JPH0550639B2 - - Google Patents

Info

Publication number
JPH0550639B2
JPH0550639B2 JP61258968A JP25896886A JPH0550639B2 JP H0550639 B2 JPH0550639 B2 JP H0550639B2 JP 61258968 A JP61258968 A JP 61258968A JP 25896886 A JP25896886 A JP 25896886A JP H0550639 B2 JPH0550639 B2 JP H0550639B2
Authority
JP
Japan
Prior art keywords
gas
cylinder
semiconductor manufacturing
hydrogen
valve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61258968A
Other languages
Japanese (ja)
Other versions
JPS63116000A (en
Inventor
Akira Nishimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP61258968A priority Critical patent/JPS63116000A/en
Publication of JPS63116000A publication Critical patent/JPS63116000A/en
Publication of JPH0550639B2 publication Critical patent/JPH0550639B2/ja
Granted legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C13/00—Details of vessels or of the filling or discharging of vessels
    • F17C13/12—Arrangements or mounting of devices for preventing or minimising the effect of explosion ; Other safety measures
    • F17C13/123—Arrangements or mounting of devices for preventing or minimising the effect of explosion ; Other safety measures for gas bottles, cylinders or reservoirs for tank vehicles or for railway tank wagons
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2201/00—Vessel construction, in particular geometry, arrangement or size
    • F17C2201/01—Shape
    • F17C2201/0104—Shape cylindrical
    • F17C2201/0109—Shape cylindrical with exteriorly curved end-piece
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2201/00—Vessel construction, in particular geometry, arrangement or size
    • F17C2201/01—Shape
    • F17C2201/0104—Shape cylindrical
    • F17C2201/0119—Shape cylindrical with flat end-piece
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2205/00—Vessel construction, in particular mounting arrangements, attachments or identifications means
    • F17C2205/03—Fluid connections, filters, valves, closure means or other attachments
    • F17C2205/0302—Fittings, valves, filters, or components in connection with the gas storage device
    • F17C2205/0323—Valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2221/00—Handled fluid, in particular type of fluid
    • F17C2221/01—Pure fluids
    • F17C2221/012—Hydrogen
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2223/00—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel
    • F17C2223/01—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel characterised by the phase
    • F17C2223/0146—Two-phase
    • F17C2223/0153—Liquefied gas, e.g. LPG, GPL
    • F17C2223/0161—Liquefied gas, e.g. LPG, GPL cryogenic, e.g. LNG, GNL, PLNG
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2223/00—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel
    • F17C2223/03—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel characterised by the pressure level
    • F17C2223/035—High pressure (>10 bar)
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2223/00—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel
    • F17C2223/03—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel characterised by the pressure level
    • F17C2223/036—Very high pressure (>80 bar)
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2260/00—Purposes of gas storage and gas handling
    • F17C2260/03—Dealing with losses
    • F17C2260/035—Dealing with losses of fluid
    • F17C2260/038—Detecting leaked fluid
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2270/00—Applications
    • F17C2270/05—Applications for industrial use
    • F17C2270/0518—Semiconductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30—Hydrogen technology
    • Y02E60/32—Hydrogen storage

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)

Description

【発明の詳細な説明】 ［産業上の利用分野］ この発明は、配管システム内の漏洩部を容易に
発見することのできる半導体製造用高圧ガスボン
ベ配管システムに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a high-pressure gas cylinder piping system for semiconductor manufacturing, which allows leaks in the piping system to be easily discovered.

［従来の技術］ 第２図は従来の半導体製造用高圧ガスボンベ配
管システムを示す図である。[Prior Art] FIG. 2 is a diagram showing a conventional high pressure gas cylinder piping system for semiconductor manufacturing.

