JPH0548331U - Reduction projection exposure system - Google Patents

Reduction projection exposure system

Info

Publication number
JPH0548331U
JPH0548331U JP9819391U JP9819391U JPH0548331U JP H0548331 U JPH0548331 U JP H0548331U JP 9819391 U JP9819391 U JP 9819391U JP 9819391 U JP9819391 U JP 9819391U JP H0548331 U JPH0548331 U JP H0548331U
Authority
JP
Japan
Prior art keywords
pressure
vacuum
wafer
measuring
reticle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9819391U
Other languages
Japanese (ja)
Inventor
正美 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9819391U priority Critical patent/JPH0548331U/en
Publication of JPH0548331U publication Critical patent/JPH0548331U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】 【構成】真空元圧力測定用圧力センサ1は、真空の発生
源につながっていて、真空圧力に応じた電気信号を出力
する。測定部圧力測定用圧力センサ2も同様に真空圧力
に応じた電気信号を出力し、被吸着部の圧力を測定する
ものである。これらをセレクタ3により選択し、A/D
変換器4を通しCPUへ取り込む。CPUは、各点の測
定データを演算処理し、正確な吸着動作を行っているか
判断する。 【効果】真空元圧力および、真空元圧力と測定部圧力と
の正確な相対圧力が分かることにより、真空元圧力変動
や真空漏れなどの外乱による装置の事故を未然に防ぐこ
とができる。
(57) [Summary] [Structure] The vacuum source pressure measuring pressure sensor 1 is connected to a vacuum source and outputs an electric signal corresponding to the vacuum pressure. Similarly, the pressure sensor 2 for measuring the pressure of the measuring portion outputs an electric signal corresponding to the vacuum pressure to measure the pressure of the adsorbed portion. These are selected by the selector 3 and the A / D
It is taken into the CPU through the converter 4. The CPU arithmetically processes the measurement data at each point and determines whether or not an accurate suction operation is performed. [Effect] By knowing the vacuum source pressure and the accurate relative pressure between the vacuum source pressure and the measurement portion pressure, it is possible to prevent an accident of the device due to a disturbance such as a vacuum source pressure fluctuation or a vacuum leak.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、VLSIを製造する縮小投影露光装置に係り、特に真空によるウェ ハおよびレティクルの吸着固定を行い、吸着状態の判定を正確に行える高信頼性 化を計った縮小投影露光装置に関する。 The present invention relates to a reduction projection exposure apparatus that manufactures VLSI, and more particularly to a reduction projection exposure apparatus that achieves high reliability by performing suction and fixation of a wafer and a reticle by vacuum and accurately determining the suction state.

【0002】[0002]

【従来の技術】[Prior Art]

レティクルおよびウェハの吸着状態を判定する手段を真空圧センサのON/ OFF出力で判断していた。また、真空元圧力測定用圧力センサは無かった。 The means for determining the adsorption state of the reticle and the wafer is determined by the ON / OFF output of the vacuum pressure sensor. Moreover, there was no pressure sensor for measuring the vacuum source pressure.

【0003】[0003]

【考案が解決しようとする課題】[Problems to be solved by the device]

上記従来技術は、真空元圧力変動,配管などからの真空もれによる真空圧力低 下、吸着動作を行うことによって生ずる被吸着物の吸着までの一時的真空圧力低 下等の外乱により、誤動作する可能性が有った。例えばレティクルが実際にあっ て吸着しているにも係らず、真空圧力センサはOFF信号を出力してしまうため 、レティクルが無いと誤判定し、レティクルの二重搬送を行い、レティクルを破 損する等の重大な事故へつながるという問題があった。 The above-mentioned prior art malfunctions due to disturbances such as fluctuations in the vacuum source pressure, vacuum pressure reduction due to vacuum leakage from piping, etc., and temporary vacuum pressure reduction until adsorption of the object to be adsorbed caused by the adsorption operation. There was a possibility. For example, the vacuum pressure sensor outputs an OFF signal even though the reticle is actually adsorbed, so it is erroneously determined that there is no reticle, the reticle is double-transported, and the reticle is damaged. There was a problem that could lead to a serious accident.

【0004】 本考案は、これら欠点を取り除くために、以上のような外乱を検出し、十分裕 度のある吸着状態の判定方法を提供することを目的とする。In order to eliminate these drawbacks, the present invention has an object to provide a method for detecting a disturbance as described above and determining a suction state with a sufficient margin.

