JPH055462U - Optical writing head for electrophotography - Google Patents
Optical writing head for electrophotographyInfo
- Publication number
- JPH055462U JPH055462U JP052108U JP5210891U JPH055462U JP H055462 U JPH055462 U JP H055462U JP 052108 U JP052108 U JP 052108U JP 5210891 U JP5210891 U JP 5210891U JP H055462 U JPH055462 U JP H055462U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- light emitting
- semiconductor optical
- driving semiconductor
- driving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
(57)【要約】
【目的】集束性ロッドレンズアレイを容易にアライメン
トすることができ、小型で、高精度の電子写真用光書込
みヘッドを提供する。
【構成】多数の独立した発光部を有する半導体光素子３
２を駆動用半導体素子３１の上に絶縁層３３を介して３
次元実装して、複合素子を形成している。該複合素子
は、半導体光素子３２の発光部３４が一列に並ぶように
基板の上に複数個固定される。そして、半導体光素子３
２の発光部３４に対向させてレンズアレイを基板の上に
固定している。また、各複合素子は、発光部３４の列方
向における駆動用半導体素子３１の幅を半導体光素子３
２の幅より狭くして、駆動用半導体素子３１の両端面に
半導体光素子３２の端部が張り出すようにしてあり、各
複合素子を基板上に配設した場合、駆動用半導体素子３
１間における接触はなく、エッジショートが発生するこ
とがない。しかも、駆動用半導体素子３１を交換する場
合における隣接素子間の影響をなくすことができる。
(57) [Summary] [Object] To provide a compact and highly accurate optical writing head for electrophotography with which a converging rod lens array can be easily aligned. [Structure] Semiconductor optical device 3 having a large number of independent light emitting portions
2 on the driving semiconductor element 31 via the insulating layer 33
Dimensionally mounted to form a composite element. A plurality of the composite elements are fixed on the substrate so that the light emitting portions 34 of the semiconductor optical element 32 are arranged in a line. Then, the semiconductor optical device 3
The lens array is fixed on the substrate so as to face the second light emitting unit 34. Further, in each composite element, the width of the driving semiconductor element 31 in the column direction of the light emitting section 34 is set to the semiconductor optical element 3.
The width of the driving semiconductor element 31 is made narrower than that of the semiconductor optical element 32 so that the end portions of the semiconductor optical element 32 project to both end surfaces of the driving semiconductor element 31, and when each composite element is arranged on the substrate, the driving semiconductor element 3
There is no contact between No. 1 and edge short circuit does not occur. In addition, it is possible to eliminate the influence between adjacent elements when the driving semiconductor element 31 is replaced.
Description
【０００１】[0001]
本考案は、半導体光素子を用いた電子写真用光書込みヘッドに関するものであ る。 The present invention relates to an optical writing head for electrophotography using a semiconductor optical element. It
【０００２】[0002]
従来、電子写真装置においては、帯電させた感光ドラムを光源によって照射し てその表面に静電潜像を形成し、該静電潜像にトナーを付着させて現像を行った 後にトナー像を記録媒体に転写させるようにしている。 この種の電子写真装置は、感光ドラムを光源によって照射するために、多数の 発光部を有する半導体光素子を使用しており、該半導体光素子の所定の発光部を データによって選択的に発光させ、光を感光ドラムに送るようにしている。この 場合、上記半導体光素子は駆動用半導体素子と共に基板上に搭載されて光書込み ヘッドを構成しており、上記駆動用半導体素子によって駆動される（K.Watanabe , et,al., "HIGH DENSITY WIRE BONDING TECHNIQUE FOR 400 DPI LED PRINT HEA D"; proc.ISHM, p211, 1988 ；山越晃次「 300ドット／インチ LED アレイプリ ントヘッドの開発」沖電気研究開発 第131 号、vol.53, No.3, 1986) 。 Conventionally, in an electrophotographic apparatus, a charged photosensitive drum is illuminated by a light source. To form an electrostatic latent image on the surface, and to develop toner particles by adhering toner to the electrostatic latent image. After that, the toner image is transferred to the recording medium. This type of electrophotographic apparatus uses a large number of light sources to illuminate the photosensitive drum with a light source. A semiconductor optical device having a light emitting unit is used, and a predetermined light emitting unit of the semiconductor optical device is used. The light is selectively emitted according to the data, and the light is sent to the photosensitive drum. this In this case, the above-mentioned semiconductor optical device is mounted on the substrate together with the driving semiconductor device for optical writing. It constitutes a head and is driven by the driving semiconductor element (K. Watanabe , et, al., "HIGH DENSITY WIRE BONDING TECHNIQUE FOR 400 DPI LED PRINT HEA D "; proc.ISHM, p211, 1988; Koji Yamakoshi" 300 dots / inch LED array pre Development of front head "Oki Electric Research and Development No. 131, vol.53, No.3, 1986).
