JPH0560830A - Thermostat for ic testing device - Google Patents
Thermostat for ic testing deviceInfo
- Publication number
- JPH0560830A JPH0560830A JP3224221A JP22422191A JPH0560830A JP H0560830 A JPH0560830 A JP H0560830A JP 3224221 A JP3224221 A JP 3224221A JP 22422191 A JP22422191 A JP 22422191A JP H0560830 A JPH0560830 A JP H0560830A
- Authority
- JP
- Japan
- Prior art keywords
- case
- hot air
- duct
- unit
- constant temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、多数のＩＣ測定部に
おける温度を一様にするＩＣ試験装置用恒温槽に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a constant temperature bath for an IC testing device which makes the temperatures in a large number of IC measuring sections uniform.
【０００２】[0002]
【従来の技術】ＩＣについての評価或いはＩＣ受け入れ
検査は、多数のＩＣを恒温槽に収容して恒温状態におい
て一度に同時に実施される。この様な用途に供されるＩ
Ｃ試験装置用恒温槽の従来例を図１を参照して説明す
る。2. Description of the Related Art Evaluations of ICs or IC acceptance inspections are carried out simultaneously at a time in a constant temperature state in which a large number of ICs are housed in a constant temperature tank. I used for such applications
A conventional example of a constant temperature bath for a C test device will be described with reference to FIG.
【０００３】図１において、１はＩＣ試験装置用恒温槽
のケースである。ケース１は、図においてその右上方領
域にファン・ユニット２およびヒータ・ユニット３を収
容し、その下方領域に多数のＩＣを同時に測定する多数
のＩＣ測定部が構成される。４は熱風を案内するダクト
であり、その下端はケース１の右上方領域を形成するケ
ース下面に係合してこれらの間に熱風流通路が形成され
る。５はケース背面基板であり、この背面基板５にはコ
ンタクト・ユニット（レール・ユニット）６が取り付け
られる。In FIG. 1, reference numeral 1 is a case of a constant temperature bath for an IC test apparatus. The case 1 accommodates the fan unit 2 and the heater unit 3 in the upper right area in the figure, and has a large number of IC measurement units for simultaneously measuring a large number of ICs in the lower area. Reference numeral 4 denotes a duct for guiding hot air, the lower end of which is engaged with the lower surface of the case forming the upper right region of the case 1 to form a hot air flow passage therebetween. Reference numeral 5 denotes a case rear substrate, to which a contact unit (rail unit) 6 is attached.
【０００４】コンタクト・ユニット６は図２に示される
が如きものである。コンタクト・ユニット６は上述した
通りケースの背面基板５に取り付けられ、測定されるべ
きＩＣ７をＩＣ測定部８に位置決め保持するためのもの
である。ＩＣ７は、共に上下方向に延伸するレール９お
よびルーフ１０とストッパ１１の３者により図示される
が如くに位置決めされるのであるが、その詳細について
は説明を省略する。なお、多数のＩＣ測定部８における
温度が一様であるか否かを判断するには測定部８におけ
る温度を測定する必要があることは言うまでもないこと
であるが、そのためには例えばＰｔセンサをＩＣ測定部
８に位置決め保持されたＩＣ７の近傍に配置する。Contact unit 6 is as shown in FIG. The contact unit 6 is attached to the rear substrate 5 of the case as described above, and serves to position and hold the IC 7 to be measured in the IC measuring section 8. The IC 7 is positioned as shown by the three members including the rail 9 and the roof 10 that both extend in the vertical direction, and the stopper 11, but a detailed description thereof will be omitted. Needless to say, it is necessary to measure the temperature in the measuring unit 8 in order to determine whether or not the temperature in the multiple IC measuring units 8 is uniform. It is arranged near the IC 7 positioned and held by the IC measuring unit 8.
【０００５】[0005]
【発明が解決しようとする課題】上述されたＩＣ試験装
置用恒温槽の従来例において、ファン・ユニット２によ
り生ぜしめられた高速空気の流れはヒータ・ユニット３
に到達し、ここにおいて熱交換されながらダクト４によ
り案内されて図１の矢印により示されるが如くに流通す
る。即ち、加熱された熱風の流れはダクト４により偏向
されて上から下向きに吹き出され、流通、循環せしめら
れる。この従来例の場合、ＩＣ測定部８は合計３２箇所
構成されるのであるが、何分にもコンタクト・ユニット
６は図２に示されるが如く大変に複雑な形状構造を有す
るものであることから、３２箇所のＩＣ測定部８に加熱
された高速空気を一様に流通、循環せしめることは容易
なことではないのである。現実に、恒温槽内温度を一様
に１００℃としたい場合、恒温槽内上部を１００℃に保
持したものとすると、下部は９０℃程度にしかならな
い。実際は、ＩＣ測定部８すべてについて設定温度±３
℃程度の精度におさめたく、種々の対策を講じてきたた
のであるが、今の所この精度を実現することはできてい
ない。In the conventional example of the constant temperature bath for the IC test apparatus described above, the flow of high-speed air generated by the fan unit 2 is the heater unit 3
And is guided by the duct 4 while exchanging heat there, and flows as shown by the arrow in FIG. That is, the flow of the heated hot air is deflected by the duct 4 and blown downward from above, and is circulated and circulated. In the case of this conventional example, the IC measuring section 8 is configured in 32 places in total, but since the contact unit 6 has a very complicated shape structure as shown in FIG. It is not easy to uniformly circulate and circulate the heated high-speed air in the 32 IC measuring units 8. In reality, when it is desired to keep the temperature inside the constant temperature bath at 100 ° C. uniformly, if the upper portion inside the constant temperature bath is kept at 100 ° C., the lower portion is only about 90 ° C. Actually, the set temperature is ± 3 for all IC measuring units 8.
Although various measures have been taken in order to reduce the accuracy to about ℃, this accuracy has not been realized so far.
【０００６】この発明は、上述の通りの問題を解消しよ
うとするものである。The present invention is intended to solve the above problems.
【０００７】[0007]
【課題を解決するための手段】ケース１を具備し、ケー
ス１の上方領域にはファン・ユニット２およびヒータ・
ユニット３を収容し、その下方領域には多数のＩＣ測定
部８を構成するコンタクト・ユニット６を収容し、熱風
を案内するダクト４を具備するＩＣ試験装置用恒温槽に
おいて、ダクト４とケース１とによりこれらの間に熱風
流通路を形成し、熱風流通路の下端はケース下方領域下
部において開口するものとした。A case 1 is provided, and a fan unit 2 and a heater are provided in an upper region of the case 1.
The duct 4 and the case 1 are provided in a thermostatic chamber for an IC test apparatus, which accommodates the unit 3 and the contact unit 6 that constitutes a large number of IC measuring units 8 in the lower region thereof and includes the duct 4 that guides hot air. A hot air flow passage is formed between them by means of, and the lower end of the hot air flow passage opens at the lower part of the lower region of the case.
