JPH055919B2 - - Google Patents

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a power supply and work support tool in a lead frame plating device used for applying various types of plating to the outer surface of semiconductor lead frames. It is.

(Prior art) For example, as a power supply and work support device for the lead frame plating apparatus described above,
As shown in Publication No. 61-87900, an arm is provided which swings up and down by the action of a guide rail etc. when moving along the plating tank, and a concave groove with a V-shaped cross section is provided on the upper surface of the arm. A device in which a cathode contact portion is formed at the inner bottom of the groove is known. In such a conventional power supply and work support device, the lead frame to be plated is dropped into the V-shaped groove and comes into contact with the cathode contact portion.
This is where the electricity for plating is received,
Since the lead frame and the cathode contact area are in contact only due to the lead frame's own weight, there is a risk that the power supply will become unstable, especially when subjected to buoyancy in liquid, and uniform plating may not be achieved. It was hot.

In addition, lead frames are plated in the form of a long, thin plate with multiple pieces connected to each other, but some of them are curved, so when the width of the groove is made narrower, the curved lead frames fit into the groove. If the lead frame is not inserted into the slot securely and the width of the groove is made wide, the uncurved lead frame will wobble inside the groove, and in any case, reliable energization will not be possible.
There was a problem that the plating was not uniform.

(Problems to be Solved by the Invention) The present invention solves the above-mentioned conventional problems and can reliably conduct electricity to both curved lead frames and straight lead frames. It was developed to serve as a power supply and workpiece support for lead frame plating equipment.

(Means for Solving the Problems) The power feeding and work supporting device in the lead frame plating apparatus of the present invention has a lead on the upper surface of the support arm 10, in which the distance in the center is narrow and the distance is gradually increased toward both ends. A pair of left and right side walls for supporting the frame are provided protrudingly, and an inverted V is connected above the support arm to a current-carrying arm that can be raised and lowered independently of the support arm, and presses the upper end surface of the lead frame at the center of the side wall. It is characterized by the provision of a letter-shaped current-carrying piece.

(Embodiment) Next, the present invention will be explained in more detail with reference to the illustrated embodiment. 1 is a plating tank, 2 is a machine frame provided on the side thereof, and 3 is a guide rail 4 on the machine frame 2. This is a conveyor chain that moves intermittently along the guided plucking tank 1. As shown in FIG. 5, this conveyor chain 3 is stretched between large sprockets 5 and 6 and is driven in the direction shown. Brackets 7 are provided at regular intervals on the chain links of the conveyor chain 3, and a support column 8 is attached to the bracket 7 so as to be able to swing around a pin 9. A supporting arm 10 is fixed to the column 8, the tip of which is horizontally immersed in the plating tank 1 when the column 8 is in the vertical position shown by the solid line in FIG.

As shown in FIGS. 3 and 4, this support arm 1
0 has a pair of left and right side walls 11, 11 for supporting the lead frame 50 vertically.
protrudes vertically. These side walls 11,1
1 has a narrow gap at the center as shown in the figure, and the gap gradually increases toward both ends.The gap at the center is slightly wider than the thickness of the lead frame 50, and It has a structure that allows it to be supported without wobbling. Although these side walls 11, 11 may have a flat plate shape, as shown in the figure, a large number of plating liquid circulation holes 12 are formed, and the upper ends thereof are diagonally outward so that the lead frame 50 can be smoothly introduced. It is preferable to provide a guide 13 that extends in the direction. Furthermore, it is preferable to provide a large number of horizontal bars 14 on the bottom surfaces of these side walls 11, 11 to stably support the lower end surface 51 of the lead frame 50.

An energizing arm 16 is provided above the support arm 10 and has an inverted V-shaped energizing piece 15 that presses the upper end surface 52 of the lead frame 50 at the center of the side walls 11, 11 on the lower surface of the tip. In this example,
The current-carrying arm 16 is supported on the column 8 by two parallel links 17 and 18 so that it can rise and fall independently of the support arm 10, and the current-carrying arm 16 is connected to the lead frame 50.
can be raised and lowered parallel to the top edge of the The current-carrying piece 15 is connected to the current-carrying portion 20 of the support arm 10 by a lead wire 19. Further, the lower surface of this current-carrying portion 20 is always in contact with the upper surface of a lifting rail 21 protruding from the side surface of the machine frame 2. The support arm 10 is placed in the
It has the role of pushing up to the position indicated by the imaginary line in the figure, and also includes the current-carrying arm 16, lead wire 19, and current-carrying part 20.
It has the role of passing the plating current to the negative power supply through the . Furthermore, at the supply and take-out positions shown in FIG. It has a structure that allows it to be lifted independently of 10. Therefore, the lead frame 50 can be attached and detached at these supply and take-out positions. Note that 23 shown in FIG. 1 is an anode for plating provided at the bottom of the plating tank 1.

(Function) In the device configured as described above, the current-carrying arm 16 is lifted upward relative to the support arm 10 at the supply position, and the lead frame 50 is connected to the pair of left and right side walls 11, 11 protruding from the upper surface of the support arm 10. After placing the lead frame 50 in between, the energizing arm 16 is lowered, and the inverted V-shaped energizing piece 15 at the tip presses the upper end surface 52 of the lead frame 50 at the center of the side walls 11, 11 to energize. be. This side wall 11,1
Since the center part of 1 is formed with narrow intervals,
Whether the lead frame 50 is straight or curved, the lead frame 50 is always supported reliably without wobbling, and therefore the current-carrying piece 15 provided above the lead frame 50 energization can be carried out reliably. Further, even when the lead frame 50 is curved as shown by the imaginary line in FIG.
11 is formed with a gap gradually increasing toward both ends thereof, so that the lead frame 50 can be dropped between the side walls 11, 11 without any trouble.

In this way, the lead frame 50 is
If the conveyor chain 3 is driven after being securely supported between the side walls 11 and 11 above the plating tank 1, the support arm 10 moves intermittently inside the plating tank 1 together with the current-carrying arm 16, and the current-carrying piece 15 is moved. Electricity is applied to the lead frame 50 through the lead frame 50, and a plating process is performed on the lead frame 50. At this time, even if a buoyant force is generated in the lead frame 50, the lead frame 50 is moved by a much stronger force than the buoyant force at the upper end of the current-carrying piece.
5, the power supply will not become unstable and the entire lead frame 50 will be uniformly plated.

(Effects of the Invention) As is clear from the above description, the present invention can reliably support the lead frame and reliably conduct electricity regardless of whether the lead frame is curved or straight. Therefore, it will greatly contribute to the industry as a power supply and work support tool for lead frame plating equipment that eliminates the problems of conventional devices.

[Brief explanation of the drawing]

Fig. 1 is a partially cutaway front view showing an embodiment of the present invention, Fig. 2 is a partially cutaway front view showing the state of the lead frame when it is attached and detached, Fig. 3 is a perspective view of the main part, and Fig. 4 5 is a plan view of only the side frame portion, and FIG. 5 is a plan view of the entire plating tank. 10: Support arm, 11: Side wall, 15: Current-carrying piece.

Claims (1)

[Claims] 1. A pair of left and right side walls 11, 11 for supporting a lead frame are protrudingly provided on the upper surface of the support arm 10, and the gap is narrow in the center and gradually increases toward both ends. arm 1
Lead frame plating characterized in that an inverted V-shaped current carrying piece 15 is attached to a current carrying arm 16 that can be raised and lowered independently of the lead frame 0 and presses the upper end surface of the lead frame at the central portion of the side walls 11, 11. Power supply and work support for equipment.