半導体製造用高圧ガスボンベ１内には半導体製
造用材料ガスが入つている。半導体製造用高圧ガ
スボンベ１にはガス路を開くボンベバルブ２が付
けられている。 A high-pressure gas cylinder 1 for semiconductor manufacturing contains material gas for semiconductor manufacturing. A high-pressure gas cylinder 1 for semiconductor manufacturing is equipped with a cylinder valve 2 that opens a gas path.

また、半導体製造用高圧ガスボンベ１には、不
活性ガス置換用配管３とガス供給配管４を接続す
るボンベ接合口金５が付けられている。 Further, the high-pressure gas cylinder 1 for semiconductor manufacturing is provided with a cylinder joint cap 5 that connects the inert gas replacement pipe 3 and the gas supply pipe 4.

ガス供給配管４は材料ガス供給バルブ６と、ガ
ス供給配管内の圧力を調節する減圧弁７を備えて
いる。 The gas supply pipe 4 includes a material gas supply valve 6 and a pressure reducing valve 7 that adjusts the pressure inside the gas supply pipe.

ガス供給配管４は、その末端でユースポイント
ライン８と排気ライン９に分岐する。ユースポイ
ントライン８にはユースポイント供給バルブ１０
が、排気ライン９には排気ラインバルブ１１が備
えられている。 The gas supply pipe 4 branches into a use point line 8 and an exhaust line 9 at its end. Use point line 8 has use point supply valve 10
However, the exhaust line 9 is equipped with an exhaust line valve 11.

一方、不活性ガス置換用配管３には置換ガス供
給バルブ１２が備えられている。 On the other hand, the inert gas replacement piping 3 is equipped with a replacement gas supply valve 12 .

次に、従来の半導体製造用高圧ガスボンベ配管
システムにおける半導体製造用高圧ガスボンベ１
の交換作業の方法について説明する。 Next, the high pressure gas cylinder 1 for semiconductor manufacturing in the conventional high pressure gas cylinder piping system for semiconductor manufacturing.
This section explains how to perform the replacement work.

使用している半導体製造用高圧ガスボンベ１内
のガス残存量が或る一定値以下になると、ボンベ
交換を行なう必要が生じる。 When the remaining amount of gas in the high-pressure gas cylinder 1 used for semiconductor manufacturing becomes below a certain value, it becomes necessary to replace the cylinder.

まず、ボンベバルブ２を閉じ、ユースポイント
供給バルブ１０を閉じる。 First, the cylinder valve 2 is closed, and the point-of-use supply valve 10 is closed.

次に、排気ラインバルブ１１を開き、ガス供給
配管４内に残存している半導体用材料ガスを排気
する。 Next, the exhaust line valve 11 is opened to exhaust the semiconductor material gas remaining in the gas supply pipe 4.

次に、置換ガス供給バルブ１２を開く。そし
て、窒素、アルゴン、ヘリウム等の不活性ガスを
ガス供給配管４内に供給し、半導体用材料ガスを
不活性ガスに置換する。このような置換は、交換
する材料ガスが異種のものである場合に特に必要
である。 Next, the replacement gas supply valve 12 is opened. Then, an inert gas such as nitrogen, argon, helium, etc. is supplied into the gas supply pipe 4 to replace the semiconductor material gas with the inert gas. Such replacement is especially necessary when the material gases to be replaced are of different types.

置換作業完了後、ボンベ接続口金５を緩め、使
用済ボンベを取り外し、新しいボンベを設置す
る。そして、ボンベ接続口金５を新ボンベに接続
する。 After the replacement work is completed, the cylinder connection cap 5 is loosened, the used cylinder is removed, and a new cylinder is installed. Then, connect the cylinder connection cap 5 to the new cylinder.

次に、配管システムの漏洩検査の方法について
説明する。 Next, a method for leak testing a piping system will be described.

