JPH0551529A - Resin composition for reflow soldering - Google Patents

Abstract

PURPOSE:To obtain the title composition excellent in rigidity at high temperature, very excellent in resistance to blistering, and used for forming a housing, etc., when reflow soldering is performed on, e.g. electronic parts adaptable to the surface mounting technique (SMT). CONSTITUTION:The title composition consists of 50-94wt.% nylon 4, 6 (A) (e.g. polytetramethyleneadipamide); 5-49wt.% amorphous polyamide resin (B); 1-20wt.% olefin polymer (C) containing functional groups; and an inorganic filler (D) in an amount of 20-200 pts.wt. based on 100 pts.wt. total of components A, B and C.

Description

Detailed Description of the Invention

[0001]

The present invention relates to (A) polytetramethylene adipamide (hereinafter referred to as nylon 4, 6),
The present invention relates to a resin composition for reflow comprising an amorphous polyamide resin (B), a functional group-containing olefin polymer (C), and an inorganic filler (D). That is, the present invention relates to a resin composition for reflow which is useful for forming a housing of an electric / electronic component compatible with surface mounting technology (SMT) which is soldered on a substrate by irradiation with infrared rays or heating with high temperature air or nitrogen gas.

[0002]

2. Description of the Related Art Nylon 4 and 6 are already known polyamides and are known to be resins having excellent properties as engineering plastics, particularly excellent heat resistance. In general, polyamide resins have excellent mechanical properties such as strength, impact resistance, and abrasion resistance, and have high heat resistance and chemical resistance, and because they have good moldability, they are used for automobile parts and electrical parts. It is used in various applications such as general machine parts. Among them, nylon 4 and 6 are
It has excellent heat resistance as indicated by its high melting point, has a short molding cycle due to its high crystallization rate, and has good flowability during molding due to its low melt viscosity. As described above, nylons 4 and 6 are excellent in chemical resistance of polyamide, and also excellent in heat resistance and moldability, and thus are expected to be applied as engineering plastics from various fields.

Conventionally, as a method of fixing an electronic component on a printed wiring board, a method of inserting a terminal of the electronic component into a through hole of the printed wiring board and then dipping the printed wiring board in a solder bath has been used. Came. However, in this method, if the mounting density of electronic components is increased, the line may be short-circuited in the printed wiring board, and there is a limit to increase the mounting density of electronic components. In recent years, with the miniaturization and weight reduction of equipment and devices in the electric and electronic fields, it has been required to further increase the mounting density of electronic components. Therefore, it is necessary to further increase the mounting density of electronic components on a printed wiring board. Came out. As a method to increase the mounting density of electronic components on the printed wiring board, place the electronic components on the printed wiring board that has been soldered in advance to the electronic component fixing part of the circuit and heat with infrared or high temperature air or nitrogen gas. Has adopted a method of soldering electronic components on a substrate. This method is generally called infrared reflow (heating by irradiation of far infrared rays or near infrared rays) and air reflow (heating by high temperature air or nitrogen gas).

However, when the electronic parts are mounted by the above reflow method, infrared rays are emitted from the upper part or both the upper part and the lower part of the printed wiring board on which the electronic parts are mounted, or high temperature air or nitrogen gas is emitted. Since it is heated by circulation, it has often been difficult to say that the resin forming the housing of an electronic component that has been conventionally used has sufficient heat resistance. Specifically, in the case of infrared reflow, it is not possible to set the temperature high enough to quickly solder the electronic components onto the board, or the resin discolors in the case of infrared reflow or air reflow. In many cases, there were problems such as blistering and swelling. Therefore, when soldering by reflow is applied to electric / electronic parts that are compatible with surface mount technology (SMT), there is a risk that the resin forming the housing and the like may occur during reflow while maintaining the rigidity at high temperature. It was necessary to improve resistance to a certain discoloration or swelling (hereinafter referred to as blister resistance).

[0005]

SUMMARY OF THE INVENTION In view of such circumstances, an object of the present invention relates to a resin for forming a housing or the like when soldering by reflow soldering to electric / electronic parts compatible with surface mounting technology (SMT). Another object of the present invention is to provide a resin composition for reflow which has excellent rigidity at high temperatures and extremely excellent blister resistance.

