JPH0555224B2 - - Google Patents
Info
- Publication number
- JPH0555224B2 JPH0555224B2 JP58248654A JP24865483A JPH0555224B2 JP H0555224 B2 JPH0555224 B2 JP H0555224B2 JP 58248654 A JP58248654 A JP 58248654A JP 24865483 A JP24865483 A JP 24865483A JP H0555224 B2 JPH0555224 B2 JP H0555224B2
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- cooling fins
- temperature
- fins
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 claims description 124
- 239000011159 matrix material Substances 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 238000005476 soldering Methods 0.000 claims description 10
- 238000005219 brazing Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/14—Soldering, e.g. brazing, or unsoldering specially adapted for soldering seams
- B23K1/18—Soldering, e.g. brazing, or unsoldering specially adapted for soldering seams circumferential seams, e.g. of shells
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、冷却母体に複数枚の冷却フインを貫
通・固定してなる積層冷却体の製造方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method of manufacturing a laminated cooling body in which a plurality of cooling fins are penetrated and fixed to a cooling matrix.
〔従来の技術及び発明が解決しようとする問題
点〕
従来、積層冷却体は、冷却母体用穴が穿設され
た冷却フインを冷却母体に１枚づつ圧入して製造
するか、圧入後、半田付けにより固定して製造さ
れている。しかし、この圧入は、冷却母体と冷却
フインの穴のクリアランスが小さい場合、人手で
行うには、圧力不足のため困難で、プレス機械で
１枚づつ圧入がなされている。従つて、プレス機
械、人工及び費用がかかる欠点がある。[Prior art and problems to be solved by the invention] Conventionally, laminated cooling bodies have been manufactured by press-fitting cooling fins with holes for the cooling matrix into the cooling matrix one by one, or by soldering after press-fitting. Manufactured in a fixed manner. However, this press-fitting is difficult to do manually due to insufficient pressure when the clearance between the holes of the cooling base and the cooling fins is small, so press-fitting is performed one by one using a press machine. Therefore, there are disadvantages in that the press machine is labor intensive and expensive.
又、クリアランスを大きくすると、挿入は容易
であるが、半田が流失して性能が悪い。 Furthermore, if the clearance is increased, insertion is easier, but the solder is washed away, resulting in poor performance.
本発明は、上記諸欠点を解決するためになされ
たものである。 The present invention has been made to solve the above-mentioned drawbacks.
本発明の要旨とするところは、次の通りである
即ち、
(1) 冷却母体に複数枚の冷却フインを貫通・固定
してなる積層冷却体の製造方法において、冷却
フインの冷却母体用穴と冷却母体の直径差が、
0.03〜0.2mmになるように、冷却母体の温度よ
り冷却フインの温度を相対的に高くして、温度
差を設ける第１工程と、
冷却母体に冷却フインを挿入する第２工程
と、
前記温度差をなくす第３工程と、
前記冷却母体に前記冷却フインを半田付け
（ブレージングを含む）する第４工程とよりな
ることを特徴とする積層冷却体の製造方法。
The gist of the present invention is as follows: (1) A method for manufacturing a laminated cooling body in which a plurality of cooling fins are penetrated and fixed to a cooling matrix, in which holes for the cooling matrix of the cooling fins and The difference in diameter of the cooling base is
a first step of creating a temperature difference by making the temperature of the cooling fins relatively higher than the temperature of the cooling base so that the temperature is 0.03 to 0.2 mm; a second step of inserting the cooling fins into the cooling base; and a second step of inserting the cooling fins into the cooling base; A method for manufacturing a laminated cooling body, comprising: a third step of eliminating the difference; and a fourth step of soldering (including brazing) the cooling fins to the cooling base.
(2) 冷却母体の温度より冷却フインの温度を高く
するために、冷却フインを加熱することを特徴
とする特許請求の範囲第１項記載の積層冷却体
の製造方法。(2) A method for manufacturing a laminated cooling body according to claim 1, characterized in that the cooling fins are heated in order to make the temperature of the cooling fins higher than the temperature of the cooling base.
