JPH0560736B2 - - Google Patents
Info
- Publication number
- JPH0560736B2 JPH0560736B2 JP63310602A JP31060288A JPH0560736B2 JP H0560736 B2 JPH0560736 B2 JP H0560736B2 JP 63310602 A JP63310602 A JP 63310602A JP 31060288 A JP31060288 A JP 31060288A JP H0560736 B2 JPH0560736 B2 JP H0560736B2
- Authority
- JP
- Japan
- Prior art keywords
- solid
- angle prism
- image sensor
- state image
- connection board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003384 imaging method Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 7
- 239000006059 cover glass Substances 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Endoscopes (AREA)
- Instruments For Viewing The Inside Of Hollow Bodies (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は電子内視鏡、さらに詳しく言えば先
端部の外径を小さくできる電子内視鏡に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic endoscope, and more specifically, to an electronic endoscope whose distal end can have a reduced outer diameter.
〔従来の技術〕
電子内視鏡においては、観察対象の内部に挿入
する先端部の内部に、対物レンズを通して得られ
る画像に関する光学的信号を電気信号に変換し、
これをプロセツサに送つてそのまま再生、あるい
は映像として記録するための撮像手段組立体が納
められている。[Prior Art] In an electronic endoscope, an optical signal related to an image obtained through an objective lens is converted into an electrical signal inside the distal end inserted into the object to be observed.
An imaging means assembly is housed therein for sending this to a processor and playing it back as it is or recording it as an image.
従来の撮像手段組立体は第４図ないし第６図に
示されるように、対物レンズ群１の光軸に直交し
て直角プリズム２の入射面が配置され、この直角
プリズム２の出射面２１の下方に面接触して、例
えばCCDのような固体撮像素子４が設けられる
（したがつて直角プリズム２の出射面２１と固体
撮像素子４のカバーガラス４１が接触する）。し
かして、その固体撮像素子４の下側にトランジス
タ６やコンデンサ７等の電子部品の搭載されたプ
リント基板である接続用基板３が設けられ、上述
した各撮像手段を支持して全体として撮像手段組
立体としてまとめられている。なお、符号９，９
はライトガイド孔を示す。 In the conventional imaging means assembly, as shown in FIGS. 4 to 6, the entrance surface of a rectangular prism 2 is disposed orthogonal to the optical axis of the objective lens group 1, and the exit surface 21 of the rectangular prism 2 is arranged perpendicularly to the optical axis of the objective lens group 1. A solid-state image sensor 4, such as a CCD, is provided downward in surface contact (therefore, the exit surface 21 of the right-angle prism 2 and the cover glass 41 of the solid-state image sensor 4 are in contact). A connection board 3, which is a printed circuit board on which electronic components such as a transistor 6 and a capacitor 7 are mounted, is provided below the solid-state imaging device 4, and supports each of the above-mentioned imaging means, forming the entire imaging means. It is put together as an assembly. In addition, the code 9, 9
indicates a light guide hole.
従来、接続用基板３は、第１に固体撮像素子４
の下側に位置してこれを支持する形であるため
と、第２の固体撮像素子４の極板面、つまりカバ
ーガラス４１の設けられる面から延びるリード線
と接続用基板３とを結ぶ接続結線部５が撮像手段
組立体の最外側端縁を周回して取付けられ、これ
により機械的損傷を受け易くなることを避けるた
めとの２つの理由によつて、その幅W1は固体撮
像素子４の同方向の幅より大きく選定される。し
たがつて、撮像手段組立体の幅は事実上この接続
用基板３の幅W1によつて規定され、内視鏡先端
部の内径はこの幅W1が納まるように選定される。
Conventionally, the connection board 3 first connects the solid-state image sensor 4.