【0005】[0005]

【課題を解決するための手段】[Means for Solving the Problems]

上記目的を達成するために真空元圧力測定用圧力センサを付加したものである 。 In order to achieve the above object, a pressure sensor for measuring the vacuum source pressure is added.

【0006】 また、従来の測定部圧力測定用圧力センサをON/OFFのしきい値固定検出 方式から、圧力センサのアナログ値をA/D変換機を用いて、デジタル化し、浮 動しきい値による判定方式にしたものである。In addition, from the conventional pressure sensor for measuring the pressure of the measuring unit, which is a fixed detection threshold value of ON / OFF, the analog value of the pressure sensor is digitized using an A / D converter, and the floating threshold value is detected. The judgment method is based on.

【0007】 さらに、外乱真空圧力変動を探知し、適確な補正を加えるソフトウェアを付加 したものである。Further, software for detecting disturbance vacuum pressure fluctuations and performing appropriate correction is added.

【0008】[0008]

【作用】[Action]

作用を説明するため、図1,図2により説明する。 The operation will be described with reference to FIGS. 1 and 2.

【0009】 真空元圧力測定用圧力センサ1は、真空源につながっていて、真空圧に応じた 電気信号を出力する。測定部圧力測定用圧力センサ2も同様に真空圧に応じた電 気信号を出力する。The vacuum source pressure measuring pressure sensor 1 is connected to a vacuum source and outputs an electric signal according to the vacuum pressure. The pressure sensor 2 for measuring the pressure of the measuring section also outputs an electric signal corresponding to the vacuum pressure.

【0010】 これをセレクタ3により欲しいセンサ出力を選択し選んだ1つの信号をA/D 変換器4によりデジタル化しCPU内へ取り込む。バルブ8は、真空源の真空圧 力をウェハ6及びレティクル7の吸着台へ伝えるか、否かの弁である。CPU5 は、デジタル変換された真空元圧力を基準に各部の真空圧力状態を判断し、吸着 中なのか、大気開放の吸着解除状態なのか、真空元圧力が上がらず、装置の誤動 作の可能性がある状態なのか判断する。真空元圧力低下が、装置正常動作保証範 囲内ならば、適確なしきい値をソフトウェアにより設定し、それを基準として 、吸着中,吸着解除中を判断することが出来るので、誤動作を未然に防げる。The desired sensor output is selected by the selector 3 and one selected signal is digitized by the A / D converter 4 and taken into the CPU. The valve 8 is a valve for transmitting or not transmitting the vacuum pressure of the vacuum source to the suction table of the wafer 6 and the reticle 7. The CPU5 determines the vacuum pressure state of each part based on the digitally converted vacuum source pressure, and the vacuum source pressure does not rise, whether it is in the adsorption state or the adsorption release state released to the atmosphere, and the device may malfunction. Judge whether there is a nature. If the vacuum source pressure drop is within the normal operation guarantee range of the device, an appropriate threshold value can be set by software, and it can be used to judge whether adsorption is in progress or desorption is in progress, thus preventing malfunctions. ..

【0011】[0011]

【実施例】【Example】

以下、本考案の1実施例を図1〜図4により説明する。 An embodiment of the present invention will be described below with reference to FIGS.

【0012】 真空元圧力測定用圧力センサ1,測定部圧力測定用圧力センサ2,圧力センサ の切り替えを行うセレクタ3,セレクトされたアナログ信号をデジタルに変換す るA/D変換器4,CPU5,被吸着体のウェハ6,同じく被吸着体のレティク ル7,吸着ON/OFFを制御するバルブ8で構成されている。Vacuum source pressure measuring pressure sensor 1, measuring section pressure measuring pressure sensor 2, selector for switching the pressure sensor 3, A / D converter 4 for converting the selected analog signal to digital, CPU 5, It is composed of a wafer to be attracted 6, a reticle 7 of the same to be attracted, and a valve 8 for controlling adsorption ON / OFF.

【0013】 次に動作を説明する。Next, the operation will be described.

【0014】 縮小投影露光装置内の真空吸着による被吸着物は、主に、ウェハ6とレティク ル7である。このウェハとレティクルは、縮小投影露光装置内を適宜搬送され、 高精度,高速で位置決めされる。搬送及び位置決め後の固定には、しばしば真空 圧力による吸着固定方法が用いられ、また、ウェハ及びレティクルがその位置に あるかどうかを各部の圧力センサにて確認している。Objects to be adsorbed by vacuum adsorption in the reduction projection exposure apparatus are mainly the wafer 6 and the reticule 7. The wafer and reticle are appropriately transported in the reduction projection exposure apparatus and positioned with high precision and high speed. The vacuum fixing method is often used to fix the wafer after transfer and positioning, and the pressure sensor in each part confirms whether the wafer and reticle are in that position.

【0015】 以下レティクルの吸着に着眼し多数ある測定部圧力測定用圧力センサ2の中で 、レティクル部の圧力を測定する圧力測定センサに着眼する。Of the pressure sensors 2 for measuring the pressure of a large number of measuring units, which are focused on the adsorption of the reticle, the pressure measuring sensor for measuring the pressure of the reticle will be focused on.

【0016】 まず、従来技術を図2,3及び図5により説明する。(ただし真空元圧力測定 用圧力センサ1は、従来技術には付いていない) 図3は、従来の吸着状態判定のON/OFF判定方式での正常動作時の図であ る。まず、吸着をON/OFFするバルブ8がOFF状態のとき、レティクル部 圧力測定用圧力センサ2は、大気中レベルとなっている。このバルブをONにす ると、真空の元圧力が配管を通して吸着用の台とつながりもしレティクル7があ れば吸着を行い、測定点の真空圧力が上がるのでレティクル部圧力測定用圧力セ ンサ2の出力が真空レベルとなる。また、レティクルが無い場合は、この圧力セ ンサの出力は大気レベルとなる。このセンサの出力を2値化制御回路9で2値化 して、吸着状態かどうかの確認としている。この2値化を決めるしきい値は、あ らかじめ電気回路で決定しており図3のa1が吸着OFF確認の正常動作する裕 度を示す。また、バルブON時の吸着中の時の確認の正常動作裕度は、図3の a2となる。First, a conventional technique will be described with reference to FIGS. (However, the pressure sensor 1 for measuring the vacuum source pressure is not included in the conventional technique.) FIG. 3 is a diagram during normal operation in the conventional ON / OFF determination method of the adsorption state determination. First, when the adsorption ON / OFF valve 8 is OFF, the reticle pressure measuring pressure sensor 2 is at the atmospheric level. When this valve is turned ON, the original pressure of the vacuum is connected to the adsorption table through the pipe. If there is a reticle 7, adsorption is performed and the vacuum pressure at the measurement point rises, so the reticle pressure measurement pressure sensor 2 Output becomes the vacuum level. If there is no reticle, the output of this pressure sensor will be atmospheric level. The output of this sensor is binarized by the binarization control circuit 9 to check whether it is in the adsorption state. The threshold value that determines this binarization is determined in advance by an electric circuit, and a1 in FIG. 3 indicates the margin of normal operation for confirmation of adsorption OFF. In addition, the normal operation margin of confirmation when the valve is ON and during adsorption is a2 in FIG.

【0017】 次に従来の吸着状態判定の真空元圧力変動(真空元圧力低下)により裕度がな くなった状態を同じく図3で説明する。元圧力が低下し、真空度が低くなった状 態で、バルブ8をONにするとレティクル部の圧力を測定するレティクル部圧力 測定用圧力センサの出力がしきい値へ近づく値となり、正常動作裕度a2が減少 する。このような状態でバルブ8のONを行い、確認のために測定部圧力測定用 圧力センサ2の値を読み込んだとき、ややもすると吸着していない状態、つまり レティクルが無と誤判断してしまい、レティクルの二重搬送等によるレティクル 破損などの重大事故につながってしまう可能性がある。Next, FIG. 3 will be used to explain a state in which the tolerance is reduced due to the vacuum source pressure fluctuation (vacuum source pressure drop) in the conventional adsorption state determination. When the original pressure is reduced and the degree of vacuum is lowered, turning on the valve 8 causes the output of the reticle pressure measuring pressure sensor, which measures the reticle pressure, to approach the threshold value. The degree a2 decreases. When the valve 8 is turned on in such a state and the value of the pressure sensor 2 for measuring the pressure of the measurement portion is read for confirmation, it may be a little unadsorbed, that is, the reticle is erroneously determined to be absent. , There is a possibility of causing a serious accident such as damage to the reticle due to double transportation of the reticle.

