JPH0571537B2 - - Google Patents
Info
- Publication number
- JPH0571537B2 JPH0571537B2 JP1324890A JP32489089A JPH0571537B2 JP H0571537 B2 JPH0571537 B2 JP H0571537B2 JP 1324890 A JP1324890 A JP 1324890A JP 32489089 A JP32489089 A JP 32489089A JP H0571537 B2 JPH0571537 B2 JP H0571537B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- temperature
- dispersant
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002270 dispersing agent Substances 0.000 claims description 22
- 239000002241 glass-ceramic Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000010304 firing Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- 239000011230 binding agent Substances 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 239000012298 atmosphere Substances 0.000 claims description 8
- 239000002002 slurry Substances 0.000 claims description 8
- 239000002202 Polyethylene glycol Substances 0.000 claims description 7
- 230000001590 oxidative effect Effects 0.000 claims description 7
- 229920001223 polyethylene glycol Polymers 0.000 claims description 7
- MUHFRORXWCGZGE-KTKRTIGZSA-N 2-hydroxyethyl (z)-octadec-9-enoate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCCO MUHFRORXWCGZGE-KTKRTIGZSA-N 0.000 claims description 6
- 229940095098 glycol oleate Drugs 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 239000004014 plasticizer Substances 0.000 claims description 3
- 239000005388 borosilicate glass Substances 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000012299 nitrogen atmosphere Substances 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 235000021323 fish oil Nutrition 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920005822 acrylic binder Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000008029 phthalate plasticizer Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Landscapes
- Compositions Of Oxide Ceramics (AREA)
Description
【発明の詳細な説明】
〔概要〕
電子部品搭載用基板の製造方法に関し、
非酸化性雰囲気中でグリーンシートを焼成して
も残留炭素が少なく、曲げ強さ、および寸法精度
のばらつきが小さい電子部品搭載用基板の製造方
法を提供することを目的とし、
ガラスセラミツク粉末100重量部に、
バインダ ５〜20重量部
可塑剤 ２〜10重量部
分散剤ポリエチレングリコールオレイン酸エス
テル２重量部以下を加えたスラリーから成形した
焼成可能なグリーンシートを積層する工程と、
この積層体を非酸化性雰囲気中、400〜500℃の
第１の温度でバインダ抜きし、次に該第１の温度
より高温の第２の温度で仮焼成し、さらに該第２
の温度より高い第３の温度で本焼成するように構
成する。[Detailed Description of the Invention] [Summary] Regarding the manufacturing method of a substrate for mounting electronic components, the present invention relates to a method for manufacturing a substrate for mounting electronic components, which produces electronic green sheets with little residual carbon and small variations in bending strength and dimensional accuracy even when the green sheet is fired in a non-oxidizing atmosphere. For the purpose of providing a method for manufacturing a substrate for mounting components, 5 to 20 parts by weight of a binder, 2 to 10 parts by weight of a plasticizer, and 2 parts by weight or less of a polyethylene glycol oleate dispersant were added to 100 parts by weight of glass ceramic powder. a step of laminating sinterable green sheets formed from a slurry; debinding the laminated body in a non-oxidizing atmosphere at a first temperature of 400 to 500°C; Temporarily fired at a temperature of 2, and then
The main firing is performed at a third temperature higher than the temperature.
本発明は特に表面状態が良好なグリーンシート
を焼成して、電子部品搭載用に必要な特性を具備
する基板の製造方法に関する。
The present invention particularly relates to a method for producing a substrate having characteristics necessary for mounting electronic components by firing a green sheet with a good surface condition.
グリーンシート組成物は、非酸化性雰囲気中で
焼成する場合、残留炭素を減少させるために、有
機成分が少ないことが望ましいので、スラリーに
分散剤を添加しないことがある。しかし分散剤を
添加すれば、スラリーの均一性が向上し、グリー
ンシートを焼成して得た基板の機械的強さが向上
し、そのばらつきも低減される。このとき添加す
る分散剤の種類によつては非酸化性雰囲気中で加
熱するときに、飛散しないで残留し、炭素残渣と
なる量が多いものがある。このような分散剤に関
する従来技術として、MIT Indus trial Liaison
Program Report ６−15−84がある、これには
分散剤としてフイツシユオイルおよびグリセロー
ルトリオレイドが記載されている。
When the green sheet composition is fired in a non-oxidizing atmosphere, it is desirable that the organic component be low in order to reduce residual carbon, so a dispersant may not be added to the slurry. However, if a dispersant is added, the uniformity of the slurry will be improved, and the mechanical strength of the substrate obtained by firing the green sheet will be improved and its variations will be reduced. Depending on the type of dispersant added at this time, when heated in a non-oxidizing atmosphere, some may remain without scattering and form a large amount of carbon residue. As conventional technology regarding such dispersants, MIT Indus trial Liaison
Program Report 6-15-84, which describes fish oil and glycerol trioleide as dispersants.
