JPH0543283B2 - - Google Patents
Info
- Publication number
- JPH0543283B2 JPH0543283B2 JP6768986A JP6768986A JPH0543283B2 JP H0543283 B2 JPH0543283 B2 JP H0543283B2 JP 6768986 A JP6768986 A JP 6768986A JP 6768986 A JP6768986 A JP 6768986A JP H0543283 B2 JPH0543283 B2 JP H0543283B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- chip
- type electrolytic
- insulating base
- cut groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 claims description 27
- 238000007789 sealing Methods 0.000 claims description 9
- 238000003780 insertion Methods 0.000 claims description 8
- 230000037431 insertion Effects 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
- Apparatus For Radiation Diagnosis (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明はリフローはんだ付け方式などによりプ
リント基板上に取付けのできるチツプ形電解コン
デンサに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a chip-type electrolytic capacitor that can be mounted on a printed circuit board using a reflow soldering method or the like.
従来の技術
従来この種のチツプ形電解コンデンサ、特にチ
ツプ形アルミニウム電解コンデンサは、コンデン
サ素子に電解液が含浸されているため、アルミケ
ースに収納したものまたは樹脂ケースに収納した
ものを、さらにモールド成形して樹脂外装するな
ど２重外装したものが考案され公開されている。Conventional technology Conventionally, in this type of chip-type electrolytic capacitor, especially in chip-type aluminum electrolytic capacitors, the capacitor element is impregnated with electrolyte, so the capacitor element is housed in an aluminum case or a resin case and then molded. A double exterior, such as a double exterior with a resin exterior, has been devised and released to the public.
また一方第３図および第４図に示すように円筒
状金属ケース５に収納した電解コンデンサの引出
リード２，３を引出し根元で折り曲げたチツプ形
電解コンデンサが考案されている。７は絶縁台で
ある。（特開昭57−20425号、特開昭58−67019号、
実開昭50−98233号など）
発明が解決しようとする問題点
上述の２重外装した電解コンデンサにおいて
は、外形寸法が大きくなり、製造工程が複雑で高
価になる問題があつた。また第３図および第４図
のようなチツプ形アルミニウム電解コンデンサに
おいては、プリント基板に取付けたとき引出リー
ド２，３の折曲部およびその近傍がプリント基板
に近接する構造であるので、基板洗浄の際コンデ
ンサの取付面に浸入したはんだフラツクス、汚物
などが除去し難く、またこれを除去するため洗浄
時間を長くすると、洗浄液が弾性封口体４の内部
まで浸入し、コンデンサ素子１を構成するアルミ
ニウム箔などが腐蝕するといつた問題があつた。 On the other hand, as shown in FIGS. 3 and 4, a chip-type electrolytic capacitor has been devised in which the lead-out leads 2 and 3 of an electrolytic capacitor housed in a cylindrical metal case 5 are bent at the base of the drawer. 7 is an insulating stand. (JP-A-57-20425, JP-A-58-67019,
(Utility Model Application Publication No. 50-98233, etc.) Problems to be Solved by the Invention The above-mentioned double-exposed electrolytic capacitor had problems in that the external dimensions were large and the manufacturing process was complicated and expensive. In addition, the chip-type aluminum electrolytic capacitors shown in Figs. 3 and 4 have a structure in which the bent portions of the lead leads 2 and 3 and their vicinity are close to the printed circuit board when mounted on the printed circuit board. During this process, it is difficult to remove solder flux, dirt, etc. that have entered the mounting surface of the capacitor, and if the cleaning time is extended to remove them, the cleaning liquid will penetrate into the inside of the elastic sealing body 4 and damage the aluminum constituting the capacitor element 1. There was a problem with the foil etc. corroding.
問題点を解決するための手段
本発明は上述の問題を解消したもので、コンデ
ンサ素子より同一方向に導出した陽極用および陰
極用の２つの引出リードを弾性封口体に貫通さ
せ、上記素子を有底金属ケースに収納し、該ケー
スの開口部を締付け密閉し、かつ上記封口体の外
表面に絶縁台を配置すると共に該絶縁台に設けた
リード挿通部に引出リードを挿入して絶縁台の外
表面に折り曲げて外部端子を構成してなるプリン
ト基板取付用チツプ形電解コンデンサにおいて、
上記絶縁台に設けられた２つのリード引出部から
各々側面方向に切溝を形成し、かつ該切溝を側面
近傍で一条にしたことを特徴とするチツプ形電解
コンデンサである。Means for Solving the Problems The present invention solves the above-mentioned problems by penetrating an elastic sealing body with two lead-out leads for an anode and a cathode led out in the same direction from a capacitor element. It is stored in a bottom metal case, the opening of the case is tightened and sealed, and an insulating stand is arranged on the outer surface of the sealing body, and the lead-out lead is inserted into the lead insertion hole provided in the insulating stand to open the insulating stand. Chip-type electrolytic capacitors for mounting on printed circuit boards that are bent on the outer surface to form external terminals,
This chip-type electrolytic capacitor is characterized in that a groove is formed in the side direction from each of the two lead lead-out portions provided on the insulating stand, and the groove is formed into a single strip near the side surface.
