JPH0546277Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a semiconductor conversion device installed in a railway vehicle, and is particularly applicable to a semiconductor stack block in a semiconductor stack consisting of a plurality of semiconductor elements each having a heat pipe. The present invention relates to a semiconductor element heatsink equipped with a sealing structure having a dustproof/waterproof function and a popping prevention function that suppresses displacement.

[Conventional technology]

Semiconductor conversion devices, such as inverters and choppers for driving vehicles, and inverters for auxiliary power supplies, are increasingly being used in railway vehicles.

Such a semiconductor conversion device for a railway vehicle is required to have cooling performance that corresponds to the increased capacity of semiconductor elements, and is also required to have dustproof and waterproof functions to prevent dust, rain, snow, etc. from entering the vehicle equipment.

The heat pipe cooling method is increasingly being adopted in semiconductor conversion devices for railway vehicles.

A semiconductor converter for a railway vehicle that uses the heat pipe cooling method consists of a semiconductor stack consisting of multiple semiconductor elements, and there are two types of insulated and non-insulated types for the insulated surface of the heating part of the heat pipe. Furthermore, there are those with shared heat pipe blocks and those with separate heat pipe blocks.

It goes without saying that in this type of heat pipe cooling type semiconductor stack, it is preferable to use semiconductor elements each having a heat pipe, since this provides flexibility.

On the other hand, it becomes necessary to make improvements to the dustproof and waterproof aspects of the pressure weld connection block of the semiconductor stack. Conventionally, in order to provide such a heat pipe block with dustproof and waterproof functions, a shield plate has been used to seal the air space between adjacent heat pipes.
The conventional method was to use semi-dry sticky viscoelastic putty (liquid putty) to fix the sheet.

Furthermore, if the press-contact connection block itself of the semiconductor stack were to constitute, for example, a three-phase bridge, the length would be about 900 mm in the longitudinal direction.

[Problem that the invention attempts to solve]

In the structure of the heat pipe cooling type semiconductor stack which is composed of a plurality of heat pipes that alternately sandwich a plurality of semiconductor elements as described above, the plurality of semiconductor elements and the heating parts of the plurality of heat pipes are arranged alternately and connected by pressure. , the pressure connection block is supported at both ends.

On the other hand, such multiple heat pipes themselves are
Heat pipes and condensing parts protrude long and large from the heating part, and must be secured in accordance with the pressure-welded connection blocks mentioned above, but when assembling and supporting them, unnecessary parts are attached to the individual heating parts. It's something you can't apply force to.

Therefore, if the heat pipe block of the conventional method is made free and a liquid packing is used for the shield plate to make the press-connected connection block of the semiconductor stack dustproof and waterproof, assembly work is possible, but it becomes a troublesome work. Furthermore, after being put into use, it was hardened with putty, making it a hassle to replace the elements.

Furthermore, in the pressure welding connection block of the semiconductor stack, the amount of displacement in the pressurized axial direction due to thermal expansion,
The popping phenomenon caused by the amount of vertical displacement caused by its own weight plus vibration load becomes a problem.

[Means for solving problems and their effects]

The present invention has been developed in view of the above-mentioned points, and includes at least a flexible packing plate having an H-shaped cross section that is specially fitted between a plurality of heat pipes, and is capable of press-bonding semiconductor stacks. As a heat pipe block compatible with the connecting block, a simple device has been realized that can exhibit dustproof and waterproof functions and a function to prevent the press-connected connecting block from popping.

Hereinafter, the present invention will be explained in detail based on the drawings.

〔Example〕

1 to 4 show an embodiment of the present invention, and FIGS. 1 and 2 are a front partially assembled view showing the main structure, a side view showing the main parts, and FIGS. FIG. 4 is a front view and a side view showing the main parts around the heat pipe.

First, in order to facilitate understanding of this embodiment, FIGS. 3 and 4, which show the portion around the heat pipe, will be described.

In FIGS. 3 and 4, reference numeral 1 indicates a heat pipe, and reference numeral 2 indicates a thin plate material for providing a dustproof and waterproof function to a press-connection block of a semiconductor stack, which will be described later. Here, the heat pipe 1 may be of a known type having a heating section A, a heat pipe section H, and a condensing section C as main components and exhibiting cooling performance. Further, in the heat pipe 1 , T is a terminal, G is an insulator, and S is a support metal fitting. That is, the insulator-shaped heat pipe 1 has a thin plate material 2 particularly attached to the low pressure side, and the thin plate material 2 is passed through the heat pipe section H between the insulator G and the condensing section C.

Next, an embodiment using such a heat pipe 1 will be described with reference to FIGS. 1 and 2.

1 and 2 show a partial configuration of an example of a three-phase inverter stack. That is, it shows a portion consisting of two switching elements S _UP and S _UN for one phase, two diodes D _UP and D _UN , and five heat pipes sandwiching these semiconductor elements.

In Figures 1 and 2, 3 is an Osae board;
4 is a spring receiver, 5 is a spring, 6 is an insulating spacer, 7
a, 7b, 7c, 7d, 7e are heat pipes, 8
is a holding bracket that holds the heat pipe block side,
Reference numerals 9 and 9' denote packing plates, 10 a general packing covering the end face of the heat pipe block, 11 a support fitting, and 12 a mounting base for firmly holding the support fitting 11. Here, heat pipes 7a, 7b,
7c, 7d, and 7e are of the same type as the heat pipe 1 shown in FIGS. 3 and 4. It goes without saying that the terminals of the individual heat pipes may be different from each other in terms of the connection structure of the stack.

In the semiconductor stack configuration, three phases are stacked in the same way as the one phase shown in the figure, and they are connected by pressure to form the pressure connection block of the semiconductor stack, which is usually held in place by three parts of the support plates at both ends. Become something. In addition to the configuration of the pressure-welding connection block, the main component is a plurality of individually separated heat pipes that are configured as follows to have low-pressure dustproof and waterproof functions. .

That is, in order to separate the heat pipe block from the pressure welding connection block at multiple locations on the thin plate material 2 shown in FIGS. 3 and 4, the heat pipe 7
A, 7b, 7c, 7d, and 7e are each provided with the thin plate material 2 described above, and are provided with packing plate materials 9, 9' that engage between the thin plate materials 2, respectively.

Here, the packing plates 9, 9' are made of a flexible rubber plate material, for example. Taking the packing plate material 9 as an example, its cross-sectional shape is an H-shaped cross section with a pillar part that fills the space between the opposing thin plates and a U-shaped engagement part on both side surfaces that engage the thin plates. It is something that has a shape. Further, it is obvious that the packing plate 9' may be one that forms the left half or the right half of the cross-sectional shape of the packing plate 9, as shown in the example. Incidentally, such a packing plate material having an H-shaped cross section may be used as long as it is interposed between the thin plate materials and has the flexibility to be combined and matched with the pitch of the pressure welding connecting block as described later. It is not limited to a flat shape, but may have a certain degree of chevron shape with both occlusal tips narrowed to improve adhesion to the thin plate material. Furthermore, the packing plates 9 and 9' are not limited to integrally formed rubber plates, but may be assembled products in which plates having a U-shaped cross section are arranged on both sides, or A flexible metal foil may be interposed between metal plates having a cross-sectional shape.

In this way, by arranging thin plates for each heat pipe between multiple heat pipes and interlocking the packing plates between the opposing thin plates, the heat pipe block can be adapted to the alignment of the press-connecting block of the semiconductor stack. It can be sealed tightly.

Furthermore, it goes without saying that the heat radiator having such dust-proofing and water-discharging functions can be disassembled and reassembled at the packing plate portion.

Furthermore, this embodiment has a function to prevent the pressure-connected connection block of the semiconductor stack from popping.
It is constructed as follows. That is, a support fitting 11 and a mounting base 12 are provided.

Although only one supporting metal fitting 11 is shown in the longitudinal direction of the pressure-welding connection block, a plurality of support fittings 11 are similarly arranged as appropriate, and the displacement of the pressure-welding connection block due to thermal expansion is suppressed by the L-shaped vertical surface. However, in order to suppress the displacement caused by the vibration load applied to the load of the pressure-welded connecting block on the side surface of the L-shape, an inverted L-shape is formed taking into consideration the amount of displacement in both directions. . Therefore, even if the pressure-welded connection block of the semiconductor stack becomes large in the longitudinal direction, it can be locked by the plurality of support fittings 11 and mounting bases 12, and the occurrence of a popping phenomenon can be prevented.

Although this explanation has been based on an insulator-insulated heat sink mechanism, it is clear that the present invention is not limited to this and is equally applicable to a non-insulated heat sink mechanism.

[Effect of idea]

As explained above, according to the present invention, there is provided a highly practical device in which a press-connection block for a semiconductor stack using a semiconductor element with a heat pipe is provided with exceptional dustproof/waterproof functions and splash-proof functions. can.

[Brief explanation of the drawing]

Figures 1 and 2 are a front partial assembly view and a side assembly view showing the main parts of an embodiment of the present invention, and Figures 3 and 4 are front views showing the main parts around the heat pipe. and a side view. 1 , 7a, 7b, 7c, 7d, 7e... Heat pipe, 2... Thin plate material, 9, 9'... Packing board material, 11... Supporting metal fittings.

Claims (1)

[Scope of utility model registration request] In a semiconductor conversion device for a railway vehicle consisting of a heat pipe cooling type semiconductor stack, the heating parts of a plurality of heat pipes that alternately sandwich a plurality of semiconductor elements are connected under pressure, and the heating parts of the heat pipes are connected to the heating part side of the heat pipes. A flexible packing plate having an H-shaped cross section is inserted through the thin plates with their thick surfaces facing each other, and is engaged with the opposing thin plates, respectively. 1. A semiconductor device heat radiator equipped with a sealing structure, characterized in that a plurality of inverted L-shaped support fittings are provided in the longitudinal direction of the pressure-welded connecting block to prevent popping caused by the amount of displacement and the amount of vertical displacement.