JPH0547864A - Probe - Google Patents

Abstract

PURPOSE:To improve reliability of a probe which is in contact with a semiconductor integrated circuit element formed in a wafer. CONSTITUTION:A tilting surface is formed in a pressing member which presses a contact point to a test element and the tilting surface is opposed to the contact point through an elastic body. When reaction is applied to the contact point, an elastic body 6C is elastically deformed and a posture of the contact point 2 is changed by the elastic formation of the elastic body 6C. When the posture of the contact point changes, sliding is generated between the contact point 2 and a contact part and the contact point 2 is self-cleaned.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe used when testing the operation of a semiconductor integrated circuit element formed on a semiconductor wafer.

[0002]

2. Description of the Related Art Conventionally, in the process of manufacturing an IC, before cutting an integrated circuit element formed on a semiconductor wafer into chips, an operation test is carried out in the state of the wafer to judge pass / fail. The present invention relates to the improvement of the probe used in this case.

FIG. 5 shows the entire structure of a conventional probe, and FIG. 6 shows the structure of the main part of the probe. In FIG. 5, reference numeral 1 denotes an object to be measured. The DUT 1 is a semiconductor wafer here. As is well known for semiconductor wafers
Several hundred integrated circuit elements are formed. Reference numeral 2 indicates a contact which comes into contact with an electrode formed on this integrated circuit element. The contact 2 is formed so as to project on the surface of the insulating film 3 as shown in FIG. Although not particularly shown in the insulating film 3,
A wiring pattern for connecting each contact 2 to the test apparatus main body (not particularly shown) is formed. This wiring pattern is extendedly formed on the periphery of the insulating film 3.

The peripheral edge of the insulating film 3 is pressed against the printed wiring board 5 by the holder 4, and
The wiring pattern formed on the substrate is electrically connected to the printed wiring board. An elastic biasing means 6 is provided at a position where the contact 2 of the insulating film 3 is formed. This elastic biasing means 6
Thus, the insulating film 3 is pushed downward to give a tension to the whole and the contact 2 is elastically brought into contact with the device under test.

As shown in FIG. 6, the elastic biasing means 6 inserts an elastic body 6A, a pushing member 6B composed of a rigid body, and an elastic body 6C in this order into a recess 4A formed in the holder 4 to elastically push the pushing member 6B. The elastic body 6A is biased downward via the body 6C by the biasing force of the elastic body 6A.

[0006]

In the conventional probe of this type, the contact 2 is pushed toward the device under test by the pushing member 6B having a planar shape. Therefore, the contact 2 is pushed vertically to the device under test formed on the device under test 1, and the contact 2 only comes into contact with and separates from the device under test and does not have an opportunity to slide. As a result, the contact 2 has conventionally not been provided with a cleaning function, so that there is a drawback that a contact failure accident is likely to occur.

An object of the present invention is to provide a cleaning function for the contact 2 and to provide a probe of this type in which a contact failure accident is unlikely to occur.

[0008]

According to the present invention, a contact is projected on the surface of an insulating film to bring the contact into contact with a device under test, and a test device and a device under test are provided through a wiring pattern formed on the contact and the insulating film. In the circuit testing device for electrically connecting between and, and testing the quality of the device under test, an inclined surface is formed on the pressing member that presses the contact against the device under test, and between the inclined surface and the contact. The elastic body is inserted, and a reaction force is applied from the contact point to elastically deform the elastic body, and the elastic deformation displaces the contact point to an inclined posture along the inclined surface.

According to the structure of the present invention, when the contact is displaced in the inclined posture according to the inclined surface of the pushing member, the contact slides on the electrode of the device under test, and the cleaning action is obtained. Therefore, according to the present invention, the reliability of the contact 2 is improved, which has the advantage that the reliability of the entire test apparatus can be improved.

[0010]

FIG. 1 shows an embodiment of the present invention. In the present invention, the pushing member 6B housed in the recess 4A of the holder 4
A slanted surface SLP is formed on the sloping surface and the slanted surface SLP faces the contact 2. In the state where no pressing force is applied to the contact 2, the elastic body 6C does not elastically deform with respect to the inclined surface SLP and maintains the protruding shape.

When the printed wiring board 5 shown in FIG. 5 is pushed down and the device under test is pressed against the contact 2, the elastic body 6C is elastically deformed by the pressing force along the inclined surface SLP formed on the pressing member 6B. (See FIG. 2). In the process of elastically deforming, the contact 2 is displaced in an inclined posture on the electrode of the device under test and slightly slid with respect to the device under test, so that the contact 2 is cleaned.

3 and 4 show a modified embodiment of the present invention. In the example of FIG. 3, the elastic body 6C is provided with an inclined surface PLS opposite to the inclined surface SLP formed on the pressing member 6B so that a large stroke from the start of contact of the contact 2 to the stop of the descending operation of the contact 2 can be obtained. The case where it is configured is shown. The example of FIG. 4 shows a case where the pushing member 6B is formed with an inclined surface PLS in the opposite direction and the contact 2 is displaced in the direction toward the inside.

[0013]

As described above, according to the present invention, when the elastic biasing means 6 presses the contact 2, the portion of the elastic biasing means 6 facing the contact 2 is elastically deformed by the reaction force applied from the contact 2. Then, the posture of the contact 2 is displaced. Due to this displacement of the contact 2, the contact 2 slides on the contact portion, and a cleaning action is obtained.

Therefore, when contacting the integrated circuit element, the contact 2 slides on the contact part, so that the contact 2 and the mating contact part are reliably brought into contact with each other by the cleaning action. Therefore, it is possible to provide a probe in which a contact failure accident is unlikely to occur.

[Brief description of drawings]

FIG. 1 is an enlarged sectional view showing an embodiment of the present invention.

FIG. 2 is an enlarged sectional view for explaining the operation of the embodiment shown in FIG.

FIG. 3 is an enlarged sectional view showing a modified embodiment of the present invention.

FIG. 4 is an enlarged sectional view similar to FIG.

FIG. 5 is a sectional view for explaining the structure of the entire probe.

FIG. 6 is an enlarged cross-sectional view for explaining a conventional technique.

[Explanation of symbols]

 1 DUT 2 Contact point 3 Insulating film 4 Holder 5 Printed wiring board 6 Elastic biasing means 6A Elastic body 6B Pushing member 6C Elastic body SLP, PLS Slope

Claims (1)

[Claims] 1. A plurality of contacts are provided on a surface of an insulating film so that the plurality of contacts are brought into contact with a device under test, and the test device and the device under test are connected through the contact and a wiring pattern formed on the insulating film. In the circuit test device for electrically connecting the test element to test the quality of the device under test, an inclined surface is formed on the pressing member that presses the contact against the device under test, and an elastic body is provided between the inclined surface and the contact. A probe which is inserted and elastically deforms an elastic body by a reaction force from a contact, and the elastic deformation of the elastic body displaces the contact in an inclined posture along the inclined surface.