置換ガス供給バルブ１２を開にする。そして、
ボンベ接続口金５部に、不活性ガスで２Kg／cm2の
圧力を加える。次いで、漏洩の可能性のあるボン
ベ接続口金５部等に漏洩チエツク用発泡液、たと
えばスヌープ、を塗布する。ガスが漏洩している
と当該液は発泡する。当該液が発泡しなければ、
ガスの漏洩がないと判断され得る。 Open the replacement gas supply valve 12. and,
Apply a pressure of 2 kg/cm 2 with inert gas to 5 parts of the cylinder connection mouth. Next, a foaming liquid for leakage check, such as Snoop, is applied to the five cylinder connection caps and the like that are likely to leak. If gas is leaking, the liquid will foam. If the liquid does not foam,
It can be determined that there is no gas leak.

ガスの漏洩がないことを確認した後、置換ガス
供給バルブ１２および排気ラインバルブ１１を開
閉する。この開閉の操作により、ボンベ接続口金
５を取り外した際に配管内に進入した空気が、不
活性ガスと置換される。 After confirming that there is no gas leakage, the replacement gas supply valve 12 and the exhaust line valve 11 are opened and closed. By this opening/closing operation, the air that entered the pipe when the cylinder connection cap 5 was removed is replaced with inert gas.

配管内が不活性ガスで置換された後、新ボンベ
のボンベバルブ２、置換ガス供給バルブ１２およ
び排気ラインバルブ１１を開閉し、材料ガスに置
換する。 After the inside of the piping is replaced with the inert gas, the cylinder valve 2, replacement gas supply valve 12, and exhaust line valve 11 of the new cylinder are opened and closed to replace the gas with the material gas.

そして排気ラインバルブ１１、置換ガス供給バ
ルブ１２を閉にし、ボンベバルブ２およびユース
ポイント供給バルブ１０を開にする。 Then, the exhaust line valve 11 and the replacement gas supply valve 12 are closed, and the cylinder valve 2 and use point supply valve 10 are opened.

以上の操作により、配管システム内は半導体製
造用材料ガスの供給が可能な状態となる。 By the above operations, the inside of the piping system becomes in a state where it is possible to supply the material gas for semiconductor manufacturing.

［発明が解決しようとする問題点］ 前述のごとく、配管システムの漏洩検査は、漏
洩の可能性のあるボンベ接続口金５部等に漏洩チ
エツク用発泡液を塗布し、その発泡の有無を人間
の目で確認することによつて行なつていた。[Problems to be Solved by the Invention] As mentioned above, a leak test for a piping system involves applying a leak check foaming liquid to five parts of the cylinder connection cap, etc. where there is a possibility of leakage, and checking whether or not there is foaming by a human. This was done by checking visually.

しかし、人間の目による確認は、習熟度により
検査レベルが異なるので、不確かである。 However, confirmation by human eyes is uncertain because the inspection level varies depending on the level of proficiency.

また、発泡液を用いているので、ボンベ接続口
金５部等の塗布部分が腐食されるという問題があ
つた。 Furthermore, since a foaming liquid was used, there was a problem that the coated parts, such as the 5 parts of the cylinder connection mouth, were corroded.

本発明は上記のような問題点を解消するために
なされたもので、作業者の習熟度に依存しない正
確な漏洩検査を行なえ、かつボンベ接続口金等を
腐食させない漏洩検査を行なえ、さらに、半導体
製造工場内において汎用されている材料を用い
て、漏洩部を正確・迅速・安価に発見できるよう
に改良された、半導体製造用高圧ガスボンベ配管
システムを提供することを目的とする。 The present invention has been made to solve the above-mentioned problems, and it is possible to perform an accurate leakage test that does not depend on the skill level of the operator, and also to perform a leakage test that does not corrode the cylinder connection cap, etc. An object of the present invention is to provide a high-pressure gas cylinder piping system for semiconductor manufacturing, which is improved so that leaks can be detected accurately, quickly, and inexpensively using materials commonly used in manufacturing plants.

