JPH0547388B2 - - Google Patents

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a thin film attachment technique, and in particular, to a technique that is effective when applied to a thin film attachment technique for attaching a thin film to a substrate surface. .

[Prior art]

2. Description of the Related Art Printed wiring boards used in electronic devices such as computers have a predetermined pattern of wiring made of copper or the like formed on one or both sides of an insulating substrate.

This type of printed wiring board can be manufactured by the following manufacturing process.

First, a laminate film consisting of a photosensitive resin (photoresist) layer and a transparent resin film (protective film) to protect it is thermocompression bonded onto a conductive layer (copper thin film) provided on an insulating substrate. Laminate.
This thermocompression bonding lamination is carried out in mass production using a thin film pasting device called a laminator. Thereafter, a wiring pattern film is placed on the laminate film, and the photosensitive resin layer is exposed to light for a predetermined period of time through the wiring pattern film and a translucent resin switch. After the transparent resin film is peeled off using a peeling device, the exposed photosensitive resin layer is developed to form an etching mask pattern. Thereafter, unnecessary portions of the conductive layer are removed by etching, and the remaining photosensitive resin layer is further removed to form a printed wiring board having a predetermined wiring pattern.

[Problem to be solved by the invention]

However, in the conventional thin film pasting method, a laminate consisting of a photosensitive resin (photoresist) layer and a transparent resin film (protective film) to protect it is placed on a conductive layer provided on an insulating substrate. Films are laminated by thermocompression bonding, but the surface of the conductive layer has minute irregularities, and when the conductor layer surface and the laminated film are laminated, air remains in the minute irregularities on the surface of the conductive layer. Voids occur on the adhesive surface between the layer surface and the laminate film,
There was a problem in that the adhesiveness between the surface of the conductor layer and the laminate film decreased.

Moreover, this also caused a problem in that the reliability of the wiring on the printed circuit board decreased.

The present invention has been made to solve the above problems.

An object of the present invention is to provide a thin film pasting technique that can improve the reliability of a substrate to which a thin film is pasted.

Another object of the present invention is to provide a technique that can improve the reliability of printed circuit boards.

Another object of the present invention is to provide a technique that can prevent air bubbles from forming on the adhesive surface between the conductive layer (copper layer) surface of the substrate on which the conductive layer is formed and the laminate film. be.

Another object of the present invention is to provide a technique that can remove residual anti-bubble agent on a substrate to which a thin film is attached after a pressure roller in a bonding technique.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means to solve the problem]

In order to achieve the above object, the means (1) of the present invention is to apply a bubble preventive agent to the thin film at a position before the substrate is transported to the thin film attachment position of the substrate transport path, and The tip of the thin film in the supply direction is attached to the surface of the substrate, and a pressure roller is brought into contact with the tip of the thin film at the attached position, and the rotation of the pressure roller conveys the substrate and applies the thin film to the substrate. A method for attaching a thin film to be attached, in which a bubble preventive agent is attached to the substrate at a position before the substrate is transported to the thin film attachment position, and a bubble preventive agent is attached to the substrate to which the thin film is attached at a stage subsequent to the pressure roller. It is characterized by removing residual antifoaming agent.

The means (2) of the present invention is to attach the leading end in the feeding direction of the thin film to the surface of the leading end in the transporting direction of the substrate in the substrate transporting path, and to contact the leading end of the thin film at this adhesion position with a pressure roller, A thin film adhering device that conveys the substrate and applies a thin film to the substrate by rotation of a pressure roller, the thin film adhering device being disposed at a position before the substrate is conveyed to the thin film adhesion position. a wet roller that attaches the anti-bubble agent to the substrate;
A means for supplying the anti-foam agent almost uniformly from the inside of the wet roller toward the surface thereof, and a means for removing the anti-foam agent remaining on the substrate to which the thin film is attached after the pressure roller are provided. Features.

A short shaft slidable in the axial direction is provided near at least one shaft end of the wet roller, and by moving the short shaft in the axial direction, the wet roller can be freely attached to and removed from the main body of the apparatus. It is characterized by being said to be.

[Effect]

As described above, the present invention provides a method for attaching a bubble preventive agent to a substrate, which is disposed below the attachment position of the frame of the substrate transport path device, at a position called a temporary attachment position, before the substrate is conveyed. By providing a wet roller and a means for supplying the anti-foam agent almost uniformly from the inside of the wet roller to the surface, the anti-foam agent can be supplied almost uniformly over the entire area of the wet roller,
Before the substrate is transported to the temporary bonding position, the anti-bubble agent can be applied almost uniformly to the substrate, so that the surface of the conductor layer and the thin film are brought into close contact, and the adhesion between the surface of the conductor layer and the thin film is improved. It is possible to prevent the formation of voids on the surface.

In addition, by providing a means for removing the remaining anti-bubble agent on the substrate to which the thin film is attached after the pressure roller, it is possible to remove stains and dirt on the substrate to which the thin film is attached. The reliability and yield of pattern formation during exposure can be improved.

Thereby, it is possible to improve the adhesiveness between the substrate and the thin film, and to improve the reliability of the wiring of the printed circuit board.

[Embodiments of the invention]

Hereinafter, an embodiment of the present invention will be described based on the drawings, in which the present invention is applied to a thin film pasting device for thermocompression laminating a laminate film consisting of a photosensitive resin layer and a translucent resin film to a printed wiring board. Explain in detail.

In addition, in all the figures for explaining the examples,
Components having the same function are given the same reference numerals, and repeated explanations thereof will be omitted.

FIG. 1 (schematic configuration diagram) shows a thin film adhering device which is an embodiment of the present invention.

As shown in FIG. 1, a laminate switch 1 having a three-layer structure of a translucent resin film, a photosensitive resin layer, and a translucent resin film is continuously wound around a supply roller 2. The laminate film 1 of the supply roller 2 is a laminate made of a transparent resin film (protective film) 1A, a photosensitive resin layer with one side (adhesive surface) exposed, and a transparent resin film by the thin film separation roller 3. It is separated into body film 1B. The separated translucent resin film 1A is configured to be wound up by a winding roller 4.

