JPH0541592A - Circuit module - Google Patents

Circuit module

Info

Publication number
JPH0541592A
JPH0541592A JP19625091A JP19625091A JPH0541592A JP H0541592 A JPH0541592 A JP H0541592A JP 19625091 A JP19625091 A JP 19625091A JP 19625091 A JP19625091 A JP 19625091A JP H0541592 A JPH0541592 A JP H0541592A
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
elastic member
circuit module
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP19625091A
Other languages
Japanese (ja)
Inventor
Hideo Araki
日出夫 荒木
Susumu Sato
晋 佐藤
Nobuki Yoshida
信喜 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP19625091A priority Critical patent/JPH0541592A/en
Publication of JPH0541592A publication Critical patent/JPH0541592A/en
Withdrawn legal-status Critical Current

Links

Abstract

PURPOSE:To provide a circuit module in which a soldering fixture is eliminated, an assembling operability is improved and which can be effectively grounded in the module having a printed circuit board formed with a circuit, and a shielding case for connecting a ground circuit, shielding and containing it. CONSTITUTION:Wedge-shaped sectional protrusions 4 are arranged at a predetermined interval on an inner periphery of a shielding case 2, an elastic member 6 is so arranged as to press a printed circuit board 1 on the protrusions 4 from a rear surface of the board 1 provided with a ground pattern 5 at an edge oppositely to the protrusions 4, and settling preventing stoppers 7 of elastic members 6 are arranged. Further, the members 6 are arranged at opposite positions of the protrusions 4, or the members 6 each having conductivity are arranged, and the pattern 5 is provided at opposite position of the member 6 on a rear edge of the board 1.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、回路を構成したプリン
ト配線板と、そのアース回路を接続させ、遮蔽して収容
する遮蔽ケースとから成る回路モジュールに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit module comprising a printed wiring board which constitutes a circuit, and a shield case which is connected to the ground circuit to shield and house it.

【0002】最近の電子装置は、特に半導体集積回路の
開発が大きく寄与して、高密度実装、小形化、高性能化
が著しく促進され、益々発展しつつある。これにより、
小さなプリント配線板に部品を集合実装し小回路に纏め
た回路モジュールが多用されるようになって来た。
Recently, the development of semiconductor integrated circuits has greatly contributed to recent electronic devices, and high-density mounting, miniaturization, and high performance have been remarkably promoted, and the electronic devices have been further developed. This allows
Circuit modules, in which components are collectively mounted on a small printed wiring board and combined into a small circuit, have come into wide use.

【0003】更に、各種回路モジュールや部品を親プリ
ント配線板に集合実装させて、保守取扱単位のプラグイ
ン構造とした回路パッケージとされる。回路モジュール
の構成規模は徐々に大形化の傾向にあり、このため高密
度実装、高度な遮蔽、部品的な生産性と経済性が要求さ
れて来ている。
Further, various circuit modules and parts are collectively mounted on a parent printed wiring board to form a circuit package having a plug-in structure for each maintenance and handling unit. The configuration scale of the circuit module is gradually increasing in size, so that high density packaging, high shielding, component productivity and economic efficiency are required.

【0004】更に、信号回路の配線に侵入したり誘導さ
れるノイズの軽減対策として、回路アースを強化させる
必要が生じて来ている。
Furthermore, as a measure for reducing the noise that enters or is induced in the wiring of the signal circuit, it is necessary to strengthen the circuit ground.

【0005】[0005]

【従来の技術】図3は従来の一例の回路モジュールを示
す。金属薄板を一面が開口した箱形に成形した遮蔽ケー
ス29に、部品9を実装したプリント配線板19が格納され
て回路モジュール39が構成され、この回路モジュール39
を図示省略の親プリント配線板に搭載し、プリント配線
板19に設けた接続端子91及び遮蔽ケース29の開口縁に突
設した突設端子28を接続させて固定させる。
2. Description of the Related Art FIG. 3 shows an example of a conventional circuit module. A circuit module 39 is configured by housing a printed wiring board 19 on which the component 9 is mounted in a shielding case 29 formed by molding a thin metal plate into a box shape with one surface open.
Is mounted on a parent printed wiring board (not shown), and the connection terminals 91 provided on the printed wiring board 19 and the protruding terminals 28 protruding from the opening edge of the shielding case 29 are connected and fixed.

