JPH0543664B2 - - Google Patents
Info
- Publication number
- JPH0543664B2 JPH0543664B2 JP978484A JP978484A JPH0543664B2 JP H0543664 B2 JPH0543664 B2 JP H0543664B2 JP 978484 A JP978484 A JP 978484A JP 978484 A JP978484 A JP 978484A JP H0543664 B2 JPH0543664 B2 JP H0543664B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- metal
- metal member
- ceramics
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 claims description 86
- 239000002184 metal Substances 0.000 claims description 70
- 229910052751 metal Inorganic materials 0.000 claims description 70
- 238000005219 brazing Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 8
- 238000010304 firing Methods 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 18
- 238000007747 plating Methods 0.000 description 15
- 229910052759 nickel Inorganic materials 0.000 description 9
- 238000005476 soldering Methods 0.000 description 7
- 238000007772 electroless plating Methods 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、アルミナ、窒化ケイ素等のセラミツ
クスと金属部材とを嵌合しロウ付により接合する
方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of fitting and joining ceramics such as alumina, silicon nitride, etc. and metal members by brazing.
（従来技術）
従来、セラミツクスと金属部材とを接合する場
合は、先ず、セラミツクスに金属メツキもしくは
メタライジングを施してから、該セラミツクスと
金属部材とをロウ付にて接合する方法が多く採用
されている。とりわけ、セラミツクスと金属部材
とを軸継手する場合は、一般にセラミツクスと金
属部材との同軸度が厳しく要求されることが多い
が、セラミツクスの金属部材と接合すべき部分が
焼成面のままであると、該両者の同軸度が確保し
難いことから、セラミツクスの金属部材と接合す
べき部分は、ダイヤモンド砥石で研磨仕上げする
のが普通である。(Prior Art) Conventionally, when joining ceramics and metal members, the method often adopted is to first apply metal plating or metallization to the ceramics and then join the ceramics and the metal members by brazing. There is. In particular, when coupling ceramics and metal components, coaxiality between the ceramics and metal components is often strictly required, but if the part of the ceramic to be joined to the metal component remains a fired surface, Since it is difficult to ensure coaxiality between the two, the part of the ceramic to be joined to the metal member is usually polished with a diamond grindstone.
すなわち、第１図は、金属部材と接合すべき外
周部分１ａがダイヤモンド砥石にて研磨仕上げさ
れた状態のセラミツクス軸１を示し、第２図は、
セラミツクス軸１の外周部分１ａに金属メツキ２
を施した状態のものを示し、さらに、第３図は、
金属メツキ２が施されたセラミツクス軸１に金属
部材３を嵌合し、該両者１，３をロウ材４にて接
合させたときの状態を示す。なお、第３図におい
て５はガス抜き孔である。 That is, FIG. 1 shows a ceramic shaft 1 in which the outer peripheral portion 1a to be joined to a metal member has been polished with a diamond grindstone, and FIG.
Metal plating 2 is applied to the outer peripheral portion 1a of the ceramic shaft 1.
Fig. 3 shows the state in which
A state is shown in which a metal member 3 is fitted onto a ceramic shaft 1 on which metal plating 2 has been applied, and both 1 and 3 are joined with a brazing material 4. In addition, in FIG. 3, 5 is a gas vent hole.
上記のようにして接合した場合、セラミツクス
と金属部材との同軸度については、比較的高精度
なものが得られるが、反面、セラミツクスと金属
部材の接合強度は充分なものではなく不安定であ
る。すなわち、セラミツクスに金属メツキを施す
場合、セラミツクスと金属メツキとの密着強度
は、セラミツクスの表面性状および表面粗度によ
つて影響され、とりわけ、セラミツクスの表面性
状によつて大きく左右される。より詳しく言え
ば、表面性状は研磨面よりも焼成面のほうが良
く、また、表面粗度も粗いほうが良いが、セラミ
ツクスと金属メツキとの密着強度に対する寄与率
は表面性状のほうがはるかに大きい。 When joined as described above, relatively high precision coaxiality can be obtained between the ceramic and the metal member, but on the other hand, the joint strength between the ceramic and the metal member is not sufficient and is unstable. . That is, when metal plating is applied to ceramics, the adhesion strength between the ceramic and the metal plating is influenced by the surface properties and surface roughness of the ceramics, and in particular, is greatly influenced by the surface properties of the ceramics. More specifically, the fired surface is better than the polished surface, and the rougher the surface roughness, the better, but the surface texture has a much larger contribution to the adhesive strength between ceramics and metal plating.
