JPH0547840A - Mounting of liquid crystal panel - Google Patents
Mounting of liquid crystal panelInfo
- Publication number
- JPH0547840A JPH0547840A JP20072891A JP20072891A JPH0547840A JP H0547840 A JPH0547840 A JP H0547840A JP 20072891 A JP20072891 A JP 20072891A JP 20072891 A JP20072891 A JP 20072891A JP H0547840 A JPH0547840 A JP H0547840A
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- connection
- crystal panel
- driving
- magnetized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
- H01L2224/171—Disposition
- H01L2224/17104—Disposition relative to the bonding areas, e.g. bond pads
- H01L2224/17106—Disposition relative to the bonding areas, e.g. bond pads the bump connectors being bonded to at least one common bonding area
- H01L2224/17107—Disposition relative to the bonding areas, e.g. bond pads the bump connectors being bonded to at least one common bonding area the bump connectors connecting two common bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75733—Magnetic holding means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
- H01L2224/81121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
Landscapes
- Wire Bonding (AREA)
- Liquid Crystal (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、液晶パネルの実装方式
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal panel mounting method.
【０００２】[0002]
【従来の技術】従来、液晶パネルと液晶駆動用ＩＣを粒
子を介して接続する実装方法においては、液晶駆動用Ｉ
Ｃの位置ぎめは、パターンの認識や、外形形状による方
法を用いているが、装置の複雑化により、多くの時間を
必要としていた。また、液晶パネルのカラー化や高精細
化に伴い、接続ピッチが細かくなると、ますます装置が
複雑化になり、多くの時間を必要となる。また、接続に
おける位置ずれにより、接続に関する粒子の数が減少
し、信頼性が低下する要因となってしまう。2. Description of the Related Art Conventionally, in a mounting method in which a liquid crystal panel and a liquid crystal driving IC are connected through particles, a liquid crystal driving IC is used.
Positioning of C uses a method of recognizing a pattern and a method based on an outer shape, but it requires a lot of time due to the complexity of the device. Further, as the connection pitch becomes finer with the colorization and high definition of the liquid crystal panel, the device becomes more complicated, and much time is required. Further, due to the positional deviation in the connection, the number of particles relating to the connection is reduced, which causes a decrease in reliability.
【０００３】[0003]
【発明が解決しようとする課題】本発明が解決しようと
する課題は、液晶パネルの接続ピッチが細かくなること
によって装置が複雑になったり、時間が多くかかること
である。また、接続における位置ずれにより、接続に関
する粒子の数が減少し、信頼性が低下する要因になるこ
とである。The problem to be solved by the present invention is that the device becomes complicated and takes a lot of time due to the fine connection pitch of the liquid crystal panel. In addition, the positional deviation in the connection reduces the number of particles related to the connection, which causes a decrease in reliability.
【０００４】[0004]
【課題を解決するための手段】本発明は、液晶パネルの
接続ピッチが細かくなっても装置の複雑化をまねかない
方法を提供することを目的としている。SUMMARY OF THE INVENTION It is an object of the present invention to provide a method which does not complicate the device even if the connection pitch of the liquid crystal panel becomes fine.
【０００５】本発明においては、液晶パネルの引出し電
極部に、磁性メッキを施し、駆動用ＩＣの電極部または
接続に用いる粒子に磁性メッキを施している。前記引出
し電極部と、前記駆動用ＩＣの電極部または前記接続に
用いる粒子の両方を磁化している。In the present invention, the extraction electrode portion of the liquid crystal panel is magnetically plated, and the electrode portion of the driving IC or particles used for connection is magnetically plated. Both the extraction electrode portion and the electrode portion of the driving IC or the particles used for the connection are magnetized.
【０００６】[0006]
【作用】本発明において、磁化された前記液晶パネルの
引出し電極部と、磁化された前記駆動用ＩＣの電極部ま
たは前記接続に用いる粒子を対向させると、磁力により
引き付けあう。このため、図２（ａ）の様に初期の位置
合わせにおいてずれが生じていても、図２（ｂ）の様に
前記接続に用いる粒子の位置が矯正される。この矯正作
用により、初期の位置合わせの精度については、着磁力
の強さにもよるが、接続に求められるピッチの３０％程
度でも良くなる。In the present invention, when the magnetized extraction electrode portion of the liquid crystal panel and the magnetized electrode portion of the driving IC or the particles used for the connection face each other, they are attracted by the magnetic force. Therefore, even if a deviation occurs in the initial alignment as shown in FIG. 2A, the position of the particles used for the connection is corrected as shown in FIG. 2B. With this correcting action, the accuracy of the initial alignment can be about 30% of the pitch required for the connection, although it depends on the strength of the magnetic attraction force.
