JPH0563122A - Cooling structure - Google Patents

Abstract

PURPOSE:To equalize a junction temperature to electronic components regarding cooling structure in which the heat generation of the electronic components arrayed on a substrate is cooled. CONSTITUTION:In cooling structure, in which the shafts 3A of fins 3 are made to abut against each of electronic components 2 arrayed on a substrate 1 and the electronic components 2 are cooled by ventilating the fins 3, a thermoelectric heat pump 4, one surface of which is brought to the low temperature side and the other surface of which to the high temperature side by supplying currents, is installed between the fin 3 at a specified position and the electronic component 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for cooling the heat generated from electronic components arranged on a substrate. In electronic equipment where electronic components such as semiconductor elements are mounted on the printed circuit board,
Generally, heat generated from electronic components is cooled.

Such cooling is usually performed by ventilation by driving a fan or the like, or by a cooling plate in which a coolant such as cold water is circulated.

[0003]

2. Description of the Related Art Conventionally, it was formed as shown in the conventional explanatory view of FIG. 5A and 5B are side views.

As shown in FIG. 5A, fins 3 are provided on the surface 2A of an electronic component 2 such as a semiconductor device mounted on the substrate 1.
Was provided, and the ventilation was performed by driving a fan or the like.

Further, the fins 3 are formed by fixing a plurality of blades 3B to the shaft 3A at predetermined intervals.
One end of is fixed to the surface 2A of the electronic component 2. Therefore, the heat generated by the electronic component 2 is transferred to the shaft 3A, and the heat amount transferred to the shaft 3A is radiated by the ventilation 7 through the blades 3B to cool the heat generated by the electronic component 2. ..

In the case of (b), the flange 6A is provided on one side of the bellows 6B, and the cooling element 6 formed by providing the contact plate 6C on the other side is engaged with the cooling plate 5 to contact the contact plate 6C. Was formed so as to be in close contact with the surface 2A of the electronic component 2 mounted on the substrate 1.

Therefore, a coolant 8 such as cold water is circulated in each cooling element 6 in the flow passage 5A of the cooling plate 5 as shown by arrows A1 to A6, and the heat generated in the electronic component 2 is generated by the coolant 8 through the contact plate 6C. It was being absorbed.

Therefore, the former is designed to cool the heat generation of the electronic component 2 by the ventilation 7 and the latter to circulate the refrigerant 8, so that the junction temperature of the electronic component 2 becomes a predetermined temperature.

[0009]

However, by setting the junction temperature of each electronic component 2 mounted on the substrate 1 to a predetermined temperature by such circulation of the ventilation 7 and the coolant 8, for example, as shown in FIG. a) As shown in (b), part A and C
Electronic component 2 located in section B than Electronic component 2 located in section
In the case where the heat generation amount is large, the junction temperature of the electronic component 2 located at the portion B naturally becomes a high temperature by the same cooling with the ventilation 7 and the refrigerant 8.

Therefore, when an electronic component 2 having a different amount of heat generation is adjacent to the substrate 1, a uniform junction temperature cannot be obtained, and particularly in the case of a semiconductor element or the like, stable electric characteristics cannot be obtained. I had.

Therefore, an object of the present invention is to make the junction temperatures of electronic components uniform.

[0012]

FIG. 1 is a diagram for explaining the principle of the first invention, and FIG. 2 is a diagram for explaining the principle of the second invention.
According to the first aspect of the present invention, as shown in FIG. 1, a shaft 3A of a fin 3 is brought into contact with each of the electronic components 2 arranged on a substrate 1, and the fins 3 are ventilated 7 to cause the electronic components 2 to flow. In the cooling structure for cooling the electric power, the thermoelectric heat pump 4 whose one side becomes the low temperature side 4B and the other side becomes the high temperature side 4A by supplying the electric current is installed in the shaft 3A and the electronic parts at predetermined positions.
In the second aspect of the invention, as shown in FIG. 2, the cooling elements 6 arranged on the cooling plate 5 are brought into contact with the electronic components 2 arranged on the substrate 1, respectively. ,
A thermoelectric heat pump having a cooling structure for cooling the electronic component 2 by circulating a cooling medium 8 in the cooling plate 5, one side being a low temperature side 4B and the other being a high temperature side 4A by supplying an electric current. 4 is provided between the cooling element 6 and the electronic component 2 at a predetermined position.

The above-mentioned problems can be solved by such a configuration.

[0014]

Function: That is, in the first invention, the shaft 3A and the electronic component
A thermoelectric heat pump 4 is provided between the electronic component 2 and the thermoelectric heat pump 4, and a temperature difference between the electronic component 2 and the thermoelectric heat pump 4, and between the shaft 3A and the thermoelectric heat pump 4. Is made larger, and the heat transfer gradient between the shaft 3A and the electronic component 2 is made steeper, thereby increasing the amount of heat transferred and enhancing the cooling efficiency.

Further, in the second aspect of the invention, the thermoelectric heat pump 4 is provided between the cooling element 6 and the electronic component 2, and the heat transfer between the cooling element 6 and the electronic component 2 is performed as described above. By making the gradient steep, the amount of heat transferred is increased and the cooling efficiency is improved.

Therefore, in any case, the junction temperature can be made uniform by providing the thermoelectric heat pump 4 for the electronic component 2 which generates a large amount of heat.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to FIGS. FIG. 3 is an explanatory view of an embodiment according to the first invention, (a) is a side view, (b) is a graph of cooling efficiency, and FIG. 4 is a side view of the embodiment according to the second invention. .. Throughout the drawings, the same reference numerals denote the same objects.

