JPH0557796A - Normal temperature sticking method - Google Patents

Abstract

PURPOSE:To perform easily sticking of very small mess at the normal temperature, by a method wherein since a high contact load is generated on the mutual sides by a principle of a wedge. CONSTITUTION:An A1 film 2 is made on a Pyrex base 1 comprised of Pyrex glass which is to be stuck and an A1 film 4 is made on a Pyrex base 3. Plane, circular, taperless recessed grooves 5 and plane, circular, tapered protrusion cogs 6 formed by making use of a semiconductor processing method comprised of a dry etching method are provided respectively to those A1 films 2, 4, those recessed grooves 5 and protrusion cogs 6 are geared with each other, to which compression load is applied and sticking by friction is performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention utilizes the removal of a surface coating, that is, the increase in surface energy due to the creation of a new surface, to bond a micro member composed of the same kind or a different material to a micro area with a micro load in a room temperature atmosphere. The present invention relates to a room temperature bonding method that can be instantaneously performed.

[0002]

2. Description of the Related Art Conventionally, adhesion of the same kind or different kinds of materials is carried out by using an inert gas ion such as Ar ⁺ in an ultrahigh vacuum as described in "Welding Technology" (July 1987 issue, P89). After the surface is cleaned by sputtering, before the surface contamination such as adsorption occurs, a pressing load is applied to keep the surfaces of both materials to be bonded to each other while keeping the clean surface. ..

Further, the adhesion between the conductor and the insulator is made by Journala
l of Applied Physics (1969, September, val40, No.10,
p.3946), etc., it is performed by heating to the glass softening point and simultaneously applying a high electric field between the adhesive materials in order to generate a larger electrostatic attractive force at the bonding interface. ..

[0004]

However, the above-mentioned conventional example is not easily implemented because it requires a large-scale apparatus for cleaning the surface and maintaining the surface cleaning, such as an ultra-high vacuum apparatus. Further, in order to reduce the amount of deformation at the time of bonding as much as possible, it is necessary to make the bonding surface roughness an ultra-smooth surface of several nm, which is not a technically simple method. Further, in the above-mentioned conventional example of joining the conductor and the insulator, it is necessary to heat the joined sample to about 400 ° C., and at the same time, a high electric field of the order of 10 ⁶ V / cm is required between the joining materials. Therefore, it is unsuitable for bonding at locations where heating and application of an electric field are unfavorable, and there are drawbacks such that bonding takes several minutes because of bonding accompanied by movement of ions inside the bonding material.

An object of the present invention is to provide a room temperature bonding method for simply bonding minute members at room temperature.

[0006]

In order to achieve the above object, the room temperature bonding method according to the present invention comprises forming a metal thin film on the surface of two substances to be bonded, and forming a plurality of metal thin films on one of the thin films. A concave groove is formed, a plurality of convex teeth that mesh with the concave groove are formed on the other thin film, and at least one of the concave groove and the convex tooth is provided with a taper angle to bond At this time, the uneven portions are positioned so that they are meshed with each other and a load is applied thereto, so that the side surfaces of the uneven portions come into contact with each other and the bonding is performed by friction during the plastic deformation process.

[0007]

According to the room temperature bonding method having the above-mentioned structure, a pair of concave grooves and convex teeth are formed on the bonding surface, and the concave and convex portions are positioned so as to mesh with each other at the time of bonding, and then a compressive load is applied. Friction and wear occur on the sides of the irregularities, which removes the surface coatings from one another and at the same time enables bonding.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail based on the illustrated embodiments. FIG. 1 shows a first embodiment, in which Al is formed on a Pyrex substrate 1 made of Pyrex glass which is a substrate to be adhered.
The film 2 is formed, and the Al film 4 is formed on the Pyrex substrate 3. A flat circular taper-less concave groove 5 and a flat circular tapered tapered convex tooth 6 formed by using a semiconductor process method including a dry etching method are formed on these Al films 2 and 4.
Are provided respectively.

FIG. 2 is an enlarged view of a part of FIG. 1, in which the flat circular tapered tapered convex tooth 6 has a taper angle θ. FIG. 3 shows a cross-sectional structure during bonding by applying a load, and FIGS. 4 and 5 each have a circular cross-sectional view of a concave groove 5 and a convex tooth 6 as seen from a direction crossing the plane of FIG. There is. Also,
Figure 6 shows the applied load f, contact angle α, and contact load F during the bonding process.
It is explanatory drawing of the correlation of.