【０００３】 図２は従来の電子写真用光書込みヘッドにおける半導体光素子の実装状態図で ある。 図において、１１は基板であり、該基板１１上に半導体光素子１２、駆動用半 導体素子１３がダイ・ボンディング樹脂を用いて搭載されている。上記半導体光 素子１２は上面に多数の発光体を備えており、該発光体がそれぞれ選択的に駆動 電流を受けて発光する。上記半導体光素子１２の個別接続電極と駆動用半導体素 子１３の出力端子、及び駆動用半導体素子１３の入力端子と基板１１上の配線１ ７との接続は、ワイヤ・ボンディング１４，１５によって行われる。また、半導 体光素子１２の共通電極は、導電性ダイ・ボンディング樹脂を用いて基板配線に 直接接続される。また、１６は図示しない外部駆動回路と電子写真用光書込みヘ ッドを接続するための電極対である。[0003] FIG. 2 is a mounting state diagram of a semiconductor optical element in a conventional optical writing head for electrophotography. is there. In the figure, 11 is a substrate on which the semiconductor optical device 12 and the driving half The conductor element 13 is mounted using a die bonding resin. Semiconductor light The element 12 has a large number of light emitters on its upper surface, and the light emitters are selectively driven. It emits light when receiving an electric current. Individual connection electrodes of the semiconductor optical device 12 and driving semiconductor element The output terminal of the child 13, the input terminal of the driving semiconductor element 13, and the wiring 1 on the substrate 11 The connection with 7 is made by wire bonding 14, 15. Also, semi-conductive The common electrode of the body light element 12 is a substrate wiring using conductive die bonding resin. Directly connected. Further, 16 is an external drive circuit (not shown) and an optical writing area for electrophotography. It is an electrode pair for connecting the head.
【０００４】 図３は従来の電子写真用光書込みヘッドの断面図である。 図において、１１は基板、１２は半導体光素子、１３は駆動用半導体素子であ る。上記半導体光素子１２と駆動用半導体素子１３、及び駆動用半導体素子１３ と基板１１上の配線１７との接続は、ワイヤ・ボンディング１４，１５によって 行われる。この基板１１はベースプレート２１に搭載され、該ベースプレート２ １に外部回路との接続用コネクタ２２が取り付けられる。また、２３は結像用の 集束性ロッドレンズアレイ２４を接着剤で取り付けたカバーであり、半導体光素 子１２の列に平行にアライメントされた後、取付ビス２５，２６によってベース プレート２１に固定されている。[0004] FIG. 3 is a sectional view of a conventional optical writing head for electrophotography. In the figure, 11 is a substrate, 12 is a semiconductor optical element, and 13 is a driving semiconductor element. It The semiconductor optical device 12, the driving semiconductor device 13, and the driving semiconductor device 13 And the wiring 17 on the substrate 11 are connected by wire bonding 14 and 15. Done. The substrate 11 is mounted on a base plate 21 and the base plate 2 A connector 22 for connecting to an external circuit is attached to the connector 1. Further, 23 is for imaging It is a cover to which the converging rod lens array 24 is attached with an adhesive, After being aligned parallel to the row of the child 12, the base is attached by the mounting screws 25 and 26. It is fixed to the plate 21.