非酸化性雰囲気中でグリーンシートを焼成して
も残留炭素が少なく、曲げ強さ、および寸法精度
のばらつきが小さい電子部品搭載用基板の製造方
法を提供することである。
It is an object of the present invention to provide a method for manufacturing a substrate for mounting electronic components, which has little residual carbon even when a green sheet is fired in a non-oxidizing atmosphere, and has small variations in bending strength and dimensional accuracy.
上記問題点は、ガラスセラミツク粉末100重量
部に、
バインダ ５〜20重量部
可塑剤 ２〜10重量部
分散剤ポリエチレングリコールオレイン酸エス
テル２重量部以下を加えたスラリーから成形した
焼成可能なグリーンシートを積層する工程と、
この積層体を非酸化性雰囲気中、400〜500℃の
第１の温度でバインダ抜きし、次に該第１の温度
より高温の第２の温度で仮焼成し、さらに該第２
の温度より高い第３の温度で本焼成して焼成物を
得る工程とを有することを特徴とする電子部品搭
載用基板の製造方法によつて解決することができ
る。
The above problem can be solved by using a sinterable green sheet formed from a slurry of 100 parts by weight of glass ceramic powder, 5 to 20 parts by weight of binder, 2 to 10 parts by weight of plasticizer, and 2 parts by weight or less of polyethylene glycol oleate dispersant. A step of laminating the laminate, removing the binder from the laminate at a first temperature of 400 to 500°C in a non-oxidizing atmosphere, then pre-firing at a second temperature higher than the first temperature, and further Second
This problem can be solved by a method of manufacturing a substrate for mounting electronic components, which comprises a step of performing main firing at a third temperature higher than the temperature of 1 to obtain a fired product.
本発明の分散剤ポリエチレングリコール型界面
活性剤添加の影響を調べるために、
アルミナ（平均粒径約３〜4μｍ） 200ｇ
ホウケイ酸ガラス（平均粒径約４〜5μｍ）
200ｇ
石英ガラス（平均粒径約４〜５mm） 200ｇ
のガラスセラミツク粉末混合物600ｇに対し、
アクリル系バインダ 70ｇ
ジブチルフタレート可塑剤 20ｇ
ポリエチレングリコールオレイン酸エステル
分散剤（分子量480） ０〜12ｇ
を添加し、ボールミルで12時間混練して、スラリ
ーを調製した。
In order to investigate the effect of adding a polyethylene glycol type surfactant to the dispersant of the present invention, 200 g of alumina (average particle size of about 3 to 4 μm) borosilicate glass (average particle size of about 4 to 5 μm)
To 200 g of 200 g of quartz glass (average particle size approximately 4 to 5 mm) and 600 g of glass-ceramic powder mixture, add 70 g of acrylic binder, 20 g of dibutyl phthalate plasticizer, and 0 to 12 g of polyethylene glycol oleate dispersant (molecular weight 480), and mill in a ball mill. A slurry was prepared by kneading for 12 hours.
第１図は分散剤添加量とスラリー粘度との関係
を示す。ガラスセラミツク100重量部に対して０
〜２重量部（ガラスセラミツク600ｇに対して10
〜12ｇ）において粘度が極小となる。 FIG. 1 shows the relationship between the amount of dispersant added and the viscosity of the slurry. 0 per 100 parts by weight of glass ceramic
~2 parts by weight (10 parts per 600g of glass ceramic)
~12g), the viscosity becomes minimum.
第２図はグリーンシートの表面あらさを接触式
表面あらさ計で測定した最大表面あらさと分散剤
との関係を示す。分散剤添加量０〜２重量部にお
いて最大表面あらさが極小となる。 FIG. 2 shows the relationship between the maximum surface roughness of the green sheet measured using a contact type surface roughness meter and the dispersant. The maximum surface roughness becomes minimal when the dispersant is added in an amount of 0 to 2 parts by weight.
次に、上記グリーンシートを15cm角に切り、こ
れを30枚重ねて30MPaの圧力で積層した。この
積層体を窒素雰囲気中で、まず400℃でバインダ
抜きし、次に840℃、４時間仮焼成し、最後に
1020℃、４時間本焼成して焼成物を得た。第３図
はこの焼成物の曲げ強さの標準偏差と分散剤添加
量の関係を示す。 Next, the green sheets were cut into 15 cm squares, and 30 sheets were stacked together under a pressure of 30 MPa. This laminate was first de-bindered at 400℃ in a nitrogen atmosphere, then pre-sintered at 840℃ for 4 hours, and finally
Main firing was performed at 1020°C for 4 hours to obtain a fired product. FIG. 3 shows the relationship between the standard deviation of the bending strength of the fired product and the amount of dispersant added.