［問題点を解決するための手段］ この発明に係る半導体製造用ガスボンベ配管シ
ステムは、半導体製造用高圧ガスボンベを備え
る。上記半導体製造用高圧ガスボンベには、該半
導体製造用高圧ガスボンベに入つている半導体製
造用材料ガスをユースポイントに供給するガス供
給配管が接続される。上記半導体製造用高圧ガス
ボンベには、該ガス供給配管内を不活性ガスで置
換する不活性ガス置換用配管が接続される。上記
不活性ガス置換用配管には、該不活性ガス置換用
配管内に当該配管システムの漏洩部を発見する水
素ガスを導入する水素ガス供給配管が接続され
る。当該半導体製造用高圧ガスボンベ配管システ
ムは、さらに、当該配管システム内の配管内に上
記水素ガスが満たされたとき、上記漏洩部に近づ
けられ、該漏洩部から漏れてくる上記水素ガスを
検出するポータブルの水素ガス検出器を備える。[Means for Solving the Problems] A gas cylinder piping system for semiconductor manufacturing according to the present invention includes a high-pressure gas cylinder for semiconductor manufacturing. A gas supply pipe for supplying the material gas for semiconductor manufacturing contained in the high pressure gas cylinder for semiconductor manufacturing to a point of use is connected to the high pressure gas cylinder for semiconductor manufacturing. An inert gas replacement pipe for replacing the inside of the gas supply pipe with an inert gas is connected to the high pressure gas cylinder for semiconductor manufacturing. A hydrogen gas supply pipe is connected to the inert gas replacement pipe to introduce hydrogen gas into the inert gas replacement pipe to detect a leak in the piping system. The high-pressure gas cylinder piping system for semiconductor manufacturing is further provided with a portable device that is brought close to the leakage portion and detects the hydrogen gas leaking from the leakage portion when the piping in the piping system is filled with the hydrogen gas. Equipped with a hydrogen gas detector.

［作用］ 半導体装置製造用高圧ガスボンベ配管システム
内の不活性ガス置換用配管に、当該配管システム
内の漏洩部を発見する水素ガスを導入する水素ガ
ス供給配管を備えている。したがつて、漏洩部が
あると、その部分から水素ガスが漏れてくる。こ
の水素ガスを水素ガス検出器によつて検出するこ
とにより、漏洩部を発見することができる。[Function] The inert gas replacement piping in the high-pressure gas cylinder piping system for semiconductor device manufacturing is provided with a hydrogen gas supply piping that introduces hydrogen gas to discover leaks in the piping system. Therefore, if there is a leakage part, hydrogen gas will leak from that part. By detecting this hydrogen gas with a hydrogen gas detector, the leakage portion can be discovered.

検知ガスとして用いる水素ガスは、半導体製造
工場において汎用されているガスであり、手近に
あり、検知用ガスとして、別途ボンベを準備する
必要がない。また、水素ガスは安価である。 The hydrogen gas used as the detection gas is commonly used in semiconductor manufacturing factories and is readily available, so there is no need to prepare a separate cylinder as the detection gas. Additionally, hydrogen gas is inexpensive.

さらに、水素ガス検出器は、水素ガスの検出を
時間をかけることなく迅速に行なえるので、漏洩
部の検出のために多大の時間を必要としない。 Furthermore, since the hydrogen gas detector can quickly detect hydrogen gas without spending much time, it does not require a large amount of time to detect a leak.

［実施例］ 以下、この発明の一実施例を図について説明す
るが、本発明はこれに限定されるものでない。[Example] Hereinafter, an example of the present invention will be described with reference to the drawings, but the present invention is not limited thereto.

第１図はこの発明に係る半導体製造用高圧ガス
ボンベ配管システムを示す図である。 FIG. 1 is a diagram showing a high pressure gas cylinder piping system for semiconductor manufacturing according to the present invention.

