JPH0540424Y2 - - Google Patents
Info
- Publication number
- JPH0540424Y2 JPH0540424Y2 JP1986176109U JP17610986U JPH0540424Y2 JP H0540424 Y2 JPH0540424 Y2 JP H0540424Y2 JP 1986176109 U JP1986176109 U JP 1986176109U JP 17610986 U JP17610986 U JP 17610986U JP H0540424 Y2 JPH0540424 Y2 JP H0540424Y2
- Authority
- JP
- Japan
- Prior art keywords
- strain
- groove
- load
- generating
- load cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005452 bending Methods 0.000 claims description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 5
- 238000007789 sealing Methods 0.000 description 10
- 238000001514 detection method Methods 0.000 description 8
- 238000003466 welding Methods 0.000 description 7
- 230000035945 sensitivity Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- OGSYQYXYGXIQFH-UHFFFAOYSA-N chromium molybdenum nickel Chemical compound [Cr].[Ni].[Mo] OGSYQYXYGXIQFH-UHFFFAOYSA-N 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Landscapes
- Measurement Of Force In General (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986176109U JPH0540424Y2 (es) | 1986-11-18 | 1986-11-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986176109U JPH0540424Y2 (es) | 1986-11-18 | 1986-11-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6381226U JPS6381226U (es) | 1988-05-28 |
| JPH0540424Y2 true JPH0540424Y2 (es) | 1993-10-14 |
Family
ID=31116043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986176109U Expired - Lifetime JPH0540424Y2 (es) | 1986-11-18 | 1986-11-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0540424Y2 (es) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6966930B2 (ja) * | 2017-11-17 | 2021-11-17 | Ｋｙｂ株式会社 | 荷重検出装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4949955U (es) * | 1972-08-07 | 1974-05-01 |
-
1986
- 1986-11-18 JP JP1986176109U patent/JPH0540424Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6381226U (es) | 1988-05-28 |
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