例えば、焼成した窒化ケイ素セラミツクスをダ
イヤモンド砥石で研磨して１〜3μRzにした後、
ニツケル無電解メツキを施すと、セラミツクスと
メツキ層との密着強度は0.5〜1.0Kgｆ／mm2程度し
かなく、さらに研磨して5μRz以上に仕上げても、
セラミツクスとメツキ層との密着強度は、数パー
セントしか向上させることができない。 For example, after polishing fired silicon nitride ceramics with a diamond grindstone to 1 to 3 μRz,
When electroless nickel plating is applied, the adhesion strength between the ceramic and the plating layer is only about 0.5 to 1.0Kgf/ mm2 , and even if it is further polished to a finish of 5μRz or more,
The adhesion strength between the ceramic and the plating layer can only be improved by a few percent.
これに対し、セラミツクスの表面性状を焼成面
のままの状態で、ニツケル無電解メツキを施した
ときの密着強度は、２〜３Kgｆ／mm2程度に向上す
る。この焼成面による密着強度の向上は、射出形
成後、すなわちグリーンボデーで旋削を施した
後、脱脂・焼成した面であつても、あるいは、グ
リーンボデーで加工を加えず脱脂・焼成した面で
あつても、いずれの場合でも同様の効果を奏す
る。 On the other hand, when electroless nickel plating is applied to ceramics with the same surface condition as the fired surface, the adhesion strength improves to about 2 to 3 kgf/mm 2 . This improvement in adhesion strength due to the fired surface is achieved even when the surface is degreased and fired after injection molding, that is, after turning with Green Body, or when the surface is degreased and fired with Green Body without any processing. However, the same effect can be achieved in either case.
かようなことから、研磨加工されたセラミツク
スに金属メツキもしくはメタライジングを施した
後、ロウ材にてセラミツクスと金属部材との接合
を行うと、セラミツクスと金属層との密着強度が
低いので、セラミツクス、金属層が有するそれぞ
れの熱膨張率の相違により、金属層が剥離し易
く、セラミツクスと金属部材との接合強度が小さ
くて安定しないという問題がある。たとえ、セラ
ミツクスの表面を５〜10μRzまで研磨仕上げした
としても、金属層との密着強度は僅かしかアツプ
しないので、やはり金属層は剥離し易く、セラミ
ツクスと金属部材との接合強度は十分なものが得
られず不安定である。 For this reason, if polished ceramics are metal-plated or metallized and then bonded to a metal member using a brazing material, the adhesion strength between the ceramics and the metal layer is low. However, due to the difference in coefficient of thermal expansion of the metal layers, the metal layers tend to peel off, and the bonding strength between the ceramic and the metal member is low and unstable. Even if the surface of the ceramic is polished to a level of 5 to 10 μRz, the adhesion strength with the metal layer will only increase slightly, so the metal layer will still easily peel off, and the bond strength between the ceramic and the metal member will not be sufficient. Unobtainable and unstable.
逆に、セラミツクスと金属部材との接合強度を
確保するために、セラミツクスを研磨せずに焼成
面のままの状態で、該セラミツクスと金属部材と
をロウ付を介して軸継手を構成した場合は、軸
径、直角度、真円度等のバラツキが大となり、そ
の結果、接合すべき金属部材側の穴径を大きく形
成しなければならず、したがつて、金属部材とセ
ラミツクス間のクリアランスのバラツキが大きく
なつて、ロウ付強度が低く不安定なものとなる。 On the other hand, in order to ensure the bonding strength between the ceramic and the metal member, if the ceramic and the metal member are brazed together to form a shaft joint while the fired surface of the ceramic is not polished. , variations in shaft diameter, perpendicularity, roundness, etc. become large, and as a result, the hole diameter on the side of the metal parts to be joined has to be made large, and therefore the clearance between the metal parts and the ceramics has to be increased. As the variation increases, the brazing strength becomes low and unstable.