In this structure, when a load is applied to the Pyrex glass substrates 1 and 3 in the direction of the arrow with the concave grooves 5 and the convex teeth 6 on the Al films 2 and 4 meshing with each other, that is, as shown in FIG. When a load f is applied as shown in FIG. 6, a contact load F is generated with a contact angle α on the side surfaces of each other, and this system is in a balanced state. In this case, the relationship between F, f, and α is
It becomes like the formula (1). F = f / (2 sin α) (1)

Here, α is a concave groove 5 on the Al films 2 and 4.
Angle of contact between the tooth and the convex tooth 6 on each side, F is the contact load, f
Is the applied load.

Therefore, by making the contact angle α as small as possible, that is, by making the taper angle θ of the convex teeth 6 in FIG. 2 as small as possible, the contact load F
It is possible to reduce the applied load f without changing. Further, when the applied load f is increased, a shearing motion is generated between the side surfaces of the concave groove 5 and the convex tooth 6 while causing plastic deformation and friction at the point of application of the contact load F.

In this case, the applied load f during bonding is
It becomes like the formula (2). f + Δf> 2μF ・ cos α + ΔFD ・ ・ ・ (2)

Here, f + Δf is an applied load for causing a shear movement between the side surfaces of the concave groove 5 and the convex tooth 6, and ΔFD is the Al film 2, 4 at the point of action of the contact load F. The force necessary for the deformation, μ is the coefficient of friction between the Al films 2 and 4 that are sliding due to friction.

Therefore, when the formula (2) is satisfied, a shearing motion is generated between the side surfaces of the concave groove 5 and the convex tooth 6, and the shearing motion causes the surface coatings of the contact portions to be broken at each other. A new surface is created at the same time and begins to bond at the same time.

Further, when the applied load f is further increased, the concave groove 5 and the convex tooth 6 are separated from each other until the flat surface portion 7 of the Al film 2 and the bottom surface portion 8 of the Al film 4 start to contact each other. Bonding continues due to the shearing motion between the sides of the. And Al
At the time of contact between the flat surface portion 7 of the film 2 and the bottom surface portion 8 of the Al film 4, the applied load f rapidly and discontinuously increases, which is one measure for stopping the bonding work. Stopping the bonding operation at this point is desirable for bonding with a low contact load and high dimensional accuracy.

Now, the dimensional accuracy after the bonding in the present bonding method, that is, the Pyrex substrates 1 and 3 in the load applying direction.
The dimensional accuracy between them depends on the dimensional accuracy of the thickness of the Al films 2 and 4. On the other hand, the dimensional accuracy in the direction perpendicular to the load application direction is determined by the number of a pair of adhesive elements consisting of the concave groove 5 of the Al film 2 and the convex tooth 6 of the Al film 4 per unit area, that is, the number of adhesive elements. Depends on density. Therefore, by gradually increasing the density of the number of adhesive elements, it becomes possible to bond the micro members and the micro members with each other with higher accuracy.

In this embodiment, the Pyrex substrate 1
An Al film 2 having an upper concave groove 5 and an Al film 4 having a convex tooth 6 on the Pyrex substrate 3 were formed by the following process. First, in the case of forming the Al film 2 having the concave groove 5,

(1) As shown in FIG. 7 (a), the diameter is 30 m.
m, 1 mm thick Pyrex substrate 1 on pure Al film 2
Is deposited by sputtering to a thickness of about 1 μm.

(2) As shown in FIG. 7 (b), a positive resist film (AZ-13 having a small etching rate with respect to Al) is used.
After coating 50) 9 on the Al film 2, it is exposed to light through a mask 10 made of circular porous holes, that is, porous holes having a plane pitch of 10 μm and a diameter of 5 μm.

(3) The resist film 9 is developed as shown in FIG. 7 (c).

(4) As shown in FIG. 7D, the concave groove 5 is formed in the Al film 2 by the dry etching method. The etching conditions are CCl ₄ gas pressure: 4.5 Pa. And power density: 0.3 W / cm ² .

(5) After the dry etching method, the residual resist film 9 is removed with an organic solvent (acetone).
A concave groove 5 without a plane circular taper as shown in (e) is obtained.

Next, in the case of forming the Al film 4 having the flat circular tapered tapered convex teeth 6, (6) as shown in FIG. 8 (a), the Pyrex substrate 3 having a diameter of 30 mm and a thickness of 1 mm is used.
A pure Al film 4 is formed thereon by sputtering to a thickness of about 1 μm.