第４図は同一焼成物内の収縮率のばらつきと分
散剤添加量の関係を示す。第３および４図から明
らかなように、焼成物の機械的強さは添加量０〜
２重量部において、ばらつきが約1/2に減少して
いることがわかる。 FIG. 4 shows the relationship between the variation in shrinkage rate and the amount of dispersant added within the same fired product. As is clear from Figures 3 and 4, the mechanical strength of the fired product varies from 0 to
It can be seen that at 2 parts by weight, the variation is reduced to about 1/2.
第５図の曲線Ａは分散剤として使用したポリエ
チレングリコールオレイン酸エステルを単独で昇
温速度10℃／minで窒素雰囲気中で加熱したとき
の残渣量を示し、500℃において飛散することが
わかる。曲線Ｂは従来技術のフイツシユオイル単
独の加熱曲線であつて、1000℃においてもまだ炭
素残渣があることを示す。本発明のポリエチレン
グリコールオレイン酸エステル界面活性剤は窒素
雰囲気中の低温で飛散するので、積層体の焼成に
おいて残留炭素が少なく、電子部品搭載用基板と
しての電気的特性がすぐれている。 Curve A in FIG. 5 shows the amount of residue when polyethylene glycol oleate used as a dispersant is heated alone at a heating rate of 10°C/min in a nitrogen atmosphere, and it can be seen that it scatters at 500°C. Curve B is a heating curve for prior art fish oil alone and shows that even at 1000°C there is still carbon residue. Since the polyethylene glycol oleate surfactant of the present invention scatters at low temperatures in a nitrogen atmosphere, there is little residual carbon during firing of the laminate, and it has excellent electrical properties as a substrate for mounting electronic components.
なお、本発明の電子部品搭載用基板の製造方法
は、特開昭59−995に記載の「熱解重合型樹脂を
含むバインダを使用してガラスセラミツク層を形
成し、この層の上に銅導体層を形成し、多層化し
た未焼結体を、ガラスセラミツクに含まれるガラ
ス成分が加熱による変化を示さない温度におい
て、水蒸気分圧を0.005〜0.3気圧に制御した窒素
雰囲気中で焼成してバインダを飛散させることを
特徴とする、銅導体多層構造体の製造方法。」或
いは、特開昭60−254697に記載の「熱解重合型樹
脂を含むバインダを使用してガラスセラミツク層
を形成し、この層の上に銅導体層を形成し、多層
化した未焼結体を、ガラスセラミツクに含まれる
ガラス成分が加熱による変化を示さない温度にお
いて、水蒸気分圧を0.005〜0.3気圧に制御した不
活性雰囲気中で焼成してバインダを飛散させる多
層セラミツク回路基板の製法であつて、ガラスセ
ラミツク原料として、20重量％以上、50重量％未
満のアルミナと、10重量％以上、60重量％未満の
石英ガラスと、20重量％以上、40重量％未満の、
銅の融点より低い温度で焼成可能なガラスまたは
結晶化ガラスとを混合して使用することを特徴と
する、多層セラミツク回路基板の製法。」等の導
体として銅を用いる多層セラミツク回路基板の製
法に好ましく適用しうるものである。 The method for manufacturing a board for mounting electronic components according to the present invention is described in JP-A-59-995, "A glass ceramic layer is formed using a binder containing a thermally depolymerizable resin, and a copper layer is formed on this layer." The multilayered unsintered body with the conductor layer formed thereon is fired in a nitrogen atmosphere with a water vapor partial pressure controlled at 0.005 to 0.3 atm at a temperature at which the glass components contained in the glass ceramic do not change due to heating. A method for manufacturing a copper conductor multilayer structure characterized by scattering a binder.'' Or, as described in JP-A-60-254697, ``A method for forming a glass-ceramic layer using a binder containing a thermally depolymerizable resin.'' A copper conductor layer was formed on this layer, and the water vapor partial pressure of the multilayered unsintered body was controlled to 0.005 to 0.3 atm at a temperature at which the glass components contained in the glass ceramic did not change due to heating. A method for producing a multilayer ceramic circuit board in which the binder is scattered by firing in an inert atmosphere, and the glass ceramic raw materials include alumina of 20% or more but less than 50% by weight and 10% or more but less than 60% by weight. quartz glass and 20% by weight or more and less than 40% by weight,
A method for manufacturing a multilayer ceramic circuit board characterized by using a mixture of glass or crystallized glass that can be fired at a temperature lower than the melting point of copper. This method can be preferably applied to a method for manufacturing a multilayer ceramic circuit board using copper as a conductor, such as the following.
