JPH0558675B2 - - Google Patents
Info
- Publication number
- JPH0558675B2 JPH0558675B2 JP30118186A JP30118186A JPH0558675B2 JP H0558675 B2 JPH0558675 B2 JP H0558675B2 JP 30118186 A JP30118186 A JP 30118186A JP 30118186 A JP30118186 A JP 30118186A JP H0558675 B2 JPH0558675 B2 JP H0558675B2
- Authority
- JP
- Japan
- Prior art keywords
- crystal silicon
- pressure sensor
- distributed pressure
- strain gauge
- silicon plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 230000008859 change Effects 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 4
- 239000013013 elastic material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Landscapes
- Force Measurement Appropriate To Specific Purposes (AREA)
- Pressure Sensors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30118186A JPS63155674A (ja) | 1986-12-19 | 1986-12-19 | 分布型圧覚センサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30118186A JPS63155674A (ja) | 1986-12-19 | 1986-12-19 | 分布型圧覚センサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63155674A JPS63155674A (ja) | 1988-06-28 |
| JPH0558675B2 true JPH0558675B2 (US20080094685A1-20080424-C00004.png) | 1993-08-27 |
Family
ID=17893753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30118186A Granted JPS63155674A (ja) | 1986-12-19 | 1986-12-19 | 分布型圧覚センサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63155674A (US20080094685A1-20080424-C00004.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7669480B2 (en) | 2005-03-30 | 2010-03-02 | National Institute Of Information And Communications Technology, Incorporated | Sensor element, sensor device, object movement control device, object judgment device |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0350638B1 (de) * | 1988-07-14 | 1993-12-15 | Blomberg Robotertechnik GmbH | Taktiler Sensor |
| JPH0715417B2 (ja) * | 1989-02-27 | 1995-02-22 | 工業技術院長 | 分布型圧覚センサ |
| JP2583615B2 (ja) * | 1989-09-28 | 1997-02-19 | 株式会社富士電機総合研究所 | 接触覚センサ |
| US9157786B2 (en) * | 2012-12-24 | 2015-10-13 | Fresenius Medical Care Holdings, Inc. | Load suspension and weighing system for a dialysis machine reservoir |
-
1986
- 1986-12-19 JP JP30118186A patent/JPS63155674A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7669480B2 (en) | 2005-03-30 | 2010-03-02 | National Institute Of Information And Communications Technology, Incorporated | Sensor element, sensor device, object movement control device, object judgment device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63155674A (ja) | 1988-06-28 |
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| JPS6140327B2 (US20080094685A1-20080424-C00004.png) | ||
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| Kaneta et al. | Sensitivity Enhancement of MEMS Tactile Sensor by Redesign of Microcantilever and Strain Gauge |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |