JPH0570649B2 - - Google Patents
Info
- Publication number
- JPH0570649B2 JPH0570649B2 JP6792285A JP6792285A JPH0570649B2 JP H0570649 B2 JPH0570649 B2 JP H0570649B2 JP 6792285 A JP6792285 A JP 6792285A JP 6792285 A JP6792285 A JP 6792285A JP H0570649 B2 JPH0570649 B2 JP H0570649B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- liquid
- anhydride
- resin composition
- room temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000203 mixture Substances 0.000 claims description 21
- 239000003822 epoxy resin Substances 0.000 claims description 20
- 229920000647 polyepoxide Polymers 0.000 claims description 20
- -1 trimellitic acid ester anhydride Chemical class 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 9
- ARCGXLSVLAOJQL-UHFFFAOYSA-N anhydrous trimellitic acid Natural products OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 125000003158 alcohol group Chemical group 0.000 claims description 2
- 239000006185 dispersion Substances 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical group OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- 150000008065 acid anhydrides Chemical class 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- 239000010419 fine particle Substances 0.000 description 6
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000003860 storage Methods 0.000 description 5
- RKFCDGOVCBYSEW-AUUKWEANSA-N tmeg Chemical compound COC=1C(OC)=CC(C(OC(C=2OC)=C34)=O)=C3C=1OC(=O)C4=CC=2O[C@@H]1O[C@H](CO)[C@@H](O)[C@H](O)[C@H]1O RKFCDGOVCBYSEW-AUUKWEANSA-N 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920005862 polyol Polymers 0.000 description 4
- 150000003077 polyols Chemical class 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- GHLKSLMMWAKNBM-UHFFFAOYSA-N dodecane-1,12-diol Chemical compound OCCCCCCCCCCCCO GHLKSLMMWAKNBM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- LLHOAKMTDJLQAZ-UHFFFAOYSA-N 2-methylhexane-3,3-diol Chemical compound CCCC(O)(O)C(C)C LLHOAKMTDJLQAZ-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010299 mechanically pulverizing process Methods 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- SNGARVZXPNQWEY-UHFFFAOYSA-N phenylmethanediol Chemical compound OC(O)C1=CC=CC=C1 SNGARVZXPNQWEY-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
Description
[産業上の利用分野]
本発明は、低粘度で保存安定性に優れた一液性
エポキシ樹脂組成物に関し、更に詳しくは、貯蔵
安定性に優れ、かつ、耐熱性、表面平滑性、電気
特性、耐薬品性等に優れた塗膜、成形物を形成し
得るエポキシ樹脂組成物に関する。
[従来の技術]
トリメリツト酸無水物と多官能アルコールとか
ら得られるトリメリツト酸エステル無水物は、こ
れを汎用のエポキシ樹脂の硬化剤とした場合、耐
熱性に優れた硬化物を与えるため、主に耐熱性を
求められる分野で広範に使用されている。
これらのトリメリツト酸エステル無水物は全て
常温では固体であるため、液状のエポキシ樹脂の
硬化剤として使用する場合には、液状酸無水物
(例えばメチルヘキサヒドロ無水フタル酸、メチ
ルテトラヒドロ無水フタル酸等)や可溶性溶剤に
溶解させて使用するのが一般的である。しかし、
これら液状変性品と液状エポキシ樹脂との混合物
は均一な液状となるため、ポツトライフが短く貯
蔵安定性に劣るという欠点を避け得なかつた。
かかる欠点を解消する方法として、機械的に粉
砕してなる微粉末状の多価カルボン酸又はその無
水物を分散させた液状エポキシ樹脂組成物が提案
されている(特開昭55−60569号)。しかしなが
ら、一般に、固体を100μ以下の微粒子にまで機
械的に粉砕するためには多大のエネルギーを要
し、更に得られた微粉砕物は埃として立ち易く
(特願昭60−36738号)、作業環境上も好ましくな
い。
[発明が解決しようとする問題点]
本発明は、耐熱性に優れ、液状で貯蔵安定性に
も優れ、製造作業環境の面からも格段に改善され
た−液状エポキシ樹脂組成物を創出することを目
的とする。
[問題点を解決するための手段]
本発明者らは、上記目的を達成すべく鋭意検討
を重ねた結果、トリメリツト酸エステル無水物を
特定の溶媒に加熱溶解後、攪拌しながら冷却する
ことにより、いわば化学的方法によつて無水物の
球状微粒子が均一に分散したペースト状物が得ら
れ、このペースト状物を分散させてなるエポキシ
樹脂組成物は、所期の目的を達成し得る一液性の
エポキシ樹脂組成物であることを見い出し、かか
る知見に基づいて本発明を完成するに至つた。
即ち、本発明に係る一液性エポキシ樹脂組成物