【０００５】[0005]
しかしながら、上記従来の電子写真用光書込みヘッドにおいては、一列に配列 された半導体光素子１２と、集束性ロッドレンズアレイ２４をアライメントする のが困難であるだけでなく、ヘッド構造が大型となり、装置の小型化を図ること ができない。 However, in the above-mentioned conventional optical writing head for electrophotography, they are arranged in a line. The aligned semiconductor optical device 12 and the converging rod lens array 24 Not only is it difficult to achieve, but the head structure also becomes large, and the size of the device can be reduced. I can't.
【０００６】 本考案は、上記従来の電子写真用光書込みヘッドの問題点を解決して、集束性 ロッドレンズアレイを容易にアライメントすることができ、小型で、高精度の電 子写真用光書込みヘッドを提供することを目的とする。[0006] The present invention solves the above problems of the conventional optical writing head for electrophotography, and improves the focusing property. The rod lens array can be easily aligned, and it is compact and highly accurate. An object is to provide an optical writing head for a child photograph.
【０００７】[0007]
そのために、本考案の電子写真用光書込みヘッドにおいては、多数の独立した 発光部を有する半導体光素子を駆動用半導体素子の上に絶縁層を介して３次元実 装して、複合素子を形成している。該複合素子は、上記半導体光素子の発光部が 一列に並ぶように基板の上に複数個固定される。 Therefore, in the optical writing head for electrophotography of the present invention, a large number of independent A semiconductor optical device having a light emitting part is three-dimensionally mounted on a driving semiconductor device through an insulating layer. And form a composite element. In the composite device, the light emitting portion of the semiconductor optical device is A plurality of substrates are fixed on the substrate so that they are arranged in a line.
【０００８】 そして、上記半導体光素子の発光部に対向させてレンズアレイを上記基板の上 に固定している。 また、各複合素子は、発光部の列方向における駆動用半導体素子の幅が半導体 光素子の幅より狭く、駆動用半導体素子の両端面に半導体光素子の端部が張り出 すようにしてあり、隣接する駆動用半導体素子の端面が相互に接触しないように 配列されている。[0008] The lens array is placed on the substrate so as to face the light emitting portion of the semiconductor optical device. It is fixed to. In addition, the width of the driving semiconductor element in the column direction of the light emitting portion is Narrower than the width of the optical element, the ends of the semiconductor optical element project on both end faces of the driving semiconductor element. So that the end faces of adjacent driving semiconductor elements do not touch each other. It is arranged.
【０００９】[0009]
本考案によれば、上記のように多数の独立した発光部を有する半導体光素子を 駆動用半導体素子の上に絶縁層を介して３次元実装して、複合素子を形成してい る。該複合素子は、上記半導体光素子の発光部が一列に並ぶように基板の上に複 数個固定される。 According to the present invention, a semiconductor optical device having a large number of independent light emitting parts as described above is provided. A composite element is formed by three-dimensionally mounting on a driving semiconductor element via an insulating layer. It The composite element is formed on the substrate so that the light emitting portions of the semiconductor optical element are arranged in a line. Several are fixed.
【００１０】 そして、上記半導体光素子の発光部に対向させてレンズアレイを上記基板の上 に固定している。 したがって、駆動用半導体素子によって制御されたデータに対応する駆動電流 が半導体光素子に送られると、多数の発光部が選択的に発光し、放射された光が 上記レンズアレイによって集束させられ、感光ドラムに送られる。[0010] The lens array is placed on the substrate so as to face the light emitting portion of the semiconductor optical device. It is fixed to. Therefore, the driving current corresponding to the data controlled by the driving semiconductor element Is sent to the semiconductor optical device, a large number of light emitting parts emit light selectively, and the emitted light is emitted. It is focused by the lens array and sent to the photosensitive drum.
