JPH0542187U - Carrier for electronic parts - Google Patents

Abstract

(57) [Abstract] [Purpose] An electronic component carrier in which an electronic component fixed by an adhesive is detached by a push-up pin, and the electronic component can be reliably detached without tilting. [Structure] An adhesive 6 is applied to an electronic component mounting portion 3 of a carrier 1 for transportation.
And a plurality of push-up pin insertion holes 5 were provided, and the adhesive 6 was positioned between the push-up pin insertion holes 5 and 5.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an electronic component carrier used for transporting an electronic component to a mounting process when the electronic component is mounted on a circuit board.

[0002]

[Prior Art]

 When an electronic component is mounted on a circuit board by an automatic mounting device, an electronic component carrier as shown in FIG. 4 may be used to transport the electronic component to the mounting position.

In FIG. 4, 1'is a transport support, 2 '... are embossed recesses for accommodating electronic parts, which are provided in the transport support 1'at regular intervals, and 3'are formed on the bottom surface of the recess 2'. It is an electronic component placement section. Denoted at 5'is a push-up pin insertion hole provided at the center of the mounting portion, and denoted at 6 ', ... is an adhesive provided around the push-up pin insertion hole 5'.

To mount an electronic component on a circuit board using this electronic component carrier, the electronic component is fixed to an electronic component mounting portion with an adhesive, and the carrier is fed to move the electronic component to a mounting location. At the mounting location, the electronic components are transported and detached from the adhesive by pushing up the push-up pins, and are positioned and moved to the mounting position by the suction hand.

When the electronic component is displaced by the push-up pin, if displacement occurs in the direction of the electronic component, misalignment of the lead of the electronic component causes misalignment, leading to mounting failure. Detachment without displacement is required.

FIG. 5 shows a mechanical state when the electronic component A ′ is detached from the carrier by the push-up pin P ′. The electronic component A ′ is a hard body like a flat package, and the electronic component A ′ is Since A'and the push-up pin P'are rigid and the carrier (plastic film) C'is a flexible body, the electronic component A is supported by the push-up pin P'at the rotation fulcrum, and at the adhesive location B '. It is equivalent to a state in which a downward vertical force is applied.

[0007]

[Problems to be solved by the device]

 As can be understood from the mechanical state shown in FIG. 5, the conventional carrier for electronic parts has a structure in which the electronic parts are detached from the adhesive in the state of being supported at one point. Since the supporting state is unstable, the electronic components tend to tilt, and it is difficult to guarantee the accuracy of mounting the electronic components on the circuit board with high accuracy.

An object of the present invention is to make it possible to reliably detach an electronic component without tilting in an electronic component carrier in which an electronic component fixed by an adhesive is detached by a push-up pin.

[0009]

[Means for Solving the Problems]

 The carrier for electronic parts of the present invention is such that an adhesive and a plurality of push-up pin insertion holes are provided in the electronic part mounting portion of the transfer support, and the adhesive is positioned between the push-up pin insertion holes. This is a characteristic configuration.

[0010]

[Action]

 At the two-point support (support by the push-up pin), the electronic component can be detached while resisting the downward tensile force at the adhesive portion, and since the supporting state is stable, the electronic component can be detached without tilting.

[0011]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of the present invention. In FIG. 1, reference numeral 1 is a support made of a plastic film, which is electrically conductive to prevent generation of static electricity. Denoted by 11 are feed sprocket holes provided on both sides of the support 1, and denoted by 2 are embossed recesses for accommodating electronic parts formed at a predetermined interval in the support 1.

Reference numeral 3 denotes an electronic component mounting portion formed on the bottom surface of the concave portion 2 except for the peripheral portion. The electronic component mounting portion 3 is surrounded by an electronic component (for example, a rectangular flat package component). Space 4 is secured to accommodate the lead. Reference numerals 5, ... Are four push-up pin insertion holes provided in the electronic component mounting portion 3, and 6 is an adhesive provided at the center of the push-up pin insertion holes 5 ,. The adhesive 6 is located at the center between the insertion holes 5 and 5.

To mount an electronic component on a circuit board using the electronic component carrier, the electronic component is accommodated in the electronic component accommodating recess 2 and then fixed to the electronic component mounting portion 3 with an adhesive 6. Then, the reel is wound around a reel, and the reel roll carrier is rewound from the reel by the engagement of the sprocket wheel into the sprocket holes 11 ,. At the mounting place, by pushing up the push-up pin through the push-up pin insertion holes 5, ..., The electronic component is detached from the electronic component mounting portion 3 against the adhesive force of the adhesive 6, and the electronic component is electronically moved by the suction hand. Move to the component mounting position and align.

In this case, the mechanical state at the time of detaching the electronic component is as shown in FIG. 2, and the downward pulling reaction force acting point B of the adhesive portion exists between the push-up pin P supporting points of the electronic component A. ing. Therefore, there is no action of force except between the push-up pin support points, and the action of force is confined between the push-up pin support points, and a force (rotational moment) that tilts the electronic component A is generated. However, since a reaction force against this rotational moment is generated at the thrust pin fulcrum, the electronic component A does not rotate. Therefore, the electronic component A can be prevented from tilting and detached from the carrier.

FIG. 3A shows another embodiment of the present invention, in which the push-up pin insertion holes 5 are provided at the center positions of the four sides of the electronic component mounting portion 3, respectively. An adhesive 6 is provided in the center of.

FIG. 3B shows another embodiment of the present invention, in which the push-up pin insertion holes 5 are provided in each of the four corners of the electronic component mounting portion 3, and the push-up pins adjacent to each other are pushed up. An adhesive 6 is provided in the center between the pin insertion holes 5, 5.

FIG. 3C shows another embodiment of the present invention, which connects the push-up pin insertion holes 5 and 5 when the rotating moment M acts when the electronic component is detached. Since the adhesive 6 is located between the push-up pin insertion holes 5 and 5 with respect to the moment component m in the direction, the inclination of the electronic component can be prevented with respect to the moment component m.

FIG. 3D shows another embodiment of the present invention different from the above. In FIGS. 3A to 3D, 3 is an electronic component mounting portion, 5 is a push-up pin insertion hole, and 6 is an adhesive.

[0019]

[Effect of the device]

 The electronic component carrier of the present invention has the above-described configuration, and can prevent the electronic component from rotating (tilting) even when a rotational moment acts on the electronic component when the electronic component is detached by the push-up pin. In addition, electronic parts can be mounted on a circuit board with high mounting accuracy, and in particular, it has a fine pitch lead and is useful for mounting an LSI flat package that requires high mounting accuracy.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a mechanical state when an electronic component is detached from the electronic component carrier of the embodiment by a push-up pin.

FIG. 3 is a plan view showing an essential part of another embodiment different from the above of the present invention.

FIG. 4 is a perspective view showing a conventional electronic component carrier.

FIG. 5 is an explanatory diagram showing a mechanical state when an electronic component is detached from a conventional electronic component carrier by a push-up pin.

[Explanation of symbols]

 1 Support 3 Electronic Component Placement 5 Push-up Pin Insertion Hole 6 Adhesive

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Creator Naohiro Matsuo 1-2 1-2 Shimohozumi, Ibaraki City, Osaka Prefecture Nitto Denko Corporation

Claims (2)

[Scope of utility model registration request] 1. A carrier for electronic parts, characterized in that an adhesive and a plurality of push-up pin insertion holes are provided on an electronic part mounting portion of a carrier for carrying. 2. The carrier for electronic parts according to claim 1, wherein an adhesive is positioned between the push-up pin insertion holes.