JPH0557852A - Laminated sheet for electrical application - Google Patents

Laminated sheet for electrical application

Info

Publication number
JPH0557852A
JPH0557852A JP3221931A JP22193191A JPH0557852A JP H0557852 A JPH0557852 A JP H0557852A JP 3221931 A JP3221931 A JP 3221931A JP 22193191 A JP22193191 A JP 22193191A JP H0557852 A JPH0557852 A JP H0557852A
Authority
JP
Japan
Prior art keywords
high dielectric
resin
laminated sheet
composite
containing inorganic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3221931A
Other languages
Japanese (ja)
Inventor
Shoji Fujikawa
彰司 藤川
Seishiro Yamakawa
清志郎 山河
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP3221931A priority Critical patent/JPH0557852A/en
Publication of JPH0557852A publication Critical patent/JPH0557852A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)

Abstract

PURPOSE:To obtain a laminated sheet for electrical applications with an excellent high frequency characteristic and a high dielectric constant by integrally disposing metallic foil on the upper surface and/or lower surface of a polyphenylene resin sheet containing inorganic high dielectric particles. CONSTITUTION:An polyphenyleneoxide resin containing inorganic high dielectric particles, there is used an inorganic compound or the like that has a perovskite crystallized structure of each group of BaTiO3, SrTiO3, PbTi1/2, Zr1/2O3 and the like, or composite perovskite crystallized structure, or a single or composite of TiO2, ZrO2, and SnO2, wherein the particles are preferable to use since the dispersibility and reliability becomes excellent as they are finer. As thermoplastic resin, the whole of thermoplastic resin such as polystylene, polyethylene, or the like cam be employed in the present instance. Furthermore, a single, alloy, or composite foil of copper, aluminum, brass, nickel, iron, or the like is given as metallic foil in the present instance. As required, metallic foil is integrally disposed on the upper surface and/or the lower surface of a polyphenyleneoxide resin sheet containing inorganic high dielectric particles to thereby obtain a laminated sheet for electrical applications.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電子機器、電気機器、
計算機器、通信機器等に用いられ、とくに高周波特性、
高誘電率に優れた電気用積層板に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic equipment, electric equipment,
Used for computing equipment, communication equipment, etc., especially high frequency characteristics,
The present invention relates to an electric laminate having an excellent high dielectric constant.

【0002】[0002]

【従来の技術】従来、電子機器、電気機器、計算機器、
通信機器等の高周波特性、高誘電率を必要とする電気用
積層板には、ポリエチレン、ポリエーテルイミド、ポリ
スルホン、ポリエーテルケトン等の熱可塑性樹脂シート
が用いられている。しかしこれらの熱可塑性樹脂は高周
波特性はよいが誘電率が低く、高周波プリント配線板を
小型化することはできなかった。
2. Description of the Related Art Conventionally, electronic equipment, electric equipment, computing equipment,
Thermoplastic resin sheets such as polyethylene, polyetherimide, polysulfone, and polyetherketone are used for electrical laminates that require high-frequency characteristics and high permittivity for communication devices and the like. However, although these thermoplastic resins have good high-frequency characteristics, they have a low dielectric constant, so that the high-frequency printed wiring board cannot be miniaturized.

【0003】[0003]

【発明が解決しようとする課題】従来の技術で述べたよ
うに、従来の熱可塑性樹脂シートによる高周波用電気用
積層板は、誘電率が低く、高周波プリント配線板を小型
化することができなかった。本発明は従来の技術におけ
る上述の問題点に鑑みてなされたもので、その目的とす
るところは、高周波特性、高誘電率の優れた電気用積層
板を提供することにある。
As described in the prior art, the conventional high-frequency electrical laminate made of a thermoplastic resin sheet has a low dielectric constant, and the high-frequency printed wiring board cannot be miniaturized. It was The present invention has been made in view of the above problems in the prior art, and an object of the present invention is to provide an electrical laminate excellent in high frequency characteristics and high dielectric constant.

【0004】[0004]

【課題を解決するための手段】本発明は無機質高誘電体
粒子含有ポリフェニレンオキサイド樹脂シートの上面及
び又は下面に、必要に応じて金属箔を配設ー体化してな
ることを特徴とする電気用積層板のため、上記目的を達
成することができたもので、以下本発明を詳細に説明す
る。
DISCLOSURE OF THE INVENTION The present invention is characterized in that an inorganic high dielectric particle-containing polyphenylene oxide resin sheet is provided with a metal foil on the upper surface and / or the lower surface thereof, if necessary, to form a body. Since the laminated plate has achieved the above object, the present invention will be described in detail below.