【０００８】[0008]
【実施例】この発明の実施例を図３を参照して説明す
る。図３について、図１における参照数字と共通する参
照数字は互いに同一の部材を示すものとする。図３に示
されるこの発明のＩＣ試験装置用恒温槽は図１に示され
る従来のＩＣ試験装置用恒温槽におけるダクト４の先端
部にケース１底面近傍に達する垂直延長部４’を付加し
たものに相当する。この垂直延長部４’は、ダクト４の
先端部からケース１底面近傍に迄達する前面板１２と、
前面板１２の左右両端部において屈曲してケースの背面
基板５に達すると共に下端はケース１底面に達する左右
の側面板１３とにより構成される。結局、この垂直延長
部４’とケースの背面基板５との間にも熱風流通路が形
成され、そしてこの熱風流通路の下端はケース下方領域
下部、即ちケース１底面近傍において開口するものであ
る。従って、ダクト４とケース１の右上方領域を形成す
るケース下面との間に形成される熱風流通路とダクトの
垂直延長部４’とケースの背面基板５との間に形成され
る熱風流通路とは互いに連通しており、ヒータ・ユニッ
ト３から送り出される熱風はこれら連通する熱風流通路
を流れ下り、図３において矢印で示される如くに恒温槽
下部から上向きに吹き出され、流通、循環せしめられ
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described with reference to FIG. 3, reference numerals common to those in FIG. 1 denote the same members. The temperature chamber for IC test equipment of the present invention shown in FIG. 3 is obtained by adding a vertical extension 4 ′ reaching the vicinity of the bottom surface of the case 1 to the tip of the duct 4 in the conventional temperature chamber for IC test equipment shown in FIG. Equivalent to. The vertical extension 4 ′ includes a front plate 12 that extends from the tip of the duct 4 to near the bottom of the case 1,
The left and right side plates 13 of the front plate 12 are bent to reach the rear substrate 5 of the case and the lower ends thereof reach the bottom surface of the case 1. Eventually, a hot air flow passage is also formed between the vertical extension 4'and the back substrate 5 of the case, and the lower end of the hot air flow passage opens at the lower part of the lower region of the case, that is, near the bottom surface of the case 1. .. Therefore, the hot air flow passage formed between the duct 4 and the lower surface of the case forming the upper right region of the case 1 and the hot air flow passage formed between the vertical extension 4 ′ of the duct and the back substrate 5 of the case. Are communicated with each other, and the hot air sent out from the heater unit 3 flows down through the hot air flow passages communicating with each other, and is blown upward from the lower part of the constant temperature oven as shown by an arrow in FIG. 3 to be circulated and circulated. ..
【０００９】[0009]
【発明の効果】熱風の流れが恒温槽内に上から下向きに
吹き出され、流通、循環せしめられるＩＣ試験装置用恒
温槽について、ＩＣ測定部８すべてについて設定温度±
３℃程度の精度におさめるべく種々の対策を講じてもこ
の精度を実現することができなかったのであるが、この
発明によってダクト４の先端部にケース１底面近傍に達
する垂直延長部４’を付加するという一見極く簡単な構
成を採用して熱風流通路を形成し、熱風を図３において
矢印で示されるが如くに恒温槽下部から上向きに吹き出
し、流通循環せしめたところ、ＩＣ測定部８すべてにつ
いて設定温度±３℃の精度は充分に保たれていることを
実測することができた。ＩＣ試験装置用恒温槽について
この程度の精度を保つことにより、ＩＣについての評価
或いはＩＣ受け入れ検査の信頼性は充分に担保されるに
到った。EFFECTS OF THE INVENTION Regarding the constant temperature chamber for the IC test apparatus in which the flow of hot air is blown downward from the inside into the constant temperature chamber, the temperature is set ± for all the IC measuring units 8 in the constant temperature chamber for IC test equipment.
Even if various measures were taken to reduce the accuracy to about 3 ° C., this accuracy could not be realized, but according to the present invention, the vertical extension 4 ′ reaching the vicinity of the bottom surface of the case 1 is provided at the tip of the duct 4. The hot air flow passage was formed by adopting a seemingly extremely simple configuration of adding, and hot air was blown upward from the lower part of the constant temperature chamber as shown by the arrow in FIG. It was possible to measure that the accuracy of the set temperature ± 3 ° C was sufficiently maintained for all of them. By maintaining this degree of accuracy in the constant temperature bath for the IC test apparatus, the reliability of the IC evaluation or IC acceptance inspection has been sufficiently ensured.
【図１】ＩＣ試験装置用恒温槽の従来例を示す図。FIG. 1 is a view showing a conventional example of a constant temperature bath for an IC test device.