【0018】 これを防止するための本考案の1実施例を図1,2及び図4で説明する。An embodiment of the present invention for preventing this will be described with reference to FIGS. 1, 2 and 4.

【0019】 本考案では、真空元圧力測定用圧力センサ1を付加した。更に各真空圧力セン サのアナログ信号を高精度にデジタル変換するA/D変換器4を付加した。これ により、正確な次の値を検出することが出来る。In the present invention, a pressure sensor 1 for measuring vacuum source pressure is added. Furthermore, an A / D converter 4 for highly accurately converting the analog signal of each vacuum pressure sensor into a digital signal was added. This makes it possible to detect the next accurate value.

【0020】 1.真空元圧力とその変動、2.被測定部の圧力とその変動、3.真空元圧力 と被測定部との相対圧力。1. Vacuum source pressure and its fluctuation, 2. 2. Pressure of the measured part and its fluctuation, Relative pressure between the vacuum source pressure and the measured part.

【0021】 これにより、まず真空元圧力が異常の場合それを直接異常と判断でき、装置が 誤動作することが無い。Thus, if the vacuum source pressure is abnormal, it can be directly determined to be abnormal, and the device does not malfunction.

【0022】 さらに、吸着ON/OFF判定用しきい値をソフトウェアで、逐次設定できる ようにした浮動しきい値設定方式とした。これにより真空元圧力変動が生じても 裕度a3,a4が確保される。このa3,a4は、各部真空圧力を常に測定して CPUにより、 しきい値=(a7+a6)/2 …(数1) の演算処理を行い、現在のしきい値として、設定している。但し元圧力の変動 範囲は、無限ではなく、ある許容値を越えると元圧力異常とし、装置を止め異常 の表示をするようにした。Further, a floating threshold value setting system is adopted in which the adsorption ON / OFF determination threshold value can be sequentially set by software. As a result, the tolerances a3 and a4 are secured even if the vacuum source pressure changes. These a3 and a4 are set as current threshold values by constantly measuring the vacuum pressure of each part and performing arithmetic processing of threshold value = (a7 + a6) / 2 ... (Equation 1) by the CPU. However, the range of fluctuation of the source pressure is not infinite, and if it exceeds a certain allowable value, the source pressure becomes abnormal and the device is stopped and an error is displayed.

【0023】 以上により、本実施例によれば、真空元圧力変動、さらには配管の破損,配管 の抜け等によるレティクルの有り無しの誤判定がなくなりひいては、レティクル 破損等の重大事故発生防止を未然に防ぐという効果がある。As described above, according to the present embodiment, the erroneous determination of the presence or absence of the reticle due to the fluctuation of the vacuum source pressure, the damage of the pipe, the disconnection of the pipe, etc. is eliminated, and the serious accident such as the damage of the reticle is prevented. The effect is to prevent.

【0024】[0024]

【考案の効果】[Effect of the device]

本考案は、以上説明したように構成されているので以下に記載される効果を奏 する。 Since the present invention is configured as described above, it has the following effects.

【0025】 真空元圧力が測定できることにより、測定部真空圧力との正確な相対圧力が分 かり、吸着中,吸着解除中を判断する適確なしきい値の設定ができ、それによっ て外乱の影響を受けない裕度のある判定が出来るため、装置が誤動作することが ない。また、真空元圧力が異常の場合、それを直接異常と判断でき、装置が誤動 作することがない。さらに、レティクルの有り無しの誤判定がなくなり、レティ クルの二重搬送などによる破損等の重大事故を未然に防ぐことができる。Since the vacuum source pressure can be measured, the accurate relative pressure with the vacuum pressure of the measuring part can be known, and an accurate threshold value for determining whether adsorption or desorption is in progress can be set, and thereby the influence of disturbance The device does not malfunction because it can be judged with a margin that is not affected by it. Also, if the vacuum source pressure is abnormal, it can be directly judged as abnormal, and the device will not malfunction. In addition, the erroneous determination of the presence or absence of the reticle is eliminated, and a serious accident such as damage due to double transportation of the reticle can be prevented.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の1実施例のブロック図である。FIG. 1 is a block diagram of an embodiment of the present invention.

【図2】本考案の1実施例の構成図である。FIG. 2 is a block diagram of an embodiment of the present invention.

【図3】従来の吸着状態判定のON/OFF判定方式の
図である。
FIG. 3 is a diagram of a conventional ON / OFF determination method for determination of a suction state.