【０００７】[0007]
【実施例】図１に本発明の実施例を示す。液晶パネル１
に、引出し電極部２がある。前記引出し電極部２と駆動
用ＩＣ３の電極部４の間には、電気的な接続に用いる粒
子５がある。前記引出し電極部２は、従来ＩＴＯまたは
ＩＴＯ上に金属のメッキをほどこしたものにより構成さ
れているが、本発明においては、ＩＴＯ上に、ニッケル
めっきを施し、尚その上に、コバルト−ニッケル−リン
などの磁性メッキを施してある。前記引出し電極部２
は、液晶パネルを組み上げ、前記駆動用ＩＣ３を実装す
る前の工程において、磁気ヘッドを用いて縞状に磁化し
ている。EXAMPLE FIG. 1 shows an example of the present invention. LCD panel 1
In addition, there is the extraction electrode section 2. There are particles 5 used for electrical connection between the extraction electrode portion 2 and the electrode portion 4 of the driving IC 3. The lead-out electrode portion 2 is conventionally made of ITO or ITO plated with a metal, but in the present invention, ITO is nickel-plated, and cobalt-nickel- Magnetic plating such as phosphorus is applied. The extraction electrode section 2
In the process before assembling the liquid crystal panel and mounting the driving IC 3, the magnetic head is used to magnetize in stripes.
【０００８】前記駆動用ＩＣ３の電極部４は通常のアル
ミパッド上にコバルト−ニッケル−リンなどの磁性メッ
キを施して、前記引出し電極部２に実装する前の工程に
おいて、磁気ヘッドにより縞状に磁化している。The electrode portion 4 of the driving IC 3 is magnetically plated with cobalt-nickel-phosphorus or the like on an ordinary aluminum pad, and is striped by a magnetic head in a step before being mounted on the extraction electrode portion 2. It is magnetized.
【０００９】前記駆動用ＩＣ３の電極部４と前記引出し
電極部２に縞状に磁化するのは、短い磁気回路を多数形
成して磁力を強化するためである。The reason why the electrode portion 4 of the driving IC 3 and the lead-out electrode portion 2 are magnetized in stripes is to form a large number of short magnetic circuits to enhance the magnetic force.
【００１０】前記接続に用いる粒子５は、電気的接続を
とるために表面は導電体で構成されている。該粒子に磁
性をもたせるには、例えば有機系の樹脂を核にして無電
解のニッケルメッキを施し熱処理をしたり、該粒子の核
に当たる部分に、酸化鉄、アルニウム−ニッケル−鉄合
金、ニッケル−鉄合金などの磁性体と樹脂を混合したも
のを用い、表面に導電性のメッキを施した物でもよい。The surface of the particles 5 used for the connection is made of a conductor in order to make an electrical connection. In order to impart magnetism to the particles, for example, electroless nickel plating is performed using an organic resin as a nucleus and heat treatment is performed, or iron oxide, arnium-nickel-iron alloy, nickel- A mixture of a magnetic material such as an iron alloy and a resin may be used, and the surface of the mixture may be conductively plated.
【００１１】前記駆動用ＩＣ３の電極部４には前記接続
に用いる粒子５をあらかじめ配置してある。この配置方
法においても磁力を用いている。Particles 5 used for the connection are previously arranged on the electrode portion 4 of the driving IC 3. Magnetic force is also used in this arrangement method.
