JPH0541465A - Resin sealing method and device for semiconductor chip - Google Patents

Abstract

PURPOSE:To prevent the flow out of resin sealing agent from the top of a semiconductor chip without installing a square-shaped ring on a board, omit the square-shaped ring and hence produce a packaging board with higher density. CONSTITUTION:A resin sealing device 1 consists of a syringe 4 having a discharge nozzle 3 and a movable head 5 which fixedly holds the syringe 4. A hot air jetting nozzle 6, which jets hot air 10, is fixed to the head 5 with a screw 7. Epoxy resin sealing agent 2 is contained in the syringe 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip resin sealing method and apparatus for covering and sealing a semiconductor chip mounted on an insulating substrate and a mounting portion thereof.

[0002]

2. Description of the Related Art Conventionally, as an invention of a resin encapsulation method and device for a semiconductor chip mounted on an insulating substrate, there is an invention described in JP-A-61-247059, for example.

In the above invention, the semiconductor chip to be sealed is composed of an insulating substrate provided with a rectangular ring around the head, and the head containing the resin sealant moves above the semiconductor chip to move the resin from the resin sealant discharge nozzle. Is discharged. The ejected paste-like resin encapsulant covers the semiconductor chip on the insulating substrate and its mounting portion and spreads out to the surroundings, but the rectangular ring prevents this spreading out.

[0004]

However, in the above-mentioned prior art, since the rectangular ring is provided on the insulating substrate, there is a drawback that the number of steps is increased and the labor is troublesome.

Therefore, the present invention was developed in view of the above-mentioned drawbacks of the prior art, and it is possible to prevent the resin sealing agent from flowing out on the insulating substrate without providing a rectangular ring. It is intended to provide a method and a device.

[0006]

According to the present invention, when a semiconductor chip mounted on an insulating substrate is sealed with a resin, a resin sealant is discharged onto the semiconductor chip, and This is a method of curing the resin sealant by blowing hot air onto the resin sealant that has flowed out.

Further, it is provided with a movably held head, a syringe having a discharge nozzle fixedly held by the head, and a hot air jet nozzle for jetting hot air.

[0008]

In the present invention, the flow of the resin sealant on the insulating substrate is prevented by the pressure of the hot air jetted from the hot air jet nozzle fixedly held on the head, and the resin sealing agent exposed to the hot air is sealed. The agent can be prevented from flowing out by immediately starting to cure.

[0009]

Embodiment 1 FIGS. 1 and 2 show the present embodiment, FIG. 1 is a plan view, and FIG. 2 is a sectional view taken along the line AA 'in FIG.

Reference numeral 1 is a resin sealing device, and this resin sealing device 1
Is a syringe 4 that houses the epoxy resin sealant 2 and has a discharge nozzle 3 that discharges the epoxy resin sealant 2, a movable head 5 that fixes and holds the syringe 4, and a head that surrounds the head 5. Four hot air jet nozzles 6 which are locked to the nozzle and jet heated air downward from the tip of the nozzle.
And a set screw 7 for fixing and holding each hot air jet nozzle 6 to the head 5.

In the resin sealing device 1 having the above-mentioned structure, first, the epoxy resin sealing agent 2 is filled in the syringe 4. Then, the head 5 is moved, and the ejection nozzle 3 is moved and arranged on the semiconductor chip 9 mounted on the substrate 8. Next, the epoxy resin sealant 2 to which pressure is applied from one end of the syringe 4 is ejected from the ejection nozzle 3 onto the semiconductor chip 9.

The ejected epoxy resin encapsulant 2 flows over the substrate 8 while covering the semiconductor chip 9 and diffuses. At this time, the curing of the epoxy resin encapsulant 2 from the hot air jet nozzle 6 begins 150. The hot air 10 heated to 0 ° C. is jetted onto the substrate 8. Therefore, the epoxy resin sealant 2 that has flowed out onto the substrate 8 is suppressed from diffusing by the pressure from directly above the hot air 10, and the epoxy resin sealant 2 in the portion exposed to the hot air 10 begins to cure. Diffusion stops.

After the head 5 has moved, the epoxy resin sealant 2 that has stopped diffusing on the substrate 8 is put into a tank (not shown) in an atmosphere of 150 ° C. and hardened.

According to this embodiment, the diffusion of the epoxy resin sealant 2 can be stopped without providing the rectangular ring.

[0015]

[Embodiment 2] FIGS. 3 and 4 show this embodiment, FIG. 3 is a plan view, and FIG. 4 is a sectional view taken along the line BB 'of FIG.