(7) As shown in FIG. 8B, the mask 10 used for forming the concave groove 5 having a circular porous shape after the negative resist film (OMR) 11 is coated on the pure Al film 4. Expose through.

(8) As shown in FIG. 8 (c), the resist film 1
Develop 1.

(9) As shown in FIG. 8D, the convex teeth 6 are formed on the Al film 4 by the dry etching method. As etching conditions, CCl ₄ gas pressure: 8 Pa, power density: 0.
3 W / cm ² .

(10) After the dry etching method, the residual resist film 11 is removed by a stripping solution to obtain the flat circular tapered tapered convex teeth 6 as shown in FIG. 8 (e).

Then, with the concave groove 5 shown in FIG. 7 (e) and the convex tooth 6 shown in FIG. 8 (e) facing each other, a compressive load of about 5 kgf is applied at room temperature in the atmosphere. When applied, the Pyrex substrates 1 and 3 easily adhered to each other. on the other hand,
When the same adhesion was performed at 200 ° C. near the recrystallization temperature of Al, the applied load required for the adhesion was smaller than that at room temperature.

Next, as a second embodiment, the case where the cross sections of the concave groove 5 and the convex tooth 6 in FIG. 1 as viewed from the direction crossing the plane of the drawing are made rectangular as shown in FIGS. 9 and 10, respectively. explain. That is, in FIG. 1, a flat rectangular non-tapered concave groove 5 and a flat square tapered tapered convex tooth 6 are formed in the Al film 2 on the Pyrex substrate 1 and the Al film 4 on the Pyrex substrate 3, respectively. The concave groove 5 and the convex tooth 6 are processed by replacing the mask with a square porous mask, that is, a mask having a plane pitch of 10 μm and a diameter of 5 μm.
Was carried out in the same manner as in the above Example. After that, when the concave groove 5 and the convex tooth 6 were opposed to each other by the same method as in the first embodiment, they were easily bonded.

As a third embodiment, a case will be described in which the concave groove 5 and the convex tooth 6 in FIG. 1 are ribbon-shaped as shown in FIGS. 11 and 12, respectively. That is, in FIG. 1, the Al film 2 and the Pyrex substrate 3 on the Pyrex substrate 1
A flat ribbon type non-tapered concave groove 5 and a flat ribbon type tapered tapered convex tooth 6 are formed on the upper Al film 4, respectively. The concave groove 5 and the convex tooth 6 are processed by forming the mask into a ribbon-shaped porous mask, that is, a mask having ribbon-like holes of vertical pitch 110 μm × horizontal pitch 10 μm, hole size; length 100 μm × width 5 μm. After replacement, the dimensions were the same as in the first embodiment. After that, when the concave groove 5 and the convex tooth 6 were opposed to each other in the same manner as in the first embodiment, they were easily bonded.

FIG. 13 shows a fourth embodiment of the present invention, and the same reference numerals as those in FIG. 1 indicate the same members. A flat circular wide-mouth tapered concave groove 12 is formed in the Al film 2, and the Al film 4 is formed.
A flat circular tapered tapered convex tooth 13 is formed on the. Figure 1
4 is a partially enlarged view of FIG. 13, showing a concave groove 12 and a convex tooth 1.
Each 3 has a tapered surface θ. Further, FIG. 15 shows a cross-sectional structure during bonding by applying a load, showing the concave groove 12,
The cross section of the convex tooth 13 as seen from the direction crossing the plane of the paper in FIG. 13 is the same as the concave groove 5 and the convex tooth 6 in FIGS. 4 and 5, respectively. FIG. 16 shows applied load f, contact angle α, and
It is explanatory drawing of the correlation of the contact load F.

In this structure, the Pyrex substrates 1 and 3 are provided with the plane circular wide-mouth taper concave groove 12 and the plane circular tapered tapered convex tooth 13 on the Al film 2 and 4 as shown in FIG. When a load is applied in the direction of the arrow in the meshed state, that is, when a load f is applied as shown in FIG. 16, a contact load F is generated at a contact angle α on the side surfaces of each other,
This system is in equilibrium, and in the first embodiment
It is similar to equation (1). Therefore, by making the taper angle θ in FIG. 14 as small as possible, the contact load F
It is possible to reduce the applied load f without changing. Further, when the applied load f is increased, as in the first embodiment, the surface coatings of the contact portions are mutually removed by the shearing movement of the concave groove 12 and the convex tooth 13 in FIG. It breaks and at this point a new surface is created and at the same time begins to bond. This bonding process is shown in FIG.
The process continues until the flat surface portion 14 of the film 2 and the bottom surface portion 15 of the Al film 4 contact each other.

In this embodiment, the Al film 2 having the concave groove 12 on the Pyrex substrate 1 and the Al film 4 having the convex tooth 13 on the Pyrex substrate 3 are formed by the following processes.

First, in the case of forming the Al film 2 having the concave groove 12, (1) as shown in FIG. 17 (a), the diameter is 30 m.
A pure Al film 2 is formed on the Pyrex substrate 1 having a thickness of m and a thickness of 1 mm by sputtering to a thickness of about 1 μm.

(2) As shown in FIG. 17B, a resist film (AZ-135) having a small etching rate with respect to Al is used.
After 0) 9 is applied on the Al film 2, it is exposed through a mask 10 made of a circular porous hole, that is, a porous hole having a plane pitch of 10 μm and a diameter of 5 μm.

(3) As shown in FIG. 17 (c), the resist film 9
To develop.

(4) As shown in FIG. 17D, the concave groove 12 is formed in the Al film 2 by the dry etching method. As etching conditions, CCl ₄ gas pressure: 8 Pa, power density:
It is set to 0.3 W / cm ² .

(5) After the dry etching method, the residual resist film 9 is removed with an organic solvent (acetone).
A plane circular wide-mouth tapered concave groove 12 as shown in (e) was obtained.

Next, when the Al film 4 having the convex teeth 13 is formed, the planer circular tapered tapered convex teeth 6 for the first embodiment shown in FIGS. 8 (a) to 8 (e) are used. I went the same way.

Then, when the concave groove 12 and the convex tooth 13 are opposed to each other, a compressive load of about 5 kgf is applied in the direction of the arrow at room temperature in the atmosphere. Glued to.

As a fifth embodiment, the concave groove 12 and the convex tooth 13 in FIG. 13 used in the description of the fourth embodiment are seen from the direction crossing the plane of the drawing, and the concave portions shown in FIGS. The groove 5 and the convex tooth 6 have the same rectangular shape. That is, in FIG. 13, on the Al film 2 on the Pyrex substrate 1 and on the Al film 4 on the Pyrex substrate 3, the flat rectangular wide-mouth tapered concave groove 12 and the flat square tapered tapered convex tooth 13 are respectively formed.
Formed. Processing of these concave groove 12 and convex tooth 13 is
The mask is a square porous, that is, the plane pitch is 10 μm, 5 μ
The mask having m holes was replaced with the same method as in the fourth embodiment. After that, as shown in FIG. 13, the concave groove 1
2. With the convex teeth 13 facing each other, a bonding experiment was conducted by the same method as in the first embodiment, and it was easily bonded.

As a sixth embodiment, the concave groove 12 and the convex tooth 13 in FIG. 13 are the same as the concave groove 5 and the convex tooth 6 shown in FIGS. It has a ribbon shape. That is, in FIG. 13, a flat ribbon type wide mouth tapered concave groove 12 and a flat ribbon tapered tapered convex tooth 13 are formed on the Al films 2 and 4 on the Pyrex substrates 1 and 3, respectively. These concave grooves 12 and convex teeth 1
In the processing of 3, the mask is a ribbon-shaped porous structure, that is, vertical pitch 110 μm × horizontal pitch 10 μm, hole size;
A mask having a ribbon-like hole of 00 μm × width 5 μm was replaced, and the same method as in the fourth example was performed. Thereafter, as shown in FIG. 13, when the concave groove 12 and the convex tooth 13 were opposed to each other in the same manner as in the fourth embodiment, they were easily bonded.

FIG. 18 shows a seventh embodiment. The Al films 2 and 4 formed on the Pyrex substrates 1 and 3 have a flat circular wide-mouth taper concave groove 16 and a flat circular non-taper convex tooth 1 respectively.
Formed 7.

FIG. 19 is an enlarged view of a part of FIG. 18, in which the concave groove 16 is provided with a tapered surface. FIG. 20 shows a cross-sectional structure during bonding by applying a load, and the concave groove 16 and the convex tooth 17 in FIG. 18 are the concave groove 5 and the convex tooth 6 in FIGS. It has the same circular shape as. FIG. 21 is an explanatory diagram of the correlation among the applied load f, the contact angle α, and the contact load F during the bonding process.

In this structure, the concave groove 16 and the convex tooth 1 are provided.
When a load is applied while 7 and 7 mesh with each other,
That is, when a load f is applied as shown in FIG. 21, a contact load F is generated at a contact angle α on the side surfaces of each other, and this system is in a balanced state, which is similar to the equation (1) in the first embodiment. ..

Therefore, it is possible to reduce the applied load f without changing the contact load F by forming the taper angle θ in FIG. 19 as small as possible.
Further, when the applied load f is increased, the surface coatings of the contact portions are ruptured from each other due to the shearing movement of the concave groove 16 and the convex tooth 17 on the respective side surfaces, as in the first embodiment. At this point, a new surface is created and begins to adhere at the same time. Such a bonding process continues until the flat surface portion 18 of the Al film 2 and the bottom surface portion 19 of the Al film 4 come into contact with each other in FIG.

In this embodiment, the concave grooves 16 and the convex teeth 17 on the Pyrex substrates 1 and 3 are formed by the following process. First, the Al film 2 having the flat circular wide-mouth tapered concave groove 16 was formed in the same manner as the Al film 2 in the fourth embodiment shown in FIGS. 17 (a) to 17 (e).

Next, in the case of forming the Al film 4 having the convex teeth 17, (1) as shown in FIG.
A pure Al film 4 is formed on the Pyrex substrate 1 having a thickness of 1 mm and a thickness of 1 mm by sputtering to a thickness of about 1 μm.

(2) As shown in FIG. 22 (b), the pure Al film 4
After coating a negative resist film (OMR) 11 on the surface, it is exposed through the mask 10 used in the first embodiment having a circular shape.

(3) As shown in FIG. 22 (c), the resist film 1
Develop 1.

(4) As shown in FIG. 22D, the convex teeth 17 are formed on the Al film 4 by the dry etching method. The etching conditions are CCl ₄ gas pressure: 4.5 Pa. And power density: 0.3 W / cm ² .

(5) After the dry etching method, the residual resist film 11 was removed with a stripping solution to obtain convex teeth 17 as shown in FIG. 22 (b).

Then, a compressive load of about 5 kgf was applied at room temperature in the atmosphere with the concave groove 16 and the convex tooth 17 facing each other, and the Pyrex substrates 1 and 3 were easily bonded to each other. did.

As an eighth embodiment, as shown in FIGS. 9 and 10 used in the description of the seventh embodiment, the concave groove 16 and the convex tooth 17 are respectively seen from the direction crossing the plane of the drawing. The case of a rectangular shape will be described. That is, the Al films 2 and 4
A flat square wide-mouth tapered concave groove 16 and a flat square non-tapered convex tooth 17 are formed on the upper surface, respectively. The concave grooves 16 and the convex teeth 17 were processed in the same manner as in the seventh embodiment, except that the mask used in the second embodiment had a square porous structure. ..

After that, when the concave groove 16 and the convex tooth 17 were opposed to each other by the same method as in the first embodiment, they were easily bonded.

As a ninth embodiment, the concave groove 16 and the convex tooth 17 in FIG. 18 are ribbon-shaped as shown in FIGS. 11 and 12 as viewed from the direction crossing the plane of the drawing. That is,
A flat ribbon type wide-mouth tapered concave groove 16 and a flat ribbon type non-tapered convex tooth 17 are formed on the Al films 2 and 4, respectively. The concave groove 16 and the convex tooth 17 were processed in the same manner as in the seventh embodiment by replacing the mask with a ribbon-shaped porous mask used in the third embodiment.

Thereafter, when the concave groove 16 and the convex tooth 17 were opposed to each other in the same manner as in the first embodiment, they were easily bonded.

FIG. 23 shows a tenth embodiment in which a flat circular taper-less concave groove 5 and a flat circular tapered tapered convex tooth 6 are formed in the Al films 2 and 4, respectively. The concave groove 5 and the convex tooth 6 in FIG. 23 are circular as shown in FIGS. 4 and 5 as viewed from the direction crossing the plane of the drawing, and the Al film 2 and the Al film 4 are processed as follows. I went through a different process.

First, in the case of forming the Al film 2 having the concave groove 5, (1) As shown in FIG. 24 (a), the diameter is 30 mm and the thickness is 1 m.
A pure Al film 2 having a thickness of about 0.8 μm is formed on a Pyrex substrate 1 of m by sputtering.

(2) As shown in FIG. 24 (b), a resist film (AZ-135) having a small etching rate with respect to Al is used.
0) 9 is applied on the Al film 2 and then exposed through the mask 10 used in the first embodiment, which has a circular shape.

(3) As shown in FIG. 24 (c), the resist film 9
To develop.

