JPH0540427Y2 - - Google Patents
Info
- Publication number
- JPH0540427Y2 JPH0540427Y2 JP1985046668U JP4666885U JPH0540427Y2 JP H0540427 Y2 JPH0540427 Y2 JP H0540427Y2 JP 1985046668 U JP1985046668 U JP 1985046668U JP 4666885 U JP4666885 U JP 4666885U JP H0540427 Y2 JPH0540427 Y2 JP H0540427Y2
- Authority
- JP
- Japan
- Prior art keywords
- vacuum
- cylindrical case
- sensor
- cap
- sealed chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 6
- 239000007789 gas Substances 0.000 description 15
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- 229920002449 FKM Polymers 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985046668U JPH0540427Y2 (US07345094-20080318-C00003.png) | 1985-03-29 | 1985-03-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985046668U JPH0540427Y2 (US07345094-20080318-C00003.png) | 1985-03-29 | 1985-03-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61161732U JPS61161732U (US07345094-20080318-C00003.png) | 1986-10-07 |
| JPH0540427Y2 true JPH0540427Y2 (US07345094-20080318-C00003.png) | 1993-10-14 |
Family
ID=30561285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985046668U Expired - Lifetime JPH0540427Y2 (US07345094-20080318-C00003.png) | 1985-03-29 | 1985-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0540427Y2 (US07345094-20080318-C00003.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0543092Y2 (US07345094-20080318-C00003.png) * | 1987-02-16 | 1993-10-29 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4995982U (US07345094-20080318-C00003.png) * | 1972-12-10 | 1974-08-19 |
-
1985
- 1985-03-29 JP JP1985046668U patent/JPH0540427Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61161732U (US07345094-20080318-C00003.png) | 1986-10-07 |
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