In the resin sealing device 11 of this embodiment, the hot air jet nozzle 6 in the first embodiment is eliminated, and instead, a substantially L shape is used.
It is different in that the hot-air jetting nozzle 12 is shaped like a letter, and the other structure is composed of the same constituent parts.

The hot air jet nozzle 12 of the present embodiment is locked so that the directions of the heated air jetted from the tip end are in the directions of the hot air jet nozzles 12 (the downward direction of the discharge nozzle 3) facing each other.

The resin encapsulation device 11 having the above-mentioned structure ejects the epoxy resin encapsulant 2 onto the semiconductor chip 9 as in the first embodiment. The discharged epoxy resin encapsulant 2 flows over the substrate 8 while covering the semiconductor chip 9 and diffuses. At the same time, the epoxy resin encapsulant 2 is heated from the hot air jet nozzle 12 to 150 ° C. where the curing of the epoxy resin encapsulant 2 begins. Hot air 10 is ejected.

At this time, the hot-air jet nozzle 12 has a retaining screw 7
Since the epoxy resin sealant 2 flowing out onto the substrate 8 is adjusted so as to come into contact with the surface of the substrate 8 by the hot air 10, the diffusion is suppressed from the side surface and the hot air 10
The epoxy resin encapsulant 2 in the portion exposed to is hardened and the diffusion is stopped.

After the head 5 has moved, the epoxy resin sealant 2 that has stopped diffusing on the substrate 8 is placed in a tank (not shown) in a 150 ° C. atmosphere and is cured.

According to this embodiment, the same effect as that of the first embodiment can be obtained.

[0022]

Third Embodiment FIGS. 5 and 6 show the present embodiment, FIG. 5 is a plan view, and FIG. 6 is a sectional view taken along the line CC ′ of FIG.

The resin sealant 21 of this embodiment eliminates the four hot air jet nozzles 12 of the second embodiment, and instead has a pipe-shaped hot air jet nozzle 22 having a substantially circular bottom.
The configuration is different from that of the first embodiment, and other configurations are composed of the same components, and the same components are designated by the same reference numerals and the description thereof will be omitted.

The hot air jet nozzle 22 of this embodiment has a large number of holes 23 for jetting heated air formed in its circular inner circumference.

In the resin sealing device 21 having the above-mentioned structure, the epoxy resin sealing agent 2 is passed through the hole 23 of the hot air jet nozzle 22 adjusted so as to come in contact with the substrate 8 by the fastening screw 7 as in the second embodiment. Hot air 10 heated to 150 ° C. at which curing begins is jetted. As a result, diffusion is suppressed, and the epoxy resin sealant 2 in the portion exposed to the heated hot air 10
Begins to harden and stops spreading.

After the head 5 has moved, the epoxy resin sealant 2 that has stopped diffusing on the substrate 8 is placed in a tank (not shown) in a 150 ° C. atmosphere and cured.

According to the present embodiment, the same effects as those of the above-described embodiments can be obtained, and since only one hot air jet nozzle 22 is required, the adjustment can be done only once and the work can be facilitated.

[0028]

As described above, according to the method and apparatus for sealing a semiconductor chip of the present invention, the resin sealant is prevented from flowing out of the semiconductor chip without providing a rectangular ring on the substrate. As a result, it is possible to save the labor of providing a rectangular ring when manufacturing a board. Moreover, since a rectangular ring is not required, a higher-density mounting board can be manufactured.

[Brief description of drawings]

FIG. 1 is a plan view showing a first embodiment.

FIG. 2 is a sectional view taken along the line AA ′ of FIG.

FIG. 3 is a plan view showing a second embodiment.

FIG. 4 is a sectional view taken along line BB ′ of FIG.

FIG. 5 is a plan view showing a third embodiment.

6 is a cross-sectional view taken along the line CC ′ of FIG.

[Explanation of symbols]

 1,11,21 Resin sealing device 2 Epoxy resin sealing agent 3 Discharge nozzle 4 Syringe 5 head 6,12,22 Hot air jet nozzle 7 Fastening screw

Claims (2)

[Claims] 1. When sealing a semiconductor chip mounted on an insulating substrate with a resin, a resin sealant is discharged onto the semiconductor chip, and hot air is blown onto the resin sealant flowing out on the semiconductor chip. A resin encapsulating method for a semiconductor chip, characterized in that the resin encapsulant is cured by spraying. 2. A resin sealing of a semiconductor chip, comprising a movably held head, a syringe having a discharge nozzle fixedly held by the head, and a hot air blowing nozzle for jetting hot air. Stop device.