(4) As shown in FIG. 24 (d), Al is formed by dry etching until the Pyrex substrate 1 is reached.
A concave groove 5 is formed in the film 2. As etching conditions, C
Cl ₄ gas pressure: 4.5 Pa., Power density: 0.3 W / cm
^Set to ² .

(5) After the dry etching method, the residual resist film 9 is removed with an organic solvent (acetone).
A concave groove 5 having no plane circular taper as shown in (e) was obtained.

Next, the formation of the Al film 4 having the convex teeth 6 was carried out in the same manner as the convex teeth 6 in the first embodiment shown in FIGS. 8 (a) to 8 (e).

Then, a compressive load of about 5 kgf was applied at room temperature in the atmosphere with the concave groove 5 and the convex tooth 6 facing each other, and the Pyrex substrates 1 and 3 were easily bonded to each other.

As an eleventh embodiment, the concave groove 4 and the convex tooth 5 in FIG. 23 are formed into a rectangular shape as shown in FIGS. 9 and 10 as seen from the direction crossing the plane of the drawing. That is, in FIG. 23, a flat rectangular non-tapered concave groove 5 and a flat square tapered tapered convex tooth 6 are formed in the Al films 2 and 4, respectively.
The film 2 and the Al film 4 were processed by the following process.

First, when the Al film 2 having the concave groove 5 is formed, the mask is formed into a square porous shape, that is, the plane pitch 10
Replacing with a mask consisting of 5 μm and 5 μm holes, FIG. 24 (a)
.About.24E, the same process as that of the Al film 2 having the concave groove 5 of the tenth embodiment shown in FIG.

Next, the Al film 4 having the convex teeth 6 is formed by the same method as the forming method of the convex teeth 6 in the second embodiment shown in FIGS. 8 (a) to 8 (e). I went there.

After that, as shown in FIG. 23, when the concave groove 5 and the convex tooth 6 were opposed to each other in the same manner as in the first embodiment, they were easily bonded.

As a twelfth embodiment, the concave groove 5 and the convex tooth 8 in FIG. 23 are ribbon-shaped as shown in FIG. That is, Al
Forming a flat ribbon-taperless concave groove 5 and a flat ribbon-tapered tapered convex tooth 6 on the film 2 and the Al film 4, respectively.
The Al film 2 and the Al film 4 were processed by the following process.

First, when the Al film 2 having the concave groove 5 is formed, the mask is replaced with the mask used in the third embodiment having a ribbon-shaped porous structure, and the mask shown in FIGS. (e)
The same method as the formation of the Al film 2 having the concave groove 5 in the tenth embodiment shown in FIG.

Next, the Al film 4 having the convex teeth 6 is formed by the same method as the method for forming the convex teeth 6 in the third embodiment shown in FIGS. 8 (a) to 8 (e). went. After that, as shown in FIG. 23, when the concave groove 5 and the convex tooth 6 were opposed to each other by the same method as in the first embodiment, they were easily bonded.

FIG. 25 shows the thirteenth embodiment, in which the Al film 2 is used.
4 and 4, a flat circular wide-mouth tapered concave groove 12 and a flat circular tapered tapered convex tooth 13 are formed, respectively. The cross sections of the concave groove 12 and the convex tooth 13 in FIG. 25 are circular as shown in FIGS. 4 and 5, and the Al film 2 and the Al film 4 are processed by the following processes.

First, in the case of forming the Al film 2 having the concave groove 12, (1) as shown in FIG.
A pure Al film 2 is formed on a Pyrex substrate 1 having a thickness of m and a thickness of 1 mm by sputtering to a thickness of about 0.8 μm.

(2) As shown in FIG. 26 (b), a resist film (AZ-135) having a small etching rate with respect to Al is used.
0) 9 is applied on the Al film 2 and then exposed through the mask 10 used in the first embodiment, which has a circular shape.

(3) As shown in FIG. 26 (c), the resist film 9
To develop.

(4) As shown in FIG. 26 (d), Al is formed by dry etching until reaching the Pyrex substrate 1.
A concave groove 12 is formed in the membrane 2. As etching conditions,
CCl ₄ gas pressure: 8 Pa., Power density: 0.3 W / cm ²
And

(5) After the dry etching method, after removing the residual resist film 9 with an organic solvent (acetone),
Plane circular wide-mouth tapered concave groove 1 as shown in FIG. 26 (e)
Got 2.

Next, in the case of forming the Al film 4 having the convex teeth 13, the same method as the forming method of the convex teeth 6 in the first embodiment shown in FIGS. 8A to 8E is used. Made by way.