（発明の目的）
本発明は、この点に鑑みてなされたもので、そ
の目的とするところは、セラミツクスと金属部材
との軸継手において、該両者の同軸度、セラミツ
クスの軸径、直角度、真円度等の精度を確保し、
かつ、セラミツクスと金属部材との充分な接合強
度が安定して得られるようにしたセラミツクスと
金属部材の接合方法を提供することにある。(Object of the Invention) The present invention has been made in view of this point, and its purpose is to improve the coaxiality of the two, the shaft diameter of the ceramic, the squareness, Ensure accuracy such as roundness,
Another object of the present invention is to provide a method for joining ceramics and a metal member that can stably obtain sufficient joint strength between the ceramic and metal member.
（発明の構成）
上記の目的を達成するため、本発明の構成は、
セラミツクスの金属部材と接合すべき部分に、研
磨されてないままの焼成面を有する溝を設け、こ
のセラミツクスの溝を含む接合部分に金属層を形
成するとともに、金属部材側にはセラミツクス嵌
合用穴を形成して、該金属部材の穴にセラミツク
スを嵌合させた後、その嵌合部分にロウ付を施す
ことによつて、セラミツクスと金属部材とを接合
することを特徴とするものである。(Structure of the invention) In order to achieve the above object, the structure of the present invention is as follows.
A groove with an unpolished firing surface is provided in the part of the ceramic that is to be joined to the metal member, a metal layer is formed on the joining part including the ceramic groove, and a hole for fitting the ceramic is provided on the metal member side. After forming a hole in the metal member and fitting the ceramic into the hole of the metal member, the fitting portion is brazed to join the ceramic and the metal member.
セラミツクスに形成される溝は、必要に応じて
１個もしくは２個以上設ければよい。該セラミツ
クスの溝を含む接合部分に、金属層を形成する方
法としては、金属無電解メツキあるいはメタライ
ジングによる方法が挙げられる。セラミツクスと
金属部材間のクリアランスは、０〜0.2mmの間の
所望する値に設定するのが好ましい。また、セラ
ミツクスの溝の深さは、0.05〜0.50mmの間の所望
する値に設定することが好ましい。セラミツクス
と金属部材との嵌合部分にはロウ付を施すことに
よつて、軸継手として充分な接合強度が安定して
確保されることとなる。本発明における「ロウ
付」とは、最も広く定義してハンダ付をも含める
ものとする。 One or more grooves may be formed in the ceramic as needed. Examples of a method for forming a metal layer on the joint portion including the groove of the ceramic include electroless metal plating or metallization. The clearance between the ceramic and the metal member is preferably set to a desired value between 0 and 0.2 mm. Further, the depth of the ceramic groove is preferably set to a desired value between 0.05 and 0.50 mm. By brazing the fitting portion between the ceramic and the metal member, sufficient bonding strength as a shaft joint can be stably ensured. In the present invention, "brazing" is defined most broadly to include soldering.
（実施例）
以下に、本発明の一実施例を図について説明す
る。第４図および第５図に示すように、窒化ケイ
素系あるいはアルミナ系のセラミツクス６の金属
部材（後述）１２と接合すべき軸部分に、軸方向
に延びる深さ0.1mmの溝７，８，９を周方向に三
等配して形成する。この溝７，８，９は、窒化ケ
イ素あるいはアルミナを焼成した後、研磨等の機
械加工が施されないよう、焼成時における収縮率
をあらかじめ計算して製作する。(Example) An example of the present invention will be described below with reference to the drawings. As shown in FIGS. 4 and 5, grooves 7, 8 with a depth of 0.1 mm extending in the axial direction are formed in the shaft portion of the silicon nitride-based or alumina-based ceramic 6 to be joined to a metal member (described later) 12. 9 are formed by distributing them three times in the circumferential direction. These grooves 7, 8, and 9 are manufactured by calculating the shrinkage rate during firing in advance so that mechanical processing such as polishing is not performed after silicon nitride or alumina is fired.