The tip of the laminate film 1B separated by the thin film separation roller 3 in the feeding direction is shown in FIGS. 1 and 2.
As shown in the figure (partially enlarged view of FIG. 1), it is configured to be attracted to a main vacuum plate 10 through a tension roller 9.

The tension roller 9 is configured to apply appropriate tension to the laminate film 1B between the supply roller 2 and the main vacuum plate (thin film supply member) 10. In other words, the tension roller 9 is configured so as not to cause wrinkles or the like on the supplied laminated film 1B.

The main vacuum plate 10 is configured to supply the laminate film 1B from the supply roller 2 onto the conductive layer (eg, copper thin film layer) of the insulating substrate 11. Main vacuum plate 10
As shown in FIGS. 1 and 2, is provided on a support member 12 that is close to the insulating substrate 11 and away from it (moves in the direction of arrow B). Support member 1
2 is provided in the device main body (casing of the thin film applicator) 7 so that the guide member 7A can be slid in the direction of arrow B. The support member 12 is an insulating substrate 11
They are provided in pairs above and below the transport path. The upper support member 12 and the lower support member 12 operate in conjunction with each other by a rack and pinion mechanism. (both of them approach or move away at the same time). In other words, the pair of upper and lower support members 12 are operated in conjunction with the racks 12A provided on the respective racks 12A and the pinions 12B fitted with the racks 12A. This operation of the support member 12 is performed by a drive source 12C provided in the lower support member 12. The drive source 12C is composed of, for example, an air cylinder. Further, the drive source 12C can be configured with a hydraulic cylinder, an electromagnetic cylinder, a step motor, a transmission mechanism that transmits the displacement to the support member 12, and the like.

The main vacuum plate 10 is provided on the support member 12 so as to approach and move away from the insulating substrate 11 (moves in the direction of arrow C) independently of movement of the support member 12. The main vacuum plate 10 is configured to operate by a drive source 12D provided on the support member 12 and a rack and pinion mechanism. This rack and pinion mechanism includes a pinion 12E provided on the drive source 12D, a rack 12F provided on the support member 12, and a rack 10A provided on the main vacuum plate 10. Drive source 12
D is composed of the same drive source 12C.

The drive source 12C and the drive source 12D are each configured with an air cylinder, for example, and are controlled by an electromagnetic valve.

Although not shown, the main vacuum plate 10 is provided with a plurality of suction holes for sucking and holding the laminated film 1B. This suction hole is connected to a vacuum source such as a vacuum pump through an exhaust pipe. The suction operation of the main vacuum plate 10 and the suction operation of the temporary attachment part 10E are configured to be independently controlled.

At the tip of the main vacuum plate 10 in the feeding direction of the laminate film 1B, a temporary attaching part 10E is provided, the surface of which attracts the laminate film 1B is formed in an arc shape. Temporary attachment part 10E
is constructed integrally with the main vacuum plate 10. As shown in FIGS. 1 and 2, a heater 10F for heating the arc-shaped portion is provided inside the temporary attachment portion 10E. Temporary attachment part 10E
The tip of the laminate film 1B supplied by the main vacuum plate 10 is connected to the insulating substrate 11.
It is configured to be temporarily bonded (temporary thermocompression bonded) onto the conductive layer.

In addition, the present invention provides main vacuum plate 1.
0 and the temporary attachment part 10E are each constructed from separate members,
Both may be supported by the support member 12.

A sub-vacuum plate (thin film holding member) 13 is provided at a position close to the temporary attachment part 10E, that is, near the supply path of the laminate film 1B between the temporary attachment part 10E and the insulating substrate 11. ing. Although the suction holes are not shown, the subvacuum plate 13 has an upper suction part 13a and a lower suction part 13b, and is configured in a U-shape, as shown in FIG. The part marked with a square corresponds to the cutting position of the laminate film 1B). The upper suction part 13a of the subvacuum plate 13 mainly consists of
It is configured to attract the leading end of the laminate film 1B in the supply direction and to adsorb (hold) it on the tacking section 10E. Subbakyum plate 13 is
Via a drive source 13A made of, for example, an air cylinder, which moves toward and away from the supply path of the laminate film 1B (moves in the direction of arrow D) so that the leading end of the laminate film 1B can be adsorbed to the temporary attachment part 10E. and is attached to the support member 12.

Further, the lower adsorption section 13b of the sub-vacuum plate 13 cuts the continuous laminate film 1B with the cutting device 14, and adsorbs the rear end of the cut laminate film 1B, thereby supplying the laminate film 1B. configured to remain within the path. After the start of thermocompression lamination, the lower suction part 13b is connected to the second rotary vacuum plate 15.
As shown in the figure, a slack is formed in the laminated film 1B (the laminated film 1 with slack is formed).
B′). The laminated film 1B' having this slack is formed by controlling the supply speed of the laminated film 1B of the main vacuum plate 10 to be faster than the circumferential speed of the thermocompression roller 16 (thermocompression lamination speed). can do. Although not shown, both are controlled by a sequence control circuit.

In addition, the driving source 1 of the subvacuum plate 13
In addition to an air cylinder, the drive source 3A may be configured with a hydraulic cylinder or the like, similar to the drive source 12C.

There is a cut in the main body 7 of the apparatus near the supply path of the laminated film 1B between the temporary attachment part 10E and the insulating substrate 11 (actually, between the temporary attachment part 10E and the rotary vacuum plate 15). A device 14 is provided (fixed). Specifically, the cutting device 14 cuts the sub-vacuum plate 13 when the rear end of the laminate film 1B is fed to the cutting position.
It is configured in a position opposite to. Cutting device 14
is a front-stage transport device 17 that transports the insulating substrate 11.
(or this front-stage conveyance device 17
). The cutting device 14 is configured to cut the laminated film 1B continuously supplied by the main vacuum plate 10 into a predetermined length corresponding to the dimensions of the insulating substrate 11.