半導体製造用高圧ガスボンベ１３内には半導体
製造用材料ガスが入つている。また、半導体製造
用高圧ガスボンベ１３には、不活性ガス置換用配
管１４とガス供給配管１５を接続するボンベ接続
口金１６が備えられている。 The high pressure gas cylinder 13 for semiconductor manufacturing contains material gas for semiconductor manufacturing. Further, the high-pressure gas cylinder 13 for semiconductor manufacturing is equipped with a cylinder connection cap 16 that connects the inert gas replacement pipe 14 and the gas supply pipe 15.

ガス供給配管１５は、半導体製造用材料ガス供
給バルブ１７とガス供給配管内の圧力を調節する
減圧弁１８を備えている。 The gas supply pipe 15 includes a semiconductor manufacturing material gas supply valve 17 and a pressure reducing valve 18 that adjusts the pressure inside the gas supply pipe.

ガス供給配管１５は、その末端でユースポイン
トライン１９と排気ライン２０に分岐する。ユー
スポイントライン１９にはユースポイント供給バ
ルブ２１が、排気ライン２０には排気ラインバル
ブ２２が備えられている。 The gas supply pipe 15 branches into a use point line 19 and an exhaust line 20 at its end. The use point line 19 is provided with a use point supply valve 21, and the exhaust line 20 is provided with an exhaust line valve 22.

一方、不活性ガス置換用配管１４は、置換ガス
供給バルブ２３と不活性ガス切換バルブ２４を備
えている。 On the other hand, the inert gas replacement piping 14 includes a replacement gas supply valve 23 and an inert gas switching valve 24.

そして、置換ガス供給バルブ２３と不活性ガス
切換バルブ２４の間に位置する不活性ガス置換用
配管１４部分には、配管システム内の漏洩部を発
見する漏洩部発見用検知ガスを導入する検知ガス
供給配管２５が備えられている。なお、本実施例
では検知ガスに水素ガスを用いている。また本実
施例では検知ガス供給配管２５は水素ガスボンベ
２６に連結されている。 A detection gas is introduced into the inert gas replacement piping 14 portion located between the replacement gas supply valve 23 and the inert gas switching valve 24 to detect a leakage part in the piping system. A supply pipe 25 is provided. Note that in this embodiment, hydrogen gas is used as the detection gas. Further, in this embodiment, the detection gas supply pipe 25 is connected to a hydrogen gas cylinder 26.

そして、水素ガスは、水素ガスボンベ２６より
水素ガスボンベバルブ２７と、減圧弁２８と、水
素ガス切換バルブ２９を経て置換ガス供給配管１
４内に入る。 Then, the hydrogen gas is supplied from the hydrogen gas cylinder 26 to the hydrogen gas cylinder valve 27, the pressure reducing valve 28, and the hydrogen gas switching valve 29 to the replacement gas supply pipe 1.
Enter within 4.

本発明に係る半導体製造用高圧ガスボンベ配管
システムにおける半導体製造用高圧ガスボンベ１
３の交換作業の方法については、従来装置と同様
であるので、その説明を省略する。 High pressure gas cylinder for semiconductor manufacturing in the high pressure gas cylinder piping system for semiconductor manufacturing according to the present invention 1
The method of the replacement work No. 3 is the same as that of the conventional device, so the explanation thereof will be omitted.

次に、配管システムの漏洩検査の方法について
説明する。 Next, a method for leak testing a piping system will be described.

従来装置と同様に、ガス供給配管１５内の半導
体材料用ガスを不活性ガスに置換後、ボンベを新
ボンベと交換し、ボンベ接続口金１６に接続す
る。 Similar to the conventional device, after replacing the semiconductor material gas in the gas supply pipe 15 with an inert gas, the cylinder is replaced with a new cylinder and connected to the cylinder connection cap 16.

その後、不活性ガス切換バルブ２４を閉にし、
水素ボンベのバルブ２７と水素ガス切換バルブ２
９と置換ガス供給バルブ２３を開にする。 After that, close the inert gas switching valve 24,
Hydrogen cylinder valve 27 and hydrogen gas switching valve 2
9 and the replacement gas supply valve 23 are opened.