(3) 冷却母体の温度より冷却フインの温度を高く
するために、冷却母体を冷却することを特徴と
する特許請求の範囲第１項記載の積層冷却体の
製造方法である。(3) A method for manufacturing a laminated cooling body according to claim 1, characterized in that the cooling matrix is cooled in order to make the temperature of the cooling fins higher than the temperature of the cooling matrix.
次に、上記発明をその工程毎に分けて説明する
第１工程
これは、冷却フインの冷却母体用穴と冷却母体
の直径差が、0.03〜0.2mmになるように冷却母体
の温度より冷却フインの温度を相対的に高くし
て、温度差を設ける工程である。 Next, the first step is to explain the above invention by dividing it into steps. This is a first step in which the temperature of the cooling fin is lowered so that the difference in diameter between the hole for the cooling fin and the cooling mother becomes 0.03 to 0.2 mm. This is a process in which the temperature of the wafer is made relatively high to create a temperature difference.
冷却フインを、例えば、100℃の炉内で、加熱
するか、又は、冷却母体を、例えば、−60℃に冷
却されたチヤンバーへ入れて冷却し、両者間に相
対的に温度差を設け、その熱膨張又は、熱収縮に
よつて、冷却フインの冷却母体用穴を冷却母体の
直径より大きくして、冷却母体へ冷却フインを挿
入し易くする。 The cooling fins are heated, for example, in a furnace at 100°C, or the cooling base is cooled, for example, in a chamber cooled to -60°C, thereby creating a relative temperature difference between the two; Due to the thermal expansion or contraction, the hole for the cooling matrix of the cooling fin is made larger than the diameter of the cooling matrix, making it easier to insert the cooling fin into the cooling matrix.
一般に使用されるアルミニユウム製積層冷却体
を製造する場合、80℃前後の温度差を設けること
によつて、挿入が容易な直径差を作り出すことが
出来る。 When manufacturing commonly used aluminum laminated cooling bodies, by creating a temperature difference of around 80°C, it is possible to create a diameter difference that facilitates insertion.
その上、両者間のクリアランスが適当になるた
め、第４工程で、半田付けをしても、両者の間〓
から半田が流失することがなくなり、かつこの半
田付けによつて、両者が強固に固着するため、得
られた製品は、熱伝導性が良くなつて、放熱性が
向上する。 Moreover, since the clearance between the two is appropriate, even if soldering is done in the fourth step, there will be no gap between the two.
Since the solder does not flow away and the two are firmly fixed together by this soldering, the resulting product has good thermal conductivity and improved heat dissipation.
第２工程
これは、上記第１工程で相対的に温度差を与え
られて、相対的に穴の直径が大きくされた冷却フ
インを冷却母体に挿入する工程である。Second Step This is a step in which the cooling fins, which have been given a relative temperature difference in the first step and whose holes have a relatively large diameter, are inserted into the cooling matrix.
冷却フインの冷却母体への挿入方法は、冷却フ
インを１枚挿入し、次いで、ドーナツ状に予め成
形されたフラツクス入りの半田環を挿入する。こ
れを所定枚数分反復する方法とか、又は前記冷却
フインが、ブレージングシートで形成されている
場合には、該冷却フインを所定枚数揃えて置いて
冷却母体をこれらの穴に貫通されるが、又は冷却
母体に前記揃えられたままの冷却フインを挿入す
る方法がある。 The method for inserting the cooling fins into the cooling matrix is to insert one cooling fin, and then insert a solder ring preformed into a donut shape and containing flux. This may be repeated for a predetermined number of sheets, or if the cooling fins are formed of a brazing sheet, a predetermined number of cooling fins may be arranged and the cooling base body may be penetrated through these holes; There is a method of inserting the aligned cooling fins into the cooling base.
従つて、従来法の如く、ブレス機械での圧入を
要しないし、従つて、又、圧入時に冷却フインが
変形されて仕舞うこともない。 Therefore, there is no need for press-fitting using a press machine as in the conventional method, and the cooling fins are not deformed during press-fitting.
第３工程
これは、前記第１工程で設けられた冷却母体と
冷却フインとの温度差をなくす工程である。Third Step This is a step to eliminate the temperature difference between the cooling base and the cooling fins provided in the first step.