ここでは、窒化ケイ素あるいはアルミナを円柱
状に射出成形した後、いわゆるグリーンボデー状
態の時点において旋削で加工し、そののち脱脂・
焼成したものであつて、溝７，８，９の製作方法
としては、従来のように射出成形時において成形
してもよく、要は、溝７，８，９の内面が、研磨
加工されない焼成のままの面性状となるように形
成すればよい。 Here, after silicon nitride or alumina is injection molded into a cylindrical shape, it is processed by turning at the so-called green body state, and then degreased and
The grooves 7, 8, and 9 may be formed by injection molding as in the conventional method. It is sufficient to form it so that the surface properties remain as they are.
上記溝７，８，９を有するセラミツクス６の最
外径周面１０は、ダイヤモンド砥石によつて研磨
加工し、該研磨部の外径は、金属部材（後述）１
２との嵌合時において、該金属部材１２に対する
クリアランスが0.05mmとなるように寸法設定し、
嵌合精度が得られるように構成するものとする。 The outermost circumferential surface 10 of the ceramic 6 having the grooves 7, 8, and 9 is polished with a diamond grindstone, and the outer diameter of the polished portion is the same as that of the metal member (described later) 1.
When mating with 2, the dimensions are set so that the clearance with respect to the metal member 12 is 0.05 mm,
The structure shall be such that fitting accuracy can be obtained.
次いで、上記セラミツクス６の接合部分の溝
７，８，９を含む外周面には、第６図および第７
図に示すように、金属層としてのニツケル無電解
メツキ１１を均一に施す。このセラミツクス６と
ニツケル無電解メツキ１１との密着強度は、セラ
ミツクス６の最外径周面１０のように研磨面であ
る部分ではせん断強度が0.5〜1.0Kgｆ／mm2である
が、溝７，８，９の内面のように焼成面である部
分ではせん断強度が2.0〜3.0Kgｆ／mm2を格段に向
上している。すなわち、セラミツク６の軸径、直
角度および真円度のみならず、金属層としてのニ
ツケル無電解メツキ１１の密着強度も充分確保さ
れている。 Next, the outer circumferential surface including the grooves 7, 8, and 9 of the bonded portion of the ceramic 6 is marked with the grooves shown in FIGS. 6 and 7.
As shown in the figure, nickel electroless plating 11 as a metal layer is uniformly applied. The adhesion strength between the ceramic 6 and the nickel electroless plating 11 is such that the shear strength is 0.5 to 1.0 Kgf/mm 2 at the polished surface such as the outermost circumferential surface 10 of the ceramic 6; The shear strength of the fired surfaces, such as the inner surfaces of Nos. 8 and 9, is significantly improved to 2.0 to 3.0 Kgf/mm 2 . That is, not only the shaft diameter, perpendicularity and roundness of the ceramic 6 but also the adhesion strength of the nickel electroless plating 11 as a metal layer are sufficiently ensured.
一方、第８図および第９図に示すように、セラ
ミツクス６に接合される金属部材１２、例えばク
ロムモリブデン鋼SCM20には、セラミツクス６
の外径に見合つた穴径を有する嵌合用穴１３を形
成し、この穴１３に、前記ニツケル無電解メツキ
１１が施されたセラミツクス６を嵌合する。その
後、セラミツクス６と金属部材１２との溝７，
８，９を含めた嵌合部分に、高周波誘導加熱等に
より高温ハンダ付を行うことによつて、セラミツ
クス６と金属部材１２とを高温ハンダ１４により
接合する。実際には、高温ハンダ付は、セラミツ
クス６に形成した溝７，８，９内にも十分充填さ
れて、良好な高温ハンダ付状態となることが確認
された。なお、高温ハンダ付の代わりに銀ロウ付
を行つても、高温ハンダ付と同様に良好な銀ロウ
付状態となることが確認された。なお、第８図に
おいて５′はガス抜き孔である。 On the other hand, as shown in FIG. 8 and FIG.
