JPH0543910Y2 - - Google Patents
Info
- Publication number
- JPH0543910Y2 JPH0543910Y2 JP19038586U JP19038586U JPH0543910Y2 JP H0543910 Y2 JPH0543910 Y2 JP H0543910Y2 JP 19038586 U JP19038586 U JP 19038586U JP 19038586 U JP19038586 U JP 19038586U JP H0543910 Y2 JPH0543910 Y2 JP H0543910Y2
- Authority
- JP
- Japan
- Prior art keywords
- powder
- substrate
- mesh
- dispersion
- hopper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000843 powder Substances 0.000 claims description 44
- 239000000758 substrate Substances 0.000 claims description 33
- 239000006185 dispersion Substances 0.000 claims description 16
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 12
- 229910006404 SnO 2 Inorganic materials 0.000 description 5
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 5
- 229910001887 tin oxide Inorganic materials 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
Landscapes
- Non-Insulated Conductors (AREA)
- Coating Apparatus (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
【考案の詳細な説明】
《産業上の利用分野》
本考案は、例えば、液晶デイスプレイ・デバイ
ス用の透明電極板、あるいはプラズマデイスプレ
イ・デバイス用の透明電極板等の表面処理工程に
おいて、基板へ粉体を均一に散布するのに使用す
る等、板状体やシート材（以下、基板と称する）
への粉体散布装置に関する。[Detailed Description of the Invention] <<Industrial Application Field>> The present invention applies powder to a substrate in the surface treatment process of, for example, a transparent electrode plate for a liquid crystal display device or a transparent electrode plate for a plasma display device. Plates or sheet materials (hereinafter referred to as substrates) used for uniformly distributing materials, etc.
Regarding powder dispersion equipment.
《従来技術》
例えば、液晶デイスプレイ・デバイス用の透明
電極板の表面処理工程において導電膜の形成は次
のようにして行われる。<<Prior Art>> For example, in the surface treatment process of a transparent electrode plate for a liquid crystal display device, a conductive film is formed as follows.
先ず、ガラス基板の表面に酸化スズ（SnO2）
の被膜を形成し、その被膜上の全面にフオトレジ
ストを塗布し、所定の電極パターンを焼付け現像
する。すると当該電極パターン以外のフオトレジ
スト膜が除去され、その部分にのみ酸化スズ
（SnO2）の被膜が露出される。 First, tin oxide (SnO 2 ) was applied to the surface of the glass substrate.
A photoresist is applied to the entire surface of the film, and a predetermined electrode pattern is baked and developed. Then, the photoresist film other than the electrode pattern is removed, and the tin oxide (SnO 2 ) film is exposed only in that part.
次にその基板の表面に亜鉛（Zn）の粉末を散
布し、その後エツチング液である塩酸（HCl）を
霧状に吹き付ける。すると亜鉛（Zn）と塩酸
（HCl）との反応によつて水素（H2）が発生し、
この水素（H2）が、フオトレジスト膜が除去さ
れて露出した前記酸化スズ（SnO2）を還元し、
この還元された酸化スズ（SnO2）が塩酸（HCl）
等の腐蝕液により溶融除去され、エツチング処理
が行われる。 Next, zinc (Zn) powder is sprinkled on the surface of the substrate, and then hydrochloric acid (HCl), an etching solution, is sprayed in a mist. Then, hydrogen (H 2 ) is generated by the reaction between zinc (Zn) and hydrochloric acid (HCl),
This hydrogen (H 2 ) reduces the tin oxide (SnO 2 ) exposed when the photoresist film is removed,
This reduced tin oxide (SnO 2 ) is converted into hydrochloric acid (HCl).
It is melted and removed using a corrosive solution such as etching treatment.
その後で電極パターン状に残つたフオトレジス
ト膜を剥離し、洗浄除去して、酸化スズ（SnO2）
の微細な電極パターンが形成された導電膜を得
る。 After that, the photoresist film remaining on the electrode pattern is peeled off, washed away, and tin oxide (SnO 2 ) is removed.