は、一般式()で表される媒体中において一般
式()で表されるトリメリツト酸エステル無水
物を析出分散せしめ、当該分散物を常温で液状の
エポキシ樹脂に配合してなることを特徴とする。
[Industrial Application Field] The present invention relates to a one-component epoxy resin composition that has low viscosity and excellent storage stability, and more specifically, has excellent storage stability and has excellent heat resistance, surface smoothness, and electrical properties. The present invention relates to an epoxy resin composition capable of forming coating films and molded articles having excellent chemical resistance. [Prior Art] Trimellitic acid ester anhydride obtained from trimellitic acid anhydride and a polyfunctional alcohol is mainly used as a curing agent for general-purpose epoxy resins because it gives a cured product with excellent heat resistance. Widely used in fields where heat resistance is required. All of these trimellitic acid ester anhydrides are solid at room temperature, so when used as a curing agent for liquid epoxy resin, liquid acid anhydrides (for example, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, etc.) should be used. It is generally used by dissolving it in a soluble solvent. but,
Since mixtures of these liquid modified products and liquid epoxy resins form a uniform liquid, they inevitably suffer from short pot lives and poor storage stability. As a method to overcome these drawbacks, a liquid epoxy resin composition in which mechanically pulverized finely powdered polyhydric carboxylic acid or its anhydride is dispersed has been proposed (Japanese Patent Laid-Open No. 55-60569). . However, in general, mechanically pulverizing a solid into fine particles of 100 microns or less requires a large amount of energy, and the resulting finely pulverized material tends to stand up as dust (Japanese Patent Application No. 60-36738). It is also unfavorable from an environmental standpoint. [Problems to be Solved by the Invention] The object of the present invention is to create a liquid epoxy resin composition that has excellent heat resistance, is liquid, has excellent storage stability, and is significantly improved in terms of manufacturing work environment. With the goal. [Means for Solving the Problems] As a result of intensive studies to achieve the above object, the inventors of the present invention have solved the problem by heating and dissolving trimellitic acid ester anhydride in a specific solvent and then cooling it while stirring. A paste-like material in which spherical fine particles of anhydride are uniformly dispersed is obtained by a so-called chemical method, and an epoxy resin composition made by dispersing this paste-like material is a one-part material that can achieve the intended purpose. The present inventors have discovered that the epoxy resin composition is a polyurethane epoxy resin composition, and have completed the present invention based on this knowledge. That is, the one-component epoxy resin composition according to the present invention is obtained by precipitating and dispersing a trimellitic acid ester anhydride represented by the general formula () in a medium represented by the general formula (), and then dispersing the dispersion at room temperature. It is characterized by being blended with liquid epoxy resin.