The laminate film 1B whose tip end is temporarily bonded (temporarily thermocompression bonded) onto the conductive layer of the insulating substrate 11 at the temporary attachment portion 10E of the main vacuum plate 10 shown in FIGS. 1 and 2 is thermocompression bonded. The entire body is laminated by thermocompression using rollers 16. The thermocompression roller 16 presses the laminate film 1B.
During the tacking operation of tacking the tip of the tacking section 10E, the thermocompression roller 16, which is placed at the evacuated position shown by the dotted line in FIG.
(1) is configured so as not to come into contact with the tacking portion 10E that moves close to the tacking position during the tacking operation.
After the tacking operation, the thermocompression roller 16 is configured to move from a retracted position indicated by a dotted line labeled 16(1) to a tacked position indicated by a solid line labeled 16(2). The thermocompression roller 16 moved to the temporary attachment position
(2) is configured to sandwich the insulating substrate 11 with the laminate film 1B interposed therebetween.

The rear end of the laminated film 1B cut by the cutting device 14 is guided by a triangular rotating vacuum plate 15 so as not to cause wrinkles, etc.
It is configured to be laminated by thermocompression using a thermocompression roller 16. Rotating vacuum plate 15
is configured to be supported on the same axis as the thermocompression roller 16 and rotate around it, and although not shown, a plurality of suction holes 15A are provided on the suction surface facing the laminated film 1B. It is provided. The structure of the suction surface on which the suction holes 15A are arranged is similar to the suction surface of the main vacuum plate 10. Although not shown, suction holes may also be provided on the upper surface of the rotary vacuum plate 15. With this configuration, as shown in FIG.
B′ can be formed more easily.

As shown in FIGS. 1 and 2, the insulating substrate 11 is transferred to a thin film pasting device by a pre-stage conveyance device 17 composed of a driving conveyance roller (lower stage) 17A and an idle conveyance roller (upper stage) 17B. The laminated film 1B is transported to the temporary attachment position.

The pre-transfer device 17 is provided with a water adhesion roller device 30 for adhering water (bubble prevention agent) to the insulating substrate 11 before the substrate 11 is transferred to the temporary attachment position.

The wet roller device 30 for water adhesion is shown in FIG. 3 (a top plan view of the lower wet roller portion of the wet roller device for water adhesion shown in FIG. 1),
As shown in FIG. 4 (a view seen from the direction of arrow P in FIG. 3) and FIG. 5 (a cross-sectional view taken along line A-A in FIG. 4), A pair of lower wet rollers 31A and upper wet rollers 31B are rotatably attached to the frame 17C of the first-stage conveyance device 17.

The pair of lower wet rollers 31A and upper wet rollers 31B are arranged as shown in FIG. 6 (perspective view) and FIG. 7 (cross-sectional view for explaining the arrangement of water supply holes (drainage holes) shown in FIG. 6). For example, the water supply pipe 32 is made of a cylindrical body made of rust-resistant metal such as stainless steel, anti-corrosion treated aluminum, or hard plastic and has a plurality of water supply holes 32A, 32B.The surface of the water supply pipe 32 is made of a porous material such as a sponge that easily absorbs water. A covering layer 33 made of a substance is provided (FIG. 5).

A plurality of water supply holes 3 provided in the water supply pipe 32 of the lower wet roller 31A are provided.
2A and 32B are water supply holes 32A and 32B, and water supply holes 32 in the radial direction of the water supply pipe 32, respectively.
B and 32B are provided facing each other, and the pair of water supply holes 32A and the pair of water supply holes 32B are provided with a phase shift of 90 degrees at a predetermined interval.
Note that the water supply holes may be provided in a staggered manner.
Moreover, a pair of water supply holes 32A and a pair of water supply holes 3
2B means changing the phase by 60 degrees or 120 degrees at specified intervals.
It may be shifted by degrees.

The water supply pipe 32 of the lower wet roller 31A is detachably connected to the connecting devices 34 and 35 provided on the rotating shafts 31A ₁ and 31A ₂ of the lower wet roller 31A.

In addition, the rotating shaft 31 of the lower wet roller 31A
_A1 is rotatably connected to the same drive source via a bearing device 31AL so as to rotate in synchronization with the drive conveyance roller 17A. This bearing device 31
The AL is attached to the frame 17C of the front-stage transport device 17 with fixing screws.

Further, the other rotating shaft _31A2 of the lower wet roller 31A is rotatably supported by a bearing device 31AR. This rotating shaft 31A ₂ has
A gear 36 is attached. 37 is a bearing.

Lower wet roller 31 of the water supply pipe 32
A water supply device 38 is provided at the left end of A, and a drainage device 39 is provided at the right end. Similarly, a water supply device 38 is provided at the left end of the water supply pipe 32 of the upper wet roller 31B, and a drain device 39 is provided at the right end.
The water supply device 38 and the drainage device 39 are each attached to the frame 17C of the front-stage conveyance device 17 by an attachment frame.

The upper wet roller 31B is a floating roller, and rotation shafts 31 ₁ and 31B ₂ are provided at both ends of the water supply pipe 32.
Each of these rotating shafts 31B ₁ and 31B ₂ is provided with a bearing (bush) 40 made of a softer bearing material than the frame 17C. The bearing 40 of the upper wet roller 31B is fitted into a U-shaped groove 41 provided in the frame 17C and is detachable.

Further, as shown in FIG. 4, a gear 70 that meshes with the gear 36 attached to the rotation shaft 31A ₂ is attached to the right end of the rotation shaft 31B ₂ of the upper wet roller 31B via an attachment member 71. There is.

Thereby, the rotation of the lower wet roller 31A is transmitted to the upper wet roller 31B.

Next, the detailed configuration of the water supply device 38 (drainage device 39) will be explained.

The water supply device 38 (drainage device 39) supplies water to its support member 42, as shown in FIG. The pipe 32 is passed through it and rotatably sealed with a ring 43. A dam 44 is provided at the center of the support member 42.
4 is connected to a water supply hole (drain hole) 45, and a water supply port (drain port) 46 is provided at the end of this water supply hole 45. A water supply pipe 3 is installed in the dam 44.
The water supply pipe 32 and the supporting member 42 of the water supply device 38 (drainage device 39) are arranged so that the water supply hole (drainage hole) 32A or 32B provided in the water supply pipe 32 and the water supply device 38 (drainage device 39) are located.