【0005】本発明の無機質高誘電体粒子含有熱可塑性
樹脂シートの無機質高誘電体粒子としては、BaTiO
3 系、SrTiO3 系、PbTi1/2 Zr1/2 3 系、
Pb(Mg2/3 Nb1/3 )O3 系、Ba(Snx MgY
Taz )O3 系、Ba(Zr x Zny Taz )O3 系等
のペロブスカイト型結晶構造や複合ペロブスカイト型結
晶構造を有するものや、TiO2 、ZrO2 、SnO2
の単独及びその複合酸化物等の無機化合物等で、粒子は
細かい程分散性、信頼性が良く、用いるのに望ましい。
添加量としてはポリフェニレンオキサイド樹脂100重
量部(以下単に部と記す)に対して10〜70部を添加
することが好ましい。即ち10部未満では高誘電率にな
り難く、70部をこえると成形性が低下する傾向にある
からである。ポリフェニレンオキサイド樹脂としては、
ノニル樹脂等の熱可塑性ポリフェニレンオキサイド樹脂
や熱硬化性ポリフェニレンオキサイド樹脂を用いること
ができる。シートの厚みは特に限定しないが0.05〜
2mmのものが用いて便利であり好ましい。シート化手
段としては、ロール、押出、射出、流延、プレス等の手
段を用いることができ、特に限定するものではない。金
属箔としては銅、アルミニュウム、真鍮、ニッケル、鉄
等の単独、合金、複合箔を用いることができ、エポキシ
樹脂、フェノ−ル樹脂、メラミン樹脂、ブチラール樹脂
等からなる接着剤を金属箔の片面に予め塗布した接着剤
付金属箔を用いることもできる。配設ー体化手段として
は、プレス、ロール、ドラム等の任意手段を用いること
ができる。
Thermoplastics Containing Inorganic High Dielectric Particles of the Present Invention
As the inorganic high dielectric particles of the resin sheet, BaTiO 3 is used.
3System, SrTiO3System, PbTi1/2Zr1/2O3system,
Pb (Mg2/3Nb1/3) O3System, Ba (SnxMgY
Taz) O3System, Ba (Zr xZnyTaz) O3System
Perovskite type crystal structure and complex perovskite type structure
Those having a crystal structure or TiO2, ZrO2, SnO2
Inorganic compounds such as single and complex oxides of
The finer the particles, the better the dispersibility and reliability, and it is desirable to use.
Polyphenylene oxide resin 100 weight
10 to 70 parts are added to the amount part (hereinafter simply referred to as part).
Preferably. That is, if it is less than 10 parts, the dielectric constant becomes high.
It is difficult to remove, and if it exceeds 70 parts, the moldability tends to decrease.
Because. As the polyphenylene oxide resin,
Thermoplastic polyphenylene oxide resin such as nonyl resin
Use of thermosetting polyphenylene oxide resin
You can The thickness of the sheet is not particularly limited, but is 0.05 to
It is convenient and preferable to use a 2 mm one. Sheeting
As steps, rolls, extrusions, injections, castings, presses, etc.
A step can be used and is not particularly limited. Money
Copper foil, aluminum, brass, nickel, iron
Can be used alone, alloy, composite foil, etc., epoxy
Resin, phenol resin, melamine resin, butyral resin
Adhesive with one side of metal foil coated in advance
An attached metal foil can also be used. Arrangement-as a unitizing means
Use any means such as press, roll, drum, etc.
You can

【0006】以下本発明を実施例に基づいて説明する。The present invention will be described below based on examples.

【0007】[0007]

【実施例1】ポリフェニレンオキサイド樹脂100部に
対して酸化チタン粉末20部を添加、混合、混練後、押
出機でシート化して得た厚み1.6mmのシートの片面
に、厚み0.035mmの接着剤付銅箔の接着剤側をシ
ート側と対向して配設後、160℃で20分間積層成形
して厚み1.6mmの電気用積層板を得た。
Example 1 Twenty parts of titanium oxide powder was added to 100 parts of polyphenylene oxide resin, mixed, kneaded, and then formed into a sheet with an extruder. After the adhesive side of the agent-coated copper foil was arranged so as to face the sheet side, lamination was performed at 160 ° C. for 20 minutes to obtain a 1.6 mm-thick electrical laminate.

【0008】[0008]

【実施例2】酸化チタン粉末40部を添加した以外は実
施例1と同様に処理して厚み1.6mmの電気用積層板
を得た。
Example 2 The same process as in Example 1 was carried out except that 40 parts of titanium oxide powder was added to obtain an electrical laminate having a thickness of 1.6 mm.

【0009】[0009]

【実施例3】酸化チタン粉末の代わりにチタン酸バリウ
ム35部を添加した以外は実施例1と同様に処理して厚
み1.6mmの電気用積層板を得た。
Example 3 An electric laminate having a thickness of 1.6 mm was obtained in the same manner as in Example 1 except that 35 parts of barium titanate was added instead of the titanium oxide powder.

【0010】[0010]

【実施例4】酸化チタン粉末の代わりにチタン酸バリウ
ム50部を添加した以外は実施例1と同様に処理して厚
み1.6mmの電気用積層板を得た。
Example 4 An electric laminate having a thickness of 1.6 mm was obtained in the same manner as in Example 1 except that 50 parts of barium titanate was added instead of the titanium oxide powder.

