JPH055579B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a multi-plate heat exchanger, particularly a so-called housingless type.

A housing-less multi-plate heat exchanger includes a plate provided with an upright wall rising from the edge of the bottom wall, a pair of spacing pieces at both ends of the plate, and plates similar to those described above stacked one after another in sequence. A multi-layer cavity is formed that is separated from the outside and between each layer, and the through holes provided in the plate and the through holes of the spacer plate are communicated, for example, in the case of a two-fluid type, there are four fluid channels. are formed to serve as entrance and exit passages for the A and B2 fluids, and cutouts that communicate with the cavity are provided in the through holes alternately in each layer, so that the A and B2 fluids enter and exit the cavity every other layer. be. One example is the one disclosed in Utility Model Application No. 148480/1983.

Such a housing-less multi-plate heat exchanger is assembled into a heat exchanger structure by inserting wax foil at the required locations on an assembly jig to form a heat exchanger structure, which is then inserted into a furnace together with the assembly jig. It is then integrally brazed.

Conventionally, the above-mentioned plate is placed on a flat table-shaped assembly jig, a hard solder foil is placed on top of the plate, a pair of spacing plates are placed on top of the plate, a concave-convex fin is placed on top of the plate, and a hard solder foil is placed on top of that. The method involved stacking plates and sequentially placing them in the required number of stages, and since there was no special means for positioning each component, the position of each component was fixed at the tips and bases of the upper and lower upstanding walls. There was only a fit between the two. Therefore, during assembly work, when transporting and inserting this heat exchanger structure into the furnace, or when moving the structure in the furnace if the furnace is a continuous type, each member may become misaligned. This resulted in an irregularly shaped assembly, resulting in gaps that caused leaks due to incomplete brazing, and constricted through passages that communicated with each other, making the flow passages narrower.

Also, there is an assembly jig with guide pins set up upright, which is described in Japanese Patent Publication No. 56-5631.
The guide pin disclosed therein is inclined with respect to the lower surface of the base of the assembly jig, and the configuration of the multi-plate heat exchanger is maintained by leaning against this inclination. Therefore, during transportation and movement during the manufacturing process, there is a risk that the constituent members may shift due to variations in inclination. It is also an assembly jig for a heat exchanger in which pin holes cannot be provided in the constituent members.

This invention is intended to solve the above-mentioned problems in the manufacturing method of a so-called housingless type heat exchanger.
Set up book guide pins, drill at least one pin hole at each end of the plate, and drill pin holes at positions corresponding to the pin holes in the plate in the hard solder foil and the spacing plate. However, by sequentially inserting the guide pin through each pin hole and assembling the assembly, misalignment of each member is eliminated.