Next, the detailed structure of the connecting devices 34 and 35 will be explained using FIGS. 10 to 14.

FIG. 10 shows the connecting device 34 and the rotating shaft 31.
FIG. 3 is a cross-sectional view of the main parts of A ₁ and the bearing device 31AL.

The coupling device 34 on the rotating shaft 31A ₁ side is connected to the first
As shown in Figure 0, the pulley 51 of the rotating shaft _31A1
A guide groove 52 is provided integrally with the rotating shaft 31A ₁ at the center of the end opposite to the portion where the rotation shaft 31A 1 is attached. This rotating shaft 31A ₁ has a guide groove 5.
A guide hole 53 concentric with the rotating shaft 31A ₁ is provided from the inside of the pulley 51 toward the pulley 51 . A connecting guide bar 55 is fitted into the guide hole 53 via a spring 54 made of, for example, a coil. Further, the guide groove 5 of the rotating shaft _31A1
A long through hole 56 is provided at a predetermined position in the portion 2. A stopper pin 57 that is slidably fitted into the through hole 56 is provided at a predetermined position of the connecting guide bar 55 (FIG. 11). Also,
As shown in FIG. 11, the connecting guide bar 55
A connecting protruding member 58 is provided integrally with the connecting guide bar 55 at the tip end on the water supply pipe 32 side.

Further, on the water supply pipe 32 side of the coupling device 34, as shown in FIG. A connecting groove 61 is provided in the center of the connecting protrusion member 60 to engage with the connecting protruding member 58 on the rotating shaft _31A1 side.

Further, the coupling device 35 of the rotating shaft 31A ₂ is connected to the first
As shown in Fig. 3 and Fig. 14, the rotating shaft 31A ₂
A connecting guide groove 62 is provided at the tip portion opposite to the portion where the gear 36 is attached. Then, the rotating shaft 3
A connecting member 63 is provided in the radial direction of _1A2 .

Further, the water supply pipe 32 side of the connection device 35 has a connection member 5 provided at the end of the water supply pipe 32, as shown in FIG. 12, similar to the connection device 34.
A connecting protrusion member 60 is integrally formed with the connecting member 59 at the center of the connecting protrusion 60, and a connecting groove 61 that engages with the connecting member 63 on the rotating shaft _31A2 side is provided at the center of the connecting protruding member 60. .

Next, the operation of the coupling devices 34 and 35 will be briefly explained.

First of all, the connecting groove 61 on the water supply pipe 32 side of the connecting device 35 and the connecting member 6 on the rotating shaft _31A2 side.
3, and push the connecting protrusion member 60 of the connecting device 34 on the rotating shaft 31A ₁ side by hand against the spring 54 to connect the connecting protruding member 58 on the rotating shaft 31 A ₁ side and the water supply pipe 32 side. Engage with the connecting groove 61 and release the hand. As a result, the water supply pipe 32
are securely connected to the rotating shafts 31A ₁ and 31A ₂ , and the lower wet roller 31A is attached.

The lower wet roller 31A is connected to the rotating shaft 31.
When removing it from A ₁ and the rotating shaft 31A ₂ , use the stopper pin 57 of the coupling device 34 on the rotating shaft 31A ₁ side.
is moved to the pulley 51 side by hand against the spring 54, and the connecting protrusion member 60 is pushed in, thereby connecting the connecting protruding member 58 on the rotating shaft _31A1 side and the water supply pipe 3.
Disengage the connection groove 61 on the 2nd side and remove the connection device 35.
The connecting groove 61 on the water supply pipe 32 side and the rotating shaft 31
Disengage the connection member 63 on the _A2 side.

Furthermore, when mounting the upper wet roller 31B, as described above, the bearings 40 provided on both parts of the water supply pipe 32
The upper wet roller 31B is fitted into the U-shaped groove 41 provided in the U-shaped groove 7C and is detachable, so that the upper wet roller 31B can be attached by lifting it by hand, and when it needs to be removed, it can also be removed by lifting it by hand.

Also, Fig. 15 (front view), Fig. 16 (Fig. 15
As shown in FIG. 17 (cross-sectional view taken along line C-C in the figure) and FIG. A water absorption device 80 is rotatably provided.

As shown in FIGS. 15 to 17, this water absorption device 80 includes a pair of water suction rollers, a lower water absorption roller 81A and an upper water absorption roller 81B. The lower water-absorbing roller 81A and the upper water-absorbing roller 81B each have a water-absorbing layer 83 made of a porous material such as sponge coated on the surface of a drainage pipe 82 having a drainage hole 82A. A drainage device 84 is provided at both ends of the water absorption layer 83. This drainage device 84 has a similar structure to the water supply device shown in FIGS. 8 and 9. The drainage device 84 is attached to a support member 85 with a mounting pin 86 (which serves as a rotation axis) such that it can rotate freely. This support member 85 is connected to the air cylinder 8
It is attached to a support frame 88 whose movement is controlled by 7. This support frame 88 is connected to the support frame 88 via a slide guide member 88A.
It is slidably supported by B. Support frame 8
8B is attached to the frame of the main body of the device.

In addition, collars 89 are interposed at both ends of the drainage device 84 of the drainage pipe 82, and a free roller 90
is provided. This free roller 90 is for rotating the lower water absorption roller 81A and the upper water absorption roller 81B following the rotation of the thermocompression bonding roller 16(2). It is designed so that it can be pulled in and rotated. That is, when the free roller 90 is used, it is brought close to the thermocompression roller 16(2) by the air cylinder 87 until it comes into contact with the thermocompression roller 16(2). Moreover, the free roller 90 of the lower water absorption roller 81A and the free roller 90 of the upper water absorption roller 81B are respectively attached, but their positions are shifted so that they do not collide with each other during rotation.

In addition, the lower water absorption roller 81A, the upper water absorption roller 81
B and the free roller 90 are integrally rotated following the rotation of the thermocompression roller 16(2), and in order to resist the rotational force and return them to their original positions, the support members 85 are , the support member 85
A tension spring 91 is provided that attracts.

The drainage device 84 is adapted to be suctioned by a suction device.

In this way, the water absorbing device 80 for removing water on the substrate to which the thin film is attached is rotatably provided downstream of the thermocompression roller 16(2). Since stains and stains such as water drop marks do not occur on the laminated film 1B attached to the film 11, the reliability and yield of pattern formation by exposure can be improved.

Further, as shown in FIGS. 1 and 2, after the laminate film 1B is temporarily pressed onto the main vacuum plate 10, an air blowing nozzle is used to separate the laminate film 1B from the main vacuum plate 10. 100 are arranged.

As shown in FIG. 18, the air blowing nozzle 100 is connected to a compressed air generator 102 via an air blowing speed regulator 101 to adjust the air blowing speed as necessary.

The reason why the air blowing nozzle 100 is provided is that the insulating substrate 11 is coated with water and the laminate film 1B is attached so that the tip of the temporary attaching part 10E provided at the tip of the main vacuum plate 10 gets wet with water, and As the water vapor is cooled and condensed by the temporary attachment part 10E and the main vacuum plate 10, the laminate film 1B adheres to the temporary attachment part 10E and the main vacuum plate 10, and follows the movement of the main vacuum plate 10. This is because the laminate film 1B will peel off from the insulating substrate 11 to which it has been temporarily attached. This is provided to prevent this peeling.

In FIG. 18, 103 is a pump unit, 105 is a flow rate adjustment valve that adjusts the flow rate of water supplied to the lower wet roller 31A and upper wet roller 31B, 106 is a trap for removing water from the suction flow, and 107 is a water valve. It is a saucer.

Further, as shown in FIG. 18, the lower wet roller 31A is rotated by the transport roller driving belt, which causes the upper wet roller 31B to rotate, and as the insulating substrate 11 is transported, it rotates and becomes insulating. Water is applied to the surface of the substrate 11. The remaining water at that time is received in the water tray 107 and passed through the drainage hose to the pump unit 103.
It is now being sent to In addition, water removed when the insulating substrate 11 and the laminate film 1B' are bonded together by the thermocompression roller 16(2) and the insulating substrate 11 to which the laminate film 1B' is bonded are removed.
The water adhering to the water is also received by the water tray 107,
The water is sent to the pump unit 103 through a drainage hose.

Further, the flow rate to the lower wet roller 31A and the upper wet roller 31B is controlled by adjusting the flow rate of water from the pump unit 103 with the flow rate adjustment valve 105, as shown in FIG. Water is supplied to the upper wet roller 31B.

In this way, before the insulating substrate 11 and the laminate film 1B' are conveyed to the temporary attachment position, the lower wet roller 3 of the water adhesion wet roller device 30 is
1A, an anti-bubble agent such as water is applied to the insulating substrate 11 using the upper wet roller 31B, and the laminated film 1B is brought into contact with the temporary attaching portion 10E on the surface of the tip of the insulating substrate 11 in the conveyance direction. After tacking the tip of the laminate film 1B' in the feeding direction and separating the tacking portion 10E from the surface of the insulating substrate 11, a thermocompression roller 16( 2) and press the thermocompression roller 1.
6(2) to convey the insulating substrate 11 and to place the laminate film 1 on the insulating substrate 11.
By pasting B', the insulating substrate 11
When the surface of the conductive layer and the laminate film 1B' are laminated, the water accumulated in the minute recesses on the surface of the conductive layer removes air bubbles and removes the photoresist (water-soluble photosensitive material) of the laminate film 1B'. In the case of a conductor layer surface and the laminated film 1B', it melts the resin and acts as an adhesive, so it not only makes the surface of the conductor layer and the laminated film 1B' stick together, but also creates voids in the adhesive surface between the surface of the conductor layer and the laminated film 1B'. ) can be prevented from occurring.

Thereby, it is possible to improve the adhesiveness between the insulating substrate 11 and the laminate film 1B', and to improve the reliability of the wiring on the printed circuit board.

Further, as the photoresist (photosensitive resin) of the laminate film 1B, an aqueous solution is suitable.

Further, as the anti-bubble agent adhesive, a surface tension adjusting agent, a copper surface adhesive, etc. may be added to water in some cases.

As shown in FIG. 1, the front-stage transport device 17 has a sensor that detects the position of the leading end of the insulating substrate 11 in the transport direction near the substrate transport path (substrate leading edge detection position) before the temporary attachment position. A sensor S1 is arranged. This detection sensor S1 is configured to output a detection signal that starts the operation of a preset counter of a microcomputer (CPU) when detecting the leading end of the insulating substrate 11 in the transport direction. The preset counter is configured to output a control signal to stop the leading end of the insulating substrate 11 in the conveyance direction at the temporary attachment position when the preset required dimension is artificially set in advance. Detection sensor S
1 is composed of, for example, a photoelectric switch.

The front-stage transport device 17 also includes a detection sensor S2 that detects the position of the rear end of the insulating substrate 11 in the transport direction near the substrate transport path (substrate rear end detection position) before the detection sensor S1. is located. Similar to the detection sensor S1, the detection sensor S2 is configured to output a detection signal that starts the operation of the preset counter of the CPU when the rear end of the insulating substrate 11 in the conveying direction is detected. When the required time set artificially in advance has elapsed, the preset counter forms a slack portion 1B' in the rear end of the laminated film 1B in the feeding direction, and cuts the laminated film 1B at the cutting position. It is configured to output a control signal for cutting the laminated film 1B by the device 14 and laminating the cut laminate film 1B on the insulating substrate 11 by thermocompression bonding the rear end portion in the feeding direction. Furthermore, the preset counter sets the rear end of the laminate film 1B in the feeding direction to the insulating substrate 1.
1 and outputs a control signal to move the thermocompression roller 16 from the temporary attachment position to the vicinity of the retreat position. The detection sensor S2 is configured, for example, by a photoelectric switch, similarly to the detection sensor S1.