A fitting hole 13 having a hole diameter commensurate with the outer diameter is formed, and the ceramic 6 coated with the nickel electroless plating 11 is fitted into this hole 13. After that, the groove 7 between the ceramic 6 and the metal member 12,
The ceramic 6 and the metal member 12 are joined by the high-temperature solder 14 by performing high-temperature soldering on the fitting portions 8 and 9 by high-frequency induction heating or the like. In fact, it was confirmed that the grooves 7, 8, and 9 formed in the ceramic 6 were sufficiently filled with high-temperature soldering, resulting in a good high-temperature soldering state. It has been confirmed that even if silver brazing is performed instead of high temperature soldering, the silver brazing state is as good as high temperature soldering. In addition, in FIG. 8, 5' is a gas vent hole.
このようにして軸継手を行つたセラミツクス６
と金属部材１２との接合は、該両者６，１２の同
軸度が高精度に確保されるだけでなく、引張り試
験およびネジリ試験においては、接合部で破壊す
ることなく接合部以外のセラミツクス６の母材で
破壊し、極めて良好で安定した接合状態であるこ
とが確認された。 Ceramics 6 with shaft joints made in this way
The joining between the metal member 12 and the metal member 12 not only ensures the coaxiality of both 6 and 12 with high precision, but also ensures that the ceramic 6 other than the joint part does not break in the tensile test and torsion test. It was confirmed that the bond broke at the base metal and was in an extremely good and stable bonding state.
また、従来の接合方法によれば、ハンダ付もし
くはロウ付等による加熱冷却で金属メツキもしく
はメタライジング層がセラミツクスの表面から剥
れ易く、たとえ剥れないにしても、繰り返し応力
および熱疲労により充分な接合強度を得ることは
困難である。これに対し、本実施例によれば、セ
ラミツクス６とニツケル無電解メツキ１１との密
着強度が全体として格段に増大し、セラミツクス
６の外周に溝７，８，９を形成したことによる形
状効果とも相俟つて、繰り返し応力および熱疲労
に対しても充分な接合強度が確保された。 In addition, according to conventional joining methods, the metal plating or metallizing layer easily peels off from the ceramic surface when heated and cooled by soldering or brazing, and even if it does not peel off, it is difficult to peel off due to repeated stress and thermal fatigue. It is difficult to obtain sufficient bond strength. On the other hand, according to this embodiment, the adhesion strength between the ceramic 6 and the electroless nickel plating 11 is significantly increased as a whole, which is also due to the shape effect due to the grooves 7, 8, and 9 formed on the outer periphery of the ceramic 6. Together, sufficient joint strength was ensured against repeated stress and thermal fatigue.
実施例では、セラミツクスの溝を含む接合部分
には、金属無電解メツキによつて金属層を形成さ
せたが、メタライジングによつて金属層を形成さ
せてもよい。 In the embodiment, a metal layer was formed by electroless metal plating on the joint portion including the ceramic groove, but the metal layer may also be formed by metallization.
また、実施例ではセラミツクスには、軸方向に
延びる溝を周方向に三等配して形成したが、接合
部に加わる負荷等に応じて、軸方向に延びる溝を
周方向に二等配して形成してもよく、さらに、必
要に応じて第１０図ないし第１５図に形成するこ
ともできる。 In addition, in the example, grooves extending in the axial direction were formed in the ceramic with three equal distributions in the circumferential direction, but depending on the load applied to the joint, etc., the grooves extending in the axial direction were formed in two equal distributions in the circumferential direction. It may also be formed as shown in FIGS. 10 to 15, if necessary.
すなわち、第１０図および第１５図は、軸状セ
ラミツクス６の軸方向に延びる溝１５，１６，１
７を周方向に三等配して設け、該溝１５，１６，
１７を、第４図および第５図に図示した溝７，
８，９よりも幅広にかつ底浅に形成したものを示
す。第１１図は、軸状セラミツクス６の周方向に
延びる幅狭の溝１８と１９を、軸方向に比較的大
きな間隔をあけて形成したものを示す。第１２図
は、軸状セラミツクス６の周方向に延びる幅広の
溝２０と２１を、軸方向に第１１図の溝１８，１
９よりも間隔を小さくして形成したものを示す。
第１３図は、軸状セラミツクス６の周方向に延び
る幅狭の溝２２と２３を、軸方向に第１１図の溝
１８，１９よりも間隔を大きくし、さらに、セラ
ミツクス６の溝２２と２３の間部分に、軸方向に
延びる溝２４を適宜数個形成したものを示す。第
１４図は、軸状セラミツクス６に螺旋状に延びる
溝２５を一個だけ形成したものを示し、この螺旋
状溝２５は必要により複数個形成してもよい。 That is, FIGS. 10 and 15 show grooves 15, 16, 1 extending in the axial direction of the shaft-shaped ceramic 6.
7 are equally spaced in the circumferential direction, and the grooves 15, 16,
17 in the groove 7 shown in FIGS. 4 and 5,
This shows one that is wider and shallower than 8 and 9. FIG. 11 shows a shaft-shaped ceramic 6 having narrow grooves 18 and 19 extending in the circumferential direction and formed with a relatively large interval in the axial direction. FIG. 12 shows wide grooves 20 and 21 extending in the circumferential direction of the shaft-shaped ceramic 6 in the axial direction.
9 is formed with smaller spacing than 9.
In FIG. 13, the narrow grooves 22 and 23 extending in the circumferential direction of the ceramic shaft 6 are spaced apart from each other in the axial direction more than the grooves 18 and 19 in FIG. A suitable number of grooves 24 extending in the axial direction are formed in the intermediate portion. FIG. 14 shows a case in which only one spirally extending groove 25 is formed in the shaft-shaped ceramic 6, but a plurality of spiral grooves 25 may be formed if necessary.
（発明の効果）
以上、詳細に説明したように、本発明方法は、
セラミツクスの接合すべき部分に、焼成面を有す
る溝を設け、この溝を含む接合部分に金属層を形
成すると共に、セラミツクスと金属部材とを嵌合
してロウ付を介して接合するようにしたので、セ
ラミツクスと金属部材との同軸度、セラミツクス
の軸径、直角度および真円度の精度が確保され、
特に、同軸度の精度が確保されることに伴い、ロ
ウ付を施したのち後加工を不要もしくは簡易にす
ることができる。(Effects of the invention) As explained above in detail, the method of the present invention has the following effects:
A groove having a fired surface is provided in the part of the ceramic to be joined, a metal layer is formed in the joining part including this groove, and the ceramic and the metal member are fitted and joined by brazing. Therefore, the coaxiality of the ceramic and metal parts, the accuracy of the shaft diameter, squareness, and roundness of the ceramics are ensured.
In particular, since coaxiality accuracy is ensured, post-processing after brazing can be unnecessary or simplified.
