JPH0541519Y2 - - Google Patents

Info

Publication number
JPH0541519Y2
JPH0541519Y2 JP16694188U JP16694188U JPH0541519Y2 JP H0541519 Y2 JPH0541519 Y2 JP H0541519Y2 JP 16694188 U JP16694188 U JP 16694188U JP 16694188 U JP16694188 U JP 16694188U JP H0541519 Y2 JPH0541519 Y2 JP H0541519Y2
Authority
JP
Japan
Prior art keywords
case
circuit board
printed circuit
insulating plate
filling material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP16694188U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0287397U (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16694188U priority Critical patent/JPH0541519Y2/ja
Publication of JPH0287397U publication Critical patent/JPH0287397U/ja
Application granted granted Critical
Publication of JPH0541519Y2 publication Critical patent/JPH0541519Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
JP16694188U 1988-12-23 1988-12-23 Expired - Lifetime JPH0541519Y2 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16694188U JPH0541519Y2 (en:Method) 1988-12-23 1988-12-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16694188U JPH0541519Y2 (en:Method) 1988-12-23 1988-12-23

Publications (2)

Publication Number Publication Date
JPH0287397U JPH0287397U (en:Method) 1990-07-11
JPH0541519Y2 true JPH0541519Y2 (en:Method) 1993-10-20

Family

ID=31454783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16694188U Expired - Lifetime JPH0541519Y2 (en:Method) 1988-12-23 1988-12-23

Country Status (1)

Country Link
JP (1) JPH0541519Y2 (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8859436B2 (en) 1996-05-28 2014-10-14 The Trustees Of Columbia University In The City Of New York Uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors formed using sequential lateral solidification and devices formed thereon

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8859436B2 (en) 1996-05-28 2014-10-14 The Trustees Of Columbia University In The City Of New York Uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors formed using sequential lateral solidification and devices formed thereon

Also Published As

Publication number Publication date
JPH0287397U (en:Method) 1990-07-11

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