JPH0550280A - Laser beam cutting method - Google Patents
Laser beam cutting methodInfo
- Publication number
- JPH0550280A JPH0550280A JP3230986A JP23098691A JPH0550280A JP H0550280 A JPH0550280 A JP H0550280A JP 3230986 A JP3230986 A JP 3230986A JP 23098691 A JP23098691 A JP 23098691A JP H0550280 A JPH0550280 A JP H0550280A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- cut
- cutting
- water
- mist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はレーザー切断方法に関す
る。FIELD OF THE INVENTION The present invention relates to a laser cutting method.
【0002】[0002]
【従来の技術】従来レーザー切断においては、被切断物
にレーザービームを照射しながら、アシストガスすなわ
ち、溶融した金属等を吹き飛ばし切断面を清浄に保つた
めの不活性ガス又は酸化反応熱を利用するための酸素等
を、切断溝に流して、能率的な切断溝の形成を図ってい
るが、この場合、レーザービームは100%有効には利
用されておらず、切断溝を通過し被切断物裏面に抜けて
いる。もしこの裏面に抜けるレーザービームも被切断物
に100%吸収させて熱として有効に利用することがで
きれば、切断能率を更に向上できる。2. Description of the Related Art Conventionally, in laser cutting, an assist gas, that is, an inert gas for blowing molten metal or the like to keep a cut surface clean while irradiating an object to be cut with a laser beam is utilized. Oxygen for the purpose is made to flow through the cutting groove to form an efficient cutting groove, but in this case, the laser beam is not used 100% effectively, and the laser beam passes through the cutting groove to cut the object to be cut. It is missing on the back. If the laser beam emitted to the back surface can be effectively absorbed by the object to be cut and used as heat, the cutting efficiency can be further improved.
【0003】[0003]
【発明が解決しようとする課題】本発明は、このような
事情に鑑みて提案されたもので、被切断物裏面に抜ける
レーザービームを切断溝内に有効に吸収させ、切断速度
を大きくし切断能率を大巾に向上させることができるレ
ーザー切断方法を提供することを目的とする。SUMMARY OF THE INVENTION The present invention has been proposed in view of such circumstances, and a laser beam that escapes to the back surface of the object to be cut is effectively absorbed in the cutting groove to increase the cutting speed and to cut. It is an object of the present invention to provide a laser cutting method capable of greatly improving efficiency.
【0004】[0004]
【課題を解決するための手段】そのために本発明は、被
切断物にレーザービームを照射するとともにアシストガ
スを吹きつけて切断するにあたり、上記アシストガスに
水のミストを混入することを特徴とする。To this end, the present invention is characterized in that a mist of water is mixed with the assist gas when the object to be cut is irradiated with a laser beam and the assist gas is blown to cut the object. .
【0005】[0005]
【作用】レーザービームのうち赤外域の波長の比較的長
いCO2 レーザー(波長10.6μm),COレーザー(波
長約5μm)は水に吸収され易い性質を持っており、ま
たYAGレーザー(波長1.06μm) も吸収される率は小
さいが同様な傾向があるので、アシストガスに水のミス
トを混入することにより、被切断物の裏面に抜け有効に
利用されなくなるレーザービームが水に吸収されて切断
溝内に有効に吸収される。[Function] Among the laser beams, CO 2 laser (wavelength 10.6 μm) and CO laser (wavelength about 5 μm), which have relatively long wavelengths in the infrared region, have the property of being easily absorbed by water, and YAG laser (wavelength 1.06 μm). ) Also tends to be absorbed, but there is a similar tendency.By mixing a mist of water in the assist gas, the laser beam that escapes to the back surface of the object to be cut and is no longer effectively used is absorbed by the water and the cutting groove is absorbed. Is effectively absorbed within.
【0006】[0006]
【実施例】本発明レーザー切断方法の一実施例を図面に
ついて説明すると、図1は本方法の実施要領を示す縦断
面図、図2は本方法の効果を示すための板厚と裏に抜け
るレーザー量との関係の線図、図3は本方法の効果を示
すための板厚と切断速度との関係の線図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the laser cutting method of the present invention will be described with reference to the drawings. FIG. 1 is a longitudinal sectional view showing an outline of the method, and FIG. FIG. 3 is a diagram showing the relationship with the laser amount, and FIG. 3 is a diagram showing the relationship between the plate thickness and the cutting speed for showing the effect of the present method.
【0007】図1において、被切断物6に対し、レーザ
ービーム1がレンズ2で集光され切断ノズル3を通じ照
射される。このとき、アシストガスは切断ノズル3に設
けられたガスノズル4から切断ノズル3内に流入し、被
切断物6に吹きつけられる。更にサイドノズル5から水
のミストを混入したアシストガスが吹きつけられる。In FIG. 1, a laser beam 1 is focused on a material 6 to be cut by a lens 2 and irradiated through a cutting nozzle 3. At this time, the assist gas flows into the cutting nozzle 3 from the gas nozzle 4 provided in the cutting nozzle 3 and is blown to the object 6 to be cut. Further, an assist gas containing a mist of water is blown from the side nozzle 5.