【００１１】 また、各複合素子は、発光部の列方向における駆動用半導体素子の幅を半導体 光素子の幅より狭くして、駆動用半導体素子の両端面に半導体光素子の端部が張 り出すようにしてあり、各複合素子を基板上に配設した場合、駆動用半導体素子 間における接触はなく、エッジショートが発生することがない。しかも、駆動用 半導体素子を交換する場合における隣接素子間の影響をなくすことができる。[0011] In addition, each composite element corresponds to the width of the driving semiconductor element in the column direction of the light emitting portion. Make the width narrower than the width of the optical element, and the end of the semiconductor optical element should be stretched on both end faces of the driving semiconductor element. When each composite element is mounted on the substrate, the driving semiconductor element There is no contact between them and no edge short circuit occurs. Moreover, for driving It is possible to eliminate the influence between adjacent elements when the semiconductor element is replaced.
【００１２】[0012]
以下、本考案の実施例について図面を参照しながら詳細に説明する。 図１は本考案の電子写真用光書込みヘッドにおける半導体光素子の実装状態図 である。図の（ａ）は斜視図、（ｂ）は正面図、（ｃ）は平面図である。 図において、３１は駆動用半導体素子、３２は半導体光素子である。該半導体 光素子３２は、その駆動回路を有する駆動用半導体素子３１の上に絶縁層３３を 介して３次元実装されている。上記半導体光素子３２の表面には、それぞれ独立 した発光部３４が複数個形成されており、それぞれに個別接続電極３５が設けら れている。また、上記半導体光素子３２の裏面には、共通電極４１が形成されて いる。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a mounting state diagram of a semiconductor optical element in an optical writing head for electrophotography according to the present invention. Is. In the figure, (a) is a perspective view, (b) is a front view, and (c) is a plan view. In the figure, 31 is a driving semiconductor element, and 32 is a semiconductor optical element. The semiconductor The optical element 32 has the insulating layer 33 on the driving semiconductor element 31 having the driving circuit. It is three-dimensionally mounted via. The surface of the semiconductor optical device 32 is independent of each other. A plurality of light emitting parts 34 are formed, and individual connection electrodes 35 are provided in each of them. Has been. In addition, a common electrode 41 is formed on the back surface of the semiconductor optical device 32. There is.
【００１３】 一方、駆動用半導体素子３１の表面には、該駆動用半導体素子３１の入力端子 部３６を避けて絶縁層３３が形成され、さらに、絶縁層３３を介して個別接続電 極３８が形成され、それぞれ駆動用半導体素子３１上の出力端子３９とスルーホ ールを介して接続されている。また、共通電極４０は絶縁層３３上を半導体光素 子３２の裏面に設けた共通電極４１の位置から駆動用半導体素子３１の入力端子 部４４，４５まで形成されている。[0013] On the other hand, on the surface of the driving semiconductor element 31, the input terminal of the driving semiconductor element 31 is provided. The insulating layer 33 is formed so as to avoid the portion 36, and the individual connection voltage is further interposed via the insulating layer 33. A pole 38 is formed, and an output terminal 39 and a through hole on the driving semiconductor element 31 are formed. Connected via a tool. In addition, the common electrode 40 is formed on the insulating layer 33 by a semiconductor photoelement. From the position of the common electrode 41 provided on the back surface of the child 32 to the input terminal of the driving semiconductor element 31. The parts 44 and 45 are formed.