【0006】この回路モジュール39でのプリント配線板
19の固定は、遮蔽ケース29の各側面に、所定間隔、開口
から所定レベルの位置に、打ち出しにより設けたストッ
パ79に、プリント配線板19の周縁を突き当て、当たり面
の反対面の周縁に所定に設けたアースパターン5と近接
の遮蔽ケース29の側面とを半田付けして固定させ、同時
に信号回路のアースを遮蔽ケース29に接続している。
Printed wiring board in this circuit module 39
The fixing of 19 is performed by abutting the peripheral edge of the printed wiring board 19 against a stopper 79 provided by punching on each side surface of the shielding case 29 at a predetermined interval and at a predetermined level from the opening, and at the peripheral edge of the opposite surface to the contact surface. The predetermined ground pattern 5 and the side surface of the adjacent shielding case 29 are fixed by soldering, and at the same time, the earth of the signal circuit is connected to the shielding case 29.

【0007】[0007]

【発明が解決しようとする課題】しかしながら、 こ
のプリント配線板19の固定方法は、遮蔽ケース29の熱容
量が大きく、半田付けに時間を要すると共に、組立作業
性が悪い。 又、プリント配線板19も高温に長時間曝
されるので、プリント配線にとって好ましくなく、配線
の剥離や半田ブリッジを発生させる恐れがある。等の問
題点がある。
However, in this method of fixing the printed wiring board 19, the heat capacity of the shielding case 29 is large, it takes a long time for soldering, and the assembling workability is poor. Further, the printed wiring board 19 is also exposed to high temperature for a long time, which is not preferable for the printed wiring and may cause peeling of the wiring or a solder bridge. There are problems such as.

【0008】本発明は、かかる問題点に鑑みて、半田付
け固定を無くし組立作業性を改善させ、且つ確実にアー
ス接続できる回路モジュールを提供することを目的とす
る。
In view of the above problems, it is an object of the present invention to provide a circuit module in which soldering and fixing are eliminated, assembly workability is improved, and grounding can be reliably performed.

【0009】[0009]

【課題を解決するための手段】上記目的は、図1の原理
説明図に示す如く、 [1] 部品9を実装し回路を構成したプリント配線板1
と、プリント配線板1のアース回路を接続させ、遮蔽し
て収容する遮蔽ケース2と、から成る回路モジュール3
において、遮蔽ケース2の内側周囲に所定間隔に、断面
が楔形の凸部4を配設し、凸部4に対向して縁面にアー
スパターン5を設けたプリント配線板1の裏面から、前
記凸部4にプリント配線板1を押圧せしめる弾性部材6
と、弾性部材6のヘタリ防止のストッパ7とを配設し
た、本発明の回路モジュール3により達成される。 [2] ここで、凸部4の対向位置に弾性部材6を配設した
前記回路モジュール3でも良く。 [3] 又、導電性を有する弾性部材6とし、プリント配線
板1の裏縁面、弾性部材6の対向位置にアースパターン
5を設けた、前記回路モジュール3とすると猶良くな
る。
As shown in the principle explanatory view of FIG. 1, [1] the printed wiring board 1 on which the component 9 is mounted to form a circuit is provided.
And a shield case 2 which is connected to the ground circuit of the printed wiring board 1 to be shielded and accommodated therein.
In the above, from the back surface of the printed wiring board 1 in which the convex portions 4 having a wedge-shaped cross section are arranged at a predetermined interval around the inside of the shielding case 2 and the ground pattern 5 is provided on the edge surface facing the convex portions 4, Elastic member 6 for pressing the printed wiring board 1 against the convex portion 4
This is achieved by the circuit module 3 of the present invention in which the stopper 7 for preventing the elastic member 6 from being set is disposed. [2] Here, the circuit module 3 in which the elastic member 6 is arranged at a position facing the convex portion 4 may be used. [3] Also, the elastic member 6 having conductivity and the ground pattern 5 provided on the back edge surface of the printed wiring board 1 and at a position facing the elastic member 6 serve as the circuit module 3, which is sufficient.

