JPH0552443A - Underwater electronic cold heat unit and manufacture thereof - Google Patents

Underwater electronic cold heat unit and manufacture thereof

Info

Publication number
JPH0552443A
JPH0552443A JP3212172A JP21217291A JPH0552443A JP H0552443 A JPH0552443 A JP H0552443A JP 3212172 A JP3212172 A JP 3212172A JP 21217291 A JP21217291 A JP 21217291A JP H0552443 A JPH0552443 A JP H0552443A
Authority
JP
Japan
Prior art keywords
substrates
elastic member
semiconductors
insulating oil
thin tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3212172A
Other languages
Japanese (ja)
Other versions
JPH0749898B2 (en
Inventor
Tomio Ito
富男 伊藤
Masanori Kyo
正憲 許
Yoshito Tsuji
義人 辻
Hisamasu Usui
久益 臼井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KAIYO KAGAKU GIJUTSU CENTER
Original Assignee
KAIYO KAGAKU GIJUTSU CENTER
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KAIYO KAGAKU GIJUTSU CENTER filed Critical KAIYO KAGAKU GIJUTSU CENTER
Priority to JP3212172A priority Critical patent/JPH0749898B2/en
Publication of JPH0552443A publication Critical patent/JPH0552443A/en
Publication of JPH0749898B2 publication Critical patent/JPH0749898B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02ATECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A40/00Adaptation technologies in agriculture, forestry, livestock or agroalimentary production
    • Y02A40/80Adaptation technologies in agriculture, forestry, livestock or agroalimentary production in fisheries management
    • Y02A40/81Aquaculture, e.g. of fish

Landscapes

  • Farming Of Fish And Shellfish (AREA)
  • Sampling And Sample Adjustment (AREA)

Abstract

PURPOSE:To cool or heat a substance to be cooled or a substance to be heated in water or in sea water. CONSTITUTION:A number of semiconductors 2 and 3 arranged in a matrix-form state between two base sheets 6 and 7, electrodes 4 and 5 for electrically interconnecting the semiconductors 2 and 3, a resilient members 8 fixed to the peripheries of the base sheets 6 and 7, and a non-compressive insulating oil 9 with which the space surrounded with the base sheets 6 and 7 and the resilient member 8 is filled are provided. A fine tube 10 for discharge and an injection fine tube 12 are inserted in the resilient member 8 and the space surrounded with the base sheets 6 and 7 and the resilient member 8 is sealed with insulating oil 9 through the injection fine tube 12.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、水中または海中で被冷
却物または被加熱物を冷却または加熱するのに好適な水
中電子冷熱ユニットおよびその製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an underwater electronic cooling unit suitable for cooling or heating an object to be cooled or an object to be heated in water or in the sea, and a method for producing the same.

【0002】[0002]

【従来の技術】例えば、海底或いは海水中から泥、海水
等の試料を採取し、試料中に存在する微生物等の生物を
回収しようとする場合、深海では水温が低く、熱水噴出
部では温度が高く、試料の入った容器をそのまま洋上ま
で移動させると、容器内の試料の温度が変化し、試料中
の生物は死滅してしまう。そこで、従来、容器を保温材
で覆って容器内の試料の温度変化を防止していた。
2. Description of the Related Art For example, when collecting a sample of mud, seawater, etc. from the seabed or seawater to recover organisms such as microorganisms present in the sample, the water temperature is low in the deep sea and the temperature at the hot water jetting part is low. When the container containing the sample is moved to the ocean as it is, the temperature of the sample in the container changes and the organisms in the sample die. Therefore, conventionally, the container is covered with a heat insulating material to prevent the temperature change of the sample in the container.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、試料の
採取深度が深い程、試料を洋上まで移動させたときの温
度変化が大きく、保温材のみで容器内の試料の温度変化
を防止することは困難である。また、容器に冷却装置を
取り付けることが考えられるが、高圧下においては冷却
装置に高圧力が作用するため、冷却装置が大型化し実現
化は困難である。本発明は、上記問題を解決するもので
あって、水中または海中で被冷却物または被加熱物を所
定温度に冷却または加熱することができる水中電子冷熱
ユニットを提供し、また、既存の電子冷熱ユニットを簡
単な加工で高圧下の水中の使用に耐える水中電子冷熱ユ
ニットの製造方法を提供することを目的とする。
However, the deeper the sampling depth of the sample, the greater the temperature change when the sample is moved to the sea, and it is difficult to prevent the temperature change of the sample in the container only with the heat insulating material. Is. Further, it is conceivable to attach a cooling device to the container, but since high pressure acts on the cooling device under high pressure, the cooling device becomes large and difficult to realize. The present invention is to solve the above problems, and provides an underwater electronic cooling unit capable of cooling or heating an object to be cooled or an object to be heated to a predetermined temperature in water or in the sea, and the existing electronic cold heat An object of the present invention is to provide a method for manufacturing an underwater electronic cooling / heating unit that can withstand underwater use under high pressure by simple processing.

【0004】[0004]

【課題を解決するための手段】そのために本発明の水中
電子冷熱ユニット1は、2つの基板6、7の間にマトリ
ックス状に配置される多数の半導体2、3と、半導体
2、3を電気的に接続する電極4、5と、基板6、7の
周囲に固着される弾性部材8と、基板6、7および弾性
部材8で囲まれる空間内に充填される非圧縮性の絶縁油
9とを備えることを特徴とする。
To this end, the underwater electronic cooling / heating unit 1 of the present invention uses a large number of semiconductors 2 and 3 arranged in a matrix between two substrates 6 and 7, and the semiconductors 2 and 3 are electrically connected. Electrodes 4 and 5 that are electrically connected to each other, an elastic member 8 fixed around the substrates 6 and 7, and an incompressible insulating oil 9 filled in a space surrounded by the substrates 6 and 7 and the elastic member 8. It is characterized by including.

【0005】また、本発明の水中電子冷熱ユニット1の
製造方法は、2つの基板6、7の間にマトリックス状に
配置される多数の半導体2、3と、半導体2、3を電気
的に接続する電極4、5と、基板6、7の周囲に固着さ
れる弾性部材8とを備え、弾性部材8に排気用細管10
および注入細管12を差し込み、基板6、7および弾性
部材8で囲まれる空間内に注入細管12から非圧縮性の
絶縁油9を封入することを特徴とする。
Further, in the method of manufacturing the underwater electronic cooling / heating unit 1 of the present invention, a large number of semiconductors 2 and 3 arranged in a matrix between the two substrates 6 and 7 and the semiconductors 2 and 3 are electrically connected. The electrodes 4 and 5 and the elastic member 8 fixed around the substrates 6 and 7 are provided.
The injection thin tube 12 is inserted, and the incompressible insulating oil 9 is sealed from the injection thin tube 12 in the space surrounded by the substrates 6 and 7 and the elastic member 8.

【0006】なお、上記構成に付加した番号は、理解を
容易にするために図面と対比させるためのもので、これ
により本発明の構成が何ら限定されるものではない。
It should be noted that the numbers added to the above configuration are for comparison with the drawings for easy understanding, and the configuration of the present invention is not limited by this.

【0007】[0007]

【作用】本発明においては、例えば図1に示すように、
基板6、7および弾性部材8で囲まれる空間内に、絶縁
性が高くかつ非圧縮性の絶縁油9が充填されているた
め、深度が深い高圧下の水中でも十分に使用可能とな
る。また、絶縁油9の充填は、弾性部材8に排気用細管
10と絶縁油9を封入した注射器11の注入細管12を
差し込み、注射器11を押し込むことにより行われ、絶
縁油9を内部に注入すると、内部の空気は排気用細管1
0から排出され、最終的に基板6、7および弾性部材8
で囲まれる空間内に絶縁油9が充填される。
In the present invention, for example, as shown in FIG.
Since the space surrounded by the substrates 6 and 7 and the elastic member 8 is filled with the insulative oil 9 having high insulation and incompressibility, it can be sufficiently used even in water under a high pressure with a deep depth. The insulating oil 9 is filled by inserting the exhaust thin tube 10 and the injection thin tube 12 of the syringe 11 in which the insulating oil 9 is sealed into the elastic member 8 and pushing the syringe 11. When the insulating oil 9 is injected inside, , The air inside is a thin tube for exhaust 1
0, and finally the substrates 6, 7 and the elastic member 8
Insulating oil 9 is filled in the space surrounded by.

【0008】[0008]

【実施例】以下、本発明の実施例を図面を参照しつつ説
明する。図1は本発明の水中電子冷熱ユニットの1実施
例を示し、図Aは断面図、図Bは図AのB−B線に沿っ
て矢印方向から見た断面図である。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows one embodiment of the underwater electronic cooling / heating unit of the present invention, FIG. A is a sectional view, and FIG. B is a sectional view taken along the line BB of FIG.

【0009】水中電子冷熱ユニット1は、n形およびp
形の2種の半導体2、3をそれぞれ交互にマトリックス
状に配置したもので、2種の半導体2、3に電流が交互
に流れるように上部電極4および下部電極5を接合して
いる。上部電極4および下部電極5を挟着するようにセ
ラミックス製の基板6、7が固着される。基板6、7の
周囲には、ゴム等の弾性部材8が固着され、基板6、7
および弾性部材8で囲まれる空間内に、絶縁性が高くか
つ非圧縮性の絶縁油9が充填されている。この電子冷熱
ユニット1は、2種の半導体2、3に直流を流すと、一
方の電極接合部で吸熱が生じ、他方の電極接合部で放熱
が生じる。また、電流の方向を逆にすれば、吸熱部と放
熱部が入れ代わる。本発明の水中電子冷熱ユニット1
は、基板6、7および弾性部材8で囲まれる空間内に、
絶縁性が高くかつ非圧縮性の絶縁油9が充填されている
ため、深度が深い高圧下の水中でも十分に使用可能とな
る。前記絶縁油9の充填方法を図Bにより説明すると、
上部電極4および下部電極5に基板6、7を固着し、基
板6、7の周囲に弾性部材8を固着した後、弾性部材8
の任意の位置に先端が針状の排気用細管10を差し込む
と共に、排気用細管10と離れた位置に絶縁油9を封入
した注射器11の注入細管12を差し込み、注射器11
を押し込むことにより、絶縁油9を内部に注入すると、
内部の空気は排気用細管10から排出され、最終的に基
板6、7および弾性部材8で囲まれる空間内に絶縁油9
が充填される。絶縁油9の充填が終了すれば、排気用細
管10および注射器11の注入細管12を引き抜いて水
中電子冷熱ユニット1が完成する。なお、排気用細管1
0および注射器11の注入細管12を引き抜いた後の穴
は、弾性部材8の弾性力により自動的に塞がれる。
The underwater electronic cooling / heating unit 1 has an n-type and a p-type.
The two types of semiconductors 2 and 3 are alternately arranged in a matrix, and the upper electrode 4 and the lower electrode 5 are joined so that currents flow through the two types of semiconductors 2 and 3 alternately. Ceramic substrates 6 and 7 are fixed so as to sandwich the upper electrode 4 and the lower electrode 5 therebetween. An elastic member 8 such as rubber is fixed around the substrates 6 and 7,
Insulating oil 9 having high insulation and incompressibility is filled in the space surrounded by the elastic member 8. When a direct current is applied to the two types of semiconductors 2 and 3, the electronic cooling / heating unit 1 absorbs heat at one electrode joint portion and radiates heat at the other electrode joint portion. Further, if the direction of the current is reversed, the heat absorbing portion and the heat radiating portion are replaced with each other. Underwater electronic cooling / heating unit 1 of the present invention
In the space surrounded by the substrates 6 and 7 and the elastic member 8,
Since the insulating oil 9 having a high insulating property and incompressibility is filled, it can be sufficiently used even in water under a high pressure with a deep depth. A method of filling the insulating oil 9 will be described with reference to FIG.
After the substrates 6 and 7 are fixed to the upper electrode 4 and the lower electrode 5, and the elastic member 8 is fixed around the substrates 6 and 7, the elastic member 8
The exhaust thin tube 10 having a needle-like tip is inserted into an arbitrary position of the above, and the injection thin tube 12 of the syringe 11 containing the insulating oil 9 is inserted into a position apart from the exhaust thin tube 10 to insert the syringe 11
By injecting the insulating oil 9 into the inside by pushing
The air inside is discharged from the exhaust thin tube 10, and finally the insulating oil 9 is introduced into the space surrounded by the substrates 6 and 7 and the elastic member 8.
Is filled. When the filling of the insulating oil 9 is completed, the exhaust thin tube 10 and the injection thin tube 12 of the syringe 11 are pulled out, and the underwater electronic cooling / heating unit 1 is completed. Note that the exhaust thin tube 1
0 and the hole of the syringe 11 after the injection thin tube 12 is pulled out is automatically closed by the elastic force of the elastic member 8.