【化】
(但し、Rはアルコール残基を示し、nは2ない
し4である。)
上記のトリメリツト酸エステル無水物は、例え
ばトリメリツト酸無水物と分子中に2ないし4個
の水酸基を有するポリオールとから得られる(特
公昭52−46940号)。上記ポリオールとしては、炭
素数2ないし12を有するものが好ましく、それら
は全体が脂肪族系であつてもよく、その中に芳香
族置換基を有していてもよい。末端ヒドロキシル
基を有する係るポリオールの中には、エチレング
リコール、1,3−プロパンジオール、1,4−
ブタンジオール、1,5−ペンタンジオール、
1,6−ヘキサンジオール、1,8−オクタンジ
オール、1,9−ノナンジオール、1,10−デカ
ンジオール、1,12−ドデカンジオール、ネオペ
ンチルグリコール、メチルプロピルプロパンジオ
ール等の脂肪族ジオール類、p−ジヒドロキシメ
チルベンゼン、シクロヘキサンジメタノール、水
素化ビスフエノールA等の環式ジオール類、ジエ
チレングリコール、トリエチレングリコール等の
グリコールエーテル類があり、3個又はそれ以上
のヒドロキシル基を有するグリセリン、トリメチ
ロールプロパン、ペンタエリスリトール等もジオ
ールのかかわりに使用し得る。
本発明に係る酸無水物を分散せしめる媒体とし
ては、一般式()[Chemical formula] (However, R represents an alcohol residue, and n is 2 to 4.) The above trimellitic acid ester anhydride can be used, for example, with trimellitic acid anhydride and a polyol having 2 to 4 hydroxyl groups in the molecule. (Special Publication No. 52-46940). The above-mentioned polyols preferably have 2 to 12 carbon atoms, and may be entirely aliphatic or may have an aromatic substituent therein. Among such polyols having terminal hydroxyl groups are ethylene glycol, 1,3-propanediol, 1,4-
butanediol, 1,5-pentanediol,
Aliphatic diols such as 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, 1,12-dodecanediol, neopentyl glycol, methylpropylpropanediol, Cyclic diols such as p-dihydroxymethylbenzene, cyclohexanedimethanol, and hydrogenated bisphenol A, glycol ethers such as diethylene glycol and triethylene glycol, and glycerin and trimethylolpropane having three or more hydroxyl groups. , pentaerythritol, etc. may also be used in conjunction with the diol. The medium for dispersing the acid anhydride according to the present invention has the general formula ()
【化】
(但し、R1及びR2は炭素数1ないし8のアルキ
ル基であり、同じであつても異なつていてもよ
い、R3は水素原子又は炭素数1ないし4のアル
キル基である。mは1ないし20を示す。)で表わ
される媒体の1種又は2種以上の混合物が適当で
あり、具体的にはセロソルブ系もしくはカルビト
ール系媒体、例えば、メチルセロソルブアセテー
ト、ブチルセロソルブアセテート、エチルカルビ
トールアセテート、ブチルカルビトールアセテー
ト等及びこれらの混合媒体、あるいはその他の有
機溶剤との混合媒体が挙げられる。
トリメリツト酸エステル無水物と媒体との混合
比率(重量比)は1:9〜9:1好ましくは1:
2〜4:1である。
本発明に係る酸無水物を媒体中で加熱溶解し、
この溶液を攪拌しながら冷却すると、当該酸無水
物は微粒子として析出し、媒体中に均一分散して
ペースト状混合物となる。
微粒子の粒径は、析出させる温度、攪拌速度等
によつて変化し、又、ある温度以上ではアモルフ
アス状を呈するため、所望の粒径、状態にコント
ロールし得る。
このペーストを汎用の液状エポキシ樹脂に配
合、分散させる。
本発明において推奨されるエポキシ樹脂は、公
知のエポキシ樹脂のうち常温で液状を呈するもの
であれば足り、具体的にはビスフエノールA、ビ
スフエノールF等の二価フエノールとエピクロル
ヒドリンより得られるビスフエノール型エポキシ
樹脂、脂環型エポキシ樹脂、グリシジルエステル
型エポキシ樹脂、ノボラツク型エポキシ樹脂、長
鎖ポリオールのグリシジルエーテル型エポキシ樹
脂、ポリオレフイン型エポキシ樹脂等があり、そ
れぞれ単独で使用してもよいし、2種以上を混合
して用いてもよい。
又、本発明に係る組成物には、所定の効果を奏
する限り、必要に応じて従来公知の酸無水物系硬
化剤、硬化促進剤、充填剤、希釈剤等を適宜配合
することが出来る。
[実施例]
以下に実施例を示し、本発明を詳説する。
実施例 1
エチレングリコールビストリメリテート二無水
物(以下、TMEGと略記する)64gとジエチレ
ングリコールモノエチルエーテルアセテート(以
下、ECAと略記する)64gを150℃で加熱混合し
た後、50℃まで冷却する。温度を50℃に保持した
まま3時間攪拌を続けると系が徐々に白濁し、淡
黄褐色のTMEGペーストが得られた。
このペーストにエピコート828、100gを添加
し、室温で1時間攪拌すると、黄色、低粘度の一
液性配合物が得られた。顕微鏡で観察すると、粒
径10〜50μmの分布をもつたTMEG微粒子が認め
られた。
実施例 2
TMEG96gとエチレングリコールモノブチル
エーテルアセテート20.6g及びスワゾール1000
(丸善石油製:芳香族系溶剤)20.6gを150℃で加
熱混合後50℃まで冷却し、4時間攪拌を続けた。
粒径10〜50μmの球状TMEG粒子が分散したペー
ストが得られた。
次に、エピコート828、100gを添加し、室温で
1時間攪拌すると、淡黄色低粘度の一液性配合物
が得られた。
実施例 3
グリセリントリストリメリテート三無水物(以
下、TMTAと略記する)100gとECA67gを混
合し、150℃まで加熱する。褐色均一溶液となつ
た後攪拌を続けながら50℃まで冷却し、3時間攪
拌を続けると淡黄色ペーストが得られた。
このペーストにエピコート828、100gを添加し
室温で1時間攪拌すると、黄色、低粘度の一液性
配合物が得られた。
比較例 1
TMTA42gと液状酸無水物(新日本理化製リ
カシツドMH−700)53gを混合し、120℃まで加
熱攪拌することにより褐色透明液体となる。更に
エピコート828、100gを加え室温で攪拌し、褐色
透明配合物が得られた。
比較例 2
液状酸無水物(リカシツドMH−700)86gと
エピコート828、100gを混合し、室温で攪拌する
ことにより、淡黄色透明配合物が得られた。
以上の実施例、比較例により得られたエポキシ
樹脂配合物及び硬化物の物性を表に示す。
[発明の効果]
表より明らかなように、本発明になる一液性エ
ポキシ樹脂組成物は、優れた貯蔵安定性を発現
し、かつその硬化物はトリメリツト酸エステル無
水物による硬化物の特徴である耐熱性、電気特性
等に優れた性能を有している。
又、このペースト状混合物はエポキシ樹脂と混
合した場合、樹脂の粘度を低下させるため、混合
が容易になり、しかも微粒子状態を維持したまま
均一に分散し得るため、エポキシ樹脂への配合物
はポツトライフが長く、粒子の沈降や粘度の急激
な変化は起こらず、更に、その硬化物は高い熱変
形温度を示し、耐熱性に優れたものである。[Chemical formula] (However, R 1 and R 2 are alkyl groups having 1 to 8 carbon atoms, and may be the same or different. R 3 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. One type or a mixture of two or more of the media represented by (m represents 1 to 20) is suitable, specifically cellosolve-based or carbitol-based media, such as methyl cellosolve acetate, butyl cellosolve acetate, Examples include ethyl carbitol acetate, butyl carbitol acetate, mixed media thereof, and mixed media with other organic solvents. The mixing ratio (weight ratio) of trimellitic acid ester anhydride and medium is 1:9 to 9:1, preferably 1:
The ratio is 2 to 4:1. The acid anhydride according to the present invention is heated and dissolved in a medium,
When this solution is cooled while stirring, the acid anhydride is precipitated as fine particles and uniformly dispersed in the medium to form a paste-like mixture. The particle size of the fine particles changes depending on the temperature at which the particles are precipitated, the stirring speed, etc., and since they exhibit an amorphous shape above a certain temperature, they can be controlled to a desired particle size and state. This paste is blended and dispersed in a general-purpose liquid epoxy resin. The epoxy resin recommended in the present invention may be any known epoxy resin as long as it is liquid at room temperature, and specifically, bisphenol obtained from dihydric phenols such as bisphenol A and bisphenol F and epichlorohydrin. There are type epoxy resins, alicyclic epoxy resins, glycidyl ester type epoxy resins, novolac type epoxy resins, glycidyl ether type epoxy resins of long chain polyols, polyolefin type epoxy resins, etc., and each may be used alone, or A mixture of more than one species may be used. Furthermore, the composition according to the present invention may contain conventionally known acid anhydride curing agents, curing accelerators, fillers, diluents, etc., as appropriate, as long as the desired effects are achieved. [Example] The present invention will be explained in detail with reference to Examples below. Example 1 64 g of ethylene glycol bistrimelitate dianhydride (hereinafter abbreviated as TMEG) and 64 g of diethylene glycol monoethyl ether acetate (hereinafter abbreviated as ECA) are heated and mixed at 150°C, and then cooled to 50°C. When stirring was continued for 3 hours while maintaining the temperature at 50°C, the system gradually became cloudy and a light yellowish brown TMEG paste was obtained. To this paste was added 100 g of Epicote 828 and stirred for 1 hour at room temperature, resulting in a yellow, low viscosity one-component formulation. When observed under a microscope, TMEG fine particles with a particle size distribution of 10 to 50 μm were observed. Example 2 TMEG 96g, ethylene glycol monobutyl ether acetate 20.6g and Swazol 1000
(Maruzen Oil Co., Ltd.: aromatic solvent) 20.6 g was heated and mixed at 150°C, cooled to 50°C, and stirred for 4 hours.
A paste was obtained in which spherical TMEG particles with a particle size of 10 to 50 μm were dispersed. Next, 100 g of Epicote 828 was added and stirred for 1 hour at room temperature, resulting in a pale yellow, low viscosity, one-component formulation. Example 3 100 g of glycerin tristrimeritate trianhydride (hereinafter abbreviated as TMTA) and 67 g of ECA are mixed and heated to 150°C. After the solution became a brown homogeneous solution, it was cooled to 50° C. while stirring, and stirring was continued for 3 hours to obtain a pale yellow paste. 100 g of Epicote 828 was added to this paste and stirred for 1 hour at room temperature, resulting in a yellow, low viscosity one-component formulation. Comparative Example 1 42 g of TMTA and 53 g of liquid acid anhydride (Rikashido MH-700, manufactured by Shin Nippon Chemical Co., Ltd.) were mixed and heated and stirred to 120°C to form a brown transparent liquid. Furthermore, 100 g of Epicote 828 was added and stirred at room temperature to obtain a brown transparent mixture. Comparative Example 2 A pale yellow transparent compound was obtained by mixing 86 g of liquid acid anhydride (Rikashid MH-700) and 100 g of Epicote 828 and stirring at room temperature. The physical properties of the epoxy resin compositions and cured products obtained in the above Examples and Comparative Examples are shown in the table. [Effects of the Invention] As is clear from the table, the one-component epoxy resin composition of the present invention exhibits excellent storage stability, and the cured product thereof has the characteristics of a cured product of trimellitic acid ester anhydride. It has excellent performance in certain heat resistance, electrical properties, etc. In addition, when this paste mixture is mixed with epoxy resin, it lowers the viscosity of the resin, making it easier to mix and evenly dispersing while maintaining the fine particle state. The cured product exhibits a high heat distortion temperature and has excellent heat resistance.