そしてボンベ接続口金１６部等に２Kg／cm2の水
素ガスの圧力を加える。 Then, a pressure of 2 kg/cm 2 of hydrogen gas is applied to 16 parts of the cylinder connection mouth.

そして、熱線型半導体式ポータブル水素ガスリ
ークテスター（たとえば、理研計器製SP−203F）
を用い、ボンベ接続口金１６部等の漏洩の可能性
のある箇所の漏洩検査を行なう。ガス漏れがある
とテスターに検知される。ガス漏れがないとテス
ターに検知されないことは言うまでもない。 And a hot wire type semiconductor type portable hydrogen gas leak tester (for example, Riken Keiki SP-203F)
Using this, conduct a leakage test at locations where there is a possibility of leakage, such as the 16 cylinder connection caps. If there is a gas leak, the tester will detect it. Needless to say, if there is no gas leak, the tester will not detect it.

ガス漏洩のないことを確認した後、水素ガスボ
ンベバルブ２７と水素ガス切換バルブ２９を閉
に、不活性ガス切換バルブ２４を開にする。 After confirming that there is no gas leakage, the hydrogen gas cylinder valve 27 and the hydrogen gas switching valve 29 are closed, and the inert gas switching valve 24 is opened.

そして、置換ガス供給バルブ２３および排気バ
ルブ２２を開閉し、ボンベ交換時に配管内に進入
した空気および水素を不活性ガスに置換する。 Then, the replacement gas supply valve 23 and the exhaust valve 22 are opened and closed to replace the air and hydrogen that entered the piping when replacing the cylinder with inert gas.

次いで、新ボンベのバルブ３０および上記の２
種のバルブ２２，２３を開閉し、不活性ガスを材
料ガスに置換する。 Next, the valve 30 of the new cylinder and the above 2
The seed valves 22 and 23 are opened and closed to replace the inert gas with the material gas.

最後に排気バルブ２２と置換ガス供給バルブ２
３を閉にし、ボンベバルブ３０とユースポイント
供給バルブ２１を開にし、材料ガスの供給を可能
な状態にする。 Finally, exhaust valve 22 and replacement gas supply valve 2
3 is closed, and the cylinder valve 30 and use point supply valve 21 are opened to enable supply of material gas.

なお、上記実施例では、１つの半導体製造用高
圧ガスボンベ１３に対して、１つの水素ガス切換
バルブ２９と１つの不活性ガス切換バルブ２４を
設置した場合を示した。しかし、半導体製造用高
圧ガスボンベ１３が複数ある場合、それらが１つ
の水素ガス切換バルブ２９、１つの不活性ガス切
換バルブ２４、および１つの水素ボンベ２６を共
有するように配管システムを構成しても、本実施
例と同様の効果が実現し得る。 In the above embodiment, one hydrogen gas switching valve 29 and one inert gas switching valve 24 are installed for one semiconductor manufacturing high pressure gas cylinder 13. However, if there are multiple high-pressure gas cylinders 13 for semiconductor manufacturing, the piping system may be configured so that they share one hydrogen gas switching valve 29, one inert gas switching valve 24, and one hydrogen cylinder 26. , the same effects as in this embodiment can be achieved.

また、本実施例では水素ガス切換バルブ２９と
不活性ガス切換バルブ２４を別々に設けた。しか
し、三方弁を用いてそれらを一体としても実施例
と同様の効果が実現する。 Further, in this embodiment, a hydrogen gas switching valve 29 and an inert gas switching valve 24 are provided separately. However, even if they are integrated using a three-way valve, the same effects as in the embodiment can be achieved.

さらに、本実施例では水素ガスの供給を水素ガ
スボンベ２６により行なつたが、工場配管から水
素ガスを供給するように構成しても実施例と同様
の効果が得られる。 Further, in this embodiment, hydrogen gas is supplied by the hydrogen gas cylinder 26, but the same effects as in the embodiment can be obtained even if the hydrogen gas is supplied from factory piping.