【0011】[0011]

【比較例】酸化チタン粉末を用いない以外は実施例1と
同様に処理して厚み1.6mmの電気用積層板を得た。
実施例1乃至4と比較例の積層板の性能は第1表のよう
である。
[Comparative Example] The same procedure as in Example 1 was carried out except that no titanium oxide powder was used to obtain a 1.6 mm-thick electrical laminate.
The performance of the laminated plates of Examples 1 to 4 and Comparative Example is as shown in Table 1.

【0012】 [0012]

【0013】[0013]

【発明の効果】本発明は上述した如く構成されている。
特許請求の範囲に記載した構成を有する電気用積層板に
おいては、誘電率が向上し本発明の優れていることを確
認した。
The present invention is constructed as described above.
It has been confirmed that the electrical laminate having the structure described in the claims has an improved dielectric constant and is excellent in the present invention.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 無機質高誘電体粒子含有ポリフェニレン
オキサイド樹脂シートの上面及び又は下面に、必要に応
じて金属箔を配設ー体化してなることを特徴とする電気
用積層板。
1. A laminated board for electrical use, wherein a metal foil is provided on the upper surface and / or the lower surface of a polyphenylene oxide resin sheet containing inorganic high-dielectric-constant particles, if necessary, and made into a body.
JP3221931A 1991-09-03 1991-09-03 Laminated sheet for electrical application Pending JPH0557852A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3221931A JPH0557852A (en) 1991-09-03 1991-09-03 Laminated sheet for electrical application

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3221931A JPH0557852A (en) 1991-09-03 1991-09-03 Laminated sheet for electrical application

Publications (1)

Publication Number Publication Date
JPH0557852A true JPH0557852A (en) 1993-03-09

Family

ID=16774406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3221931A Pending JPH0557852A (en) 1991-09-03 1991-09-03 Laminated sheet for electrical application

Country Status (1)

Country Link
JP (1) JPH0557852A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7531112B2 (en) 2004-05-04 2009-05-12 Samsung Electro-Mechanics Co., Ltd. Composition for forming dielectric, capacitor produced using composition, and printed circuit board provided with capacitor
JP2013119240A (en) * 2011-12-08 2013-06-17 Furukawa Electric Co Ltd:The Copper clad laminate for high frequency substrate, and surface treated copper foil used for the same
US9058912B2 (en) 2003-04-04 2015-06-16 Toray Industries, Inc. Paste composition and dielectric composition using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9058912B2 (en) 2003-04-04 2015-06-16 Toray Industries, Inc. Paste composition and dielectric composition using the same
US7531112B2 (en) 2004-05-04 2009-05-12 Samsung Electro-Mechanics Co., Ltd. Composition for forming dielectric, capacitor produced using composition, and printed circuit board provided with capacitor
JP2013119240A (en) * 2011-12-08 2013-06-17 Furukawa Electric Co Ltd:The Copper clad laminate for high frequency substrate, and surface treated copper foil used for the same

Similar Documents

Publication Publication Date Title
CN108878142B (en) Multilayer ceramic capacitor
US20170345569A1 (en) Multilayer ceramic capacitor
JP2007126661A (en) Dielectric polymer ceramic composition and built-in capacitor and print circuit substrate board using the same
KR20060112906A (en) Printed circuit board with embedded capacitors using hybrid materials, and manufacturing process thereof
JP3470830B2 (en) Manufacturing method of multilayer capacitor
US11004605B2 (en) Multilayer ceramic capacitor, circuit substrate and manufacturing method of the same
KR20170135665A (en) Multilayer ceramic capacitor and manufacturing method of multilayer ceramic capacitor
JP2017108057A (en) Multilayer ceramic capacitor
DE112006000519B4 (en) Integrated thin-film capacitor with optimized temperature characteristic
US20210090802A1 (en) Multilayer ceramic electronic component
US11631538B2 (en) Electronic component
KR20040084785A (en) Laminated electronic parts and method of manufacturing the same
CN108922779A (en) A kind of chip through-hole gold electrode chip capacitor and preparation method thereof
KR20200064350A (en) Method for manufacturing conductive ink composition for internal electrode of multilayer ceramic capacitor and method for manufacturing internal electrode of multilayer ceramic capacitor using the same
JPH0613259A (en) Multilayered ceramic capacitor and its manufacture
WO1998024126A1 (en) Alumina multilayer wiring substrate provided with high dielectric material layer
JP2006248074A (en) Composite substrate with high dielectric constant, composite sheet with high dielectric constant, and methods for producing them
JPH0557852A (en) Laminated sheet for electrical application
JP2017103377A (en) Multilayer ceramic electronic component
JPH0557853A (en) Laminated sheet for electrical application
JP2022016002A (en) Electronic component
JP2002329634A (en) Laminated electronic component and its manufacturing method
CN116544034A (en) Ceramic electronic component and method for manufacturing the same
JPH0557851A (en) Laminated sheet for electrical application
JP2022101469A (en) Multilayer electronic component