【0010】[0010]

【作用】図1は本発明の原理を説明する側断面図で、
(a) は組立前、(b) は組立後である。
1 is a side sectional view for explaining the principle of the present invention.
(a) is before assembly, (b) is after assembly.

【0011】即ち、プリント配線板1の縁にはアースパ
ターン5が設けてあり、遮蔽ケース2の側壁内側には楔
形の凸部4と、図中上下方向に圧縮された弾性部材6
と、ストッパ7と、が設けてあり、プリント配線板1の
幅寸法A、遮蔽ケース2の内法B、凸部4の頭面間寸法
Cとし、 B>A≧(B+C)/2の関係にあればプリント
配線板1を固定することが出来る。
That is, a ground pattern 5 is provided on the edge of the printed wiring board 1, a wedge-shaped convex portion 4 is formed inside the side wall of the shield case 2, and an elastic member 6 is compressed vertically in the drawing.
And a stopper 7 are provided, and the width dimension A of the printed wiring board 1, the inner dimension B of the shielding case 2 and the head-to-face dimension C of the convex portion 4 are set, and the relation of B> A ≧ (B + C) / 2 If it is, the printed wiring board 1 can be fixed.

【0012】図1の(a) で、プリント配線板1を図中上
から下に遮蔽ケース2に収めると、最初に凸部4の位置
で支えるので、押し下げれば凸部4の楔形により側面が
しなり凸部4が後退してプリント配線板1を通過させ
る。すると次に、ストッパ7に突き当たり、弾性部材6
がプリント配線板1の下面に当たり押し上げ力を作用さ
せると共に、側面のしなりは自己回復して凸部4はプリ
ント配線板1の上面の上方にて被さる位置となる。この
状態にて上からの押し力を無くせば、弾性部材6の作用
でプリント配線板1を押し上げ、凸部4に弾性的に押し
付けて固定させる。この際、凸部4及び弾性部材6にプ
リント配線板1のアースパターン5が押し当たり、導通
接続状態が得られる。
In FIG. 1 (a), when the printed wiring board 1 is housed in the shielding case 2 from the top to the bottom in the figure, it is supported at the position of the convex portion 4 first. The flexure convex portion 4 moves backward to pass the printed wiring board 1. Then, next, it hits the stopper 7 and the elastic member 6
While applying a pushing force to the lower surface of the printed wiring board 1, the bending of the side surface is self-recovered and the convex portion 4 is located above the upper surface of the printed wiring board 1. If the pushing force from above is eliminated in this state, the printed wiring board 1 is pushed up by the action of the elastic member 6 and is elastically pressed and fixed to the convex portion 4. At this time, the ground pattern 5 of the printed wiring board 1 is pressed against the convex portion 4 and the elastic member 6, and a conductive connection state is obtained.

【0013】このストッパ7は、プリント配線板1が押
し下げられて弾性部材6に当たり、これを限度以上に押
し下げてヘタらせてしまうことを防止するためのストッ
パである。
The stopper 7 is a stopper for preventing the printed wiring board 1 from being pushed down and hitting the elastic member 6 and pushing down the elastic member 6 more than a limit to make it loose.