作 用
絶縁台のプリント基板取付側の面に設けた切溝
は、２つのリード挿通部から側面方向に設けら
れ、かつ側面近傍で一つの切溝に構成されている
ので、プリント基板上にはんだ付けされた後、洗
浄する際引出リードの折り曲げ部の根元近傍のフ
ラツクス汚物などが切溝を通して容易に絶縁台の
側面および外方に除去出来ると共に、絶縁台の熱
吸収が少ないため、引出リードとプリント基板上
の電極パツドとの半田付が良好となる。また引出
リード間隔が少なく半田付によつて生じる半田た
まりを切溝に逃すようにでき、シヨート不良の発
生を解消することができた。Function The cut grooves provided on the printed circuit board mounting side of the insulating stand are provided in the side direction from the two lead insertion portions, and there is one cut groove near the side surface, so there is no solder on the printed circuit board. After being attached, when cleaning, flux and dirt near the base of the bent part of the lead can be easily removed through the cut grooves to the sides and outside of the insulating base, and since the insulating base absorbs less heat, Good soldering with electrode pads on the printed circuit board. Furthermore, the spacing between the lead-out leads is small, allowing solder pools generated during soldering to escape into the kerf, thereby eliminating the occurrence of shot defects.
さらにプリント基板上にはんだ付けされる際
に、はんだ溶融で加熱されたガスが切溝を通して
絶縁台の外方に対流するので、引出リードの折り
曲げ部の根元のはんだ付性が著しく向上しはんだ
が不完全に付着して断線するといつた事故は全く
生じない。 Furthermore, when soldering onto a printed circuit board, the heated gas from the melting of the solder flows outward from the insulating base through the grooves, which significantly improves the solderability at the base of the bent part of the lead lead and prevents the solder from melting. Accidents such as incomplete adhesion and disconnection never occur.
実施例
以下、本発明を第１図および第２図に示す実施
例により説明する。EXAMPLES The present invention will be explained below with reference to examples shown in FIGS. 1 and 2.
第１図はチツプ形電解コンデンサの断面図、第
２図は絶縁台で、イは平面図、ロは底面図であ
る。絶縁台６はPBT、PET、ABS、PPSなどか
らなる耐熱性熱可塑性樹脂またはエポキシ樹脂な
どの熱硬化性樹脂などを成形加工して形成された
もので、６ａ，６ｂはリード挿通部で、２つのリ
ード挿通部は側面に向けて切溝６ｃを形成し、か
つ該切溝６ｃを側面近傍で一条に形成されてい
る。 Fig. 1 is a sectional view of a chip electrolytic capacitor, Fig. 2 is an insulating stand, A is a plan view, and B is a bottom view. The insulating stand 6 is formed by molding a heat-resistant thermoplastic resin such as PBT, PET, ABS, or PPS, or a thermosetting resin such as an epoxy resin, and 6a and 6b are lead insertion parts; Each of the lead insertion portions has a cut groove 6c formed toward the side surface, and the cut groove 6c is formed in a line near the side surface.
このようにコンデンサ素子１より同一方向に導
出した引出しリード２，３を弾性封口体４に貫通
させ、上記コンデンサ素子１をアルミニウムなど
からなる有底金属ケース５に収納し、該ケース５
の開口部を締付け密閉する。 The lead-out leads 2 and 3 led out in the same direction from the capacitor element 1 are passed through the elastic sealing member 4, and the capacitor element 1 is housed in a bottomed metal case 5 made of aluminum or the like.
Tighten and seal the opening.
次に上記弾性封口体４の外表面に上述の絶縁台
６を配置すると共に該絶縁台６に設けたリード挿
通部６ａ，６ｂに引出リード２ａ，３ａを挿入し
絶縁台６の切溝６ｃと重ならない方向の外表面に
折り曲げる。このとき引出リード２ａ，３ａは互
いに反対方向で各々絶縁台６の側面に向けて幅お
よび深さが順次広がるよう構成した凹部内にほぼ
直角に折り曲げられ、外部端子２ａ，３ａを形成
する。 Next, the above-mentioned insulating stand 6 is arranged on the outer surface of the elastic sealing body 4, and the lead-out leads 2a and 3a are inserted into the lead insertion parts 6a and 6b provided on the insulating stand 6, and the lead-out leads 2a and 3a are inserted into the cut grooves 6c of the insulating stand 6. Fold to the outside surface in a direction that does not overlap. At this time, the pull-out leads 2a, 3a are bent at a substantially right angle in opposite directions into recesses each configured to gradually increase in width and depth toward the side surface of the insulating base 6, thereby forming external terminals 2a, 3a.