具体的には、前記第２工程を経たものを、大気
中に放置するか、強制冷却するか、又は加熱して
冷却母体と冷却フインとの間の温度差をなくす。 Specifically, the material that has undergone the second step is left in the atmosphere, forcedly cooled, or heated to eliminate the temperature difference between the cooling base and the cooling fins.
これによつて、冷却フインは、冷却母体に緊着
する。 As a result, the cooling fins are tightly attached to the cooling base.
第４工程
これは、前記第３工程で一体化された前記冷却
母体に前記冷却フインを半田付けする工程であ
る。Fourth Step This is a step of soldering the cooling fins to the cooling base body integrated in the third step.
前記の如く、フラツクス入りの半田環の介在さ
れたもの及びブレージングシート製冷却フインを
使用したものでは、半田付け又はブレージングす
るに必要な温度まで加熱して、冷却フインのそれ
ぞれを冷却母体に固着させる。 As mentioned above, in cases where a flux-cored solder ring is interposed or a cooling fin made of a brazing sheet is used, the cooling fins are heated to the temperature necessary for soldering or brazing to fix each cooling fin to the cooling base. .
このように、第３工程で、冷却フインは、冷却
母体に緊着されているので、半田付けをしても、
冷却母体と冷却フインとの間〓から半田が流失す
ることがないし、かつこの第４工程での半田付け
によつて、両者がより一層強固に固着するため、
中間に空気の層が介在することがなくなり、得ら
れた製品は、熱伝導性が良くなつて、放熱性が向
上する。 In this way, in the third step, the cooling fins are tightly attached to the cooling base, so even if soldered,
The solder does not flow away from between the cooling base and the cooling fins, and the soldering in this fourth step makes the two more firmly attached.
There is no intervening air layer, and the resulting product has better thermal conductivity and improved heat dissipation.
次に、本発明の１実施例をその図面に基づいて
説明する。
Next, one embodiment of the present invention will be described based on the drawings.
１は、外周部が銅被覆されたアルミニユウム製
の冷却母体であつて、23℃のとき、直径が60.00
mm、長さが40mmのものである。 1 is an aluminum cooling base whose outer periphery is coated with copper, and the diameter is 60.00 at 23℃.
mm, and the length is 40 mm.
２は、冷却母体用穴３のバーリング部内側４に
銅被覆がなされた厚さ1.2mm、150×150mmのアル
ミニユウム製の冷却フインであつて内径が23℃に
おいて、60.1mmのものである。 Reference numeral 2 is a cooling fin made of aluminum with a thickness of 1.2 mm and a size of 150 x 150 mm, in which the inner side 4 of the burring part of the cooling matrix hole 3 is coated with copper, and the inner diameter is 60.1 mm at 23°C.
この冷却フイン２が、100℃に加熱されるその
内径が60.2mmに大きくなつた該冷却フイン２とフ
ラツクス入りの半田環５とを、冷却フイン２，２
の間隔を3.0mmにして７セツト積層して、前記23
℃のボス部１に順次挿入した後、全体を280℃に
加熱された炉内に、30分間入れて加熱して、半田
付けを行つた。 This cooling fin 2 connects the cooling fin 2, which is heated to 100°C and whose inner diameter has increased to 60.2 mm, and the flux-cored solder ring 5 to the cooling fins 2, 2.
Laminated 7 sets with a spacing of 3.0 mm, and
After sequentially inserting them into the boss portions 1 at 280° C., the whole was placed in a furnace heated to 280° C. for 30 minutes to perform soldering.
しかる後、これを取り出して、大気中で放冷し
て、アルミニユウム製積層冷却体を得ることが出
来た。 Thereafter, this was taken out and allowed to cool in the atmosphere, and an aluminum laminated cooling body was obtained.