A conductive film on which a fine electrode pattern is formed is obtained.
ところで、上記のような表面処理工程において
例えば亜鉛粉末を散布するには従来次のようにし
て行つていた。 Incidentally, in the above-mentioned surface treatment process, for example, zinc powder was conventionally sprinkled in the following manner.
すなわち、第５図に示すように亜鉛粉末２を収
容したホツパー１を加振手段９で振動させ、ホツ
パー１の下側に設けた散布用メツシユ３を介して
粉体２を粉煙状に落下させ移送中の基板１１の表
面に粉体２を散布するように構成されている（特
公昭55−35699号公報）。ちなみに当該メツシユの
網目の大きさは、例えば、およそ200〜300メツシ
ユ程度、亜鉛粉末２の粒度は20〜30μ程度であ
る。 That is, as shown in FIG. 5, the hopper 1 containing the zinc powder 2 is vibrated by the vibrating means 9, and the powder 2 falls in the form of powder smoke through the dispersing mesh 3 provided at the bottom of the hopper 1. The powder 2 is scattered on the surface of the substrate 11 during transfer (Japanese Patent Publication No. 55-35699). Incidentally, the mesh size of the mesh is, for example, about 200 to 300 meshes, and the particle size of the zinc powder 2 is about 20 to 30 μm.
《考案が解決しようとする問題点》
しかるに上記従来技術に係る粉体散布装置にお
いては、ホツパー内に収容された粉体の量が十分
に多い場合には、下方の粉体は自重及び振動によ
る重圧を強く受けるため、振動させても十分にほ
ぐれず、あるいは散布用メツシユの目詰りを生じ
易く、粉体の供給量によつて基板への散布に過不
足を生じたり不均一を生じ、その結果基板のエツ
チング処理を正しく行なうことができないという
難点があつた。<<Problems to be solved by the invention>> However, in the powder dispersion device according to the above-mentioned prior art, when the amount of powder contained in the hopper is large enough, the powder below is spread by its own weight and vibration. Because it is subjected to strong pressure, it may not be loosened sufficiently even when vibrated, or the spreading mesh may become clogged, and depending on the amount of powder supplied, the powder may be spread too little or too little on the substrate, or unevenly. As a result, there was a problem in that the etching process of the substrate could not be carried out correctly.
他方、粉体を少量散布する場合に、上記従来装
置では散布が不均一となるため、局所的にではあ
るがまつたく散布されない部分が生じる一方、確
実に散布しようとすると、過剰に散布することに
なるから、特にこの少量での均一な散布は困難で
あつた。 On the other hand, when spraying a small amount of powder, the above-mentioned conventional device scatters unevenly, resulting in some areas not being sprayed as closely as possible. Therefore, uniform dispersion was difficult, especially in such a small amount.
その上、複数台の粉体散布装置を並列的に使用
する場合には加振手段９の取付条件、例えばボル
トの締め付け具合等により固有振動数が変化し、
粉体散布装置間でバラツキが生ずる等の問題があ
つた。 Furthermore, when using multiple powder dispersing devices in parallel, the natural frequency changes depending on the installation conditions of the vibration excitation means 9, such as the tightening of bolts, etc.
There were problems such as variations between powder dispersion devices.
本考案は、このような難点を解消した基板の粉
体散布装置を提供することをその目的とする。 An object of the present invention is to provide a powder dispersion device for a substrate that overcomes these difficulties.
《問題点を解決しようとする手段》
本考案は上記問題点を解決するために、以下の
ように構成される。<Means for Solving the Problems> In order to solve the above problems, the present invention is constructed as follows.