【0014】かくして、本発明により、半田付け固定を
無くし組立作業性を改善させ、且つ確実にアース接続で
きる回路モジュールを提供することが可能となる。
Thus, according to the present invention, it is possible to provide a circuit module which eliminates soldering and fixing, improves assembly workability, and can be surely connected to the ground.

【0015】[0015]

【実施例】以下図面に示す実施例によって本発明を具体
的に説明する。全図を通し同一符号は同一対象物を示
す。図2に本発明の一実施例の構成図を示す。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail with reference to the embodiments shown in the drawings. Throughout the drawings, the same reference numerals denote the same objects. FIG. 2 shows a block diagram of an embodiment of the present invention.

【0016】本実施例は光−電気変換用の回路モジュー
ルに適用したもので、外形が42×82×高12mmの直方体
で、親プリント配線板に実装するように一面に接続兼固
定用の複数の接続端子を配設し、一側面に光コネクタを
備えたものである。
This embodiment is applied to a circuit module for optical-electrical conversion, and is a rectangular parallelepiped having an outer shape of 42 × 82 × height 12 mm, and a plurality of connecting / fixing terminals are mounted on one surface so as to be mounted on a parent printed wiring board. Connection terminals are provided and an optical connector is provided on one side surface.

【0017】この回路モジュール3は、図2に示す如
く、部品9や所定位置に接続端子91を実装して回路を構
成したプリント配線板1と、これを収容する遮蔽ケース
2とから構成される。
As shown in FIG. 2, the circuit module 3 is composed of a printed wiring board 1 having a component 9 and a connection terminal 91 mounted at a predetermined position to form a circuit, and a shielding case 2 for accommodating the printed wiring board 1. ..

【0018】遮蔽ケース2は、 0.3mm厚の鉄薄板で上面
と一側面とを開口した箱形のケース21と、光コネクタ99
を1個取付けた側面板22とから成り、固定ねじにて締着
固定している。
The shielding case 2 is a 0.3 mm thick iron thin plate, which is a box-shaped case 21 having an open top and one side, and an optical connector 99.
It is composed of a side plate 22 to which is attached one by one, and is fixed by fastening with a fixing screw.

【0019】このケース21には、プリント配線板1を収
容固定し、アース接続が自動的に行われるように、所定
間隔に楔形の凸部4が打ち出し加工にて、又、その間に
ストッパ7が切り起こし加工にて、三側面の所定レベル
位置に設けられ、更に、凸部4に対向して底面を固定端
としたL字形の片持ちばねの弾性部材6を切り起こしに
て一体に形成してあり、且つ、開口縁に一体に突設した
アース用の突設端子28が複数個設けてある。
In this case 21, the printed wiring board 1 is housed and fixed, and wedge-shaped convex portions 4 are punched out at predetermined intervals so that the ground connection is automatically performed, and a stopper 7 is provided therebetween. By cutting and raising, an elastic member 6 of an L-shaped cantilever spring, which is provided at a predetermined level position on three side surfaces and faces the convex portion 4 and has a bottom surface as a fixed end, is integrally formed by cutting and raising. In addition, a plurality of protruding terminals 28 for grounding are integrally provided on the edge of the opening.

【0020】プリント配線板1には、凸部4及び弾性部
材6の開放端との対向域に信号回路につながったアース
パターン5を両面に設けてある。かくして、部品を実装
したプリント配線板1を遮蔽ケース2の開口から押圧挿
入し、凸部4を通過してストッパ7に突き当たるまで押
し下げて、放置すれば、下面に突き当たった弾性部材6
の弾性力で押し上げられ、凸部4に押し付けられて固定
される。この時、凸部4及び弾性部材6の端部がアース
パターン5に押圧接触して確実なアースの接続がなさ
れ、ケース21の突設端子28にて図示省略の親プリント配
線板に低インピーダンスにて確実に接続される。
The printed wiring board 1 is provided with ground patterns 5 connected to the signal circuit on both sides in the area facing the open ends of the convex portions 4 and the elastic member 6. Thus, the printed wiring board 1 on which the components are mounted is pressed and inserted from the opening of the shielding case 2, and is pushed down until it passes through the convex portion 4 and hits the stopper 7, and if left unattended, the elastic member 6 that hits the lower surface.
Is pushed up by the elastic force of and is pressed against the convex portion 4 and fixed. At this time, the protrusions 4 and the ends of the elastic member 6 are pressed into contact with the earth pattern 5 to make a reliable earth connection, and the projecting terminals 28 of the case 21 provide a low impedance to the parent printed wiring board (not shown). Be connected securely.