また、本発明方法によれば、セラミツクスに対
する金属層の密着強度が向上するため、セラミツ
クスに形成した溝による形状効果と相まつて、セ
ラミツクスと金属部材との接合強度が増大し、繰
り返し応力および熱疲労に対しても充分な接合強
度を安定して確保することができる。 In addition, according to the method of the present invention, the adhesion strength of the metal layer to the ceramic is improved, which, together with the shape effect of the grooves formed in the ceramic, increases the bonding strength between the ceramic and the metal member, reducing repeated stress and thermal fatigue. It is possible to stably ensure sufficient bonding strength even for
第１図は従来のセラミツクスを焼成後において
研磨させたときの状態を示す正面図、第２図は第
１図のセラミツクスに金属メツキを施したときの
状態を示す部分断面正面図、第３図は第２図のセ
ラミツクスに金属部材を接合させたときの状態を
示す部分断面正面図、第４図は本発明の一実施例
を示すもので、本発明に係るセラミツクスを焼成
後において研磨させたときの状態を示す正面図、
第５図は第４図の平面図、第６図は第４図のセラ
ミツクスにニツケル無電解メツキを施したときの
状態を示す部分断面正面図、第７図は第６図のＡ
−A′線に沿つた断面図、第８図は第６図のセラ
ミツクスに金属部材を接合させたときの状態を示
す部分断面正面図、第９図は第８図のＢ−B′線
に沿つた断面図、第１０図ないし第１４図はそれ
ぞれ本発明に係る溝の変形例を示す正面図、第１
５図は第１０図の平面図である。
６……セラミツクス、７，８，９……溝、１０
……最外径周面、１１……ニツケル無電解メツ
キ、１２……金属部材、１３……嵌合用穴、１４
……高温ハンダ、１５〜２５……溝。
Fig. 1 is a front view showing the state when conventional ceramics are polished after firing, Fig. 2 is a partial cross-sectional front view showing the state when metal plating is applied to the ceramics of Fig. 1, and Fig. 3 2 is a partially sectional front view showing a state when a metal member is bonded to the ceramic of FIG. 2, and FIG. 4 shows an embodiment of the present invention, in which the ceramic according to the present invention was polished after firing. A front view showing the state when
Fig. 5 is a plan view of Fig. 4, Fig. 6 is a partial cross-sectional front view showing the state when nickel electroless plating is applied to the ceramics of Fig. 4, and Fig. 7 is A of Fig. 6.
8 is a partial sectional front view showing the state when a metal member is bonded to the ceramics in FIG. 6, and FIG. 9 is a sectional view taken along line B-B' in FIG. 8. 10 to 14 are a front view and a first view showing modified examples of the groove according to the present invention, respectively.
FIG. 5 is a plan view of FIG. 10. 6... Ceramics, 7, 8, 9... Groove, 10
... Outermost circumferential surface, 11 ... Nickel electroless plating, 12 ... Metal member, 13 ... Fitting hole, 14
...High temperature solder, 15-25...groove.
Claims (1)
に、研磨加工が施されてないままの焼成面を有す
る溝を設け、前記セラミツクスの前記溝を含む接
合部分に金属層を形成するとともに、前記金属部
材には前記セラミツクスが嵌合される穴を形成
し、該セラミツクスと前記金属部材とを嵌合し、
この後、該両者の嵌合部分をロウ付けすることに
より、前記セラミツクスと金属部材とを接合する
ことを特徴とするセラミツクスと金属部材の接合
方法。1. A groove having an unpolished firing surface is provided in a portion of the ceramic to be bonded to a metal member, a metal layer is formed on the bonding portion of the ceramic including the groove, and a metal layer is bonded to the metal member. forms a hole into which the ceramic is fitted, and fits the ceramic and the metal member;
A method for joining ceramics and a metal member, characterized in that the ceramic and the metal member are then joined by brazing the fitting portions of the two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP978484A JPS60155578A (en) | 1984-01-23 | 1984-01-23 | Method of bonding ceramic and metal member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP978484A JPS60155578A (en) | 1984-01-23 | 1984-01-23 | Method of bonding ceramic and metal member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60155578A JPS60155578A (en) | 1985-08-15 |
| JPH0543664B2 true JPH0543664B2 (en) | 1993-07-02 |
Family
ID=11729854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP978484A Granted JPS60155578A (en) | 1984-01-23 | 1984-01-23 | Method of bonding ceramic and metal member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60155578A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0229013U (en) * | 1988-08-16 | 1990-02-23 |
-
1984
- 1984-01-23 JP JP978484A patent/JPS60155578A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60155578A (en) | 1985-08-15 |
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