即ち、底部に散布用メツシユを有し内部に粉体
を収容するホツパーと、ホツパーの下方に設けら
れ基板を水平搬送する基板搬送手段とを備え、基
板の上面に粉体を散布するように構成した基板の
粉体散布装置において、回転駆動手段により回転
する長軸のブラシローラを基板の搬送方向と交差
する方向に、かつ散布用メツシユに当接させて配
置し、ブラシの先端を散布用メツシユの開口に挿
入可能に構成したことを特徴とするものである。 That is, it is configured to include a hopper having a scattering mesh at the bottom and storing powder therein, and a substrate conveying means provided below the hopper for horizontally conveying the substrate, so as to scatter the powder on the upper surface of the substrate. In a powder dispersion device for powdered substrates, a long-axis brush roller rotated by a rotary drive means is arranged in a direction intersecting the conveyance direction of the substrate and in contact with a dispersion mesh, and the tip of the brush is placed in contact with the dispersion mesh. The device is characterized by being configured so that it can be inserted into the opening of the device.
《作用》
長軸のブラシローラは基板の搬送方向と交差す
る方向で、かつ散布用メツシユに当接されて配置
されていることから、回転駆動手段により回転さ
れるとブラシが散布用メツシユに打ち当てられ、
当該メツシユに適度な振動が与えられる。この振
動によりメツシユの開口より粉体が落下する。一
方、メツシユの開口にブラシの先端が挿入するこ
とから、メツシユの開口内に詰まつている粉体は
ブラシの先端ではじき飛ばされ、目詰まりを生ず
ることもなく、基板の表面に均一に散布される。《Operation》 Since the long-axis brush roller is disposed in a direction that intersects with the conveying direction of the substrate and is in contact with the spreading mesh, when it is rotated by the rotation drive means, the brush hits the spreading mesh. guessed,
Appropriate vibration is applied to the mesh. This vibration causes the powder to fall from the opening of the mesh. On the other hand, since the tip of the brush is inserted into the opening of the mesh, the powder stuck in the opening of the mesh is flicked away by the tip of the brush, and is evenly distributed over the surface of the substrate without causing clogging. Ru.
《実施例》
以下、本考案による粉体散布装置の実施例を図
面に基づいて説明する。第１図は第１の実施例を
示す縦断側面図、第２図はその縦断正面図であ
る。<<Example>> Hereinafter, an example of the powder scattering device according to the present invention will be described based on the drawings. FIG. 1 is a longitudinal sectional side view showing a first embodiment, and FIG. 2 is a longitudinal sectional front view thereof.
この粉体散布装置は、底部に散布用メツシユ３
を有し内部に粉体２を収容するホツパー１と、散
布用メツシユ３に当接させて配置したブラシロー
ラ１３と、ホツパー１の下方に設けられ基板１１
を水平搬送する基板搬送手段１６とを備えて成
る。 This powder spreading device has 3 meshes for spreading at the bottom.
a hopper 1 which has a hopper 1 and accommodates powder 2 therein; a brush roller 13 disposed in contact with the dispersion mesh 3; and a substrate 11 provided below the hopper 1.
and a substrate transport means 16 for horizontally transporting the substrate.
ホツパー１は、粉体の散乱を防止するカバー７
を介して図示しない基枠に支持されており、粉投
入口より粉体２を投入した後は、その投入口を蓋
８で閉止するようになつている。 The hopper 1 has a cover 7 that prevents powder from scattering.
It is supported by a base frame (not shown) via a powder inlet, and after the powder 2 is introduced through the powder inlet, the inlet is closed with a lid 8.
ブラシローラ１３は、基板１１の搬送方向と交
差する方向に、かつ散布用メツシユ３に当接する
ように、上記基枠に軸受２１，２１を介して回転
自在に枢支され駆動モータ２３により所要の回転
速度で回転するように設けられている。 The brush roller 13 is rotatably supported on the base frame via bearings 21, 21 so as to be in contact with the dispersing mesh 3 in a direction intersecting with the conveying direction of the substrate 11, and is driven by a drive motor 23 to perform the required rotation. It is arranged to rotate at a rotational speed.