本実施例では、ほぼ100％純粋の市販水素ガス
を用いて行なつた場合を示したが、爆発限界以下
の濃度の水素ガスを用いても、最近の検出機器は
敏感（理研計器製SP−203Fは2ppmの水素を検出
可能）であるので、漏洩部発見は可能である。 In this example, a case was shown in which almost 100% pure commercially available hydrogen gas was used, but even if hydrogen gas with a concentration below the explosive limit is used, recent detection equipment is sensitive (SP- 203F can detect 2ppm of hydrogen), so it is possible to find the leak.

また、上記実施例では漏洩部発見用検知ガスに
水素ガスを用いる場合を示したが、本発明はこれ
に限られず、ヘリウムガスであつても実施例と同
様の効果を実現しうる。但し、この場合は、検知
器としてエドワード（Edwands）社製ハンデイ
テクターを用いる。 Further, although the above embodiment shows a case where hydrogen gas is used as the detection gas for detecting a leakage portion, the present invention is not limited to this, and the same effects as in the embodiment can be achieved even when helium gas is used. However, in this case, a hand detector manufactured by Edwands is used as the detector.

さらに、水素ガスの圧力は常圧以上であること
を要し、その圧力が高ければ高いほど該水素ガス
は検出されやすくなる。 Furthermore, the pressure of the hydrogen gas needs to be equal to or higher than normal pressure, and the higher the pressure, the more easily the hydrogen gas can be detected.

［発明の効果］ 以上のようにこの発明に係る半導体製造用高圧
ガスボンベ配管システムは、不活性ガス置換用配
管に、当該配管システム内の漏洩部を発見する水
素ガスを導入する水素ガス供給用配管を備えてい
る。したがつて、漏洩部があると、その部分から
水素ガスが漏れてくる。その水素ガスを水素ガス
検出器によつて検出することにより、漏洩部を発
見する。その結果、ガス漏洩部の発見が、習熟度
に依存しないので、非常に正確となる。[Effects of the Invention] As described above, the high-pressure gas cylinder piping system for semiconductor manufacturing according to the present invention includes hydrogen gas supply piping that introduces hydrogen gas into the inert gas replacement piping to discover leaks in the piping system. It is equipped with Therefore, if there is a leakage part, hydrogen gas will leak from that part. The leakage part is discovered by detecting the hydrogen gas with a hydrogen gas detector. As a result, the detection of gas leaks is highly accurate, as it is independent of proficiency.

また、漏洩部発見のための検知ガスとして水素
ガスを用いているので、従来の方法で見られたよ
うな、ボンベ接続口金部の腐食の問題も解決され
る。また、検知用ガスとして用いる水素ガスは、
半導体製造工場において汎用されているガスであ
り、手近にあり、また安価である。その結果、漏
洩部の発見を安価に行なうことができる。 Furthermore, since hydrogen gas is used as the detection gas for detecting leakage points, the problem of corrosion of the cylinder connection mouthpiece, which was seen in conventional methods, is also solved. In addition, the hydrogen gas used as the detection gas is
It is a commonly used gas in semiconductor manufacturing factories, and is readily available and inexpensive. As a result, leakage portions can be discovered at low cost.

また、水素ガス検出器は、水素ガスの検出を時
間をかけることなく迅速に行なえるので、漏洩部
の検出のために多大な時間を必要としない。ひい
ては、漏洩部の発見を迅速に行なえるという効果
を奏する。 Further, since the hydrogen gas detector can quickly detect hydrogen gas without spending much time, it does not require a large amount of time to detect a leak. As a result, there is an effect that the leakage portion can be quickly discovered.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例を示す図、第２図は
従来の半導体製造用高圧ガスボンベ配管システム
を示す図である。 図において、１３は半導体製造用高圧ガスボン
ベ、１４は不活性ガス置換用配管、１５はガス供
給配管、２５は検知ガス供給配管である。 FIG. 1 is a diagram showing an embodiment of the present invention, and FIG. 2 is a diagram showing a conventional high-pressure gas cylinder piping system for semiconductor manufacturing. In the figure, 13 is a high-pressure gas cylinder for semiconductor manufacturing, 14 is an inert gas replacement pipe, 15 is a gas supply pipe, and 25 is a detection gas supply pipe.