After that, when the concave groove 12 and the convex tooth 13 are opposed to each other in the same manner as in the first embodiment, they are easily adhered.

As a fourteenth embodiment, the concave groove 12 and the convex tooth 13 shown in FIG. 25 have a rectangular shape as shown in FIGS. 9 and 10 as viewed from the direction crossing the plane of the drawing. That is, Al
Planar square wide mouth tapered concave groove 1 on membranes 2 and 4, respectively
2. Planar square tapered tapered convex teeth 13 are formed. The processing of the Al film 2 and the Al film 4 was performed by the following process.

First, when the Al film 2 having the concave groove 12 is formed, the mask is replaced with the mask used in the second embodiment, which is composed of the square porous structure, and FIGS. The same method as the method for forming the concave groove 12 in the thirteenth embodiment shown in e) was used.

Next, when the Al film 4 having the convex teeth 13 is formed, the same method as that for forming the convex teeth 6 in the second embodiment shown in FIGS. 8A to 8E is used. Made by way. After that, when the concave groove 12 and the convex tooth 13 were opposed to each other by the same method as in the first embodiment, the adhesion was easy.

As a fifteenth embodiment, the concave groove 12 and the convex tooth 13 in FIG. 25 have a ribbon shape shown in FIGS. 11 and 12 as seen from the direction crossing the plane of the drawing. That is, Al
A flat ribbon type wide-mouth taper concave groove 12 and a flat ribbon taper tapered convex tooth 13 were formed in the films 2 and 4, respectively, and the Al film 2 and the Al film 4 were processed by the following process.

First, in the case of forming the Al film 2 having the concave groove 12, the mask used in the third embodiment having a ribbon-shaped porous structure is used, and the mask shown in FIGS. 26 (a) to 26 (e) is used. The same method as the method of forming the concave groove 12 in the thirteenth embodiment shown in FIG.

Next, in the case of forming the Al film 4 having the convex teeth 13, the same method as the forming method of the convex teeth 6 in the third embodiment shown in FIGS. 8A to 8E is used. Made by way. After that, with the concave groove 12 and the convex tooth 13 facing each other, the first
When the bonding was carried out in the same manner as in Example 1, the bonding was easy.

FIG. 27 shows a sixteenth embodiment, in which the Al film 2 is used.
4 and 4 respectively, a flat circular wide-mouth tapered concave groove 16 and a flat circular non-taper convex tooth 17 are formed. The concave groove 16 and the convex tooth 17 are circular as shown in FIGS. 4 and 5, and the Al film 2 and the Al film 4 were processed by the following process.

First, in the case of forming the Al film 2 having the concave groove 16, the same method as the method of forming the concave groove 12 in the thirteenth embodiment shown in FIGS. 26 (a) to 26 (e) is used. It was

Next, in the case of forming the Al film 4 having the convex teeth 17, the Al film 4 having the convex teeth 17 in the seventh embodiment shown in FIGS. 22 (a) to 22 (e) is formed. The formation was performed in the same manner. After that, the concave groove 16 and the convex tooth 17 were made to face each other, and the bonding was carried out in the same manner as in the first embodiment, and the bonding was easy.

As a seventeenth embodiment, in FIG. 27, the concave groove 16 and the convex tooth 17 have a rectangular shape as shown in FIGS. 9 and 10 as viewed from the direction crossing the plane of the drawing. That is, Al
Membranes 2 and 4 each have a flat rectangular wide mouth tapered concave groove 16,
Planar square tapered convex teeth 17 are formed, and Al film 2 and A are formed.
The 1 film 4 was processed by the following process.

First, in the case of forming the Al film 2 having the concave groove 16, the mask used in the second embodiment having a square porous structure is used, and FIGS. 26 (a) to 26 (e) are used. The same method as the method for forming the concave groove 16 in the sixteenth embodiment shown in FIG.

Next, in the case of forming the Al film 4 having the convex teeth 17, the same method as the forming method of the convex teeth 17 in the eighth embodiment shown in FIGS. 22 (a) to 22 (e) is used. Made by way.
After that, when the concave groove 16 and the convex tooth 17 are opposed to each other, the bonding is performed in the same manner as in the first embodiment.
Easily glued.

In the eighteenth embodiment, the concave groove 16 and the convex tooth 17 in FIG. 27 are ribbon-shaped as shown in FIGS. 11 and 12 as seen from the direction crossing the plane of the drawing. That is, the flat ribbon type wide mouth tapered concave groove 16 and the flat ribbon type non-tapered convex tooth 17 are formed on the Al films 2 and 4, respectively, and the Al film 2 and the Al film 4 are processed by the following process. went.