【0008】このようにアシストガスに水のミストを混
入して吹きつけることの効果を図2及び図3について説
明すると、図2に示すように、被切断物6に照射された
レーザービーム1は、切断溝内で100%は吸収されず
薄板程裏面に抜ける量が多いが、アシストガスに水のミ
ストを混入することによって裏に抜ける量を減らすこと
ができ、切断溝内で有効に吸収させることができ、それ
によって、図3に示すように、切断速度が向上できる。
なおこの水のミストの添加量は、被切断物6の材質や切
断面の要求精度により適宜選定すればよく、また薄板の
場合は多目にすることが望ましい。The effect of mixing and blowing the mist of water into the assist gas in this way will be described with reference to FIGS. 2 and 3. As shown in FIG. 2, the laser beam 1 irradiated on the object 6 to be cut is Although 100% is not absorbed in the cutting groove, and the thinner the plate is, the more it escapes to the back surface, but by mixing the mist of water in the assist gas, the amount that escapes to the back surface can be reduced, and it is effectively absorbed in the cutting groove. This can improve the cutting speed, as shown in FIG.
The amount of the water mist added may be appropriately selected according to the material of the object 6 to be cut and the required accuracy of the cut surface, and in the case of a thin plate, it is desirable to increase it.
【0009】かくして、この方法によれば、レーザービ
ーム1により被切断物6を切断するにあたり、アシスト
ガスに水のミストを混入させることによって照射された
レーザービーム1を水のミスト中に吸収することがで
き、それによって被切断物6の裏面に抜けるレーザービ
ーム1を切断溝内に有効に吸収させることができ、ひい
ては切断速度を大きくすることができる。Thus, according to this method, when the object 6 to be cut is cut by the laser beam 1, the laser beam 1 irradiated by mixing the mist of water in the assist gas is absorbed in the mist of water. As a result, the laser beam 1 passing through the back surface of the object 6 to be cut can be effectively absorbed in the cutting groove, and the cutting speed can be increased.
【0010】[0010]
【発明の効果】要するに本発明によれば、被切断物にレ
ーザービームを照射するとともにアシストガスを吹きつ
けて切断するにあたり、上記アシストガスに水のミスト
を混入することにより、被切断物裏面に抜けるレーザー
ビームを切断溝内に有効に吸収させ、切断速度を大きく
し切断能率を大巾に向上させることができるレーザー切
断方法を得るから、本発明は産業上極めて有益なもので
ある。In summary, according to the present invention, when the object to be cut is irradiated with a laser beam and the assist gas is blown to cut the object, the assist gas is mixed with water mist so that the back surface of the object is cut. INDUSTRIAL APPLICABILITY The present invention is extremely useful industrially because a laser cutting method capable of effectively absorbing a laser beam passing therethrough into a cutting groove to increase the cutting speed and greatly improve the cutting efficiency.
【図1】本発明レーザー切断方法の一実施例における実
施要領を示す縦断面図である。FIG. 1 is a vertical cross-sectional view showing the procedure of an embodiment of the laser cutting method of the present invention.
【図2】本方法の効果を示すための板厚と裏に抜けるレ
ーザー量との関係の線図である。FIG. 2 is a diagram showing the relationship between the plate thickness and the amount of laser light passing through the back surface to show the effect of this method.
【図3】本方法の効果を示すための板厚と切断速度との
関係の線図である。FIG. 3 is a diagram showing the relationship between plate thickness and cutting speed for showing the effect of the present method.
1 レーザービーム 2 レンズ 3 切断ノズル 4 ガスノズル 5 サイドノズル 6 被切断物 1 laser beam 2 lens 3 cutting nozzle 4 gas nozzle 5 side nozzle 6 object to be cut
Claims (1)
ともにアシストガスを吹きつけて切断するにあたり、上
記アシストガスに水のミストを混入することを特徴とす
るレーザー切断方法。1. A laser cutting method, wherein a mist of water is mixed into the assist gas when the object to be cut is irradiated with a laser beam and is blown with an assist gas.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3230986A JPH0550280A (en) | 1991-08-19 | 1991-08-19 | Laser beam cutting method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3230986A JPH0550280A (en) | 1991-08-19 | 1991-08-19 | Laser beam cutting method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0550280A true JPH0550280A (en) | 1993-03-02 |
Family
ID=16916442
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3230986A Pending JPH0550280A (en) | 1991-08-19 | 1991-08-19 | Laser beam cutting method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0550280A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006150499A (en) * | 2004-11-29 | 2006-06-15 | Fujitsu Ltd | Laminate body cutting method and laminate body |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5037918A (en) * | 1973-08-09 | 1975-04-09 | ||
JPS62238092A (en) * | 1986-04-09 | 1987-10-19 | Sanoyasu:Kk | Cooling method for laser beam processing |
JPH0289588A (en) * | 1988-09-26 | 1990-03-29 | Seiko Epson Corp | Light working method |
-
1991
- 1991-08-19 JP JP3230986A patent/JPH0550280A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5037918A (en) * | 1973-08-09 | 1975-04-09 | ||
JPS62238092A (en) * | 1986-04-09 | 1987-10-19 | Sanoyasu:Kk | Cooling method for laser beam processing |
JPH0289588A (en) * | 1988-09-26 | 1990-03-29 | Seiko Epson Corp | Light working method |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006150499A (en) * | 2004-11-29 | 2006-06-15 | Fujitsu Ltd | Laminate body cutting method and laminate body |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19970527 |