【図２】ＩＣ試験装置に使用されるコンタクト・ユニッ
トを示す図。FIG. 2 is a diagram showing a contact unit used in an IC test apparatus.
【図３】この発明のＩＣ試験装置用恒温槽を示す図。FIG. 3 is a view showing a thermostatic chamber for an IC test device according to the present invention.
１ ケース ２ ファン・ユニット ３ ヒータ・ユニット ４ ダクト ６ コンタクト・ユニット 1 case 2 fan unit 3 heater unit 4 duct 6 contact unit
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成４年８月２１日[Submission date] August 21, 1992
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】請求項１[Name of item to be corrected] Claim 1
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００７[Correction target item name] 0007
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００７】[0007]
【課題を解決するための手段】ケース１を具備し、ケー
ス１の上方領域にはファン・ユニット２およびヒータ・
ユニット３を収容し、その下方領域には多数のＩＣ測定
部８を構成するコンタクト・ユニット６を収容し、熱風
および冷風を案内するダクト４を具備するＩＣ試験装置
用恒温槽において、ダクト４とケース１とによりこれら
の間に熱風流通路を形成し、熱風流通路の下端はケース
下方領域下部において開口するものとした。A case 1 is provided, and a fan unit 2 and a heater are provided in an upper region of the case 1.
The unit 3 is housed, and the contact unit 6 that constitutes a large number of IC measuring units 8 is housed in the lower region of the unit 3.
And a constant temperature bath for an IC test apparatus, which is provided with a duct 4 for guiding cold air, in which a hot air flow passage is formed between the duct 4 and the case 1, and a lower end of the hot air flow passage opens at a lower portion of a lower region of the case. And
Claims (1)
ファン・ユニットおよびヒータ・ユニットを収容し、そ
の下方領域には多数のＩＣ測定部を構成するコンタクト
・ユニットを収容し、熱風を案内するダクトを具備する
ＩＣ試験装置用恒温槽において、ダクトとケースとによ
りこれらの間に熱風流通路を形成し、熱風流通路の下端
はケース下方領域下部において開口するものであること
を特徴とするＩＣ試験装置用恒温槽。1. A case is provided, a fan unit and a heater unit are accommodated in an upper region of the case, and a contact unit which constitutes a large number of IC measuring units is accommodated in a lower region thereof, and hot air is guided. In a thermostatic chamber for an IC test apparatus including a duct, a hot air flow passage is formed between a duct and a case, and a lower end of the hot air flow passage opens at a lower portion of a lower region of the case. Constant temperature bath for IC test equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03224221A JP3075542B2 (en) | 1991-09-04 | 1991-09-04 | Constant temperature bath for IC test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03224221A JP3075542B2 (en) | 1991-09-04 | 1991-09-04 | Constant temperature bath for IC test equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0560830A true JPH0560830A (en) | 1993-03-12 |
| JP3075542B2 JP3075542B2 (en) | 2000-08-14 |
Family
ID=16810409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03224221A Expired - Lifetime JP3075542B2 (en) | 1991-09-04 | 1991-09-04 | Constant temperature bath for IC test equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3075542B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100811418B1 (en) * | 2007-06-08 | 2008-03-07 | 김기영 | A corrugated board |
| EP2048283B1 (en) | 2007-08-30 | 2015-08-19 | INDUSTRIE CARTARIE TRONCHETTI SpA | Apparatus for pasting two or more plies for manufacturing tissue products |
-
1991
- 1991-09-04 JP JP03224221A patent/JP3075542B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100811418B1 (en) * | 2007-06-08 | 2008-03-07 | 김기영 | A corrugated board |
| EP2048283B1 (en) | 2007-08-30 | 2015-08-19 | INDUSTRIE CARTARIE TRONCHETTI SpA | Apparatus for pasting two or more plies for manufacturing tissue products |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3075542B2 (en) | 2000-08-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20000509 |