【００１２】治具６に吸着させた前記駆動用ＩＣ３を、
前記液晶パネル１の引出し電極部２と対向させて接近さ
せると、前記駆動用ＩＣ３の電極部４と前記引出し電極
部２の間には、前記接続に用いる粒子５を介して磁気回
路が形成され、磁力によってひきつけあう。この際、前
記治具６の吸着を切ることにより、前記駆動用ＩＣ３
は、磁力によって自己整列作用が生じ、所定の位置に配
置させることが出来る。前記駆動用ＩＣ３及び前記接続
に用いる粒子５を前記液晶パネル１の引出し電極部２に
固定するには、位置合わせ終了後に固定用の樹脂を注入
すればよい。なお、固定する際には電気的導通性を高め
るため、圧力をかけるのがよい。また、位置合わせにお
いて不具合が生じた場合においては、磁化部分の脱磁を
おこなうことによるか、治具での吸着により実現でき
る。The driving IC 3 attracted to the jig 6 is
When facing and approaching the extraction electrode section 2 of the liquid crystal panel 1, a magnetic circuit is formed between the electrode section 4 of the driving IC 3 and the extraction electrode section 2 through the particles 5 used for the connection. , Attract by magnetic force. At this time, by cutting off the adsorption of the jig 6, the driving IC 3
Are self-aligned by the magnetic force and can be arranged at a predetermined position. To fix the driving IC 3 and the particles 5 used for the connection to the extraction electrode portion 2 of the liquid crystal panel 1, a fixing resin may be injected after the alignment is completed. In addition, when fixing, it is preferable to apply pressure in order to enhance electrical conductivity. Further, when a problem occurs in alignment, it can be realized by demagnetizing the magnetized portion or by adsorbing with a jig.
【００１３】[0013]
【発明の効果】本発明による効果は、着磁力の強さにも
よるが、初期の位置合わせの精度が接続ピッチの３０％
程度でも良くなり、装置の複雑化をまねかないという効
果がある。The effect of the present invention depends on the strength of the magnetic attraction force, but the initial alignment accuracy is 30% of the connection pitch.
There is an effect that the degree is improved and the device is not complicated.
【図１】 本発明の実施例を示す図。FIG. 1 is a diagram showing an embodiment of the present invention.
【図２】 本発明の実施例の透視図。FIG. 2 is a perspective view of an embodiment of the present invention.
１ 液晶パネル ２ 引出し電極部 ３ 駆動用ＩＣ ４ 電極部 ５ 接続に用いる粒子 ６ 治具 1 Liquid crystal panel 2 Extraction electrode part 3 Driving IC 4 Electrode part 5 Particles used for connection 6 Jig
Claims (1)
て接続する液晶パネルの実装方法において、液晶パネル
の引出し電極部にメッキを施して磁化し、駆動用ＩＣの
電極部にメッキを施して磁化し、接続に用いる粒子に磁
性をもたせ、前記液晶パネルの引出し電極部と前記駆動
用ＩＣの電極部の磁力により、前記接続に用いる粒子を
最適位置に移動して電気的接続をすることを特徴とした
液晶パネルの実装方法。1. A method of mounting a liquid crystal panel, wherein a liquid crystal panel and a liquid crystal driving IC are connected through particles, wherein a lead electrode portion of the liquid crystal panel is plated and magnetized, and an electrode portion of the driving IC is plated. The particles used for connection are magnetized, and the particles used for connection have magnetism, and the particles used for connection are moved to an optimum position for electrical connection by the magnetic force of the extraction electrode section of the liquid crystal panel and the electrode section of the driving IC. LCD panel mounting method characterized by.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20072891A JPH0547840A (en) | 1991-08-09 | 1991-08-09 | Mounting of liquid crystal panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20072891A JPH0547840A (en) | 1991-08-09 | 1991-08-09 | Mounting of liquid crystal panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0547840A true JPH0547840A (en) | 1993-02-26 |
Family
ID=16429203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20072891A Pending JPH0547840A (en) | 1991-08-09 | 1991-08-09 | Mounting of liquid crystal panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0547840A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1463030A2 (en) | 2003-03-26 | 2004-09-29 | Yamaha Corporation | Reverberation sound generating apparatus |
-
1991
- 1991-08-09 JP JP20072891A patent/JPH0547840A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1463030A2 (en) | 2003-03-26 | 2004-09-29 | Yamaha Corporation | Reverberation sound generating apparatus |
| US7217879B2 (en) | 2003-03-26 | 2007-05-15 | Yamaha Corporation | Reverberation sound generating apparatus |
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