In addition, a rear conveyance device 18 composed of a conveyance roller (lower stage) 18A and a conveyance roller (upper stage) 18B.
The insulating substrate 11, on which the laminate film 1B is laminated by thermocompression bonding, is conveyed to an exposure device for forming a wiring pattern using a thermocompression roller 16 of a thin film pasting device.

Temporary attachment part 1 of the main vacuum plate 10
The apparatus main body 7 (or the front-stage conveyance device 17, or the support member 1) near the movement path (thin film supply path) of 0E
2) is provided with a thin film correction device 19, as shown in FIGS. 1 and 2. Thin film correction device 1
9 is configured to straighten the leading end of the laminate film 1B' in the feeding direction in the direction of bringing it into close contact with the temporary attachment part 10E (in the direction of arrow G). The thin film straightening device 19 includes a fluid transport pipe 19A extending in the width direction of the laminated film 1B, and a plurality of fluid spray holes 19B provided in the fluid transport pipe 19A.

The fluid transport pipe 19A has a hollow interior and is configured to flow fluid at a pressure higher than normal pressure. Although the fluid transport pipe 19A has a substantially circular cross-sectional shape in this embodiment, the cross-sectional shape is not limited to this, and may be rectangular or elliptical.

The fluid spray holes 19B are provided so as to spray fluid in a direction to straighten the laminated film 1B.

As the fluid used in the thin film correction device 19, air is used. Further, as the fluid, a gas such as an inert gas, or a liquid such as water or oil may be used.

Furthermore, the apparatus main body 7 (or the front-stage conveyance device 17, or the support member 12) near the laminated film 1B' supplied between the lower suction part 13b of the sub-vacuum plate 13 and the rotating vacuum plate 15 is , as shown in Figures 1 and 2,
A thin film ejection device 20 is provided. That is, the thin film ejecting device 20 is configured to form the laminated film 1B' with the slack in the direction of bringing it into close contact with the thermocompression roller 16 (in the direction of arrow H). The thin film protrusion device 20 is a laminate film 1B.
A liquid conveying pipe 2 provided extending in the supply width direction of
0A, and a plurality of fluid spray holes 20B provided in this fluid transport pipe 20A.

The fluid transport pipe 20A has a hollow interior and is configured to flow fluid at a pressure higher than normal pressure. Although the cross-sectional shape of the fluid transport pipe 20A is configured to be approximately circular in this embodiment, the fluid is not limited to this like the transport pipe 19A, and may be configured to have a rectangular or elliptical shape.

The fluid spray holes 20B are provided so as to spray fluid in a direction that causes the slack of the laminated film 1B' to protrude as described above.

As the fluid used in the thin film ejection device 20, air is used as in the thin film correction device 19. Further, as the fluid, a gas such as an inert gas, or a liquid such as water or oil may be used.

In addition, in the present invention, the thin film straightening device 19 or the thin film protruding device 20 is configured to apply a fluid so as to straighten or protrude a plurality of laminate films 1B provided in the width direction of the laminate film 1B in an appropriate direction as described above. It may be configured with a fluid spray nozzle.

Further, the present invention uses the thin film straightening device 19 or the thin film protruding device 20 to apply fluid so as to straighten or protrude a plurality of laminate films 1B provided in the width direction of the laminate film 1B in an appropriate direction as described above. It may be configured with a fluid spray nozzle.

In addition, according to the present invention, the thin film correction device 19 or the thin film protrusion device 20 is provided by a suction tube extending in the width direction of the laminate film 1B and a plurality of laminate films 1B provided in this suction tube. It may also be configured with a suction hole that sucks in a direction that corrects or protrudes in an appropriate direction.

Further, in the present invention, the thin film straightening device 19 or the thin film protruding device 20 may be constituted by a protruding member that straightens or protrudes the laminated film 1B in an appropriate direction as described above.

Further, in the present invention, the thin film straightening device 19 can also be used as the thin film protruding device 20, or the thin film protruding device 20 can also be used as the thin film straightening device 19.

The thermocompression roller 16(2) placed at the temporary attachment position
In the device main body 7 (or the subsequent conveyance device 18) between the drive conveyance roller 18A of the second conveyance device 18,
As shown in FIGS. 1 and 2, a substrate guide member 21 is provided. The board guide member 21 is
It is configured to guide the insulating substrate 11 on which the laminate film 1B is thermocompression laminated from the thermocompression lamination position (temporary attachment position) to the positions of the transport rollers 18A and 18B. The substrate guide member 21 has, for example, a comb-like shape in which a plurality of rod-shaped portions extending in the transport direction of the insulating substrate 11 are arranged in the transport width direction. The comb-shaped substrate guide member 21 can reduce the contact area with the insulating substrate 11 and reduce frictional resistance when transporting the insulating substrate 11, so that it can guide the insulating substrate 11 smoothly. can.

Note that in the present invention, the substrate guide member 21 may have a net-like structure or a plate-like structure.

Next, a method of thermocompression laminating the laminate film 1B using the thin film pasting apparatus of this embodiment will be briefly described with reference to FIGS. 1 and 2.

First, as shown in FIGS. 1 and 2, the leading end in the feeding direction of the laminate film 1B separated by the thin film separation roller 3 is manually cut between the sub-vacuum plate 13 and the cutting device 14. Place it between.

Next, the tip of the laminate film 1B is sucked by the sub-vacuum plate 13. After adsorption of the laminate film 1B, the laminate film 1 is moved by the driving source 13A.
The sub-vacuum plate 13 is moved to a position away from the supply path of B, and the tip of the laminate film 1B is attracted to the temporary attachment part 10E. At this time, the suction operation of the main vacuum plate 10 and the temporary attachment part 10E is performed, and the thin film straightening device 19 can straighten the laminate film 1B.
The leading end of the laminate film 1B' can be reliably attracted to 0E. Incidentally, when the continuous operation is performed, the leading end of the laminated film 1B cut by the cutting device 14 is attracted to the temporary attachment part 10E.

Next, the drive conveyance roller 17 of the front conveyance device 17
The insulating substrate 11 is transported by the floating transport rollers 17A and 17B.

Then, before the insulating substrate 11 is transported to the temporary attachment position, water is applied to the surface of the insulating substrate 11 by the lower wet roller 31A and the upper wet roller 31B.

Next, the tip of the insulating substrate 11 in the transport direction is
When passing the substrate tip detection position, the detection sensor S1 is activated and the position is detected. The detection signal of this detection sensor S1 is input to the CPU and operates a preset counter. This preset counter stops the leading end of the insulating substrate 11 in the transport direction at the temporary attachment position. A predetermined time set in advance is counted.

Furthermore, the detection signal of the detection sensor S1 is
Activate other preset counters. Another preset counter is used to set the start time for bringing the tacking section 10E close to the conveying path while the leading edge of the insulating substrate 11 in the conveying direction is being conveyed from the substrate tip detection position to the tacking position. configured to count.

In this state, the temporary attachment part 10E (main vacuum plate 10) is located at the start position of the temporary attachment operation, and the thermocompression roller 16 is arranged at the retracted position. The start position of the tacking operation is a position where the drive source 12D for moving the main vacuum plate 10 is activated while the upper and lower support members 12 are stopped closest to the substrate transport path.

Next, while the leading end portion of the insulating substrate 11 in the transport direction is being transported from the substrate leading end detection position to the tacking position, the tacking unit 10E starts approaching. This temporary attachment part 10
The proximity operation of E is started by controlling the drive source 12D by the CPU based on the output signal of the other preset counter mentioned above.

Next, based on the output signal of the preset counter, when the leading end of the insulating substrate 11 in the conveyance direction reaches the temporary attachment position, the conveyance of the insulating substrate 11 is stopped. Substantially at the same time as this insulating substrate 11 stops,
Or, a little later than that, the tacking part 10E that moves close comes into contact with the leading end in the conveying direction on the conductive layer of the insulating substrate 11, and the leading end of the laminate film 1B adsorbed by the tacking part 10E is pulled. Temporary bonding (temporary thermocompression bonding).

In this way, in the method of pasting the laminate film 1B, the leading end of the insulating substrate 11 in the transport direction is detected at the board leading end detection position before being transported to the temporary mounting position, and based on this detection signal, Insulating substrate 11
The leading end of the insulating substrate 11 in the transporting direction is stopped after being transported from the substrate leading edge detection position to the tacking position, and while the leading end of the insulating substrate 11 in the transporting direction is being transported from the detection position to the tacking position, the tacking part 10E is After bringing the insulating substrate 11 close to the substrate transport path and stopping the leading end in the transport direction of the insulating substrate 11 at the tacking position, the tacking part 1
By temporarily attaching the leading end of the laminate film 1B in the supply direction onto the conductive layer of the insulating substrate 11 at 0E,
During the time for transporting the leading edge of the insulating substrate 11 in the transport direction from the substrate leading edge detection position to the temporary attachment position, a part of the time for moving the temporary attachment part 10E close to the conveyance path is incorporated, so that the temporary attachment part 10E is Since the substantial time for close movement (the time from the stop of the leading end of the insulating substrate 11 in the transport direction to the end of the tacking operation at the tacking position) is shortened, the time for attaching the laminate film 1B is shortened. can do.

As a result, 1B of laminate film per unit time
Since the number of times of pasting can be increased, the production capacity for thin film pasting can be improved.

When the temporary attachment part 10E comes into contact with the leading end in the conveyance direction on the conductive layer of the insulating substrate 11, the drive source 12D is activated. This operation is input to the CPU, and after the CPU holds the tacking operation for a predetermined period of time, the adsorption operation of the main vacuum plate 10 and the tacking section 10E is stopped, and the drive sources 12C and 12D are used to The attaching portion 10E is moved away from the conveyance path. This separation causes the drive sources 12C and 12D to move the main vacuum plate 1 to a position further away from the position shown in FIGS. 1 and 2.
0. Temporary attachment part 10E and sub-vacuum plate 1
Move 3. This amount of movement is proportional to the amount of slack that the laminate film 1B' has.

Here, before the drive sources 12C and 12D move the main vacuum plate 10 and the temporary attachment part 10E away from the conveyance path, the main vacuum plate 10, the temporary attachment part 10E, the sub-vacuum plate 13, and the laminate film 1B are Air is blown between the main vacuum plate 10 and the temporary attachment part 10 by using an air blowing nozzle 100.
E and the laminate film 1B are separated.

Next, the thermocompression roller 16 is moved from the retracted position shown by the dotted line to the tacking position shown by the solid line, and the leading end in the feeding direction of the thermocompression roller 16 is brought into contact with the tacking laminated film 1B.

Next, by rotating the insulating substrate 11 while holding it between the thermocompression rollers 16, the laminate film 1B is thermocompression laminated onto the conductive layer of the insulating substrate 11. At this time, the suction operation of the main vacuum plate 10, the temporary attachment part 10E, and the sub vacuum plate 13 is stopped, so the thermocompression roller 16 has its rotational force and the clamping force of the insulating substrate 11. With force, laminate film 1B
is automatically supplied from the supply roller 2.

Then, the remaining bubble preventing agent on the insulating substrate 11 to which the laminated film 1B is attached is removed by a water absorbing device 80 at the downstream stage of the thermocompression roller 16.

Next, a certain amount of the laminate film 1B is thermocompression laminated, and the rear end of the insulating substrate 11 in the transport direction is detected by the detection sensor S2 at the substrate rear end detection position shown in FIG. The detection signal of the substrate rear end detection sensor S2 is input to the CPU, and the suction operations of the main vacuum plate 10, the sub vacuum plate 13, and the rotating vacuum plate 15 are started substantially simultaneously. Then, the drive source 12 is
C, the support member 12 is moved, and the main vacuum plate 10 is used to excessively supply the laminate film 1B to the insulating substrate 11 side, and as shown in FIG. Then, the rear end (cutting position) of the laminate film 1B in the feeding direction is aligned with the cutting position of the cutting device 14. The supply speed of the laminate film 1B (the moving speed of the support member 12) is set faster than the thermocompression laminating speed (the circumferential speed of the thermocompression roller 16) by the thermocompression roller 16(2).