[0006]

Means for Solving the Problems As a result of intensive studies conducted by the present inventors for such purposes, the constituent components (A) nylon 4,6 resin, (B) amorphous polyamide resin of the present invention,
It has been found that the resin composition for reflow comprising (C) a functional group-containing olefin polymer and (D) an inorganic filler solves the above problems and satisfies the object of the present invention, and has arrived at the present invention. is there. That is, the present invention relates to (A) polytetramethylene adipamide 50 to 94% by weight of claim 1, (B) amorphous polyamide resin 5 to 49% by weight,
(C) 1 to 20% by weight of a functional group-containing olefin polymer, and (D) 20 to 200 parts by weight of an inorganic filler, based on 100 parts by weight of the total amount of (A) to (C), a reflow resin. It relates to a composition. Hereinafter, the present invention will be described according to constituent elements.

(A) Nylon 4,6 Nylon 4,6 used in the present invention is a conventionally used polyamide, that is, polycaproamide (nylon 6), polylauryl lactam, polyhexamethylene adipamide ( Nylon 6,6), polyhexamethylene azeramide (nylon 6,9), polyhexamethylene sebacamide (nylon 6,10), polyundecamethylene adipamide (nylon 6,11), polyhexamethylene dodecamide (Nylon 6,12), polyundecane amide (nylon 11), polydodecane amide (nylon 1)
2) and has a higher melting point than polyamides represented by these copolyamides and mixed polyamides. That is, the melting point of nylon 4,6 is about 295 ° C., which is higher than that of nylon 6,6 by about 30 ° C., for example.
As described above, since nylons 4 and 6 used in the present invention have higher melting points than conventionally used polyamides, surface mount technology (SMT) compatible reflow electric
It can be said that it is the most suitable polyamide for use as a housing for electronic parts.

The nylons 4 and 6 used in the present invention include
It includes a polytetramethylene adipamide obtained from tetramethylene diamine and adipic acid and a copolyamide having a polytetramethylene adipamide unit as a main constituent. Further, other polyamide may be contained as a mixed component within a range that does not impair the properties of nylons 4 and 6.
The copolymerization component is not particularly limited, and a known amide-forming component can be used. Typical examples of the copolymerization component include amino acids such as 6-aminocaproic acid, 11-aminoundecanoic acid, 12-aminoundecanoic acid and para-aminomethylbenzoic acid, lactams such as ε-caprolactam and ω-lauryllactam, and hexamethylene. Diamine,
Undecamethylenediamine, dodecamethylenediamine,
2,2,4- / 2,4,4-trimethylhexamethylenediamine, 5-methylnonamethylenediamine, metaxylylenediamine, paraxylylenediamine, 1,3-bis (aminomethyl) cyclohexane, 1,4- Bis (aminomethyl) cyclohexane, 1-amino-3-aminomethyl-3,5,5-trimethylcyclohexane, bis (3-methyl-4-aminocyclohexyl) methane,
2,2-bis (4-aminocyclohexyl) propane,
Diamines such as 2,2-bis (aminoprosyl) piperazine and aminoethylpiperazine and adipic acid, suberic acid, azelaic acid, sebacic acid, dodecanedioic acid, terephthalic acid, isophthalic acid, 2-chloroterephthalic acid, 2-
Dicarboxylic acids such as methyl terephthalic acid, 5-methyl isophthalic acid, 5-sodium sulfoisophthalic acid, hexahydroterephthalic acid, hexahydroisophthalic acid and diglycolic acid can be mentioned, and other polyamides used as a mixed component Can include those composed of these components.

Nylon 4,6 used in the present invention
The manufacturing method of is arbitrary. For example, JP-A-56-1494
30, JP-A-56-149431, JP-A-58-83029 and JP-A-61-43631.
The method disclosed in Japanese Unexamined Patent Publication (KOKAI) No. 6-96, that is, a prepolymer having a small number of cyclic end groups is first produced under specific conditions, and then solid-state polymerized in a steam atmosphere to produce high-viscosity nylon 4,6.
Or a method of obtaining it by heating in a polar organic solvent such as 2-pyrrolidone or N-methylpyrrolidone. The degree of polymerization of nylons 4 and 6 is not particularly limited, but nylon 46 having a relative viscosity in the range of 2.0 to 6.0 at 25 ° C and 96% sulfuric acid at 1 g / dl is preferably used. The amount of nylon 4,6 added in the present invention is 50 to 94% by weight, preferably 55 to 90% by weight, and more preferably 60 to 80% by weight. If the amount of nylon 4,6 added is less than 50% by weight, the rigidity at high temperature will be poor, and if it exceeds 94% by weight, blister resistance will be a problem.

(B) Amorphous Polyamide Resin The amorphous polyamide resin used in the present invention is obtained from diamine, aromatic dicarboxylic acid and other aliphatic copolymerization component, and alicyclic diammine may be used. It is possible. As typical examples of the alicyclic diamine, 1,3-diaminocyclohexane, 1,4-diaminocyclohexane, 1,3-bis (aminomethyl) cyclohexane,
1,4-bis (aminomethyl) cyclohexane, isophoronediamine, piperazine, 2,5-dimethylpiperazine, bis (4-aminocyclohexyl) methane, bis (4-aminocyclohexyl) propane, 4,4′-diamino-3, 3'-dimethylcyclohexylmethane,
4,4'-diamino-3,3'-dimethylcyclohexylpropane, 4,4'-diamino-3,3'-dimethyl-5,5'-dimethylcyclohexylmethane, 4,4 '
-Diamino-3,3'-dimethyl-5,5'-dimethylcyclohexylpropane, bis (4-amino-3-methyl-5-ethylcyclohexyl) methane, bis (4-amino-3-methyl-5-ethylcyclohexyl) ) Propane, bis (4-amino-3,5-diethylcyclohexyl) methane, bis (4-amino-3,5-diethylcyclohexyl) propane, bis (4-amino-3-methyl-5-isopropylcyclohexyl) methane, Screw (4
-Amino-3-methyl-5-isopropylcyclohexyl) propane, bis (4-amino-3,5-diisopropylcyclohexyl) methane, bis (4-amino-3,
5-diisopropylcyclohexyl) propane, bis (4-amino-3-ethylcyclohexyl) methane, bis (4-amino-3-ethylcyclohexyl) propane, bis (4-amino-3-isopropylcyclohexyl) methane, bis (4- Amino-3-isopropylcyclohexyl) propane, α-α′-bis (4-aminocyclohexyl) -p-diisopropylbenzene, α-
α'-bis (4-aminocyclohexyl) -m-diisopropylbenzene, α-α'-bis (4-aminocyclohexyl) -1,4-cyclohexane, α-α'-bis (4-aminocyclohexyl) -1, Preferred examples include those derived from an aliphatic alkylenediamine having a cyclohexane ring such as 3-cyclohexane.

Typical examples of the aromatic dicarboxylic acid which constitutes the amorphous polyamide resin include isophthalic acid, terephthalic acid, naphthalene dicarboxylic acid, and a mixture thereof, and particularly isophthalic acid, or ,
A mixture of isophthalic acid and terephthalic acid is preferably used. As a typical example of the other aliphatic copolymerization component constituting the amorphous polyamide resin, 6-aminocaproic acid,
Amino acids such as 11-aminoundecanoic acid, ε-caprolactam, lactams having 4 to 12 carbon atoms such as ω-lauryllactam, tetramethylenediamine, hexamethylenediamine, undecamethylenediamine, dodecamethylenediamine, 2,2 , 4-trimethylhexamethylenediamine, 2,4,4-trimethylhexamethylenediamine, 5-methylnonamethylenediamine, 1,
Linear and branched aliphatic diamines having 2 to 18 carbon atoms, such as 3-bis (aminomethyl) cyclohexane, 1,4-bis (aminomethyl) cyclohexane,
Adipic acid, suberic acid, azelaic acid, sebacic acid,
Examples thereof include aliphatic dicarboxylic acids such as dodecanedioic acid.

To obtain good physical properties, the relative viscosity of the amorphous polyamide resin (1% by weight of the amorphous polyamide resin is
(Measured at 20 ° C. using a meta-cresol solution)
It is desirable to be in the range of 5.0. In order to adjust the relative viscosity of the amorphous polyamide resin, it is possible to add a known monofunctional amine or carboxylic acid at the time of polymerization. The amorphous polyamide resin thus obtained has no melting point and is transparent. The addition amount of the amorphous polyamide resin in the present invention is 5 to 49% by weight, preferably 11
˜45 wt%, more preferably 15-39 wt%. If the amount of the amorphous polyamide resin added is less than 5% by weight, the blister resistance will be problematic, and if it exceeds 49% by weight, the rigidity at high temperatures will be poor.

(C) Functional Group-Containing Olefin Polymer The functional group-containing olefin polymer used in the present invention is used as a compatibilizing agent for the constituent components (A) and (B) of the present invention. This functional group-containing olefin polymer is a binary or multi-component polymer mainly composed of an olefin unit and an unsaturated compound unit having at least one functional group selected from a carboxyl group, an acid anhydride group, an oxazoline group and an epoxy group. Is a copolymer of. Representative examples of olefins in the above copolymer include ethylene, propylene, butene,
Pentene, hexene, heptene, methylbutene, methylpentene and the like can be mentioned, with ethylene and propylene being preferred.

Representative examples of the carboxyl group-containing unsaturated compound in the above copolymer include acrylic acid, methacrylic acid, maleic acid, and the like, and typical examples of the acid anhydride group-containing unsaturated compound are anhydrous. There are maleic acid, itaconic anhydride, etc., representative examples of the oxazoline group-containing unsaturated compound include vinyl oxazoline, etc., and representative examples of the epoxy group-containing unsaturated compound include glycidyl methacrylate and allyl glycidyl ether. is there. Examples of the functional group preferably used in the present invention include an acid anhydride group and an epoxy group. Also,
With respect to the above copolymer, for example, containing a vinyl compound in the main chain, or by graft polymerization as a side chain,
It has the effects of increasing the heat resistance of the functional group-containing olefin polymer used in the present invention and further improving the compatibility with other components in the composition, which is preferable for the purpose of the present invention.

The addition amount of the functional group-containing olefin polymer in the present invention is 1 to 20% by weight, preferably 2 to
It is 15% by weight, more preferably 3 to 10% by weight.
If the addition amount of the functional group-containing olefin polymer is less than 1% by weight, the blister resistance is inferior because the compatibility state of the constituents (A) and (B) of the present invention is insufficient, and exceeds 20% by weight. And it causes problems in rigidity at high temperatures.

(D) Inorganic Filler The inorganic filler used in the present invention is various fillers having a fibrous shape, a powdery shape, a granular shape, a plate shape, a needle shape, a cloth shape, and a mat shape. Typical examples of such inorganic fillers include glass fiber, asbestos fiber, carbon fiber, graphite fiber, calcium carbonate, talc, catalbot, wollastonite, silica, alumina, silica-alumina, diatomaceous earth, clay and calcined clay. , Kaolin, mica (fine mica), granular glass, glass flakes, glass balloons (hollow glass), gypsum, red iron oxide, metal fibers, titanium dioxide, potassium titanate whiskers, magnesium oxide, calcium silicate, asbestos, sodium aluminate , Calcium aluminate, aluminum, aluminum oxide, aluminum hydroxide, copper, stainless steel, zinc oxide, metal whiskers and the like. For the purpose of the present invention, glass fiber, carbon fiber, kaolin, mica, and talc are preferable, and glass fiber, kaolin, mica, and talc are particularly preferable because of their economical efficiency. It may be surface-treated as long as it does not impair the moldability and physical properties of the present invention, and among them, those subjected to surface treatment represented by aminosilane treatment, acrylsilane treatment, vinyl treatment and the like are preferable.

In the present invention, it is of course possible to use only one kind of the above-mentioned inorganic fillers, but it is also possible to use two or more kinds in combination, and in particular, from the viewpoint of improving the blister resistance, glass fiber and A combination of two or more kinds of fibrous inorganic fillers typified by carbon fibers and inorganic fillers generally called non-fibrous inorganic fillers typified by kaolin, mica, talc, etc. preferable. However,
Regarding the above-mentioned non-fibrous inorganic filler, preferably, a non-fibrous inorganic filler having an aspect ratio represented by the ratio of the average diameter to the thickness of 50 or less and an average diameter of 0.01 to 50 μm is used. And, the blister resistance is remarkably improved.
The addition amount of the inorganic filler in the present invention is 20 to 100 parts by weight of the total amount of the constituent components (A) to (C) of the present invention.
The amount is 200 parts by weight, preferably 30 to 180 parts by weight, more preferably 40 to 150 parts by weight. If the addition amount of the inorganic filler is less than 20 parts by weight, the rigidity at high temperature is poor, and if it exceeds 200 parts by weight, problems occur in processability, particularly extrusion moldability and injection moldability.

Further, in the reflow resin composition of the present invention, other polymers such as polyptadiene (PB) and polyethylene (P
E), ethylene-propylene copolymer (EP and EP
DM), butadiene-styrene copolymer, styrene-ethylene-butadiene-styrene copolymer (SEBS),
Aryl rubber (AR), fluororubber (FR), acrylonitrile-butadiene-styrene copolymer (ABS),
Acrylonitrile-ethylene-styrene copolymer (AE
S), acrylonitrile-styrene copolymer (AS),
Polystyrene (PS), polyethylene terephthalate (PET), polybutylene terephthalate (PBT),
Polyester mixture, polycarbonate (PC), polysulfone, polyether sulfone (PES), polyimide (PI), PPS, polyether ether ketone (P
EEK), vinylidene fluoride polymer (PVDF, etc.),
Polyoxymethylene (POM), polytetrafluoroethylene (PTFE), polyphenylene ether (PP
E), polyamides other than nylon 4,6, crosslinked particles, and modified products thereof may be appropriately blended. In the resin composition for reflow of the present invention, other components such as pigments, dyes, colorants, organic reinforcing materials, heat-resistant agents, copper compounds and hindered phenolic compounds can be used as long as the moldability and physical properties are not impaired. Representative stabilizers,
Addition of antioxidants, photoprotectors, crosslinking agents such as styrene maleic anhydride and epoxy compounds, weathering agents, light stabilizers, crystal nucleating agents, lubricants, release agents, plasticizers, antistatic agents, etc. Can be introduced.

Further, underwriters laboratory (UL) is abbreviated to electrical and electronic parts which can be applied to the surface mounting technology (SMT) which is an application of the resin composition for reflow according to the present invention. In a flammability test according to UL-94 test method of
Alternatively, it is often required to pass the V-1 standard. Therefore, in that case, it is naturally necessary to introduce a flame retardant represented by halogenated polystyrene and the like and a flame retardant auxiliary represented by a zinc compound, an antimony compound, an iron compound and the like. However, even in this case, since the resin composition for reflow of the present invention does not impair the performance which is the object of the present invention, there is no hindrance to the addition of a flame retardant or a flame retardant auxiliary agent typified by the above compounds. Absent.
The resin composition for reflow of the present invention is obtained by subjecting the above resin composition to a known molding method such as injection molding, extrusion molding, blow molding, vacuum molding, compression molding or the like which is used for ordinary thermoplastic resins. As a result, various molded products can be formed.

Electricity that can be applied to the surface mounting technology (SMT), which is the application of the resin composition for reflow according to the present invention.
Typical examples of electronic parts include various connectors and I /
Various modules such as O modules, solid state relays, various relays such as twin tact relays, various power supply units, various terminals and terminal blocks, button switches,
Flat panel switch, illuminated switch, rotary switch, paddle rocker switch, rocker switch, key lock switch, keypad switch, DIP switch, slide switch, toggle switch, various switches, mounters for various switches, various indicator lights,
Various elements such as diodes, transistors, rectifiers,
Various sockets, various volumes, various plug boards, various sensors, various transformers, various ICs (integrated circuits), various resistors, various capacitors, various coil bobbins, etc.
And parts attached to them, the resin composition for reflow of the present invention is mainly used for the housing thereof,
It is formed and used as a case, a body, a cover, a frame, an electrical insulator, a slide (slider), a base, a lens cam, a spool, a yoke, and the like and their associated parts. In addition, secondary processing such as painting, vapor deposition, and adhesion can be applied to such a molded part.