To explain with an example, in the figure, a rectangular assembly jig 1 has a pair of guide pins 1 at both ends thereof.
a, 1b and 1c, 1d are respectively erected. On the assembly jig 1, a reinforcing plate 21 having pin holes 2a, 2b and a reinforcing plate 22 having pin holes 2c, 2d are inserted into the guide pins 1a, 1b, 1c, 1d through the pin holes 2a, 2b and 2c, 2d, respectively. and placed. A hard solder foil 31 having pin holes 3a, 3b and a hard solder foil 32 having pin holes 3c, 3d are placed on the reinforcing plates 21, 22 to connect the pin holes 3a, 3b, 3c, 3d to the guide pins 1a, 1, respectively.
b, 1c, and 1d. On top of that, there are pin holes 4a, 4b in the four corners of the rectangular bottom wall 41.
4c and 4d, and through holes 4e, 4f, 4g, and 4h are provided slightly toward the center thereof, and standing walls 42 and 4 are made by bending the edges of the bottom wall 41 and standing up.
3 with pin holes 4a, 4b, 4
c, 4d are inserted through guide pins 1a, 1b, 1c, 1d, respectively, and on top of the guide pins 1a, 1b, 1c, and 1d, through holes 5e, 5f, which are approximately the same shape as the bottom wall 41 and have pin holes 5a, 5b, 5c, 5d at the four corners, are mounted. 5g and 5h are placed on the guide pins 1a, 1b, 1c, and 1d through the pin holes 5a, 5b, 5c, and 5d, respectively, and the pin holes 6a and 6b and the through holes are placed thereon. 6e, 6f, and a spacing plate 61 provided with a notch 61e that opens the through hole 6e inward, and a pin hole 6.
A spacing plate 62 having through holes 6g, 6h and a notch 62h that opens the through hole 6h inward.
In addition, a fin 63 having an uneven wave shape is placed between the spacer plates 61 and 62 so that the guide pins 1a, 1b, 1c, and 1d are inserted through the pin holes 6a, 6b, 6c, and 6d, and the hard brazing material 5 is placed on top of the fin 63. Place the plate 4 in the same manner as above, place the plate 4 on top of it in the same manner as above, fit the bases of the upright walls 42 and 43 into the upper edges of the corresponding lower upright walls, and place the hard brazing material 5 on top of it. The spacing plate 61 has a notch (not shown) that opens inward in the through hole 6f, and the spacing plate 62 has a notch (not shown) that opens inward in the through hole 6g. Place it on the hard soldering material 5,
Thereafter, the heat exchanger structure is assembled by repeating the steps one after another and stacking the required number of stages, and placing the spacer plates 71 and 72 without cutouts on the top stage. In this case, through hole 4
e, 5e, through holes 6e... communicate with each other to form a through path, and 4f, 5f, 6f..., 4g, 5g, 6g
The same applies to ..., 4h, 5h, 6h.... Next, the heat exchanger structure inserted through the guide pins is put into a brazing furnace together with the assembly jig 1 and brazed together, and after being taken out of the furnace, it is extracted from the guide pins of the assembly jig to obtain a heat exchanger. .

The method for manufacturing a multi-plate heat exchanger of the present invention is a method for manufacturing a housingless type heat exchanger in which spacer pieces are stacked on both ends of the plates, and pin holes are formed at corresponding positions on both ends of the plates and the spacer pieces. A guide pin can be inserted into the guide pin to position each component. Therefore, unlike when using a jig without guide pins or assembling a heat exchanger that does not have pin holes by leaning on guide pins, each member can be reliably positioned relative to each other and will not shift even when tilted. Since there are no gaps, there is no possibility of parts shifting during transportation for insertion into the furnace or movement in the furnace, so the finished product will not have an irregular shape and will not cause gaps due to shifting. There will be no leakage due to incomplete soldering or narrowing of the through passage, and assembly work will be extremely easy.

In the above case, the fins provided as necessary are not positioned using guide pins, but they can be fixed by being held between spacer plates at both ends or by being appropriately retained by a plate or hard foil.

In addition to the above-mentioned embodiments, an assembly method is adopted in which the plates are stacked in a face down position with the upright wall facing downward, and an assembly method in which the reinforcing plate is placed on the top level and the spacer plate without a notch is placed on the bottom level. You can also do that.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the invention. 1... Assembly jig, 1a, 1b, 1c, 1d...
Guide pin, 21, 22... Reinforcement plate, 41... Plate, 5... Hard solder foil, 61, 62... Spacing plate.

Claims (1)

[Claims] 1. On the assembly jig, place a plate consisting of a bottom wall with an upright wall on the periphery and at least two through holes punched at both ends, and overlay hard solder foil on the bottom wall. , at least two through-holes are provided on both ends of the solder foil, and at least one at least one through-hole extends inwardly from the through-holes.
A pair of spacer plates each having a number of notches are stacked on top of each other.
Layer the hard solder foil over the pair of spacing plates, then layer the same plates as above on top of that, stack the required number of layers in the same order, and assemble the multi-plate heat exchanger structure. In a method for manufacturing a housing-less multi-plate heat exchanger, the structure is inserted into the housing and integrally brazed and fixed,
Set up at least two guide pins on the assembly jig,
At least one pin hole is formed at each end of the bottom wall of the plate, pin holes are formed at positions corresponding to the pin holes of the plate in the hard solder foil and the spacing plate, and the guide pin A method for manufacturing a housing-less multi-plate heat exchanger, which comprises assembling a housing-less multi-plate heat exchanger by sequentially inserting each pin hole into the heat exchanger.