Claims (1)

【特許請求の範囲】 １ 半導体製造用高圧ガスボンベと、 前記半導体製造用高圧ガスボンベに接続され、
該半導体製造用高圧ガスボンベに入つている半導
体製造用材料ガスをユースポイントに供給するガ
ス供給配管と、 前記半導体製造用高圧ガスボンベに接続され、
該ガス供給配管内を不活性ガスで置換する不活性
ガス置換用配管と、 前記不活性ガス置換用配管に接続され、該不活
性ガス置換用配管内に当該配管システムの漏洩部
を発見する水素ガスを導入する水素ガス供給配管
と、 当該配管システムの配管内に前記水素ガスが満
たされたとき、前記漏洩部に近づけられ、該漏洩
部から漏れてくる前記水素ガスを検出するポータ
ブルの水素ガス検出器と、 を備えた半導体製造用高圧ガスボンベ配管システ
ム。[Scope of Claims] 1. A high-pressure gas cylinder for semiconductor manufacturing; connected to the high-pressure gas cylinder for semiconductor manufacturing;
a gas supply pipe that supplies material gas for semiconductor manufacturing contained in the high-pressure gas cylinder for semiconductor manufacturing to a point of use; connected to the high-pressure gas cylinder for semiconductor manufacturing;
An inert gas replacement pipe that replaces the inside of the gas supply pipe with an inert gas, and a hydrogen pipe connected to the inert gas replacement pipe to discover a leakage part of the piping system in the inert gas replacement pipe. A hydrogen gas supply pipe that introduces the gas, and a portable hydrogen gas that is brought close to the leakage part and detects the hydrogen gas leaking from the leakage part when the pipe of the piping system is filled with the hydrogen gas. A high-pressure gas cylinder piping system for semiconductor manufacturing equipped with a detector and.
JP61258968A 1986-10-30 1986-10-30 High-pressure gas cylinder piping system for manufacturing semiconductor Granted JPS63116000A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61258968A JPS63116000A (en) 1986-10-30 1986-10-30 High-pressure gas cylinder piping system for manufacturing semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61258968A JPS63116000A (en) 1986-10-30 1986-10-30 High-pressure gas cylinder piping system for manufacturing semiconductor

Publications (2)

Publication Number Publication Date
JPS63116000A JPS63116000A (en) 1988-05-20
JPH0550639B2 true JPH0550639B2 (en) 1993-07-29

Family

ID=17327518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61258968A Granted JPS63116000A (en) 1986-10-30 1986-10-30 High-pressure gas cylinder piping system for manufacturing semiconductor

Country Status (1)

Country Link
JP (1) JPS63116000A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5237824A (en) * 1989-02-16 1993-08-24 Pawliszyn Janusz B Apparatus and method for delivering supercritical fluid
JP4774634B2 (en) * 2001-06-15 2011-09-14 トヨタ自動車株式会社 Gas storage system
KR101589909B1 (en) * 2014-07-11 2016-01-29 한화탈레스 주식회사 Portable super high pressure gas-supplying apparatus for fast-colling down infrared seeker

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5477448A (en) * 1977-11-05 1979-06-20 Yoshiaki Tamaoki Method of detecting laid water pipe leakage

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60133627U (en) * 1984-02-16 1985-09-06 日本電気株式会社 gas gathering device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5477448A (en) * 1977-11-05 1979-06-20 Yoshiaki Tamaoki Method of detecting laid water pipe leakage

Also Published As

Publication number Publication date
JPS63116000A (en) 1988-05-20

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