[0021]

EXAMPLES AND COMPARATIVE EXAMPLES The present invention will be described in more detail below with reference to Examples and Comparative Examples, but the present invention is not limited thereto. The performance of the samples described in Examples and Comparative Examples was measured by the following method. 1) Deflection temperature under load (heat distortion temperature): ASTM D64
8, load 18.6 kg / cm ² 2) Blister resistance: length 15 mm, width 30 mm, height 1
A sample injection-molded into a box shape with a thickness of 0 mm and a thickness of 1 mm is 23 ° C.
After being immersed in water for 24 hours, the temperature of the sample surface in the preheating part was changed using a far infrared reflow device YSR-8533H manufactured by Yokota Machinery Co., Ltd. and an air reflow device FAR-300ccM manufactured by Nippon Denki Keiki Co., Ltd. Blister generation after passing through the reflow furnace under the conditions of 150 ± 3 ° C. and a passing time of about 120 seconds, the maximum temperature of the sample surface in the reflow section being 230 ± 2 ° C. and a passing time of about 60 seconds. The presence or absence was visually confirmed.

The following materials were used in Examples and Comparative Examples. Component (A); Nylon 4,6 as Dutch DS
STANYLKS300 manufactured by M Co. was used. Amylan CM3001N manufactured by Toray Industries, Inc. was used as nylon 6,6 (PA66). As the constituent component (B); the amorphous polyamide resin, the following amorphous polyamides (a) to (e) were used. The amorphous polyamide (a) is composed of bis (4-amino-methylhexyl) methane, hexamethylenediamine, terephthalic acid, isophthalic acid and caprolactam, and the amorphous polyamide (b) is isophoronediamine,
It is an amorphous polyamide composed of hexamethylenediamine, terephthalic acid, isophthalic acid and caprolactam.
The amorphous polyamide (c) is “Trogamide T” (a trimethylhexamethylenediamine and terephthalic acid type amorphous polyamide) manufactured by Dynamid Nobel. The amorphous polyamide (d) is hexamethylenediamine and isophthalic acid-based amorphous polyamide (polyhexamethyleneisophthalamide). The amorphous polyamide (e) is bis (4-amino-3-methylcyclohexyl) methane,
It is an amorphous polyamide obtained from bis (4-amino-3-methyl-5-ethylcyclohexyl) methane, hexamethylenediamine, terephthalic acid, isophthalic acid and caprolactam.

Component (C); As the functional group-containing olefin polymer, an acid anhydride group-containing olefin polymer and an epoxy group-containing olefin polymer were used.
As the olefin polymer containing an acid anhydride group, JSREP T7711NS manufactured by Nippon Synthetic Rubber Co., Ltd. was used. This is a maleic anhydride modified ethylene-propylene copolymer. As an olefin polymer containing an epoxy group, MODIPER A4 manufactured by NOF CORPORATION
101 was used. This is a graft copolymer whose main chain is an ethylene-glycidyl methacrylate copolymer (ethylene component 85 wt%, glycidyl methacrylate component 15 wt%) and which has a styrene polymer in the side chain (the weight ratio of the main chain to the side chain is 1 to 1).

Component (D): As the inorganic filler, glass fiber, kaolin, talc and mica were used. As the glass fibers, chopped strands having an aspect ratio represented by the ratio of the length in the longitudinal direction to the average diameter of the cross section of about 200 and an average diameter of the cross section of about 10 to 20 μm were used. Kaolin having an average diameter of about 1.4 μm and an aspect ratio of 8 to 20 was used. The talc used had an average diameter of about 2.0 μm and an aspect ratio of 20-30. Mica having an average diameter of 30 to 60 μm and an aspect ratio of 60 to 100 was used. The resin compositions of Examples and Comparative Examples were twin-screw extruders (cylinder temperature 290 to 290).
Pelletized at 320 ° C. A predetermined test piece was prepared from the obtained pellets by an injection molding machine (cylinder temperature 290 to 320 ° C.) and used for the test. As an example and a comparative example, the composition and the evaluation results of the above items are shown in Table 1.