【００１４】 なお、４６は個別接続電極３５，３８間を接続するための、４７は共通電極４ ０，４１間を接続するためのはんだ材接続部である。 次に、半導体光素子３２と駆動用半導体素子３１の外形の関係について図の（ ｃ）によって説明する。 上記発光部３４の列方向における駆動用半導体素子３１の幅（Ｗｄｒ）を半導 体光素子３２の幅（Ｗｌｅｄ）以下に設定することによって、半導体光素子３２ をわずかな隙間を置いて複数個１列に並べた場合に駆動用半導体素子３１間の接 触をなくすことができる。したがって、駆動用半導体素子３１相互間の干渉がな くなる。[0014] In addition, 46 is for connecting between the individual connection electrodes 35 and 38, and 47 is the common electrode 4 It is a solder material connection portion for connecting between 0 and 41. Next, regarding the relationship between the outer shapes of the semiconductor optical device 32 and the driving semiconductor device 31, This will be explained with reference to c). The width (Wdr) of the driving semiconductor element 31 in the column direction of the light emitting portion 34 By setting the width (Wled) of the body light element 32 or less, the semiconductor light element 32 Are arranged in a line with a slight gap, the contact between the driving semiconductor elements 31 You can get rid of the touch. Therefore, there is no interference between the driving semiconductor elements 31. Become
【００１５】 次に、上記半導体光素子３２の３次元実装構造を得るための工程について述べ る。 まず、ウエハー状態の駆動用半導体素子３１にめっきなどの方法によって個別 接続電極３８及び共通電極４０にはんだ材を形成し、その後、発光部３４単位で ダイシングによって切り分ける。また、半導体光素子３２も同様の方法で個別接 続電極３５及び共通電極４１上にはんだ材を形成し、発光部３４単位でダイシン グによって切り分ける。このようにして得られた駆動用半導体素子３１及び半導 体光素子３２をアライメントし、はんだ材を形成した部分にレーザを照射し、は んだ材を溶融させて接続する。ここでは、個別接続電極３５，３８が微細な場合 を想定しているが、微細ではない場合は、印刷法によってはんだ・ペーストを供 給したり、フロー・ソルダリング法などの手段を用いてもよく、はんだ材以外の 接続法を採用することができる。[0015] Next, the steps for obtaining the three-dimensional mounting structure of the semiconductor optical device 32 will be described. It First, the driving semiconductor elements 31 in a wafer state are individually separated by a method such as plating. Solder material is formed on the connection electrode 38 and the common electrode 40, and then the light emitting unit 34 is used as a unit. Divide by dicing. Also, the semiconductor optical device 32 is individually connected by the same method. A solder material is formed on the continuation electrode 35 and the common electrode 41, and the light emitting unit 34 is used as a unit for dicing. Divide by gu. The driving semiconductor element 31 and the semiconductor thus obtained Align the body light element 32, irradiate the portion where the solder material is formed with a laser, The melted material is melted and connected. Here, when the individual connection electrodes 35 and 38 are fine However, if it is not fine, solder and paste are provided by the printing method. Or soldering method such as flow soldering method may be used. The connection method can be adopted.
【００１６】 続いて、上記半導体光素子３２を用いた電子写真用光書込みヘッドの実装構造 について説明する。 図４は本考案の電子写真用光書込みヘッドの構成図である。図の（ａ）は電子 写真用光書込みヘッドの平面図、（ｂ）は電子写真用光書込みヘッドの断面図で ある。[0016] Subsequently, a mounting structure of an optical writing head for electrophotography using the semiconductor optical device 32 Will be described. FIG. 4 is a schematic view of an optical writing head for electrophotography according to the present invention. (A) of the figure is an electron A plan view of an optical writing head for photography, (b) is a sectional view of an optical writing head for electrophotography. is there.
【００１７】 図において、３１は駆動用半導体素子、３２は半導体光素子であり、上述した 方法で接続の完了した半導体光素子３２と駆動用半導体素子３１は、発光部３４ が一列に並ぶように基板５１上に配列され、ダイ・ボンディングによって固定さ れる。その後、基板５１上に形成された配線５６と駆動用半導体素子３１の入力 端子部３６，４４，４５とを接続ワイヤ５７を用いて接続部５５で接続する。ま た、配線５６は基板５１の端部でコネクタ５３に接続され、該コネクタ５３によ って外部駆動回路に接続される。[0017] In the figure, 31 is a driving semiconductor element, 32 is a semiconductor optical element, and The semiconductor optical device 32 and the driving semiconductor device 31 which have been connected by the Are arranged on the substrate 51 so that they are aligned, and fixed by die bonding. Be done. After that, the wiring 56 formed on the substrate 51 and the input of the driving semiconductor element 31 are input. The terminal portions 36, 44 and 45 are connected by the connecting portion 55 using the connecting wire 57. Well The wiring 56 is connected to the connector 53 at the end of the substrate 51, and the connector 53 Connected to the external drive circuit.