一方散布用メツシユ３は、弾性体で構成され、
第３図の示すようにメツシユの開口３ａが下向き
に拡大して形成されており、ブラシローラ１３の
ブラシの先端がこのメツシユ開口３ａに挿入し易
くなつている。 On the other hand, the dispersion mesh 3 is made of an elastic body,
As shown in FIG. 3, the opening 3a of the mesh is formed to expand downward, so that the tip of the brush of the brush roller 13 can be easily inserted into the opening 3a of the mesh.
即ち、ブラシローラ１３の回転に伴つてブラシ
が散布用メツシユ３に打ち当てられ、このメツシ
ユ３に適当な振動が与えられる。一方メツシユ３
の開口３ａにブラシの先端が挿入し、その開口３
ａ内に詰まつている粉体をブラシの先端ではじき
飛ばす。これによりメツシユ３の目詰まりを生ず
ることもなく、基板１１の表面には粉体２が均一
に散布されることになる。 That is, as the brush roller 13 rotates, the brush hits the dispersing mesh 3, giving the mesh 3 appropriate vibrations. On the other hand, Metsuyu 3
The tip of the brush is inserted into the opening 3a of the
Use the tip of the brush to blow away the powder stuck inside a. As a result, the mesh 3 will not be clogged, and the powder 2 will be uniformly spread over the surface of the substrate 11.
基板搬送手段１６は、上記基枠に軸受２４，２
４を介して回転可能に枢支され、多数の無端ベル
ト１２，１２……を巻掛けた一組の搬送ローラ１
４，１４と、搬送ローラ１４を回転駆動する駆動
モータ２５とから成り、基板供給装置４により１
枚づつ供給される基板１１を無端ベルト１２上に
受け取つて水平搬送し、その上面に均一に粉体が
散布された基板１１をエツチング装置６へ送り込
むように構成されている。なお符号５は粉体受皿
である。 The substrate conveying means 16 includes bearings 24, 2 on the base frame.
A set of conveyor rollers 1 rotatably supported via rollers 4 and around which a large number of endless belts 12, 12, . . . are wound.
4, 14, and a drive motor 25 that rotationally drives the conveyance roller 14.
The substrates 11 supplied one by one are received on an endless belt 12 and conveyed horizontally, and the substrates 11 with powder evenly sprinkled on the upper surface thereof are sent to the etching device 6. Note that the reference numeral 5 is a powder receiving tray.
第４図は本考案に係る粉体散布装置の第２の実
施例を示す縦断側面図である。この図において散
布用メツシユ３は側面から見て円弧状に形成さ
れ、ホツパー１に着脱自在に固定されており、ブ
ラシローラ１３の回転によつて散布用メツシユ３
に振動を与え易くしてある。 FIG. 4 is a longitudinal sectional side view showing a second embodiment of the powder dispersion device according to the present invention. In this figure, the dispersing mesh 3 is formed into an arc shape when viewed from the side, and is detachably fixed to the hopper 1, and the dispersing mesh 3 is rotated by the rotation of the brush roller 13.
This makes it easier to apply vibrations to the
なお、上記と第１及び第２の実施例においてブ
ラシローラ１３の回転数を可変できるようにブラ
シローラ１３と駆動モータ２３との間に変速手段
を介在させ、変速手段を介して粉体２の散布量を
微調節するように構成するのが望ましい。 In addition, in the above, first and second embodiments, a speed change means is interposed between the brush roller 13 and the drive motor 23 so that the rotation speed of the brush roller 13 can be varied. It is desirable to configure the system so that the amount of spraying can be finely adjusted.
また、ブラシローラ１３をメツシユ３に対して
当接位置調節可能に設け、メツシユ３に与える振
動を加減調節することにより、粉体の散布量を微
調節するように構成するのが望ましい。 Further, it is preferable that the brush roller 13 is provided so that its contact position with respect to the mesh 3 can be adjusted, and the amount of powder to be spread can be finely adjusted by adjusting the amount of vibration applied to the mesh 3.