First, in the case of forming the Al film 2 having the concave groove 16, the same mask as that used in the third embodiment having the ribbon-shaped porous structure is used, and FIGS. 26 (e)
The same method as the method for forming the concave groove 12 in the sixteenth embodiment shown in FIG.

Next, in the case of forming the Al film 4 having the convex teeth 17, the same method as that for forming the convex teeth 17 in the ninth embodiment shown in FIGS. 22 (a) to 8 (e) is used. Made by way. After that, with the concave groove 16 and the convex tooth 17 facing each other,
When the bonding was performed in the same manner as in the first example, the bonding was easy.

[0097]

As described above, the room temperature bonding method according to the present invention has the following advantages. (a) When a pair of concavo-convex portions on the surface of an object to be adhered are meshed with each other, a large contact load is generated on the side surfaces of each other by the principle of wedges, and therefore bonding can be performed by applying a relatively small compression load.

(B) By forming a pair of irregularities on the surface of the adherend as small as possible, or by increasing the number of irregularities per unit area, that is, increasing the density of the irregularities, It is possible to bond minute members.

(C) It is possible to bond different materials such as insulators such as glass, conductor (semiconductor) and insulator, conductor (semiconductor) -conductor and the like.

(D) Adhesion at room temperature in air becomes possible.

(E) Since the bonding does not involve diffusion of ions and the like, the bonding can be completed in a short time.

[Brief description of drawings]

FIG. 1 is a sectional view of a first embodiment.

FIG. 2 is a partially enlarged view of FIG.

FIG. 3 is an explanatory diagram during bonding by applying a load.

FIG. 4 is a cross-sectional view of a flat circular concave groove.

FIG. 5 is a cross-sectional view of a planar circular convex tooth.

FIG. 6 is an explanatory diagram of a relationship among an applied load f, a contact load F, and a contact angle α during bonding.

FIG. 7 is a process of forming a concave groove.

FIG. 8 is a process of forming a convex tooth.

FIG. 9 is a cross-sectional view of a plane rectangular concave groove.

FIG. 10 is a cross-sectional view of a planar square convex tooth.

FIG. 11 is a cross-sectional view of a flat ribbon-shaped concave groove.

FIG. 12 is a cross-sectional view of a flat ribbon-shaped convex tooth.

FIG. 13 is a sectional view of a fourth embodiment.

FIG. 14 is a partially enlarged view of FIG.

FIG. 15 is an explanatory diagram during bonding by applying a load.

FIG. 16: Applied load f, contact load F, and contact angle α during bonding
It is explanatory drawing of a relation with.

FIG. 17 is a process of forming a concave groove.

FIG. 18 is a sectional view of a seventh embodiment.

FIG. 19 is a partially enlarged view of FIG. 18.

FIG. 20 is an explanatory diagram during bonding by applying a load.

FIG. 21: Applied load f, contact load F, and contact angle α during bonding
It is explanatory drawing of a relation with.

FIG. 22 is a process of forming a convex tooth.

FIG. 23 is a sectional view of a tenth embodiment.

FIG. 24 is a process of forming a concave groove.

FIG. 25 is a sectional view of the thirteenth embodiment.

FIG. 26 is a process of forming a concave groove.

FIG. 27 is a sectional view of a sixteenth embodiment.

[Explanation of symbols]

 1, 3 Pyrex substrate 2, 4 Al film 5, 12, 16 Concave groove 6, 13, 17 Convex tooth 9 Positive resist film 10 Mask 11 Negative resist film

Claims (3)

[Claims] 1. A plurality of metal thin films are formed on the surfaces of two materials to be bonded, a plurality of concave grooves are formed in the one thin film, and a plurality of concave grooves are meshed with the other thin film. By forming a convex tooth, at least one of these concave groove, convex tooth with a taper angle, by positioning and applying a load so that these concave and convex portions mesh with each other at the time of bonding, A room-temperature bonding method, wherein the side surfaces of the uneven portion are in contact with each other and are bonded by friction during a plastic deformation process. 2. The room temperature bonding method according to claim 1, wherein a planar shape of the concave groove and the convex tooth is any one of a circle, an ellipse, a rectangle, and a polygon. 3. The metal thin film formed on the material surface is Al,
The room temperature bonding method according to claim 1, wherein Au is used.