【００１８】 ５２は上記半導体光素子３２から放射された光を感光ドラム上に結像させるた めの集束性ロッドレンズアレイであり、発光部３４にアライメントされ、基板５ １に固定されている。なお、５４はカバーである。 上記構成の電子写真用光書込みヘッドにおいて、半導体光素子３２上の発光部 ３４のＡ点から放射された光は、集束性ロッドレンズアレイ５２を通って感光ド ラム５８上の点Ｂで結像する。[0018] 52 denotes an image of the light emitted from the semiconductor optical device 32 formed on the photosensitive drum. Is a converging rod lens array for aligning the light emitting unit 34, It is fixed at 1. Reference numeral 54 is a cover. In the optical writing head for electrophotography having the above structure, the light emitting portion on the semiconductor optical device 32 Light emitted from point A of 34 passes through the converging rod lens array 52 and is exposed to light. An image is formed at a point B on the ram 58.
【００１９】 なお、本考案は上記実施例に限定されるものではなく、本考案の趣旨に基づい て種々変形することが可能であり、これらを本考案の範囲から排除するものでは ない。[0019] It should be noted that the present invention is not limited to the above embodiment, but is based on the gist of the present invention. Can be variously modified, and these are not excluded from the scope of the present invention. Absent.
【００２０】[0020]
以上詳細に説明したように、本考案によれば、多数の独立した発光部を有する 半導体光素子を駆動用半導体素子の上に絶縁層を介して３次元実装して、複合素 子を形成している。該複合素子は、上記半導体光素子の発光部が一列に並ぶよう に基板の上に複数個固定される。また、上記半導体光素子の発光部に対向させて レンズアレイを上記基板の上に固定している。 As described in detail above, according to the present invention, it has a large number of independent light emitting parts. A semiconductor optical device is three-dimensionally mounted on a driving semiconductor device via an insulating layer to form a composite device. Forming a child. In the composite element, the light emitting portions of the semiconductor optical element are arranged in a line. A plurality of substrates are fixed on the substrate. Also, facing the light emitting portion of the semiconductor optical device The lens array is fixed on the substrate.
【００２１】 したがって、ワイヤ・ボンディングが不要となり、電子写真用光書込みヘッド を小型化することができる。また、基板上において駆動用半導体素子に対してレ ンズアレイを容易にアライメントすることができるので、電子写真用光書込みヘ ッドを組み立てる際の光軸合わせが容易になる。 また、各複合素子は、発光部の列方向における駆動用半導体素子の幅を半導体 光素子の幅より狭くして、駆動用半導体素子の両端面に半導体光素子の端部が張 り出すようにしてあり、各複合素子を基板上に配設した場合、隣接する半導体光 素子をわずかな間隙をおいて配列させた場合に駆動用半導体素子間における接触 を防止することができ、エッジショートが発生することがないだけでなく、駆動 用半導体素子を交換する場合における隣接素子間の影響をなくすことができる。[0021] Therefore, wire bonding becomes unnecessary, and the optical writing head for electrophotography is used. Can be miniaturized. In addition, on the substrate, the drive semiconductor element Since the lens array can be easily aligned, optical writing for electrophotography is possible. It becomes easy to align the optical axis when assembling the head. In addition, each composite element corresponds to the width of the driving semiconductor element in the column direction of the light emitting portion. Make the width narrower than the width of the optical element, and the end of the semiconductor optical element should be stretched on both end faces of the driving semiconductor element. When each composite element is mounted on the substrate, the Contact between driving semiconductor elements when the elements are arranged with a slight gap Drive, which can prevent the occurrence of edge short circuit It is possible to eliminate the influence between adjacent elements when replacing the semiconductor element for use.
【図面の簡単な説明】[Brief description of drawings]
【図１】本考案の電子写真用光書込みヘッドにおける半
導体光素子の実装状態図である。FIG. 1 is a mounting state diagram of a semiconductor optical element in an electrophotographic optical writing head of the present invention.
