JPH0541462A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To reduce unnecessary radiation and prevent erroneous operation of a product by using a bonding agent which contains ferromagnetic powder such as ferrite powder so as to bond a sealed package with a lead frame. CONSTITUTION:A bonding agent 5 which contains ferromagnetic powder such as ferrite powder is used to bond a sealed package 6 with a lead frame 4. This means that an inductance is inserted into connection terminals of a semiconductor integrated circuit. A drastic change in output waveform is inhibited by the action of the inductance. It is, therefore, possible to obtain an output waveform having small harmonic components and inhibit unnecessary radiation from an output terminal.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a connection terminal for connecting to an external circuit in a semiconductor integrated circuit.

[0002]

2. Description of the Related Art At present, semiconductor integrated circuits have been used in many electric products and have been made compact and multifunctional.

However, recently, due to the speeding up and increasing the number of pins of a semiconductor integrated circuit, and the speeding up and downsizing of the product itself, there are many cases in which the semiconductor integrated circuit causes a malfunction of the product.

Unwanted radiation from a semiconductor integrated circuit is mainly radiated from an output terminal having a high energy level. The cause of such unnecessary radiation is that the output waveform is a square wave and thus contains many harmonic components. Therefore, the frequency component radiated from the output terminal has a spectrum in the vicinity of the fundamental wave and an integral multiple of the fundamental wave in addition to the fundamental wave.

As the degree of integration of semiconductor integrated circuits has increased in recent years, the number of integrated circuits and the number of input / output terminals tends to increase. However, there are almost no terminals that take measures for reducing unnecessary radiation, and when a semiconductor integrated circuit is used to assemble a product, the current situation is that self-defense measures must be taken on the circuit board of the product.

[0006]

SUMMARY OF THE INVENTION The present invention solves the problems of the prior art as described above, and improves the semiconductor integrated circuit itself without changing the conventional semiconductor integrated circuit manufacturing method as much as possible. The purpose is to reduce unnecessary radiation from semiconductor integrated circuits.

[0007]

SUMMARY OF THE INVENTION The present invention comprises at least one
In a semiconductor integrated circuit device including one or more chips including individual semiconductor circuit chips and a lead frame having conductivity, which is sealed with a sealing container, for bonding the sealing container and the lead frame. It is characterized by using an adhesive containing a ferromagnetic material such as ferrite.

[0008]

According to the above-mentioned means of the present invention, it becomes equivalent to that an inductance is inserted in the connection terminal of the semiconductor integrated circuit, and the function of the inductance suppresses the steep change of the output waveform, so that the harmonic component is small. An output waveform can be obtained, and unnecessary radiation from the output terminal can be suppressed.

[0009]

EXAMPLES The present invention will be described in detail below based on examples.

FIG. 1 shows an example of a semiconductor integrated circuit embodying the present invention. In this example, the case of a sardip type package which is inexpensive and highly reliable is taken as an example.

As shown in FIGS. 1 and 2, the sealing container on the upper surface and the sealing container on the lower surface are bonded to each other across the lead frame. However, since the adhesive contains ferrite, it is as if the ferrite leads. The shape is like sandwiching the frame.

The current flowing in the lead frame generates a magnetic field, but in the present invention, since ferrite tries to suppress the fluctuation of the magnetic field, the effect that an inductance is inserted in series in the lead frame is produced and a high frequency is generated. The component of is attenuated.

As shown in FIGS. 1 and 2, according to the present invention, there is no difference from the manufacturing process of a normal sardip type package. Simply change the adhesive to one containing ferrite.

When no measures are taken, the output waveform of the semiconductor integrated circuit is a square wave, and therefore, the frequency components shown in FIG. 3 are included.

The output waveform in the case of implementing the present patent has a frequency component as shown in FIG. 4 because a sharp change is suppressed by the action of the inductance as described above.

It is clear from the comparison between FIG. 3 and FIG. 4 that the harmonic components that cause unwanted radiation and adversely affect the device are reduced.

[0017]

As described above, according to the present invention,
By using an adhesive containing a ferromagnetic material such as ferrite, it has become possible to effectively reduce unnecessary radiation of higher harmonics from the output terminal of the semiconductor integrated circuit.

Therefore, it is possible to prevent the malfunction of the product due to the unnecessary radiation from the semiconductor integrated circuit being used.

In particular, the present invention will be able to obtain a significant effect in a large scale integrated circuit having a large number of output terminals.

[Brief description of drawings]

FIG. 1 is a structural diagram of a semiconductor integrated circuit device embodying the present invention.

FIG. 2 is a sectional view of a semiconductor integrated circuit device embodying the present invention.

FIG. 3 is an example diagram of frequency components of an output waveform from an output terminal of a semiconductor integrated circuit device according to a conventional technique.

FIG. 4 is an example diagram of frequency components of an output waveform from an output terminal of a semiconductor integrated circuit device embodying the present invention.

[Explanation of symbols]

 1 Semiconductor Circuit Chip 2 Bonding Wire 3 Die Pad 4 Lead Frame 5 Adhesive Containing Ferrite 6 Encapsulation Container

Claims (1)

[Claims] 1. A semiconductor integrated circuit device comprising one or more chips including at least one semiconductor circuit chip and a lead frame having conductivity, which is sealed with a sealing container. A semiconductor integrated circuit device characterized in that an adhesive containing a ferromagnetic material such as ferrite is used to bond the lead frame and the lead frame.