なお、外部端子２ａ，３ａは偏平状に形成して
もよく、丸線状であつてもよい。 Note that the external terminals 2a and 3a may be formed into a flat shape or may be formed into a round wire shape.
発明の効果
本発明のチツプ形電解コンデンサは以上のよう
にして構成され、上述の作用によつてプリント基
板の洗浄が短時間にかつ完全にでき、洗浄液が弾
性封口体内へ侵入しないので、極めて信頼性の高
いコンデンサが得られると共に引出リードの折り
曲げ角度がほぼ直角に安定して製作できるので、
プリント基板への固定が著しく安定するため、生
産性が向上するなど顕著な効果を生ずる。Effects of the Invention The chip-type electrolytic capacitor of the present invention is constructed as described above, and due to the above-described action, the printed circuit board can be completely cleaned in a short time, and the cleaning liquid does not enter the elastic sealing body, so it is extremely reliable. In addition to obtaining a capacitor with high performance, the bending angle of the lead lead can be stably manufactured at almost a right angle.
The fixation to the printed circuit board is extremely stable, resulting in significant effects such as improved productivity.
第１図は本発明のチツプ形電解コンデンサの一
実施例の断面図、第２図は本発明に係るチツプ形
電解コンデンサの絶縁台で、イは平面図、ロは底
面図、第３図および第４図は従来の各々異なるチ
ツプ形電解コンデンサの断面図である。
１：コンデンサ素子、２，３：引出リード、２
ａ，３ａ：外部端子、４：弾性封口体、５：金属
ケース、６：絶縁台、６ａ，６ｂ：リード挿通
部、６ｃ：切溝。
FIG. 1 is a sectional view of an embodiment of the chip-type electrolytic capacitor of the present invention, FIG. 2 is an insulating stand of the chip-type electrolytic capacitor according to the present invention, A is a plan view, B is a bottom view, FIGS. FIG. 4 is a sectional view of different conventional chip type electrolytic capacitors. 1: Capacitor element, 2, 3: Output lead, 2
a, 3a: external terminal, 4: elastic sealing body, 5: metal case, 6: insulating stand, 6a, 6b: lead insertion part, 6c: kerf.
Claims (1)
用および陰極用の２つの引出リードを、弾性封口
体に貫通させ、上記素子を有底金属ケースに収納
し、該ケースの開口部を締付け密閉し、かつ上記
封口体の外表面に絶縁台を配置すると共に、該絶
縁台に設けたリード挿通部に引出リードを挿入し
て絶縁台の外表面に折り曲げて外部端子を構成し
てなるプリント基板取付用チツプ形電解コンデン
サにおいて、上記絶縁台に設けられた２つのリー
ド挿通部から各々側面方向に切溝を形成し、かつ
該切溝を側面近傍で一条にしたことを特徴とする
チツプ形電解コンデンサ。 ２ 上記切溝がリード線折り曲げ方向と異なる方
向に設けたことを特徴とする特許請求の範囲第１
項記載のチツプ形電解コンデンサ。[Claims] 1. Two lead-out leads for an anode and a cathode led out in the same direction from a capacitor element are passed through an elastic sealing body, the element is housed in a bottomed metal case, and the opening of the case is is tightened and sealed, and an insulating base is placed on the outer surface of the sealing body, and a lead-out lead is inserted into the lead insertion portion provided on the insulating base and bent over the outer surface of the insulating base to form an external terminal. This chip type electrolytic capacitor for mounting on a printed circuit board is characterized in that a cut groove is formed in the side direction from each of the two lead insertion portions provided on the insulating stand, and the cut groove is made into a single strip near the side surface. Chip type electrolytic capacitor. 2. Claim 1, characterized in that the cut groove is provided in a direction different from the lead wire bending direction.
Chip-type electrolytic capacitors as described in .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6768986A JPS62222622A (en) | 1986-03-25 | 1986-03-25 | Electrolyte chip capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6768986A JPS62222622A (en) | 1986-03-25 | 1986-03-25 | Electrolyte chip capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62222622A JPS62222622A (en) | 1987-09-30 |
| JPH0543283B2 true JPH0543283B2 (en) | 1993-07-01 |
Family
ID=13352204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6768986A Granted JPS62222622A (en) | 1986-03-25 | 1986-03-25 | Electrolyte chip capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62222622A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5589212B2 (en) * | 2011-05-24 | 2014-09-17 | ニチコン株式会社 | Chip type electrolytic capacitor |
-
1986
- 1986-03-25 JP JP6768986A patent/JPS62222622A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62222622A (en) | 1987-09-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |