JPH0552016B2 - - Google Patents
Info
- Publication number
- JPH0552016B2 JPH0552016B2 JP17144681A JP17144681A JPH0552016B2 JP H0552016 B2 JPH0552016 B2 JP H0552016B2 JP 17144681 A JP17144681 A JP 17144681A JP 17144681 A JP17144681 A JP 17144681A JP H0552016 B2 JPH0552016 B2 JP H0552016B2
- Authority
- JP
- Japan
- Prior art keywords
- output ring
- anode seal
- anode
- magnetron
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005219 brazing Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 10
- 230000007547 defect Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005304 joining Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J23/00—Details of transit-time tubes of the types covered by group H01J25/00
Landscapes
- Microwave Tubes (AREA)
Description
【発明の詳細な説明】
本発明は、出力リングとアノードシールとの接
合部ろう付けが完全に行なわれ、電波漏洩不良が
発生しないようにしたマグネトロンに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a magnetron in which the joint between an output ring and an anode seal is completely brazed to prevent radio wave leakage defects.
第１図はマグネトロンの構造例を示し、１は出
力リング、３はアノードシール、４はセラミツク
円筒、５はガスケツト、６はアンテナのキヤツ
プ、７は陽極円筒である。陽極円筒７と端部で真
空気密に封着されたアノードシール３に、出力リ
ング１がろう付けにより接合され、このリング１
はガスケツト５を介して、図示してない導波栄壁
に接続される。 FIG. 1 shows an example of the structure of a magnetron, where 1 is an output ring, 3 is an anode seal, 4 is a ceramic cylinder, 5 is a gasket, 6 is an antenna cap, and 7 is an anode cylinder. An output ring 1 is joined by brazing to an anode seal 3 which is vacuum-tightly sealed at the end of the anode cylinder 7.
is connected to a waveguide wall (not shown) via a gasket 5.
出力リング１とアノードシール３との接合は、
従来は、第２図に示す様に、リング１とアノード
シール３の接合個所の上に、ろうリング２をセツ
トして融解させることにより、ろう付け接合して
いた。しかし、この様な従来の方法では、ろうが
接合個所全部に行渡らないろう流れ不完全不良
や、時にはろうリングのセツト忘れ不良まで発生
し、その結果この部分から高周波電力が漏洩する
不良品が生じていた。従来は電波漏洩不良の発生
を防ぐため、ろう流れが悪くても全接合部にろう
が行渡るように、ろうリング２のろうの量を多目
にするなどしていた。この様にしてもまだ不良発
生を絶滅できないので、この個所の全数検査工程
を設けなければならないという問題があつた。 The connection between the output ring 1 and the anode seal 3 is as follows:
Conventionally, as shown in FIG. 2, a solder ring 2 was set and melted on the joint between the ring 1 and the anode seal 3 to achieve brazing joint. However, with these conventional methods, failures occur such as incomplete solder flow, where the solder does not reach all the joints, and failures in which the solder rings are sometimes forgotten to be set.As a result, high-frequency power leaks from these parts, resulting in defective products. It was happening. Conventionally, in order to prevent the occurrence of radio wave leakage defects, the amount of solder in the solder ring 2 was increased so that the solder would spread to all joints even if the solder flow was poor. Even with this method, it is still not possible to eliminate the occurrence of defects, so there is a problem in that a 100% inspection process must be established for this location.
本発明の目的は上記の様な問題のない、出力リ
ングがアノードシールに完全に接合した電波漏洩
のないマグネトロンを提供することにある。 SUMMARY OF THE INVENTION An object of the present invention is to provide a magnetron in which the output ring is completely joined to the anode seal and there is no radio wave leakage, which is free from the above-mentioned problems.
上記目的を達成するために本発明においては、
出力リングをあらかじめ、めつき作業により、ろ
う材たとえばCu＋Agで被覆したのち、アノード
シールに嵌合させ、この被覆ろう材を融解させて
ろう付けするようにした。この場合、ろう材成分
はいわゆるろう材として市販されているものにこ
だわる必要はない。 In order to achieve the above object, in the present invention,
The output ring was coated in advance with a brazing material such as Cu+Ag by plating, then fitted onto the anode seal, and the coated brazing material was melted and brazed. In this case, the brazing material component need not be limited to what is commercially available as a so-called brazing material.
第３図は本発明実施例の出力リング１とアノー
ドシール３との接合部を示し、８はめつき作業に
より被覆させたろう材層である。この図ではよく
わかるようにろう材層８の厚さを誇張して示して
いるが、実際には薄くて差支えない。第２図に示
した従来の場合と異なり、本発明の実施例では、
あらかじめ、ろう材が出力リングのアノードシー
ルとの全接合部表面にまんべんなく行渡つている
から、めつきずみ出力リングをアノードシールに
強制嵌合させるようにすれば、ろう材重量を従来
のリング状の場合よりも低減しても完全な接合が
できる。出力リングの材質ならびにめつきするろ
う材の材質によつては、接合作業時に、ろう材だ
けでなく、ろう材と出力リング母材との合金が生
ずることもある。本発明ではめつき作業という工
程が増加する代りに、ろうリングのセツト忘れな
どの作業ミスが確実に防止され、ろうリングのセ
ツト工程は不要となり、更に接合不良が激減して
接合部の全数検査工程が不要となるなど、量産時
確実に原価が低減される。 FIG. 3 shows the joint between the output ring 1 and the anode seal 3 according to the embodiment of the present invention, and 8 is a brazing material layer covered by a plating operation. Although the thickness of the brazing filler metal layer 8 is exaggerated in this figure for better understanding, it may actually be thin. Unlike the conventional case shown in FIG. 2, in the embodiment of the present invention,
Since the brazing filler metal is evenly distributed over the entire joint surface of the output ring and the anode seal, by forcibly fitting the output ring to the anode seal, the weight of the filler metal can be reduced compared to the conventional ring shape. Perfect bonding can be achieved even with a reduction compared to the case of . Depending on the material of the output ring and the material of the brazing material to be plated, an alloy of not only the brazing material but also the brazing material and the output ring base material may be formed during the joining operation. In the present invention, although the process of plating work is increased, work errors such as forgetting to set the solder ring are reliably prevented, the process of setting the solder ring is no longer necessary, and the number of joint defects is drastically reduced, making it possible to inspect all joints. Costs are definitely reduced during mass production, such as by eliminating the need for processes.
以上説明したように本発明によれば、電波漏洩
のない均一な品質の製品が高歩留で、かつ低原価
で生産できる。 As explained above, according to the present invention, products of uniform quality without radio wave leakage can be produced at high yield and at low cost.
第１図はマグネトロン構造例図、第２図は出力
リングとアノードシールとの従来の接合作業の説
明図、第３図は本発明実施例の出力リングとアノ
ードシールとの接合部を示す図である。
１……出力リング、３……アノードシール、５
……ガスケツト、８……めつき作業により被覆さ
せたろう材層。
Fig. 1 is a diagram showing an example of the structure of a magnetron, Fig. 2 is an explanatory diagram of a conventional joining operation between an output ring and an anode seal, and Fig. 3 is a diagram showing a joint part between an output ring and an anode seal in an embodiment of the present invention. be. 1... Output ring, 3... Anode seal, 5
... Gasket, 8 ... Brazing material layer covered by plating work.
Claims (1)
部回路に接続する出力リングとアノードシールと
を接合するマグネトロンの製造方法において、前
記出力リングの全面をCu＋Ag材からなるろう材
で被覆したのち、前記アノードシールとの接合部
に強制嵌合させ、前記ろう材またはろう材と前記
出力リング母材の一部を融解、固化させて前記出
力リングと前記アノードシールとを電気的に短絡
せしめることを特徴とするマグネトロンの製造方
法。1. In a method for manufacturing a magnetron in which an output ring and an anode seal are bonded together to connect the anode of the magnetron to an external circuit via a gasket, the entire surface of the output ring is coated with a brazing material made of Cu+Ag material, and then the anode seal and the anode seal are bonded together. The magnetron is forcibly fitted into a joint portion of the output ring, and a portion of the brazing filler metal or the brazing filler metal and the output ring base material is melted and solidified to electrically short-circuit the output ring and the anode seal. manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17144681A JPS5873942A (en) | 1981-10-28 | 1981-10-28 | Magnetron |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17144681A JPS5873942A (en) | 1981-10-28 | 1981-10-28 | Magnetron |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5873942A JPS5873942A (en) | 1983-05-04 |
| JPH0552016B2 true JPH0552016B2 (en) | 1993-08-04 |
Family
ID=15923254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17144681A Granted JPS5873942A (en) | 1981-10-28 | 1981-10-28 | Magnetron |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5873942A (en) |
-
1981
- 1981-10-28 JP JP17144681A patent/JPS5873942A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5873942A (en) | 1983-05-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5143590A (en) | Method of manufacturing sputtering target assembly | |
| EP0500031A1 (en) | Method of manufacturing a sputtering target | |
| US6533161B1 (en) | Process for producing a gas-tight soldered joint and use of the process in the production of components with a vacuum-tight casing | |
| JPH0552016B2 (en) | ||
| KR100824901B1 (en) | Metal-ceramic assembly and vacuum switch unit using the same | |
| US5250782A (en) | Method for the closing, by laser, of electronic circuit packages, notably hybrid circuit packages, minimizing mechanical stresses | |
| US3932227A (en) | Electroformed hermetic glass-metal seal | |
| JPH1058188A (en) | Brazing filler metal and endhat provided with the same | |
| CN110000442A (en) | A kind of method of the silver-plated welding substitution silver-based solder soldering of copper part | |
| KR830002575B1 (en) | Manufacturing method of hermetic terminal | |
| JPS6086838A (en) | Semiconductor device | |
| JPS606544B2 (en) | Manufacturing method for airtight terminals | |
| JP2001068575A (en) | Seal ring for semiconductor device and method of manufacturing semiconductor device using the same | |
| JPH01102822A (en) | Manufacture of vacuum valve | |
| JPH0226405A (en) | Cylinder-type crystal resonator | |
| CN119421364A (en) | A high-density metal packaged radio frequency component and assembly method thereof | |
| RU1807042C (en) | Method for joining ceramics with metal | |
| JPS5875735A (en) | Mesh electrode and manufacture thereof | |
| CN117718696A (en) | Manned spacecraft analog circuit tube holder packaging shell and its soldering process | |
| JPH07202449A (en) | Airtight sealing for ceramic wiring board | |
| KR200392169Y1 (en) | Welding structure of a chipset for electronic parts | |
| JPH0495333A (en) | magnetron | |
| SU1103306A1 (en) | Process for manufacturing rectifying cells | |
| JPS60135504A (en) | Sintered composite body | |
| JPS627155B2 (en) |