【0021】上記実施例は一例を示したもので、各部の
形状、寸法、材料はこれに限定するものではない。凸部
4は、独立して打ち出しにてケース21に一体に突設させ
たが、別の折曲した弾性部材を固着させて、楔形断面形
状とし、プリント配線板1の縁端で押圧すれば変形して
通過させ、通過後直ちにばね力で復元し押圧に耐えるよ
うにしたものでも良く、この場合、周縁に沿った帯状の
弾性部材でも差支えない。
The above embodiment is an example, and the shape, size, and material of each part are not limited to these. The convex portion 4 is independently projected and integrally projected to the case 21, but if another bent elastic member is fixed to have a wedge-shaped cross-section and is pressed by the edge of the printed wiring board 1. It may be deformed and passed, and immediately after passing, it may be restored by spring force to withstand pressing, and in this case, a band-shaped elastic member along the peripheral edge may be used.

【0022】弾性部材6は、ケース21に一体に設けた
が、別部材を固着させたものでも良く、又、凸部4に対
向した位置でなく、ずれた位置に設けても良い。同様
に、ストッパ7も別部材を固着させたものでも良く、そ
の位置も限定しないが、一体に形成した凸部4の場合に
はそれから離れた位置の方が確実にストップ作用を成し
安全である。
Although the elastic member 6 is provided integrally with the case 21, a separate member may be fixed to the case 21. Alternatively, the elastic member 6 may be provided not at a position facing the convex portion 4 but at a shifted position. Similarly, the stopper 7 may be a member to which another member is fixed, and the position thereof is not limited, but in the case of the integrally formed convex portion 4, a position apart from the stopper 7 surely provides a stop action and is safe. is there.

【0023】[0023]

【発明の効果】以上の如く、本発明により、プリント配
線板と遮蔽ケースとの半田付け固定が無くなり、組立作
業性が著しく改善され、且つ確実にアース接続できる回
路モジュールが得られ、コストの低廉化、高品質化に寄
与するところが大きい。
As described above, according to the present invention, the soldering fixing of the printed wiring board and the shielding case is eliminated, the assembly workability is remarkably improved, and the circuit module which can be surely connected to the ground is obtained, and the cost is low. Greatly contributes to higher quality.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の原理説明図 (a) 組立前 (b) 組立後FIG. 1 is an explanatory view of the principle of the present invention (a) before assembly (b) after assembly

【図2】 本発明の一実施例の構成図FIG. 2 is a configuration diagram of an embodiment of the present invention.

【図3】 従来の一例の回路モジュールFIG. 3 is a circuit module of a conventional example.

【符号の説明】[Explanation of symbols]

1,19 プリント配線板 2,29 遮蔽ケース 3,
39 回路モジュール 4 凸部 5 アースパターン 6
弾性部材 7,79 ストッパ 9 部品 21
ケース 22 側面板 28 突設端子 91
接続端子 99 光コネクタ
1,19 Printed wiring board 2,29 Shielding case 3,
39 Circuit module 4 Convex part 5 Ground pattern 6
Elastic member 7,79 Stopper 9 Parts 21
Case 22 Side plate 28 Projection terminal 91
Connection terminal 99 Optical connector