【図4】本考案の1実施例の浮動しきい値設定方式での
判定裕度が向上した状態の図である。
FIG. 4 is a diagram showing a state in which the judgment margin is improved in the floating threshold value setting method according to the embodiment of the present invention.

【図5】従来技術のブロック図である。FIG. 5 is a block diagram of the prior art.

【符号の説明】[Explanation of symbols]

1…真空元圧力測定用圧力センサ、2…測定部圧力測定
用圧力センサ、3…セレクタ、4…A/D変換器、5…
CPU、6…ウェハ、7…レティクル、8…真空バル
ブ、9…2値化制御回路。
DESCRIPTION OF SYMBOLS 1 ... Pressure sensor for measuring vacuum source pressure, 2 ... Pressure sensor for measuring measuring section pressure, 3 ... Selector, 4 ... A / D converter, 5 ...
CPU, 6 ... Wafer, 7 ... Reticle, 8 ... Vacuum valve, 9 ... Binary control circuit.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】レティクル上の原画パターンを縮小レンズ
を通して縮小し、ウェハ上に高精度で焼き付ける機能を
有し、かつ前工程でウェハ上に焼かれたウェハ粗位置合
わせ用マーク(プリアライメントマーク)を検出し、粗
位置合わせ終了後、露光ステージへウェハを高精度搬送
する機能、さらに露光ステージへ搬送されたウェハ位置
を精検出し、前記レティクル上の原画パターンとウェハ
上パターンを相対合わせする機能を有し、かつレティク
ル原画およびウェハを真空吸着による固定と真空圧力セ
ンサによる吸着確認を行う機能を有し、真空元圧力が測
定できる真空圧力センサ、被測定部の真空圧力が測定で
きる1つ又は複数の真空圧力センサを有し、真空元圧力
と測定部圧力との正確な相対圧力を知る手段を有するこ
とにより、十分裕度のある吸着状態の判定ができる機能
を有し、それらを制御するCPU,コントローラ,ドラ
イバより成ることを特徴とする縮小投影露光装置。
1. A rough alignment mark (pre-alignment mark) for a wafer, which has a function of reducing an original image pattern on a reticle through a reduction lens and baking it on a wafer with high accuracy, and which is baked on a wafer in a previous process. Function to accurately transfer the wafer to the exposure stage after completion of rough alignment, and to precisely detect the position of the wafer transferred to the exposure stage and to align the original pattern on the reticle with the on-wafer pattern. And has a function of fixing the reticle original image and the wafer by vacuum suction and performing suction confirmation by a vacuum pressure sensor, and is capable of measuring the vacuum source pressure, a vacuum pressure sensor capable of measuring the vacuum pressure of the measured portion, or With multiple vacuum pressure sensors and means for knowing the accurate relative pressure between the vacuum source pressure and the measurement section pressure, it is possible to A function that allows determination of the adsorption state with, CPU for controlling them, the controller, a reduction projection exposure apparatus, characterized in that resulting from the driver.
JP9819391U 1991-11-28 1991-11-28 Reduction projection exposure system Pending JPH0548331U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9819391U JPH0548331U (en) 1991-11-28 1991-11-28 Reduction projection exposure system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9819391U JPH0548331U (en) 1991-11-28 1991-11-28 Reduction projection exposure system

Publications (1)

Publication Number Publication Date
JPH0548331U true JPH0548331U (en) 1993-06-25

Family

ID=14213172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9819391U Pending JPH0548331U (en) 1991-11-28 1991-11-28 Reduction projection exposure system

Country Status (1)

Country Link
JP (1) JPH0548331U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005209859A (en) * 2004-01-22 2005-08-04 Matsushita Electric Ind Co Ltd Wafer transfer handling method, and semiconductor manufacturing apparatus using the same
JP2007266503A (en) * 2006-03-29 2007-10-11 Nec Electronics Corp Semiconductor manufacturing device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005209859A (en) * 2004-01-22 2005-08-04 Matsushita Electric Ind Co Ltd Wafer transfer handling method, and semiconductor manufacturing apparatus using the same
JP2007266503A (en) * 2006-03-29 2007-10-11 Nec Electronics Corp Semiconductor manufacturing device
JP4582715B2 (en) * 2006-03-29 2010-11-17 ルネサスエレクトロニクス株式会社 Semiconductor manufacturing apparatus, and apparatus and method for sensitivity adjustment

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