《考案の効果》
本考案によれば、長軸のブラシローラを基板の
搬送方向と交差する方向でかつ散布用メツシユに
当接させて配置し、ブラシの先端を散布用メツシ
ユの開口に挿入可能に構成したことから、散布用
メツシユには適当な振動が与えられ、一方ブラシ
の先端でメツシユの開口内に詰まつている粉体を
はじき飛ばすので、メツシユの目詰まりは解消さ
れ、基板上には過不足なく粉体が均一に散布され
る。また、従来例のように加振手段の取付具合等
により複数台の粉体散布装置間でバラツキが生ず
ることもない。<<Effects of the invention>> According to the invention, the long-axis brush roller is disposed in a direction intersecting with the conveying direction of the substrate and in contact with the spreading mesh, and the tip of the brush can be inserted into the opening of the spreading mesh. Because of this structure, appropriate vibration is applied to the dispersing mesh, while the tip of the brush flicks off the powder stuck in the openings of the mesh, which clears the clogging of the mesh and spreads it onto the substrate. The powder is evenly distributed with just the right amount. Further, unlike the conventional example, variations do not occur among the plurality of powder dispersing devices due to the mounting condition of the vibrating means, etc.
第１図は本考案の第１の実施例を示す粉体散布
装置の縦断側面図、第２図はその縦断正面図、第
３図は散布用メツシユの断面図、第４図は本考案
の第２の実施例装置の縦断側面図、第５図は従来
例を示す概要図である。
１……ホツパー、２……粉体、３……散布用メ
ツシユ、３ａ……メツシユ開口、１３……ブラシ
ローラ、１６……基板搬送手段。
Fig. 1 is a longitudinal sectional side view of a powder dispersing device showing the first embodiment of the present invention, Fig. 2 is a longitudinal sectional front view thereof, Fig. 3 is a sectional view of the dispersing mesh, and Fig. 4 is a longitudinal sectional view of the powder dispersing device according to the first embodiment of the present invention. FIG. 5 is a longitudinal sectional side view of the device of the second embodiment, and is a schematic diagram showing a conventional example. 1...Hopper, 2...Powder, 3...Mesh for dispersing, 3a...Mesh opening, 13...Brush roller, 16...Substrate conveyance means.
Claims (1)
容するホツパーと、ホツパーの下方に設けられ
基板を水平搬送する基板搬送手段とを備え、基
板の上面に粉体を散布するように構成した基板
の粉体散布装置において、 回転駆動手段により回転する長軸のブラシロ
ーラを基板の搬送方向と交差する方向に、かつ
散布用メツシユに当接させて配置し、ブラシの
先端を散布用メツシユの開口に挿入可能に構成
したことを特徴とする基板の粉体散布装置。 (2) 散布用メツシユの開口を下向きに拡大させた
実用新案登録請求の範囲第１項に記載した基板
の粉体散布装置。[Claims for Utility Model Registration] (1) A hopper having a dispersion mesh at the bottom and containing powder inside, and a substrate transport means provided below the hopper for horizontally transporting the substrate, In a substrate powder dispersion device configured to scatter powder on a substrate, a long-axis brush roller rotated by a rotary drive means is arranged in a direction intersecting the conveyance direction of the substrate and in contact with a dispersion mesh. A powder spreading device for a substrate, characterized in that the tip of the brush can be inserted into an opening of a spreading mesh. (2) The substrate powder dispersion device as set forth in claim 1 of the utility model registration claim, in which the opening of the dispersion mesh is enlarged downward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19038586U JPH0543910Y2 (en) | 1986-12-09 | 1986-12-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19038586U JPH0543910Y2 (en) | 1986-12-09 | 1986-12-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6394478U JPS6394478U (en) | 1988-06-17 |
| JPH0543910Y2 true JPH0543910Y2 (en) | 1993-11-05 |
Family
ID=31143555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19038586U Expired - Lifetime JPH0543910Y2 (en) | 1986-12-09 | 1986-12-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0543910Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002177865A (en) * | 2000-12-18 | 2002-06-25 | Kozen Honten:Kk | Powder scattering apparatus |
-
1986
- 1986-12-09 JP JP19038586U patent/JPH0543910Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6394478U (en) | 1988-06-17 |
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