【0010】図2は上記水中電子冷熱ユニット1の使用
例を示している。潜水船13には、載置用架台14が設
けられ、この載置用架台14に試料容器15が載置され
る。試料容器15は耐圧容器16と、耐圧容器16の周
囲を覆う保温材17と、耐圧容器16内に試料を挿入す
るための開閉弁18とからなり、耐圧容器16の外壁に
前記水中電子冷熱ユニット1およびサーモスタット19
が配設され、水中電子冷熱ユニット1およびサーモスタ
ット19は、潜水船13内に設けられた電源制御装置2
0に接続されている。なお、21は海面、22は海底を
示している。
FIG. 2 shows an example of use of the underwater electronic cooling / heating unit 1. The submersible 13 is provided with a mounting base 14, and a sample container 15 is mounted on the mounting base 14. The sample container 15 is composed of a pressure-resistant container 16, a heat insulating material 17 covering the periphery of the pressure-resistant container 16, and an opening / closing valve 18 for inserting a sample into the pressure-resistant container 16. 1 and thermostat 19
The submersible electronic cooling / heating unit 1 and the thermostat 19 are installed in the submersible 13.
It is connected to 0. In addition, 21 is the sea surface and 22 is the seabed.

【0011】そして、潜水船13に取付けられているマ
ニピュレータ(図示せず)により開閉弁18を開き、海
水或いは泥等の試料23を耐圧容器16内に挿入、採取
した後、開閉弁18を閉じる。同時に電源制御装置20
から水中電子冷熱ユニット1に直流を流すと、電流の方
向により一方の電極接合部で吸熱が生じ、他方の電極接
合部で放熱が生じ、耐圧容器16を冷却または加熱する
ことができる。このとき、サーモスタット19の信号に
より電源制御装置20において電流を制御することによ
り、耐圧容器16内の試料23を所定温度に維持するこ
とができる。試料容器15は、そのまま洋上まで移動さ
せるか、潜水船13内の冷蔵室または温蔵室に貯蔵され
る。
Then, the on-off valve 18 is opened by a manipulator (not shown) attached to the submersible 13, and the sample 23 such as seawater or mud is inserted into the pressure vessel 16 and collected, and then the on-off valve 18 is closed. .. At the same time, the power supply control device 20
When a direct current is caused to flow from the underwater electronic cooling unit 1 to the underwater electronic cooling unit 1, heat is absorbed at one electrode joint portion and heat is generated at the other electrode joint portion depending on the direction of the current, and the pressure vessel 16 can be cooled or heated. At this time, by controlling the current in the power supply control device 20 by the signal of the thermostat 19, the sample 23 in the pressure vessel 16 can be maintained at a predetermined temperature. The sample container 15 is moved to the ocean as it is, or is stored in a refrigerating room or a warming room in the submersible 13.

【0012】[0012]

【発明の効果】以上の説明から明らかなように本発明に
よれば、2つの基板の間にマトリックス状に配置される
多数の半導体と、これら半導体を電気的に接続する電極
と、前記2つの基板の周囲に固着される弾性部材と、前
記2つの基板および弾性部材で囲まれる空間内に充填さ
れる非圧縮性の絶縁油とを備える構成のため、深度が深
い高圧下の水中でも十分に使用可能となり、水中または
海中で被冷却物または被加熱物を所定温度に冷却または
加熱することができる。
As is apparent from the above description, according to the present invention, a large number of semiconductors arranged in a matrix between two substrates, electrodes for electrically connecting these semiconductors, and the two Since the elastic member fixed around the substrate and the incompressible insulating oil filled in the space surrounded by the two substrates and the elastic member are provided, it is sufficiently deep in water under high pressure. It becomes usable, and the object to be cooled or the object to be heated can be cooled or heated to a predetermined temperature in water or sea.

【0013】また、弾性部材に排気用細管および注入細
管を差し込み、前記2つの基板および弾性部材で囲まれ
る空間内に前記注入細管から非圧縮性の絶縁油を封入す
るようにしたため、既存の電子冷熱ユニットを簡単な加
工で高圧下の水中の使用に耐える水中電子冷熱ユニット
を提供することができる。
Further, the exhaust thin tube and the injection thin tube are inserted into the elastic member, and the incompressible insulating oil is sealed from the injection thin tube in the space surrounded by the two substrates and the elastic member. It is possible to provide an underwater electronic cooling / heating unit that withstands use in water under high pressure by simple processing of the cooling / heating unit.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の水中電子冷熱ユニットの1実施例を示
し、図Aは断面図、図Bは図AのB−B線に沿って矢印
方向から見た断面図
1 shows an embodiment of an underwater electronic cooling and heating unit of the present invention, FIG. A is a sectional view, and FIG. B is a sectional view taken along the line BB of FIG.

