invention> However, the electrode 3 in a general plating tank 2 is a rectangular electrode in which the length of the electrode 2 in the direction of movement of the steel plate 1 is longer than the width of the steel plate 1. Therefore, in the above-described method of increasing the flow rate of the plating liquid, the flow rate of the plating liquid near the jet nozzle above the liquid level of the plating tank 2 is high, and the flow rate of the plating liquid near the jet nozzle at the upper part of the liquid level of the plating tank 2 is high, and in the lower part of the plating tank 2 (near the sink roll 5), the flow rate of the plating liquid is high. It is clear that the flow rate of the plating liquid is reduced. Therefore, it is not possible to effectively provide a flow velocity over the entire length of the electrode 3.

In addition, in the case of a pass passing above the sink roll 5, the plating liquid in the plating tank 2 moves in the same direction as the traveling direction of the steel plate 1 as the line speed increases, so that the plating liquid in the plating tank 2 moves in the vicinity of the jet nozzle above the liquid level. In the lower part (near the sink roll 5), the difference in flow velocity of the plating liquid becomes larger. In addition, there is a difference with the path passing downward, and there is a drawback that a uniform flow velocity for uniform plating cannot be obtained. An object of the present invention is to provide an electroplating device that solves these problems.

<Means for Solving the Problems> The present invention provides an electroplating tank in which electrodes are provided opposite to the down pass and up pass of a steel plate in a plating solution, and in each of the down pass and up pass, a side surface of the steel plate passing through is provided. This electroplating tank is characterized by being equipped with a spout nozzle that spouts out a hem plating liquid.

<Function> A jet nozzle is provided on each of the down-path and up-path of the steel plate in the plating liquid, and the plating liquid is jetted out from the side of the steel plate in the width direction of the steel plate. Compared to the method of ejecting the plating liquid from the upper surface of the plating liquid, the plating liquid can be uniformly flowed at a high speed and the plating efficiency can be improved.

<Example> An embodiment of the present invention will be described based on the drawings.

1 to 4 show an embodiment of the device of the present invention,
FIG. 1 is a side sectional view of the apparatus of the present invention, FIG. 2 is a plan sectional view, FIG. 3 is a perspective view, and FIG. 4 is a diagram showing the flow direction of the plating liquid in FIG. 2. It is.

1 to 4, in the present invention, in order to obtain a uniform flow velocity, jet chambers 6 and 6' having jet nozzles 9 are provided on the side surface of the plating tank 2 along the traveling direction of the steel plate 1, and the inside of the plating tank 2 is The plating liquid is suctioned and pressurized by booster pumps 8, 8', and is supplied to the ejection chambers 6, 6' through piping 7, 7', and the plating liquid is ejected from the side surface of the steel plate 1 from the ejection nozzles 9, 9'. The jet nozzles 9, 9' are installed separately in the down-pass and up-path parts of the steel plate 1, and the boost pumps 8, 8' and piping are installed so as to apply a flow velocity to the side surface of the steel plate 1 as indicated by arrows 11, 11'. 7 and 7' are provided. Furthermore, piping 7, so as to be able to adjust the flow rate of the plating liquid supplied to the ejection chambers 6, 6'.
A flow rate regulating valve 10 is installed at 7'.

In this way, by spouting the plating liquid separately from both sides of the steel plate 1, a circulating flow of the plating liquid is created in the plating tank 2, so that more efficient plating can be performed (see FIG. 4).

Therefore, since the plating liquid is ejected from the side surface of the steel plate 1 in the width direction of the plate, the ejection distance is shorter than the conventional method in which the plating liquid is ejected downward from the top surface in the longitudinal direction. More efficient plating becomes possible.

Next, regarding specific examples and comparative examples of the present invention, the relationship between line speed and allowable current density is shown in the fifth section.
As shown in the figure. In FIG. 5, A shows the case where the apparatus of the present invention is used, B shows the case where the plating liquid is injected downward from the upper surface of the conventional method, and C shows the case where the plating liquid is not injected. From FIG. 5, it was confirmed that the device of the present invention can significantly improve the plating effect compared to the conventional device.

<Effects of the Invention> As explained above, the apparatus of the present invention can significantly improve the plating effect and has excellent industrial effects.

[Brief explanation of the drawing]

1 to 4 show an embodiment of the device of the present invention,
FIG. 1 is a side sectional view of the device of the present invention, FIG. 2 is a plan sectional view, third is a perspective view, and fourth is a perspective view.
The figure shows the direction of flow of the plating liquid in FIG. 2. FIG. 5 is a graph showing the relationship between line speed and allowable current density for specific examples and comparative examples of the present invention. FIG. 6 is a side sectional view of a conventional electroplating tank. 1... Steel plate, 2... Plating tank, 3... Electrode,
4, 4'...Deflector roll, 5...Sink roll, 6,6'...Ejection chamber, 7,7'...
... Piping, 8, 8'... Boost pump, 9, 9'... Jet nozzle, 10... Flow rate adjustment valve, 11, 11'...
...Flow direction.

Claims (1)

[Claims] 1. In an electroplating tank with electrodes placed opposite the down and up paths of the steel plate in the plating solution,
An electroplating tank characterized in that each of the down pass and the up pass is provided with a spout nozzle that spouts plating liquid onto the side surface of the steel plate passing through.