As shown in FIG. 3 (a), a plurality of electronic components 2 are mounted on the substrate 1, and the heat generation amount of the electronic component 2 located in the B section is located in the A section and the C section. If it is larger than that, the electronic component 2 located in the part B is provided with a thermoelectric heat pump 4, and the fin 3 fixed to the surface 2A of the electronic component 2 is provided.
The shaft 3A is fixed by interposing the thermoelectric heat pump 4.

The thermoelectric heat pump 4 is of the N type.
Commercially available products made of P type semiconductor materials (for example, manufactured by Marlow Industries)
By supplying a predetermined current A to the electrode, one surface becomes the high temperature side 4A and the other surface becomes the low temperature side 4B.
A predetermined temperature difference ΔT is obtained between 4A and the low temperature side 4B.

Therefore, when the low temperature side 4B is brought into close contact with the surface 2A of the electronic component 2 and the high temperature side 4A is brought into close contact with the shaft 3A, and the electronic component 2 is cooled by the ventilation 7, as shown in (b),
When the heat generation temperatures of the electronic component 2 located in the C and C parts are TA and TC, respectively, the heat generated by the fin 3 causes Ta and TC
Since it is cooled to Tc, Ta and Tc are set to a predetermined junction temperature TJ, and the cooling gradient in this case is performed by C1.

Electronic parts located in the A and C parts
The electronic component 2 located in the portion B where the temperature of TB is higher than the heat generation temperature of 2 is normally cooled to Tb by a cooling gradient C2 steeper than that of C1 described above, as shown by the dotted line. There is a temperature difference T1 between the junction temperature TJ and the cooling temperature T of the electronic component 2 located in the parts A and C.
There will be a clear difference between a and Tc.

However, when the thermoelectric heat pump 4 is provided, the temperature difference ΔT is further added to the heat generation temperature of TB, so that the heat generation temperature becomes TB1. Therefore, the amount of heat dissipated by the fins 3 increases, which is compared to the above-mentioned C2. And then a steep cooling gradient
It will be cooled by C3 and cooled to Tb1.
In this case, a temperature difference of T2 occurs between Tb1 and the predetermined junction temperature TJ, which is smaller than the above-mentioned temperature difference T1 and can approach the predetermined junction temperature TJ.

In the case of FIG. 4, the surface 2A of the electronic component 2 and the contact plate 6C of the cooling element 6 located in the portion B where the heat generation amount is large.
A thermoelectric heat pump 4 is provided between the thermoelectric heat pump 4 and the thermoelectric heat pump 4, and a predetermined current is supplied to the thermoelectric heat pump 4 so that the low temperature side 4B of the thermoelectric heat pump 4 adheres to the surface 2A of the electronic component 2 and the high temperature side 4A contacts the contact plate 6C. It is designed to be closely attached to.

Even with this structure, the above-mentioned FIG. 3 (b) is used.
As shown in Fig. 3, the electronic component 2 located in the B part, which has a temperature TB higher than the heat generation temperature of the electronic component 2 located in the A part and the C part, has a steep cooling gradient due to the thermoelectric heat pump 4. It is cooled by C3, which is the temperature of Tb1, and can approach the predetermined junction temperature TJ in the same manner as described above.

Therefore, in any case, even if the electronic components 2 having different heat generation amounts are arranged adjacent to each other, the thermoelectric heat pump 4 is provided so as to obtain a uniform junction temperature without special cooling. Therefore, it is possible to eliminate the variation in the junction temperature.

[0026]

As described above, according to the present invention,
When a plurality of electronic components are mounted, a thermoelectric heat pump is provided especially for electronic components that generate a large amount of heat, so that the cooling efficiency can be increased and a uniform predetermined junction temperature can be obtained.

Therefore, without special cooling,
Stable electrical characteristics of electronic parts can be obtained, and reliability can be improved.

[Brief description of drawings]

FIG. 1 is an explanatory view of the principle of the first invention.

FIG. 2 is an explanatory view of the principle of the second invention.

FIG. 3 is an explanatory diagram of an embodiment according to the first invention.

FIG. 4 is a side view of an embodiment according to the second invention.

FIG. 5 is a conventional explanatory diagram.

[Explanation of symbols]

1 substrate 2 electronic component 3 fin 4 thermoelectric heat pump 5 cooling plate 6 cooling element 7 ventilation 8 refrigerant 3A shaft 4A high temperature side 4B low temperature side

Claims (2)

[Claims] 1. A shaft (3A) of a fin (3) is brought into contact with each of the electronic components (2) arranged on a substrate (1), and ventilation (7) is applied to the fin (3) so that It is a cooling structure that cools electronic components (2), and a thermoelectric heat pump (4) whose one side becomes a low temperature side (4B) and the other side becomes a high temperature side (4A) by supplying an electric current A cooling structure provided between the shaft (3A) and the electronic component (2). 2. A cooling element (6) arranged on a cooling plate (5) is brought into contact with each of the electronic components (2) arranged on the substrate (1), and a cooling medium (8) is attached to the cooling plate (5). ) Is a cooling structure for cooling the electronic component (2), and by supplying an electric current, one side is a low temperature side (4B) and the other side is a high temperature side (4A) (4) A cooling structure, characterized in that it is provided between a predetermined location between the cooling element (6) and the electronic component (2).