上記実施例によれば、プレス機械で圧入するこ
となく、容易に冷却フイン２を冷却母体１に挿入
することが出来、冷却フイン２が変形することが
ないので、その矯正も要せず、生産性が向上した
他、冷却母体１と冷却フイン２との間が、緊着し
ているため、両者を半田付けする半田の量も少な
くて済み、従つて、半田がたれ流れることがなく
て、仕上がり見栄えも良く、かつ両者間がしつか
り半田付けされているため、中間に空気の層が介
在することがなくなり、冷却母体１から冷却フイ
ン２への熱伝導も向上し、その放熱性も向上し
た。 According to the above embodiment, the cooling fins 2 can be easily inserted into the cooling base 1 without being press-fitted with a press machine, and the cooling fins 2 are not deformed. In addition to improved properties, since the cooling matrix 1 and the cooling fins 2 are in close contact, the amount of solder needed to solder them together is small, and therefore the solder does not drip or flow. The finished product has a good appearance, and since the two are tightly soldered, there is no air layer in between, which improves heat conduction from the cooling base 1 to the cooling fins 2, and improves heat dissipation. did.
参考例
本発明と比較するために、次に、その参考例を
説明する。Reference Example Next, a reference example will be described for comparison with the present invention.
１は、直径80.0000mm、長さ90mmの銅製の冷却
母体であり、２は、23℃で、内径79.98mm、長さ
95mm、180×180mmの銅製の冷却フインである。 1 is a copper cooling base with a diameter of 80.0000 mm and a length of 90 mm, and 2 is a cooling base made of copper with an inner diameter of 79.98 mm and a length of 23°C.
It is a 95mm, 180x180mm copper cooling fin.
上記冷却フイン２が、30枚、2.5mm間隔で内孔
を揃えて積み重ねられる。他方、冷却母体１は、
冷却されて、直径が79.89mmに熱収縮した。該冷
却母体１が、該チヤンバーから取り出されて、前
記積み重ねられた冷却フイン２の内孔に挿入さ
れ、放置して、常温に戻して完成された。 Thirty cooling fins 2 are stacked with inner holes aligned at 2.5 mm intervals. On the other hand, the cooling base 1 is
It was cooled and heat-shrinked to a diameter of 79.89 mm. The cooling matrix 1 was taken out from the chamber, inserted into the inner holes of the stacked cooling fins 2, and left to return to room temperature to complete the process.
このように、冷却フイン２をプレス機械で圧入
することなく、容易に挿入出来、生産性も向上し
たが、冷却体としての使用中も、冷却フイン２が
ひどくずれることもなく、又、その放熱性は、少
し間〓があつて、熱伝導が良くないが、実用上支
障がなかつた。 In this way, the cooling fins 2 can be easily inserted without being press-fitted with a press machine, and productivity has been improved. Although the temperature was a little long and the heat conduction was not good, there was no problem in practical use.
本発明の製造方法によれば、冷却フインを冷却
母体に挿入することが容易になり、生産性も向上
する。又、プレス機械を使用しないで製造出来る
ため、冷却フインが冷却母体に挿入されるときに
変形することがなくなる。その上、焼き嵌め、又
は冷し嵌めで緊着するだけでなく、半田付け又は
ブレージング等をすることで、より一層両者間が
固着されて、放熱性も一段と向上するものであ
る。
According to the manufacturing method of the present invention, it becomes easy to insert the cooling fins into the cooling matrix, and productivity is also improved. Furthermore, since the cooling fins can be manufactured without using a press machine, the cooling fins will not be deformed when inserted into the cooling base. Moreover, not only can they be tightly attached by shrink fitting or cold fitting, but also by soldering or brazing, etc., the two can be further fixed, and the heat dissipation performance can be further improved.
なお、本発明は、上記実施例に限定されること
なく、本願特許請求の範囲の記載の要旨に反しな
い限り、付加変更をなし得るものであつて、例え
ば、冷却母体は、内実の棒材製に限らず、ヒート
パイプ等のような管材でも良い。 It should be noted that the present invention is not limited to the above-mentioned embodiments, and can be modified without departing from the gist of the claims of the present application. It is not limited to the material made of aluminum, and may be made of a pipe material such as a heat pipe.