Examples 1 to 11 Examples 1 to 11 are all reflow resin compositions within the scope of the claims of the present invention. Examples 1 and 2
In the case where glass fiber was used as the inorganic filler of the component (D) and the filling amount was relatively small, the deflection temperature under load and the blister resistance showing the rigidity at high temperature were sufficiently good. The amorphous polyamide as the component (B) may be either (a) or (b), and the functional group-containing olefin polymer as the component (C) was good in both T7711NS and modiper. In Examples 3, 4 and 5, glass fibers and kaolin or glass fibers and talc were used together as the inorganic filler of the component (D), and in any case, the deflection temperature under load and the blister resistance were sufficiently good. there were. Example 6
Then, three kinds of inorganic fillers of glass fiber, kaolin and talc were used together, and the result was good. In Example 7, 200 parts by weight of glass fiber was filled in the total amount of components (A), (B), and (C), and there was no problem in workability, and the deflection temperature under load and blister resistance Was good enough. Further, in Example 8, the amorphous polyamides (a) and (b) of the component (B) were used in combination, and the result was good. Further, in Examples 9, 10, and 11, the amorphous polyamides (c), (d), and (e) were used as the amorphous polyamide of the component (B), but the amorphous polyamide of the component (B) was used. The results were good as in the case of the functional polyamides (a) and (b).

Comparative Examples 1 to 10 All Comparative Examples 1 to 10 are reflow resin compositions outside the scope of the claims of the present invention. Comparative Example 1 is a case where the amount of nylon 4,6 as the component (A) is less than the range of the present invention, and both the deflection temperature under load and the blister resistance are inferior. On the contrary, Comparative Example 2 is a case where the amount of nylon 4,6 as the component (A) exceeds the range of the present invention, and the deflection temperature under load is good, but the blister resistance is poor. Comparative Example 3
Indicates that the amount of the amorphous polyamide as the component (B) is less than the range of the present invention, and the deflection temperature under load is good but the blister resistance is poor. On the contrary, in Comparative Example 4, the component (B)
When the amount of the amorphous polyamide exceeds the range of the present invention, both the deflection temperature under load and the blister resistance are inferior.
Comparative Example 5 is a case where the amount of the functional group-containing olefin polymer of the component (C) exceeds the range of the present invention, and both the deflection temperature under load and the blister resistance are inferior. On the contrary, in Comparative Example 6,
In the case where the amount of the functional group-containing olefin polymer of the component (C) is less than the range of the present invention and the compatibility state of the component (A) and the component (B) is insufficient, the deflection temperature under load is good. However, the blister resistance is inferior.

In Comparative Example 7, the filling amount of the inorganic filler of the component (D) exceeds the range of the present invention, and the workability is extremely poor, so that the deflection temperature under load and the blister resistance cannot be measured. On the contrary, Comparative Example 8 is a case where the filling amount of the inorganic filler of the component (D) is less than the range of the present invention, and both the deflection temperature under load and the blister resistance are inferior. Comparative Examples 9 and 1
0 is a case where nylon 6,6 was used as another nylon instead of nylon 4,6 of the component (A). Compared with Examples 2 and 5 using nylons 4 and 6, the deflection temperature under load was lower by about 30 ° C, and there was a problem in blister resistance. This also confirms the significance of using nylon 4,6 for the reflow resin composition.

[0028]

INDUSTRIAL APPLICABILITY As specifically shown in the examples, the present invention provides (A) nylon 4,6 resin, (B) amorphous polyamide resin, (C) functional group-containing olefin polymer, and ( D) A resin composition for reflow, which is composed of an inorganic filler and has excellent rigidity at high temperatures and extremely excellent blister resistance.

[Table 1]

[Table 2]

[Table 3]

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification number Office reference number FI technical indication location C08L 23:26) (72) Inventor Shuji Tsuchikawa 2-11-24 Tsukiji, Chuo-ku, Tokyo Japan Naru Rubber Co., Ltd.

Claims (1)

[Claims] 1. (A) Polytetramethylene adipamide 5
0-94% by weight, (B) amorphous polyamide resin 5-49
% Of the functional group-containing olefin polymer (C), and 20 to 200 parts by weight of the inorganic filler (D) per 100 parts by weight of the total amount of the above (A) to (C). Resin composition for reflow.