In this state, the laminate film 1B
The laminated film 1B' can be formed in which a slack is provided between the sub-vacuum plate 13 and the rotating vacuum plate 15. Both ends of the laminated film 1B' with the slack in the supply direction are corrected by the thin film correction device 19, so that the lower suction portion 13b of the sub-vacuum plate 13,
It can be reliably attracted to each of the rotary vacuum plates 15.

Next, the rear end of the laminate film 1B in the feeding direction, which is aligned with the cutting position of the cutting device 14, is cut by the cutting device 14 into a predetermined size corresponding to the size of the insulating substrate 11. Then, the laminate film 1
The thermocompression roller 16 is moved in the same direction as the substrate conveyance direction while thermocompression laminating the rear end in the feeding direction of B.

Next, the thermocompression roller 16 is moved onto the insulating substrate 11 until the rear end of the laminate film 1B in the feeding direction is substantially laminated onto the conductive layer of the insulating substrate 11 by thermocompression bonding using the rotary vacuum plate 15. Move with transportation. This thermocompression roller 16 is
It is possible to move close to the evacuation position. The rotary vacuum plate 15 has a thermocompression bonding roller 1
The rear end of the laminate film 1B is laminated onto the conductive layer of the insulating substrate 11 by thermocompression bonding. In other words, when the rotary vacuum plate 15 rotates at a speed slightly slower than the rotation speed of the thermocompression roller 16, it is possible to apply an appropriate tension to the laminate film 1B between it and the thermocompression roller 16. 1B can be laminated by thermocompression bonding without causing wrinkles or the like.

Next, when the thermocompression bonding lamination is completed, the thermocompression bonding roller 16 moves from the vicinity of the retracted position to the retracted position in a direction away from the substrate conveyance path.

Further, the present invention provides the insulating substrate 11 of the above embodiment.
After preheating the insulating substrate 11, the present invention can be applied to a thin film pasting device that heat-presses and laminates the laminate film 1B onto the insulating substrate 11 using a non-heated pressure roller.

Further, the present invention can be applied to a thin film pasting device for pasting a protective film on a decorative board used as a construction material.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to prevent the generation of air bubbles on the adhesive surface between the substrate and the thin film, thereby improving the adhesiveness between the substrate and the thin film.

Furthermore, since stains and dirt on the substrate to which the thin film is attached can be removed, reliability and yield of pattern formation during exposure can be improved.

As a result, it is possible to improve the adhesiveness between the substrate and the thin film, and to improve the reliability of the wiring of the printed circuit board.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram for explaining the schematic configuration of a thin film sticking device that is an embodiment of the present invention, FIG. 2 is a partially enlarged configuration diagram of FIG. 1, and FIG. 1 is a top plan view of the lower wet roller portion of the water adhesion roller device shown in FIG. Cross-sectional view taken along line A-A, No. 6
The figure is a perspective view showing the schematic structure of the water supply pipe shown in Fig. 5, Fig. 7 is a cross-sectional view for explaining the arrangement of the water supply holes shown in Fig. 6, and Fig. 8 is the water supply pipe shown in Fig. 4. 9 is an enlarged cross-sectional view taken along line BB in FIG. 8; FIGS. 10 to 14 are diagrams for explaining the detailed structure of the connecting member; FIG. 15 is a sectional view of the main parts of the device; is a diagram for explaining the schematic configuration of the water supply device, FIG. 16 is a sectional view taken along line C-C in FIG. 15,
FIG. 17 is a side view of FIG. 15, and FIG. 18 is a diagram for explaining the schematic system configuration of the water supply section and water absorption section of the thin film pasting device of this embodiment. In the figure, 1B... laminate film (thin film), 7...
...Device body, 10...Main vacuum plate (thin film supply member), 10E...Temporary attaching part, 11...Insulating substrate, 13...Sub vacuum plate (thin film holding member), 14...Cutting device, 15...Rotating vacuum plate, 16...Thermocompression bonding roller, 3
0...Bubble prevention wet roller device, 31A.3
1B...Water roller, 32...Water supply pipe,
34, 35... Connection device, 80... Water absorption device, 1
00...Air blow nozzle.

Claims (1)

[Claims] 1. A bubble preventive agent is attached to the thin film at a position before the substrate is transported to the thin film attachment position in the substrate transport path, and a bubble preventive agent is applied to the surface of the leading end in the transport direction of the substrate at the leading end in the supply direction of the thin film. Attach it to the tip of the thin film at the attached position,
A thin film pasting method in which a pressure roller is brought into contact with the substrate and the thin film is pasted on the substrate while the substrate is conveyed by rotation of the pressure roller, wherein the thin film is attached at a position before the substrate is conveyed to the thin film attachment position. A method for attaching a thin film, which comprises: adhering an anti-bubble agent to the substrate, and removing the remaining anti-bubble agent on the substrate to which the thin film is attached after the pressure roller. 2. The tip of the thin film in the supply direction is attached to the surface of the tip of the substrate in the conveyance direction of the substrate conveyance path, and a pressure roller is brought into contact with the tip of the thin film at this attachment position, and by rotation of the pressure roller, the A thin film pasting device for transporting a substrate and pasting a thin film on the substrate, the thin film pasting device being disposed at a position before the substrate is transported to the thin film attachment position, for depositing a bubble preventive agent on the substrate. a wet roller, a means for supplying the anti-bubble agent almost uniformly from the inside of the wet roller toward the surface, and a means for removing the anti-bubble agent remaining on the substrate after the thin film is applied after the pressure roller. A thin film pasting device characterized by being provided with. 3. A short shaft slidable in the axial direction is provided near at least one shaft end of the wet roller, and by moving the short shaft in the axial direction, the wet roller can be attached to and removed from the mounting main body. 3. The thin film application device according to claim 2, wherein the thin film application device is flexible.