第１図は、本発明の１実施例にして、その説明
用側断面図、第２図は、参考例にして、その説明
用側断面図である。
１：冷却母体 ２：冷却フイン ３：冷却母体
用穴 ４：バーリング部内側 ５：フラツクス入
りの半田環。
FIG. 1 is an explanatory side cross-sectional view of one embodiment of the present invention, and FIG. 2 is an explanatory side cross-sectional view of a reference example. 1: Cooling base 2: Cooling fins 3: Holes for cooling base 4: Inside of burring part 5: Solder ring containing flux.
Claims (1)
してなる積層冷却体の製造方法において、冷却フ
インの冷却母体用穴と冷却母体の直径差が、0.03
〜0.2mmになるように、冷却母体の温度より冷却
フインの温度を相対的に高くして、温度差を設け
る第１工程と、 冷却母体に冷却フインを挿入する第２工程と、 前記温度差をなくす第３工程と、 前記冷却母体に前記冷却フインを半田付け（ブ
レージングを含む）する第４工程とよりなること
を特徴とする積層冷却体の製造方法。 ２ 冷却母体の温度より冷却フインの温度を高く
するために、冷却フインを加熱することを特徴と
する特許請求の範囲第１項記載の積層冷却体の製
造方法。 ３ 冷却母体の温度より冷却フインの温度を高く
するために、冷却母体を冷却することを特徴とす
る特許請求の範囲第１項記載の積層冷却体の製造
方法。[Claims] 1. In a method for manufacturing a laminated cooling body in which a plurality of cooling fins are penetrated and fixed to a cooling base, the diameter difference between the cooling base holes of the cooling fins and the cooling base is 0.03.
a first step of creating a temperature difference by making the temperature of the cooling fins relatively higher than the temperature of the cooling base so that the temperature is ~0.2 mm; a second step of inserting the cooling fins into the cooling base; and a second step of inserting the cooling fins into the cooling base; A method for manufacturing a laminated cooling body, comprising: a third step of eliminating the cooling fins; and a fourth step of soldering (including brazing) the cooling fins to the cooling base. 2. The method for manufacturing a laminated cooling body according to claim 1, characterized in that the cooling fins are heated in order to make the temperature of the cooling fins higher than the temperature of the cooling base body. 3. The method of manufacturing a laminated cooling body according to claim 1, characterized in that the cooling matrix is cooled in order to make the temperature of the cooling fins higher than the temperature of the cooling matrix.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24865483A JPS60137567A (en) | 1983-12-26 | 1983-12-26 | Production of laminated cooling body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24865483A JPS60137567A (en) | 1983-12-26 | 1983-12-26 | Production of laminated cooling body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60137567A JPS60137567A (en) | 1985-07-22 |
| JPH0555224B2 true JPH0555224B2 (en) | 1993-08-16 |
Family
ID=17181337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24865483A Granted JPS60137567A (en) | 1983-12-26 | 1983-12-26 | Production of laminated cooling body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60137567A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101862876B (en) * | 2010-06-29 | 2012-02-22 | 浙江金宸三普换热器有限公司 | Buffer type lashing bar for heat exchanger during brazing |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5461049A (en) * | 1977-10-25 | 1979-05-17 | Toshiba Corp | Fixing construction for monmetallic rigid pipe and metallic container |
| JPS573743A (en) * | 1980-06-03 | 1982-01-09 | Toshiba Corp | Joining method of glass |
| JPS5881558A (en) * | 1981-11-06 | 1983-05-16 | Matsushita Refrig Co | Connecting method of tube and end plate in heat exchanger |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5492169U (en) * | 1977-12-12 | 1979-06-29 |
-
1983
- 1983-12-26 JP JP24865483A patent/JPS60137567A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5461049A (en) * | 1977-10-25 | 1979-05-17 | Toshiba Corp | Fixing construction for monmetallic rigid pipe and metallic container |
| JPS573743A (en) * | 1980-06-03 | 1982-01-09 | Toshiba Corp | Joining method of glass |
| JPS5881558A (en) * | 1981-11-06 | 1983-05-16 | Matsushita Refrig Co | Connecting method of tube and end plate in heat exchanger |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60137567A (en) | 1985-07-22 |
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