【図２】従来の電子写真用光書込みヘッドにおける半導
体光素子の実装状態図である。FIG. 2 is a mounting state diagram of a semiconductor optical element in a conventional optical writing head for electrophotography.
【図３】従来の電子写真用光書込みヘッドの断面図であ
る。FIG. 3 is a sectional view of a conventional optical writing head for electrophotography.
【図４】本考案の電子写真用光書込みヘッドの構成図で
ある。FIG. 4 is a schematic view of an optical writing head for electrophotography according to the present invention.
３１ 駆動用半導体素子 ３２ 半導体光素子 ３３ 絶縁層 ３４ 発光部 ３５，３８ 個別接続電極 ５１ 基板 31 Driving semiconductor element 32 Semiconductor optical device 33 insulating layer 34 Light emitting part 35, 38 Individual connection electrodes 51 substrate
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 33/00 Ｎ 8934−4Ｍ (72)考案者 烏野 ゆたか 東京都港区虎ノ門１丁目７番12号 沖電気 工業株式会社内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification number Reference number within the agency FI technical display location H01L 33/00 N 8934-4M (72) Inventor Yutaka Karasuno 1-7 Toranomon, Minato-ku, Tokyo No. 12 Oki Electric Industry Co., Ltd.
Claims (2)
導体光素子を駆動用半導体素子の上に絶縁層を介して３
次元実装して、複合素子を形成し、 （ｂ）該複合素子を、上記半導体光素子の発光部が一列
に並ぶように基板の上に複数個固定し、 （ｃ）上記半導体光素子の発光部に対向させてレンズア
レイを上記基板の上に固定したことを特徴とする電子写
真用光書込みヘッド。1. A semiconductor optical element having a large number of independent light emitting portions is provided on a driving semiconductor element with an insulating layer interposed therebetween.
Dimensionally mounted to form a composite device, (b) a plurality of the composite devices are fixed on a substrate so that the light emitting portions of the semiconductor optical devices are aligned, and (c) the light emission of the semiconductor optical devices. An optical writing head for electrophotography, characterized in that a lens array is fixed on the above-mentioned substrate so as to be opposed to the section.
駆動用半導体素子の幅が半導体光素子の幅より狭く、隣
接する駆動用半導体素子の端面が相互に接触しないよう
に配列された請求項１記載の電子写真用光書込みヘッ
ド。2. The composite elements are arranged such that the width of the driving semiconductor element in the column direction of the light emitting portion is narrower than the width of the semiconductor optical element and the end faces of the adjacent driving semiconductor elements do not contact each other. Item 1. An optical writing head for electrophotography according to Item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP052108U JPH055462U (en) | 1991-07-05 | 1991-07-05 | Optical writing head for electrophotography |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP052108U JPH055462U (en) | 1991-07-05 | 1991-07-05 | Optical writing head for electrophotography |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH055462U true JPH055462U (en) | 1993-01-26 |
Family
ID=12905671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP052108U Pending JPH055462U (en) | 1991-07-05 | 1991-07-05 | Optical writing head for electrophotography |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH055462U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6340355A (en) * | 1986-08-05 | 1988-02-20 | Mitsubishi Electric Corp | Three-dimensional semiconductor integrated circuit |
| JPS6358879A (en) * | 1986-08-29 | 1988-03-14 | Fuji Xerox Co Ltd | Photosemiconductor element array |
| JPS6361150B2 (en) * | 1980-10-04 | 1988-11-28 |
-
1991
- 1991-07-05 JP JP052108U patent/JPH055462U/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6361150B2 (en) * | 1980-10-04 | 1988-11-28 | ||
| JPS6340355A (en) * | 1986-08-05 | 1988-02-20 | Mitsubishi Electric Corp | Three-dimensional semiconductor integrated circuit |
| JPS6358879A (en) * | 1986-08-29 | 1988-03-14 | Fuji Xerox Co Ltd | Photosemiconductor element array |
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