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 部品(9) を実装し回路を構成したプリン
ト配線板(1) と、 該プリント配線板(1) のアース回路を接続させ、遮蔽し
て収容する遮蔽ケース(2) と、から成る回路モジュール
(3) において、 遮蔽ケース(2) の内側周囲に所定間隔に、断面が楔形の
凸部(4) を配設し、 該凸部(4) に対向して縁面にアースパターン(5) を設け
たプリント配線板(1)の裏面から、前記凸部(4) に該プ
リント配線板(1) を押圧せしめる弾性部材(6)と、該弾
性部材(6) のヘタリ防止のストッパ(7) とを配設したこ
とを特徴とする回路モジュール。
1. A printed wiring board (1) on which a component (9) is mounted to form a circuit, and a shield case (2) which is connected to the ground circuit of the printed wiring board (1) and is housed in a shielded manner. Circuit module consisting of
In (3), convex portions (4) having a wedge-shaped cross section are arranged at a predetermined interval around the inside of the shielding case (2), and the ground pattern (5) is provided on the edge surface facing the convex portions (4). From the back surface of the printed wiring board (1) provided with the elastic member (6) for pressing the printed wiring board (1) to the convex portion (4), and the stopper (7) for preventing the elastic member (6) from being settled. ) And a circuit module characterized by being provided.
【請求項2】 凸部(4) の対向位置に弾性部材(6) を配
設したことを特徴とする、請求項1記載の回路モジュー
ル。
2. The circuit module according to claim 1, wherein an elastic member (6) is arranged at a position facing the convex portion (4).
【請求項3】 導電性を有する弾性部材(6) とし、プリ
ント配線板(1) の裏縁面、該弾性部材(6) の対向位置に
アースパターン(5) を設けたことを特徴とする、請求項
1記載の回路モジュール。
3. An elastic member (6) having conductivity, wherein a ground pattern (5) is provided on the back edge surface of the printed wiring board (1) and at a position facing the elastic member (6). The circuit module according to claim 1.
JP19625091A 1991-08-06 1991-08-06 Circuit module Withdrawn JPH0541592A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19625091A JPH0541592A (en) 1991-08-06 1991-08-06 Circuit module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19625091A JPH0541592A (en) 1991-08-06 1991-08-06 Circuit module

Publications (1)

Publication Number Publication Date
JPH0541592A true JPH0541592A (en) 1993-02-19

Family

ID=16354685

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19625091A Withdrawn JPH0541592A (en) 1991-08-06 1991-08-06 Circuit module

Country Status (1)

Country Link
JP (1) JPH0541592A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1014771A1 (en) * 1998-12-23 2000-06-28 Lucent Technologies Inc. Pack designed to take, in particular, an electrical and/or electronic board, method for the manufacturing and assembley of a system comprising a corresponding pack and board
US6303855B1 (en) 1998-12-23 2001-10-16 Avaya Technology Corp. Pack designed to take, in particular, an electrical and/or electronic board, method for the manufacture and assembly of a system comprising a corresponding pack and board
JP2014504798A (en) * 2010-12-31 2014-02-24 トムソン ライセンシング Grounding structure for printed circuit boards
JP2015226076A (en) * 2014-05-26 2015-12-14 株式会社オーディオテクニカ Microphone

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1014771A1 (en) * 1998-12-23 2000-06-28 Lucent Technologies Inc. Pack designed to take, in particular, an electrical and/or electronic board, method for the manufacturing and assembley of a system comprising a corresponding pack and board
US6303855B1 (en) 1998-12-23 2001-10-16 Avaya Technology Corp. Pack designed to take, in particular, an electrical and/or electronic board, method for the manufacture and assembly of a system comprising a corresponding pack and board
JP2014504798A (en) * 2010-12-31 2014-02-24 トムソン ライセンシング Grounding structure for printed circuit boards
JP2015226076A (en) * 2014-05-26 2015-12-14 株式会社オーディオテクニカ Microphone

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19981112