This is because the structure is positioned below and supports the second solid-state image sensor 4, and the connection between the lead wire extending from the electrode plate surface of the second solid-state image sensor 4, that is, the surface where the cover glass 41 is provided, and the connection substrate 3 is made. The width W 1 is smaller than that of the solid-state image sensor for two reasons: the connecting portion 5 is attached around the outermost edge of the imaging means assembly, and this makes it susceptible to mechanical damage. 4 in the same direction. Therefore, the width of the imaging means assembly is effectively defined by the width W 1 of this connection board 3, and the inner diameter of the endoscope tip is selected to accommodate this width W 1 .
さらに、接続用基板３に搭載されるトランジス
タ６やコンデンサ７等の電子部品は固体撮像素子
４が接触する反対面、即ち第６図で接続用基板の
下面に取付けられるため、それらが送気給水孔１
０や鉗子孔１１等と干渉しないような配慮も先端
部内径の選定に際して加味される。 Furthermore, since the electronic components such as the transistor 6 and the capacitor 7 mounted on the connection board 3 are mounted on the opposite side where the solid-state image sensor 4 contacts, that is, the bottom surface of the connection board in FIG. Hole 1
0, the forceps hole 11, etc., consideration is also taken into consideration when selecting the inner diameter of the tip.
以上の説明から分かるように、内視鏡先端部の
直径は結局は固体撮像素子４の幅が基準となり、
これより接続結線部５を設けるスペース分だけ大
きい幅の接続用基板３が納まり、かつ接続用基板
３に搭載される電子部品が各種導孔と干渉しない
条件によつて決定されることとなり、電子内視鏡
の先端部直径をできるだけ小径にしようとしても
固体撮像素子の幅という基本的制約を脱すること
ができず、大きい成果が望めなかつた。 As can be seen from the above explanation, the diameter of the tip of the endoscope is determined based on the width of the solid-state image sensor 4.
From this, the width of the connection board 3 that is wide enough to accommodate the space provided with the connection wiring section 5 is determined, and the electronic components mounted on the connection board 3 are determined based on the conditions that they do not interfere with the various conductive holes. Even if we tried to make the diameter of the tip of the endoscope as small as possible, we could not overcome the basic constraint of the width of the solid-state image sensor, and no great results could be expected.
この発明は、前述の問題を解決するためになさ
れたものであつて、対物レンズ群と、前記対物レ
ンズ群の光軸に入射面が直交するよう設けられる
直角プリズムと、前記直角プリズムの出射面に面
接触するように配置される固体撮像素子と、この
固体撮像素子によつて得られる画像信号をプロセ
ツサに送るための接続用基板を撮像手段組立体を
有する電子内視鏡において、前記接続用基板に前
記直角プリズムの出射面に対応する切欠き部が形
成され、これによりこの接続用基板が前記固体撮
像素子に対して前記直角プリズムの側にあつて前
記固体撮像素子のカバーガラスの表面に面接触す
るように設けられたものである。
The present invention was made in order to solve the above-mentioned problem, and includes an objective lens group, a right-angle prism provided with an incident surface perpendicular to the optical axis of the objective lens group, and an exit surface of the right-angle prism. In an electronic endoscope, the electronic endoscope includes an imaging means assembly including a solid-state imaging device disposed in surface contact with the solid-state imaging device, and a connection board for sending an image signal obtained by the solid-state imaging device to a processor. A notch corresponding to the output surface of the right-angle prism is formed in the substrate, so that the connection substrate is on the side of the right-angle prism with respect to the solid-state image sensor and is on the surface of the cover glass of the solid-state image sensor. It is provided so that it makes surface contact.
接続用基板が固体撮像素子に対し直角プリズム
の側にあるため、接続用基板を固体撮像素子の幅
より小さくして所望の接続結線部が形成でき、ま
た接続用基板の切欠き部に直角プリズムの出射面
を合致させることにより、固体撮像素子に面接触
させることができる。
Since the connection board is located on the side of the right-angle prism relative to the solid-state image sensor, the desired connection portion can be formed by making the connection board smaller than the width of the solid-state image sensor. By matching the emission surfaces of the two, surface contact can be made with the solid-state image sensor.
〔実施例〕
第１図ないし第３図について、この発明の一実
施例を説明する。図中の符号で第４図ないし第６
図の従来技術について用いられたものと同一の符
号は同一の要素を示すものとする。[Embodiment] An embodiment of the present invention will be described with reference to FIGS. 1 to 3. Figures 4 to 6 are indicated by the numbers in the figure.
The same reference numerals as used for the prior art in the figures refer to the same elements.
直角プリズム２は、対物レンズ群１の光軸にそ
の入射面を直交させるように配置される。一方、
固体撮像素子４より狭い幅Ｗを持つ接続用基板３
は、固体撮像素子４の表面、即ちカバーガラス面
４１に面接続して配置され、この両者をつなぐ接
続結線部５は接続用基板３の側端縁よりは外側
で、しかも固体撮像素子４の側端縁よりは内側に
位置する。直角プリズム２の出射面２１は、接続
用基板３の切欠き部３１を通して固体撮像素子４
の表面、つまりカバーガラス４１の表面に面接触
して配置される。 The right-angle prism 2 is arranged so that its entrance plane is orthogonal to the optical axis of the objective lens group 1. on the other hand,
Connection board 3 having a width W narrower than the solid-state image sensor 4
is disposed so as to be surface-connected to the surface of the solid-state image sensor 4, that is, the cover glass surface 41, and the connecting wire portion 5 that connects the two is located outside the side edge of the connection board 3, and furthermore, is connected to the surface of the solid-state image sensor 4. It is located inside the side edge. The output surface 21 of the right-angle prism 2 passes through the notch 31 of the connection board 3 to the solid-state image sensor 4.
, that is, the surface of the cover glass 41 .
上述の各構成要素の配列順を改めて記すと、第
１図において上方から直角プリズム２、接続用基
板３、カバーガラス４１および固体撮像素子４と
なり、従来（第４図）は最下側にあつた接続用基
板３が直角プリズム２の次に位置が変わつている
ことに注目されたい。このような配置によつても
直角プリズム２の出射面２１を固体撮像素子４に
対する接触を可能にしているものは、もちろん接
続用基板３に形成される切欠き部３１である。 To rewrite the arrangement order of each of the above-mentioned components, from the top in FIG. Note that the connecting board 3 is now next to the rectangular prism 2. What allows the exit surface 21 of the right-angle prism 2 to come into contact with the solid-state image sensor 4 even in this arrangement is, of course, the notch 31 formed in the connection substrate 3.
なお、トランジスタ６およびコンデンサ７は接
続用基板３の直角プリズム２の側に取付けられ
る。また、符号８は固体撮像素子４において変換
された画像信号を図示していないプロセツサに送
る接続ケーブルである。 Note that the transistor 6 and the capacitor 7 are attached to the connection substrate 3 on the right angle prism 2 side. Further, reference numeral 8 is a connection cable that sends the image signal converted in the solid-state image sensor 4 to a processor (not shown).
この発明によれば、（）固体撮像素子より狭
い幅の接続用基板を用いるため、撮像手段組立体
の最大幅は固体撮像素子のそれによつて定まるこ
とになり、この結果従来より明らかに幅が狭くな
り、したがつて内視鏡先端部の直径を小さくする
ことができる。また（）接続用基板の直角プリ
ズム側の面に電子部品を搭載できるスペースが生
ずるため、従来直角プリズムと反対側の面に取付
けられる場合と異なり、送気給水孔や鉗子孔との
干渉を心配する必要なく先端部直径を減少させる
ことに役立つ効果がある。
According to this invention, (1) since a connection substrate having a width narrower than that of the solid-state image sensor is used, the maximum width of the imaging means assembly is determined by that of the solid-state image sensor; The diameter of the endoscope tip can be reduced. In addition, since there is space for mounting electronic components on the surface of the connection board on the right-angle prism side, there is a risk of interference with the air and water supply holes and forceps holes, unlike conventional cases where electronic components are mounted on the surface opposite to the right-angle prism. This has the effect of helping to reduce the tip diameter without having to do so.
第１図はこの発明の一実施例を示す斜視図、第
２図は同じく直角プリズム側から見た平面図、第
３図は同じく横断面図、第４図、第５図および第
６図は従来技術におけるそれぞれ斜視図、直角プ
リズム側から見た平面図及び横断面図である。
１……対物レンズ群、２……直角プリズム、３
……接続用基板、４……固体撮像素子、３１……
切欠き部、６，７……電子部品。
FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is a plan view as seen from the right angle prism side, FIG. 3 is a cross-sectional view, and FIGS. 4, 5, and 6 are They are a perspective view, a plan view viewed from the right-angle prism side, and a cross-sectional view, respectively, in the prior art. 1...Objective lens group, 2...Right angle prism, 3
...Connection board, 4...Solid-state image sensor, 31...
Notches, 6, 7...Electronic components.
Claims (1)
に入射面が直交するよう設けられる直角プリズム
２と、前記直角プリズムの出射面２１に面接触す
るように配置される固体撮像素子４と、この固体
撮像素子によつて得られる画像信号をプロセツサ
に送るための接続用基板３を含む撮像手段組立体
を有する電子内視鏡において、前記接続用基板３
に前記直角プリズムの出射面に対応する切欠き部
３１が形成され、これによりこの接続用基板が前
記固体撮像素子４に対して前記直角プリズムの側
にあつて前記固体撮像素子のカバーガラス４１の
表面に面接触するように設けられたことを特徴と
する電子内視鏡。 ２ 前記接続用基板３に搭載される電子部品６，
７の一部または全部が、前記固体撮像素子４に対
して前記直角プリズム２側の面上に取付けられて
いることを特徴とする請求項１記載の電子内視
鏡。[Scope of Claims] 1. An objective lens group 1, a right-angle prism 2 provided with an incident surface perpendicular to the optical axis of the objective lens group, and a right-angle prism 2 arranged so as to be in surface contact with an exit surface 21 of the right-angle prism. In an electronic endoscope having an imaging means assembly including a solid-state imaging device 4 and a connection board 3 for sending an image signal obtained by the solid-state imaging device to a processor, the connection board 3
A notch 31 corresponding to the output surface of the right-angle prism is formed in the right-angle prism, so that the connection substrate is on the side of the right-angle prism with respect to the solid-state image sensor 4, and the cover glass 41 of the solid-state image sensor is An electronic endoscope characterized in that it is provided so as to be in surface contact with a surface. 2 electronic components 6 mounted on the connection board 3;
2. The electronic endoscope according to claim 1, wherein a part or all of 7 is attached to a surface on the right angle prism 2 side with respect to the solid-state image sensor 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63310602A JPH02156924A (en) | 1988-12-08 | 1988-12-08 | Electronic endoscope |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63310602A JPH02156924A (en) | 1988-12-08 | 1988-12-08 | Electronic endoscope |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02156924A JPH02156924A (en) | 1990-06-15 |
| JPH0560736B2 true JPH0560736B2 (en) | 1993-09-02 |
Family
ID=18007230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63310602A Granted JPH02156924A (en) | 1988-12-08 | 1988-12-08 | Electronic endoscope |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02156924A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2842687B2 (en) * | 1990-11-27 | 1999-01-06 | 旭光学工業株式会社 | Electronic endoscope tip |
| JP2694750B2 (en) * | 1991-07-10 | 1997-12-24 | 富士写真光機株式会社 | Solid-state image sensor package |
-
1988
- 1988-12-08 JP JP63310602A patent/JPH02156924A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02156924A (en) | 1990-06-15 |
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