【図2】水中電子冷熱ユニットの使用例を示す断面図FIG. 2 is a sectional view showing an example of using an underwater electronic cooling / heating unit.

【符号の説明】[Explanation of symbols]

1…水中電子冷熱ユニット、2、3…半導体、4、5…
電極、6、7…基板 8…弾性部材、9…絶縁油、10…排気用細管、11…
注射器 12…注入細管
1 ... Underwater electronic cooling / heating unit, 2, 3 ... Semiconductor, 4, 5 ...
Electrodes 6, 7 ... Substrate 8 ... Elastic member, 9 ... Insulating oil, 10 ... Exhaust thin tube, 11 ...
Syringe 12 ... Injection capillary

───────────────────────────────────────────────────── フロントページの続き (72)発明者 臼井 久益 神奈川県横須賀市夏島町2番地15 海洋科 学技術センター内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hisasu Usui 2-2 Natsushima-cho, Yokosuka City, Kanagawa Prefecture Ocean Science and Technology Center

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】2つの基板の間にマトリックス状に配置さ
れる多数の半導体と、これら半導体を電気的に接続する
電極と、前記2つの基板の周囲に固着される弾性部材
と、前記2つの基板および弾性部材で囲まれる空間内に
充填される非圧縮性の絶縁油とを備えることを特徴とす
る水中電子冷熱ユニット。
1. A large number of semiconductors arranged in a matrix between two substrates, electrodes for electrically connecting these semiconductors, elastic members fixed around the two substrates, and two of the two substrates. An in-water electronic cooling / heating unit, comprising: an incompressible insulating oil filled in a space surrounded by a substrate and an elastic member.
【請求項2】2つの基板の間にマトリックス状に配置さ
れる多数の半導体と、これら半導体を電気的に接続する
電極と、前記2つの基板の周囲に固着される弾性部材と
を備え、該弾性部材に排気用細管および注入細管を差し
込み、前記2つの基板および弾性部材で囲まれる空間内
に前記注入細管から非圧縮性の絶縁油を封入することを
特徴とする水中電子冷熱ユニットの製造方法。
2. A plurality of semiconductors arranged in a matrix between two substrates, electrodes for electrically connecting these semiconductors, and an elastic member fixed around the two substrates, A method for manufacturing an underwater electronic cooling / heating unit, characterized in that an exhaust thin tube and an injection thin tube are inserted into an elastic member, and incompressible insulating oil is sealed from the injection thin tube in a space surrounded by the two substrates and the elastic member. ..
JP3212172A 1991-08-23 1991-08-23 Underwater electronic cooling / heating unit and method for manufacturing the same Expired - Fee Related JPH0749898B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3212172A JPH0749898B2 (en) 1991-08-23 1991-08-23 Underwater electronic cooling / heating unit and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3212172A JPH0749898B2 (en) 1991-08-23 1991-08-23 Underwater electronic cooling / heating unit and method for manufacturing the same

Publications (2)

Publication Number Publication Date
JPH0552443A true JPH0552443A (en) 1993-03-02
JPH0749898B2 JPH0749898B2 (en) 1995-05-31

Family

ID=16618102

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3212172A Expired - Fee Related JPH0749898B2 (en) 1991-08-23 1991-08-23 Underwater electronic cooling / heating unit and method for manufacturing the same

Country Status (1)

Country Link
JP (1) JPH0749898B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09321354A (en) * 1996-05-28 1997-12-12 Matsushita Electric Works Ltd Metal pattern plate
US9863463B2 (en) 2012-05-25 2018-01-09 Kabushiki Kaisha Somic Ishikawa Ball joint

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09321354A (en) * 1996-05-28 1997-12-12 Matsushita Electric Works Ltd Metal pattern plate
US9863463B2 (en) 2012-05-25 2018-01-09 Kabushiki Kaisha Somic Ishikawa Ball joint

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JPH0749898B2 (en) 1995-05-31

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