本発明によれば、グリーンシート中のガラスセ
ラミツク粉末と有機成分の分散性を良好にし、か
つ積層体を窒素雰囲気中で焼成した焼成物は残留
炭素が少なく、かつ収縮率のばらつき、および、
曲げ強さのばらつきを低減する効果がある。
According to the present invention, the fired product obtained by improving the dispersibility of the glass ceramic powder and organic components in the green sheet and firing the laminate in a nitrogen atmosphere has less residual carbon and has less variation in shrinkage rate and
This has the effect of reducing variations in bending strength.
第１図はスラリー粘度と分散剤添加量の関係を
示すグラフであり、第２図はグリーンシート最大
表面あらさと分散剤添加量の関係を示すグラフで
あり、第３図は焼成物曲げ強さの標準偏差と分散
剤添加量の関係を示すグラフであり、第４図は同
一焼成物内の収縮率のばらつきと分散剤添加量の
関係を示すグラフであり、第５図は分散剤残渣量
と加熱温度の関係を示すグラフである。
Figure 1 is a graph showing the relationship between slurry viscosity and the amount of dispersant added, Figure 2 is a graph showing the relationship between the maximum surface roughness of the green sheet and the amount of dispersant added, and Figure 3 is a graph showing the relationship between the maximum surface roughness of the green sheet and the amount of dispersant added. FIG. 4 is a graph showing the relationship between the standard deviation of the dispersant and the amount of dispersant added. FIG. 4 is a graph showing the relationship between the variation in shrinkage rate within the same fired product and the amount of dispersant added. FIG. It is a graph which shows the relationship between and heating temperature.
Claims (1)
テル２重量部以下を加えたスラリーから成形した
焼成可能なグリーンシートを積層する工程と、 この積層体を非酸化性雰囲気中、400〜500℃の
第１の温度でバインダ抜きし、次に該第１の温度
より高温の第２の温度で仮焼成し、さらに該第２
の温度より高い第３の温度で本焼成して焼成物を
得る工程と を有することを特徴とする電子部品搭載用基板の
製造方法。 ２ 前記ガラスセラミツク粉末が アルミナ粉末 20〜60重量％ ホウケイ酸ガラス粉末 20〜50重量％ 石英ガラス粉末 20〜40重量％ からなることを特徴とする特許請求の範囲第１項
記載の電子部品搭載用基板の製造方法。[Claims] 1. A sinterable green molded from a slurry of 100 parts by weight of glass ceramic powder, 5 to 20 parts by weight of binder, 2 to 10 parts by weight of plasticizer, and 2 parts by weight or less of polyethylene glycol oleate dispersant. a step of laminating the sheets, removing the binder from this laminate at a first temperature of 400 to 500°C in a non-oxidizing atmosphere, and then pre-firing at a second temperature higher than the first temperature, Furthermore, the second
A method for manufacturing a board for mounting an electronic component, comprising the step of performing main firing at a third temperature higher than the temperature of 1 to obtain a fired product. 2. For mounting electronic components according to claim 1, wherein the glass ceramic powder is comprised of 20 to 60% by weight of alumina powder, 20 to 50% by weight of borosilicate glass powder, and 20 to 40% by weight of quartz glass powder. Substrate manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1324890A JPH02192452A (en) | 1989-12-16 | 1989-12-16 | Production of board for supporting electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1324890A JPH02192452A (en) | 1989-12-16 | 1989-12-16 | Production of board for supporting electronic part |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59274534A Division JPS61155243A (en) | 1984-12-28 | 1984-12-28 | Green sheet composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02192452A JPH02192452A (en) | 1990-07-30 |
| JPH0571537B2 true JPH0571537B2 (en) | 1993-10-07 |
Family
ID=18170767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1324890A Granted JPH02192452A (en) | 1989-12-16 | 1989-12-16 | Production of board for supporting electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02192452A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100291534B1 (en) * | 1998-09-07 | 2001-07-12 | 박호군 | Ceramic Sheet for a Heat Resistant Pattern, and Method and Composition for the Preparation Thereof |
| JP4748435B2 (en) * | 2001-08-21 | 2011-08-17 | 日本電気硝子株式会社 | Laminated glass ceramic material and laminated glass ceramic sintered body |
-
1989
- 1989-12-16 JP JP1324890A patent/JPH02192452A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02192452A (en) | 1990-07-30 |
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