Claims (1)
式()で表されるトリメリツト酸エステル無水
物を析出分散せしめ、当該分散物を常温で液状の
エポキシ樹脂に配合してなることを特徴とする一
液性エポキシ樹脂組成物。 【化】 [式中、R1、R2は同一又は異なつて、炭素数1
〜8のアルキル基を表す。R3は水素原子又は炭
素数1〜4のアルキル基を表す。mは1〜20の整
数を示す。] 【化】 [式中、Rはアルコール残基を表し、nは2〜4
の整数を示す。][Claims] 1. A trimellitic acid ester anhydride represented by the general formula () is precipitated and dispersed in a medium represented by the general formula (), and the dispersion is blended into an epoxy resin that is liquid at room temperature. A one-component epoxy resin composition. [In the formula, R 1 and R 2 are the same or different and have a carbon number of 1
~8 alkyl group. R 3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. m represents an integer of 1 to 20. ] [In the formula, R represents an alcohol residue, and n is 2 to 4
indicates an integer. ]
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6792285A JPS61225212A (en) | 1985-03-30 | 1985-03-30 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6792285A JPS61225212A (en) | 1985-03-30 | 1985-03-30 | Epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61225212A JPS61225212A (en) | 1986-10-07 |
JPH0570649B2 true JPH0570649B2 (en) | 1993-10-05 |
Family
ID=13358887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6792285A Granted JPS61225212A (en) | 1985-03-30 | 1985-03-30 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61225212A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5992963B2 (en) * | 2014-07-04 | 2016-09-14 | ダウ グローバル テクノロジーズ エルエルシー | Thermosetting composition comprising a combination of amphiphilic block copolymer and polyol and thermosetting product therefrom |
-
1985
- 1985-03-30 JP JP6792285A patent/JPS61225212A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61225212A (en) | 1986-10-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3746686A (en) | Process for curing polyepoxides with polycarboxylic acid salts of an imidazole compound and compositions thereof | |
CA2527099C (en) | Use of urea derivatives as accelerators for epoxy resins | |
JP5789297B2 (en) | Epoxy resin composition, cured product, and preparation method thereof | |
CN104725602A (en) | Easily processed dianhydride hardener for epoxy resin systems based on 5,5 '-oxybis (isobenzofuran-1,3-dion) | |
CN102803334A (en) | Thermosettable composition containing a half ester of a cycloaliphatic diol and a thermoset product therefrom | |
CN112194779A (en) | Single-component epoxy resin composition containing latent imidazole curing accelerator and preparation method and application thereof | |
CN112142951B (en) | Bio-based latent waterborne epoxy resin and preparation method thereof | |
US3705129A (en) | Epoxy resin composition containing metallocenes | |
CN112062941A (en) | 6040 type polyester resin and preparation method thereof | |
JPS62276804A (en) | Permanent magnet | |
JPH0570649B2 (en) | ||
EP0215740A2 (en) | Branched polyesters | |
KR102453940B1 (en) | Method for producing an epoxy resin composition using an anhydride curing agent | |
CA2286676A1 (en) | Modified epoxy resin and its use as a formulating component for heat-curable compositions, especially for powder coatings | |
JPH0336847B2 (en) | ||
JPH04161466A (en) | Production of epoxy resin-based powder coating | |
JPS61190521A (en) | Epoxy resin composition | |
JP2764421B2 (en) | Curing agent composition for epoxy resin and method for curing epoxy resin using the same | |
JPH04264123A (en) | Triglycidyl isocyanurate composition | |
JPS5825118B2 (en) | Fun Taiyo Yoji Yushisoseibutsu | |
JPS6164726A (en) | Curable resin composition for production for electronic or electric parts | |
CN108070085B (en) | Polymer and resin composition containing the same | |
JPS63165429A (en) | Curing accelerator for epoxy resin | |
JP3312485B2 (en) | Powder epoxy resin composition | |
KR100554031B1 (en) | Thermosetting Epoxy Powder Coating Composition_ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |