JPH0538814A - Recording head unit, recording head cartridge, recording device mountable with them and manufacture of recording head - Google Patents

Abstract

PURPOSE:To prevent a storage element from being damaged at the time of handling and install a recording head base horizontally by substantially including a storage element which has conditions regarding driving, etc., of an energy generating element in a recording head unit, in the recording head unit. CONSTITUTION:The major part of a recording head unit consists of a base plate 111 on which a notch 111A is formed, a heater board 112 on which an ink discharge energy generating element is formed, and a printed circuit base 115 which electrically connects the energy generating element and the printer main body. A semiconductor chip 128 which constitutes a ROM, which is a storage element, is soldered to the rear of the printed circuit board 115. In this case, the semiconductor chip 128 is arranged in the notch 111A when the print circuit board 115 is bonded to the base plate 111. The thickness after attaching components which are separately attached, such as the semiconductor chip 128 or condenser, etc., is set within the thickness of the base plate 111.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a recording head, an ink tank, a recording head cartridge which can be mounted on a recording device such as a printer, a facsimile, a copying machine, etc., and a recording device mounting these. In particular, the present invention relates to a recording head ink tank, a recording head cartridge having an element capable of mounting information on recording conditions, a recording head cartridge, and a recording apparatus mounting the same.

(Description of Related Art) An ink jet recording system in which a small droplet of a sink recording liquid is ejected and adhered to a recording medium such as paper to perform recording so that generation of noise during recording can be ignored. It is extremely small and capable of high-speed recording, and has been actively developed and researched as a recording method capable of recording on plain paper without requiring special processing such as fixing.

A recording head applied to such an ink jet recording apparatus generally has a fine liquid discharge port (orifice), a liquid passage communicating with the orifice, and an energy acting portion provided in a part of the liquid passage. A droplet energy generating means for acting on the liquid in the energy acting portion is provided.

As the energy generating means for generating such energy, a recording method using an electromechanical transducer such as a piezo element, electromagnetic waves such as a laser are radiated, and droplets are ejected by the heat generated by the laser to fly. There is a recording method and the like. Among them, an ink jet recording head having an electrothermal converter as an energy generating means can have a high density arrangement of liquid ejection ports (orifices) for ejecting recording liquid droplets to form flying liquid droplets. Therefore, it is possible to record high resolution. Further, by applying the recent IC semiconductor technology and micro processing technology, it becomes possible to provide an inkjet recording head which can be easily multi-nozzled and mounted at a high density, and which can be mass-produced with high productivity and low manufacturing cost. ing.

Recently, there has been proposed a structure in which an ink jet recording head cartridge can be detachably attached to a recording device, or a color recording can be performed by using recording head cartridges different for each color.

In particular, in such a construction in which the ink jet recording head cartridge can be attached to and detached from the recording apparatus, the apparatus conditions for the apparatus of the recording head cartridge, the color and density of the ink used in the recording head cartridge, the recording head cartridge Drive conditions Each recording head cartridge (ink tank, ink tank,
It is necessary to change the recording operation according to this characteristic, because it depends on the head).

Then, the recording head cartridge provided with the storage element for holding the information about these characteristics is the VSP,
No. 5,049,898.

On the other hand, in the method of manufacturing an ink jet recording head having a memory element, for example, the following steps are taken.

FIG. 12 is an explanatory view showing a manufacturing process of a substrate of an ink jet recording head as a related technique.

First, the base plate 1 (first substrate) made of glass, ceramics, plastic, metal or the like is washed (FIG. 12 (a)), and then, as shown in FIG. 12 (b), it is used as an electric / thermal converter. Heater board 2 on which an ink ejection pressure generating element (an ink ejection energy generating element that generates energy used to form ink droplets) such as a heating element or a piezoelectric element as an electromechanical converter is formed. The (second substrate) is bonded to a predetermined position on the base plate 1 using a UV curable adhesive or the like. Thereafter, as shown in FIG. 12C, a printed circuit board 3 (third substrate) that electrically connects the ink ejection pressure generating element and the printer body is bonded onto the base plate 1. Finally, for example, a semiconductor chip 4 (ROM), which is a storage element that stores data regarding the above-described characteristics, is soldered to the surface opposite to the joint surface between the base plate 1 and the heater board 3 (FIG. 12D). In addition, the manufacturing process of the recording head as described above is almost always carried out on an automated line.

[0011]

However, VSP 5,
In the configuration described in Japanese Patent Publication No. 049,898, a ROM, which is a storage element, is attached to the housing of the inkjet head cartridge. In the case of such a configuration, there are problems to be solved as described below.

If the information stored in the storage element is disturbed, the operation of the recording apparatus and the driving state of the recording head are disturbed accordingly, and not only the recorded image is disturbed but also when the trouble is serious. There is a risk that even recording will not be performed. When such a delicate storage element is attached to the housing of the recording head cartridge and exposed, a direct impact is applied to the storage element during transportation, or
When the recording head cartridge is attached to or detached from the recording apparatus, the user's hand or the like may touch the storage element, which may hinder the storage element.

Further, since the ink jet head cartridge itself holds ink which is a liquid, ink leaks during transportation, ink splashes during recording, etc., may interfere with the memory element and circuits around it. There was a fear.

On the other hand, there were the following problems to be solved in manufacturing the ink jet.

When the method of manufacturing the recording head substrate as shown in the figure is adopted, after the base plate 1 and the printed circuit board 115 are bonded to each other as shown in FIG. When soldered, the semiconductor chip 128 is in a state of protruding on the printed circuit board 115. Therefore, for example, when the recording head substrates are stored in a storage unit such as a magazine in the manufacturing process, it is difficult to stack the recording head substrates horizontally.
Therefore, the configuration for supplying the work may be complicated during the automatic assembly process. In addition, there is a possibility that the protruding semiconductor chip may be caught in the manufacturing process and may be damaged.

In the case of a separate semiconductor chip, when it is soldered to the printed circuit board 3, the heater board 112 is already bonded on the base plate 111 in the manufacturing process. For this reason, there are cases in which dust when soldering the semiconductor chip has an adverse effect such as damage to the heater board 112 or blocking of the ejection port. Furthermore, the solder residue after soldering moves to the ink ejection pressure generating element and electrode transistor formed on the heater board,
There is a risk that the semiconductor current may leak or solder residue may remain in the liquid passage, the liquid chamber, and the orifice, causing unstable ink ejection and non-ejection.

In order to prevent the contamination of the heater board 112 due to such solder residue, cleaning after soldering is considered, but when the semiconductor chip 128 is soldered, the heater board 112 is already integrated. Therefore, cleaning is often difficult.

It has been desired to solve these problems.

An object of the present invention is to solve the above-mentioned problems, and it interferes with a storage element provided in a recording head unit or a recording head cartridge during manufacturing, transportation, use, or the like. An object of the present invention is to provide a storage head, a recording head cartridge, and a manufacturing method thereof that do not have such a problem.

Another object of the present invention is to provide a recording head substrate in which a recording head substrate can be stacked horizontally in a magazine without damaging the memory elements during the manufacturing process and the work can be easily supplied for automatic assembly. It is to provide a manufacturing method.

Another object of the present invention is to provide a method of manufacturing a recording head substrate in which contamination in the soldering process during the manufacturing process does not adversely affect the heater board.

[0022]

In order to achieve such an object, the present invention solves the problems during the manufacturing process by optimizing the arrangement position and the arrangement method of the storage elements arranged on the recording head substrate. Can be resolved.

Further, according to the present invention, the recording head substrate can be made compact by arranging the semiconductor chip, for example, in the cutout portion, the groove portion, or the through hole of the base plate, and, for example, in the storage element. Since the protrusions can be eliminated, the recording head substrates can be horizontally stacked in a storage unit such as a magazine.

Further, according to the present invention, a semiconductor chip is soldered to a printed circuit board, cleaned, and then joined to a base plate and the printed circuit board, thereby performing a soldering step for mounting a memory element cleaning. It is possible to prevent the dirt from adversely affecting the heater board.

The present invention also provides an ink jet recording head,
By optimizing the arrangement position of the storage elements arranged in the inkjet head cartridge and by protecting the arranged storage elements, damage to the storage elements can be eliminated.

Further, the main structure of the ink jet recording head unit according to the present invention is such that an ejection port for ejecting ink, an ink channel communicating with the ejection port, and energy for ejecting the ink to the ink in the ink channel. And an energy generating element for generating the energy generating element, and the recording head unit has a memory element having conditions such as driving of the energy generating element, and the memory element is substantially included in the recording head unit. Or has an ejection port for ejecting ink, a flow path communicating with the ejection port, and an energy generating element for generating energy for ejecting ink to the ink in the ink flow path. A first substrate provided with a notch, a groove, or a through hole; and the energy generating element provided at a predetermined position on the first substrate. The second substrate thus obtained and a third substrate provided with a semiconductor element and electrically connected to the second substrate, wherein the first substrate and the third substrate are bonded to each other. Then, the semiconductor element is arranged at the cutout portion, the groove portion, or the through hole position.

The main structure of the ink jet recording head cartridge according to the present invention has an ink jet recording head for ejecting ink for recording, and an ink tank for supplying ink to the recording head. The head includes a discharge port for discharging ink, an ink flow path communicating with the discharge port, an energy generating element for generating energy for discharging ink, and a storage element having conditions such as driving of the energy generating element. And the storage element is covered by the connection between the recording head and the ink tank.

The main structure of the recording apparatus of the present invention is as follows.
A discharge port for discharging ink, an ink flow path communicating with the discharge port, an energy generating element for generating energy for discharging ink to the ink in the ink flow path, conditions for driving the energy generating element, etc. A storage element having a storage element, the storage element having the recording head cartridge,
Signal supply means for supplying a signal for driving the energy generating element.

Further, the main manufacturing method of the recording head unit is to bond a second substrate provided with a heating element for ejecting ink onto the first substrate, and form a third substrate which is an electric circuit substrate. Bonding the semiconductor element, cleaning the third substrate to which the semiconductor element is bonded, and cleaning the first substrate and the third substrate.
And the step of joining the substrate of FIG.

[0030]

Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 2 is an exploded perspective view of the main part of the recording head unit.

The main part of the recording head unit is constructed so as to prevent the memory element from being damaged during manufacturing, and does not affect the memory element even if ink is scattered.

In FIG. 1, reference numeral 111 is a cutout portion 5.
Is a base plate provided with. Reference numeral 112 is a heater board on which an ink ejection energy generating element such as an electrothermal converting element is formed. Reference numeral 115 denotes a printed circuit board that electrically connects the energy generating element and the printer body, and has double-sided wiring. Reference numeral 128 is a semiconductor chip that constitutes a ROM that is a storage element soldered to the back surface of the printed circuit board 3.

The semiconductor chip 128 has a structure in which the printed circuit board 115 is joined to the base plate 111 when
It is arranged in the cutout portion 111A of the base plate 111. At this time, the thickness of the semiconductor chip 128, the capacitor, and the like, after being attached to the base plate 111
Since it is formed within the thickness of the base plate 111, it does not project from the surface of the base plate 111. As a result, the assembled components can be horizontally loaded in the magazine or the like. Further, since there is no protruding portion, there is no risk of being caught in other steps, and therefore the semiconductor chip 12
8 etc. will not be damaged.

Incidentally, it is desirable that the printed circuit board 3 and the base plate 1 are joined to each other in a portion of the printed circuit board where the wiring pattern is not provided in order to prevent an influence of an adhesive or the like on the wiring pattern.

On the heater board 112, there is provided a top plate 113 having a plurality of grooves for forming a liquid passage and a common liquid chamber communicating with the liquid passage. Here, the top plate 113 is integrated with a front plate (orifice plate) having ink discharge ports communicating with the respective liquid paths. When the top plate 113 is aligned with each ejection port and the liquid passage and then joined to the base plate 111, an ink supply port, a liquid passage, a liquid chamber, and an ejection port are formed.

In this embodiment, the base plate 11
1 has a cutout 111A, but the base plate 1
A groove or a through hole may be provided in 11 and the semiconductor chip 128 may be housed therein. At that time, the semiconductor chip 1
If the thickness of 28 is within the thickness of the base plate 111, it will not project from the surface of the base plate 111.

Next, a method of manufacturing the recording head substrate constituting the recording head unit of this embodiment will be described with reference to FIG. In FIG. 2, the left side shows the procedure of each step, and the right figures (a) to (c) show the recording head substrate in each step. First, the base plate 111 is washed (FIG. 2A). Thereafter, as shown in FIG. 2B, the heater board 112 is bonded onto the base plate 111 by using a UV curable adhesive or the like. On the other hand, the semiconductor chip 128 is soldered to the back surface of the printed circuit board 115, and the printed circuit board with a semiconductor chip is washed to remove solder scraps, ball solder, dirt, flux and the like. Finally, as shown in FIG. 2C, the printed circuit board 115
The semiconductor chip 128 soldered to the back surface of the base plate 111 and the printed circuit board 3 are arranged by using a UV curable adhesive or the like so that the semiconductor chip 128 is arranged in the cutout portion 111A (in FIG. 1) of the base plate 111. To join.

According to this manufacturing process, after the step of soldering a semiconductor chip or the like to the printed circuit board is performed, the printed circuit board can be washed to remove solder residue, dirt, flux, etc. It is possible to prevent adverse effects on the heater board provided above. That is, the solder residue does not leak to the ink discharge pressure generating element electrodes, transistors, etc. formed on the semiconductor substrate that constitutes the heater board, and the semiconductor current does not leak, and the residue remains in the liquid path or liquid chamber. ,
Since it does not remain in the orifice, it is possible to prevent unstable ink ejection and non-ejection of ink. Therefore, a highly reliable recording head substrate can be supplied.

After the above steps are completed, the heater board and the printed circuit board are joined by a method such as wire bonding. Then, after the secondary processing of the reference surface of the base plate is performed, the top plate is bonded.

Next, the structure of the head unit and the head cartridge on which the recording head substrate manufactured through the above-mentioned steps is mounted will be described, and the structure for protecting the memory element and the like will be described below.

(1) Head Cartridge (1.1) General Description FIG. 3 shows a structural example of a head cartridge which can be mounted on the carriage of the ink jet recording apparatus according to this embodiment. The cartridge according to this example integrally includes an ink tank unit 200 and a head unit 100,
Further, the head unit 100 is the ink tank unit 2
00 can be detached and separated as described later. A wiring connector 102 for receiving a signal for driving the ink ejection unit 101 of the head unit 100 and outputting an ink remaining amount detection signal is provided at a position aligned with the head unit 100 and the ink tank unit 200. is there. Therefore, the height H of the cartridge can be reduced and the thickness W of the cartridge can be reduced in the posture taken when the cartridge is mounted on the carriage described later. This makes it possible to make the carriage small when a plurality of recording head cartridges are arranged side by side.

When mounting the head cartridge on the carriage, the knob 201 provided on the ink tank unit 200 can be gripped and placed on the carriage with the ejection portion 101 facing downward. When the head unit 1 is mounted, the pins provided on the carriage side are attached to the head unit 1.
00 to engage with the pin engaging portion 103 of the head unit 10
Positioning of 0 is performed. This aspect will be described later.

In the head cartridge according to this example, an absorber 104 for cleaning a member for wiping the surface of the ink ejection portion 101 to clean the same is provided in at least one of the absorbers 104 in the same direction as the surface of the ink ejection portion 101. They are juxtaposed so that the parts are exposed. Further, the atmosphere communication port 203 for introducing air into the ink tank as the ink is consumed.
Is provided substantially at the center of the ink tank unit 200.

FIG. 4 is an exploded perspective view of the head cartridge shown in FIG. The head cartridge according to this example is
It is composed of a head unit 100 and an ink tank unit 200, and the detailed configuration of these units will be described with reference to this drawing and the like.

(1.2) Head Unit The reference for mounting the components of the head unit 100 is the base plate 111 formed of a metal such as Al, on which energy used for ink ejection is generated. A substrate (base body) 112 on which an energy generating element group is formed and a printed circuit board (PCB) 115 having wiring for supplying electric power to the element are mounted, and these are connected by wire bonding or the like. Has been done. On the substrate 112, an electrothermal conversion element that generates thermal energy that causes film boiling in the ink in accordance with an energization timing based on a facsimile signal, a reading signal of a copying machine, or a recording signal from a host is provided as the energy generating element. In the example, 128 rows are provided. However, the arrangement and the number thereof are not particularly limited.
Further, in order to make the recording head compact, an electrothermal conversion element is desirable as the above-mentioned energy generating element, but not limited to this, a piezoelectric element or the like may be used as the energy generating element. In the following, this substrate 112 will be referred to as a heater board.

The wiring connector 102 described above is a PCB 11
A drive signal from a control circuit (not shown) on the apparatus body side is received by the wiring connector 102.
It is supplied to the heater board 112 via the PCB 115. The PCB 115 is a double-sided wiring board in this example,
Information unique to the head, for example, appropriate driving conditions of the electrothermal conversion element, ID number, ink color and density information, driving condition correction data (head shading (H
S) data), a PWM control condition, and a semiconductor element such as an IC 128 in the form of a ROM (which may be a writable IC) and a capacitor 129 as a storage element that stores a condition for changing a recording signal. ing.

FIG. 5 shows the base plate 111 and the PCB 11
FIG. 5 is a bottom view showing a state in which 5 and 5 are integrated, the PCB 115 has a contour shown by a solid line, and the base plate 111 shows a hatched contour. As shown, according to the present invention, the storage element 128 and the capacitor 1
Reference numeral 29 denotes a notch portion 111A of the base plate 111 on the surface of the PCB 115 which is to be joined to the base plate 111.
Are arranged at positions corresponding to, and the storage element is surrounded by the base plate on three sides.

As a result, if the height of the IC or the like when mounted is less than or equal to the thickness of the base plate 111, the PCB 115
The IC or the like does not protrude from the surface when the base plate 111 and the base plate 111 are joined. Therefore, it is not necessary to consider the storage mode corresponding to the protrusions in the manufacturing process, and there is no fear of damage to the protruding parts such as ICs.
Further, when a metal such as Al is used for the base plate 111, since the base plate is arranged around the storage element or the like, the storage element or the like is not affected by harmful electromagnetic waves from outside or inside the device. Also has.

On the heater board 112, there is provided a common liquid chamber for temporarily storing the ink supplied from the ink tank unit 200 side, and a recess for forming a liquid passage group for connecting the liquid chamber and the discharge port. The plate 113 is arranged. Further, an ejection port forming member (orifice plate) 113A having an ink ejection port is integrally formed on the top plate 113. 114 is a top plate 113 and a heater board 11
This is a pressing spring that applies a uniform pressure (linear pressure) in the vicinity of the discharge port because the discharge portion 101 is configured by closely contacting the pressure sensor 2 and the discharge port 101.

As described above, the work of attaching the ink supply path to the liquid path (ink path) from the outside of the recording head unit is R.
PC with semiconductor element such as OM and capacitor
There is no risk of damaging the semiconductor element because the process is performed on the opposite side with B in between. Therefore, even if the ink leaks from the ink supply path or the like, there is no fear of affecting the semiconductor element.

Referring again to FIG. 4, reference numeral 116 denotes a head unit cover, which is used for communicating ink between the ink supply pipe portion 116A which enters the ink tank unit 200 and the ink introduction pipe portion on the top plate side. Ink flow path 116
B, three pins 116C for three-point positioning or fixing to the base plate 111, pin engaging portion 103, absorber 10
4 is a member formed by integrally molding the mounting portion of 4 and other necessary portions. A flow path lid 117 is arranged for the ink flow path 116B. In addition, the ink supply pipe 1
A filter 118 for removing bubbles and dust is provided at the tip of 16A.
And an O-ring for preventing ink leakage from the joint.

In assembling the above head unit, the pins 111P protruding from the base plate are mounted on the PCB.
The through hole 115P provided in 115 is positioned so that it is inserted, and both are fixed by adhesion or the like. Precision is not required so much for fixing both. This is because the heater board 112, which should be mounted on the base plate 111 with high accuracy, is fixed separately from the PCB 115.

Next, the heater board 112 is accurately arranged and fixed on the base plate 111, and necessary electrical connection is made with the PCB 115. Then, the top plate 113 and the spring 114 are arranged, and after adhering and sealing as necessary, the three pins 116C protruding from the cover are inserted into the holes 111C of the base plate 111 to perform positioning.
After that, the head unit is completed by heat-sealing these three pins 116C. Further, by covering the exposed side of the semiconductor element (the lower side of FIG. 6) with the member 222 or the like, the semiconductor element is protected and the recording head unit as shown in FIG. 8 is completed. As described above, when the head unit is covered with the member 222 or the like, the semiconductor element is almost covered, and thus the head unit alone protects the semiconductor element.

Next, an ink tank unit that can be used by connecting to the above-mentioned recording head unit will be described with reference to the drawings.

(1.3) Ink Tank Unit In FIG. 4, 211 is an ink container that forms the main body of the ink tank unit, 215 is an ink absorber for impregnating ink, and 216 is an ink tank lid. Reference numeral 212 denotes an electrode pin for detecting the remaining amount of ink, the tip of which is inserted into the ink absorber 215 and is sealed and fixed by welding the root to the wall surface of the container. Reference numerals 213 and 214 are contact members related to the pin 212, and constituent elements of the ink tank unit 200 will be described.

The cylindrical portion 233 in the ink tank is provided so as to face the atmosphere communication port 203, and functions as a buffer portion for preventing ink leakage due to vibration and swing of the ink tank.

The ink impregnating absorber 21 according to the present example
5 is provided with a hole 215A for receiving the insertion of the cylindrical portion 233 and preventing a compression region from being generated around the cylindrical portion 233. By arranging the tubular portion 233 in the hole 215A, the absorber 215 becomes the tubular portion 233.
Ink is not generated in the compressed portion having a high negative pressure.

(1.4) Attachment of Head Unit to Ink Tank Unit The attachment of the head unit 100 to the ink tank unit 200 will be described with reference to FIGS. 6, 7 and 8. Note that FIG. 14 is a schematic view of the attachment mode, and an appropriate portion is broken and simplified.

First, in FIGS. 6 and 7, reference numerals 161 and 221 respectively denote a protrusion provided on the cover 116 of the head unit 100 and the ink tank unit 200.
This is a latch provided on the container 216 and having a spring property, and the engagement of the both prevents the head unit 100 from falling off. 6, FIG. 7, and FIG. 8, reference numeral 163 denotes a fitting portion provided on the head cover 116 and including a portion 165 and an abutting portion 167 that face each other at a predetermined interval. The fitting portion 223 on the container side is provided between the portions 165. When the head unit 100 is engaged and is in a state of being abutted against the abutting portion 167, movement of the head unit 100 in the y and y ′ directions in FIG. 11 and movement in the mounting direction (Z direction in FIG. 14) are restricted. It

In FIG. 7, reference numerals 227 and 229 are restricting members, and the lower surface portions of the respective members in the figure are portions 111 on the rear edge side of the base plate 111 when the head unit is mounted.
B (see FIG. 8) is engaged to restrict upward displacement of the head unit 100 (y ′ direction in FIG. 8). Also,
It is also possible to engage the rear edge portion of the head unit 100 using the regulation member and regulate the displacement in the right or left direction (x or x ′ direction in FIG. 8). Further, as shown in FIG. 8, a concave portion 171 provided at the rear end edge portion of the base plate 111 can be fitted with a convex portion 251 provided at the innermost portion of the head unit mounting portion of the container. Base plate 11 when the head unit is attached
The displacement of the one end side of 1 in the left-right direction (x, x ′ direction in FIG. 8) is restricted.

Reference numeral 253 denotes a rail provided on the head unit mounting portion of the container 211 along the head unit mounting direction, and the head unit 100 is arranged on the back side thereof in the upward direction of FIG. 7 (y'direction in FIG. 8). A convex portion 253A for slightly displacing is provided.

On the other hand, the contact members 213 and 214 connected to the electrodes 212 and 212 are appropriately bent so as to avoid contact with each other (in FIG. 8, the bending is changed to FIG. 7 for simplification of the drawing). However, any of them may be different), but the head units 213A and 214A extend toward the back side in the mounting direction of the head unit, and their tip portions 213A and 214A have a biasing force in the y direction in FIG. 14 (downward direction in FIG. 7). It has a leaf spring shape so as to act. Further, the position of the leaf spring-shaped tip portion is near the convex portion 253A. And on the PCB 115,
Contact surfaces 173 and 174 are provided that can contact the contact member tip portions 213A and 214A, respectively. That is,
When mounting the head unit 100, the head unit 1
00 is slightly upward in FIG. 13 due to the convex portion 253A (see FIG.
In addition to being displaced in the middle y ′ direction), the contact member tip portions 213A and 214A near the protrusions are urged in the direction opposite to that direction and held in a state of being abutted on the protrusions 253A. Become. Further, since the head unit is elastically biased in the vicinity of the convex portion 253A that constitutes the abutting portion, it is possible to prevent play in the biasing direction.

In FIGS. 7 and 8, 259 is pin 2
12 and below the portion other than the tip of the contact member (see FIG. 8).
It is a regulating member provided on the (middle y direction) side, and P
It can be engaged with the CB 115.

Next, the mounting operation of the head unit 100 will be described mainly with reference to FIG.

When mounting, as shown in FIG.
In the head unit in which the semiconductor element is covered by the member 222, the bottom surface of the member 222 is regulated by the slide rail 253 in the head unit which is not covered, and the head cover and the side edge of the base plate are controlled by the side surface of the container 211. While regulating
The head unit 100 is slid as shown by the arrow in FIG. In addition, even if the head unit 100 is displaced in the y'direction in FIG.
Since the restricting member 259 engages with the 115, further displacement is restricted, and the pin 112 and the contact member are connected to the PC.
B115 does not come into contact with and damage it.

When the head unit 100 is further slid, the contact member tip 213A on the front side in the mounting direction presses near the contact surface 174 of the PCB 115.
The head unit 100 is temporarily pressed. In this state, the supply pipe 116A faces the supply port 231.

The head unit 1 temporarily pressed in this way
When 00 is further pushed in, the contact member tip 214A on the far side in the mounting direction starts to contact the contact surface 174. In this state, the supply pipe 116A is almost fitted in the supply port 231, and the concave portion 171, the convex portion 251, and the fitting portion 163 and the fitting portion 2 are fitted.
23 starts to engage each other. Also, the latch 221 starts to ride on the slope of the protrusion 161.

Then, when the mounting operation is completed, the contact member tip portions 213A and 214A are moved to the contact surfaces 173 and 1 respectively.
74, and the supply pipe 116A is completely connected to the supply port 23.
1, the base plate 111 is pressed against the abutting surface on the convex portion 253A by the urging caused by the contact, and the concave portion 171, the convex portion 251, the fitting portion 163 and the fitting portion 223, the projection 161 and the latch are provided. 221, the regulation member 22
The displacement of the head unit 100 in the ink tank unit 200 is restricted by the engagement of the 7, 229 and the base plate 111, and the restriction member 229 and the head cover rear edge 169. Further, in addition to the engagement relationship between the respective parts described above, the fitting of the ink supply pipe 116A and the ink supply port 231 is also involved in the regulation of the respective directions and the rotation directions θ _x , θ _y , and θ _z. ..

Even when the head unit has a structure in which one surface of the semiconductor element 128 of the head unit is not covered with the cover member 222 (FIG. 6), when the head unit is completed, the member 217 (ink tank) on the ink tank side is completed. It is also possible to prevent the semiconductor element from being damaged when it is attached to the recording apparatus, and also to prevent damage due to adhesion of ink or the like.

It is needless to say that this structure is not limited to the one in which the recording head unit and the ink tank can be separated, and the one in which the recording head unit and the ink tank are joined at the time of manufacturing.

When the ink in the ink tank is consumed, or when the head unit 100 and the ink tank unit 200 are removed when performing maintenance of any unit, the latch 221 is released from the protrusion 161. Then, if the head unit 100 is slid from the ink tank unit 200 in the opposite direction to the mounting, it is easy to separate the two.

According to the present embodiment as described above, since the electrode contact surface is on the back side of the PCB, by providing the contact member tip on the back side in the mounting direction, the sliding amount of the tip portion on the PCB can be reduced. .. In addition, a rail 25 that guides the slide device
By providing 3, the slide can be performed smoothly, and
The rail can also function as a reinforcing member. Further, the contact member tip portions 213A and 214A are formed into a leaf spring shape and are arranged in the vicinity of the abutting surface of the projection 253A to serve also as a pressing member for the abutting surface, so that the contact with the contact surface is ensured. Not only that, the number of parts is reduced, and further, the head unit 100 can be held without causing a large backlash. In addition, when the head unit is mounted, the pin 212 and the contact members 213 and 214 are provided in the space formed by the head cover 116 and the PCB 115.
And a member 217 on the ink tank side and a PC
Since a semiconductor element such as a memory element is housed in the space covered by B115 and the base plate, these members can be reliably protected from displacement due to external factors and adhesion of dust, and erroneous detection and malfunction can be prevented.

By adopting the above configuration, the head unit 100 becomes the ink tank unit 200.
On the other hand, although it is held without a large amount of backlash, it may not be completely rigidly held as long as the connected state of the ink supply portion can be maintained and the positioning accuracy of the head unit is not deteriorated due to the backlash. The specific slight play (fixed and held after mounting the device) is preferably within ± 3 μm. In short, when the head unit 100 is mounted on the printer body using the head unit 100, the ejection unit 101
Should be set to an appropriate position, and the connection between the head unit 100 and the ink tank 200 may be inconvenient due to vibration or other influences during use, such as ink leakage from the ink supply section, It is sufficient to ensure that the semiconductor element is not damaged, or the positioning accuracy is not lowered or the semiconductor element is damaged due to backlash of the head unit as described later. In this sense, in the head cartridge of this example, the ink tank unit 200 and the head unit 100 are temporarily held to the extent that the above inconvenience does not occur (however, in the embodiment, there is no play in the y direction in FIG. 8). From that point of view, the configuration and mounting operation of the respective engaging portions of both can be significantly simplified. This becomes more effective by arranging the engaging portions substantially behind the head unit, that is, on the side opposite to the ejection portion 101.

FIG. 9 is a front view when the ink jet head cartridge is mounted on the carriage 2. The base plate 111 of the head unit 100 is pressed by the contact pressure F _s generated by the leaf spring-shaped contact member tips 213A and 213A, and the abutting surface abuts the abutting surface 253A on the ink tank unit, and the head unit 100. And the ink tank unit 200 are fixed in the pressing direction without play. Pressing force F _s ×
A pressure of 2≈800 g is sufficient as a biasing force. The head cartridge is the abutting surface 1 of the head unit 100.
b on the abutting surface 2b of the carriage 2, the tank unit 2
00 abutting surface 200a is a carriage-side abutting surface 2d
Then, the components are pressed and abutted by the component forces F _b and F _d generated by the pressing force F of the push pin 10, and the positioning is performed. Therefore, the reliable positioning of the head cartridge including the head unit 100 in the left-right direction in FIG. 9 can be achieved.

In this example, the contact member tips 213A, 2
14A has a leaf spring shape, and the head unit 100 is pressed against the ink tank unit 200 by its elastic force to eliminate backlash in the pressing direction, and thus the head unit 100 can be reliably positioned on the carriage. Instead of using the contact point member itself as the pressing member in this manner, as shown in FIG.
May be separately provided. As a result, it is possible to eliminate backlash in the left-right direction in FIG. 10 and ensure the positioning state with respect to the carriage in that direction.

Further, in the above example, a spherical projection is provided on the inclined surface of the head unit side pin engaging portion 103 in order to ensure the positive pressing force of the pin 10.

In the above-described structure for protecting the semiconductor element by joining the recording head unit and the ink tank unit, an example in which the recording head unit side is provided with a semiconductor element such as a memory element has been shown.

However, the main object of the present invention is to protect the semiconductor element and the like from mechanical damage or damage due to adhesion of ink or the like. Therefore, in the ink jet recording head cartridge in which the recording head and the ink tank unit are integrated. The semiconductor element may be provided near the ink tank in a state where most of the semiconductor elements are finally covered with the outer wall or the like.

As an example of such a constitution, a part of the wall of the ink tank unit is a double wall, and the semiconductor element is arranged in the space, the wall of the ink tank unit and the recording head. It is sufficient that the semiconductor element is arranged in the space with the wall that covers the unit.

An example of an ink jet recording head equipped with the ink jet recording head and the ink jet recording head cartridge manufactured by using the above-described embodiments and examples will be described with reference to FIG. 11
FIG. 3 is a schematic perspective view showing a main part of an example of an inkjet recording device.

In FIG. 4, 320 is a platen 324.
An ink jet recording head cartridge of a removable cartridge type having a recording liquid storage unit integrated structure, which has a plurality of ink ejection ports facing a recording surface of a recording paper (not shown) which is a recording medium conveyed above. .. Reference numeral 316 denotes a carriage on which the ink jet recording head cartridge 320 is placed, which is connected to a part of a drive belt 318 for transmitting the driving force of a drive motor 317, and two guide shafts 329A arranged parallel to each other and 329
It is slidable with B. This allows the inkjet recording head cartridge 320 to reciprocate over the entire width of the recording paper.

Reference numeral 326 denotes a recovery device for rotating and preventing defective ink ejection from the recording head, which is located at a predetermined position in the moving range of the inkjet recording head cartridge 320.
For example, it is arranged at a position facing the home position.
The recovery device 326 includes the motor 32 via the transmission mechanism 323.
The ejection port of the inkjet recording head is capped by the driving force of 2. In connection with the capping operation of the ejection port of the inkjet recording head by the cap 326A of the recovery device 326, ink is sucked from the ejection port by a proper suction means (not shown) provided in the recovery device 326, or ink is ejected from the device side. In an apparatus (not shown) that is supplied to the recording head, ink is pressure-fed by an appropriate pressurizing means (not shown) provided in the ink supply path of the inkjet recording head. As a result, a recovery process is performed in which ink is forcibly discharged from the ejection port to remove foreign matter such as thickened ink inside the ejection port.

A blade 330 is provided on the side surface of the recovery device 326 and is made of silicon rubber as a wiping member. This blade 330 is held by the blade holding member 330A in the form of a cantilever, and the recovery device 32
Similar to 6, the motor 322 and the transmission mechanism 323 operate to enable engagement with the ejection port surface of the inkjet recording head. Thereby, the plate 330 is projected into the moving range of the inkjet recording head at an appropriate timing during the recording operation of the inkjet recording head, or after the recovery process using the recovery device 326, and the inkjet recording head moves. With the operation, it is possible to wipe off foreign matter such as dew condensation, wetness, or dust attached to the ejection port surface.

The driving of the recording paper conveying means, the carriage and the recovery device of the ink jet recording apparatus, the driving of the recording head and the like are controlled based on the commands and signals output from the control means including the CPU of the apparatus main body side. It

The present invention provides excellent effects particularly in an ink jet recording type head and recording apparatus for recording by forming flying droplets by utilizing thermal energy in the ink jet recording system. ..

Regarding its typical structure and principle, see, for example, US Pat. Nos. 4,723,129 and 4740.
No. 796, the present invention is preferably carried out using these basic principles. This recording method is applicable to both the so-called on-demand type and continuous type.

This recording method will be briefly described. Corresponding to the recording information, the electrothermal converter, which is the discharge energy generating means arranged corresponding to the sheet or liquid path holding the liquid (ink), is used. By applying at least one drive signal to the liquid (ink) to cause a rapid temperature rise that causes a film boiling phenomenon by overcoming the nucleate boiling phenomenon, thermal energy is generated, and the thermal action surface of the recording head is generated. Causes film boiling. In this way, bubbles can be formed in one-to-one correspondence with the drive signal applied from the liquid (ink) to the electrothermal converter, which is particularly effective for the on-demand recording method. The liquid (ink) is ejected through the ejection holes by the growth and contraction of the bubbles to form at least one droplet. It is more preferable to make this drive signal into a pulse shape, because the bubble growth and contraction are immediately and appropriately performed, so that the ejection of the liquid (ink) with excellent responsiveness can be achieved. As this pulse-shaped drive signal, US Pat.
Those described in the specifications of No. 359 and No. 4345262 are suitable. If the conditions described in US Pat. No. 4,313,124 of the invention relating to the rate of temperature rise on the heat acting surface are adopted, more excellent recording can be performed.

The structure of the recording head is a combination of a discharge hole, a liquid flow path, and an electrothermal converter as disclosed in the above-mentioned specifications (straight liquid flow path or right-angled liquid flow path).
In addition to the above, the present invention is also effective for a device having a structure in which the heat acting portion is arranged in the bending region as disclosed in US Pat. No. 4,558,333 and US Pat. No. 4,459,600. ..

In addition, Japanese Patent Laid-Open No. 123670/1984 discloses a structure in which a common slit is used as a discharge hole for a plurality of electrothermal converters, and a pressure wave of thermal energy is absorbed. The present invention is also effective for a structure based on JP-A-59-138461, which discloses a structure in which the corresponding opening corresponds to the discharge portion.

Further, as a recording head in which the present invention is effectively used, there is a full line type recording head having a length corresponding to the maximum width of the recording medium which can be recorded by the recording apparatus. The full line head may be a full line configuration formed by combining a plurality of print heads as disclosed in the above-mentioned specification, or may be a single full line print head integrally formed.

In addition, by being mounted on the apparatus main body, it can be electrically connected to the apparatus main body and can be supplied with ink from the apparatus main body by a replaceable chip type recording head or the recording head itself. The present invention is also effective when a cartridge-type recording head that is specially provided is used.

Further, it is preferable to add recovery means for the recording head or preliminary auxiliary means to the recording apparatus of the present invention because the recording apparatus can be made more stable. Specific examples of these are: preheating of the recording head by capping means, cleaning means, pressure or suction means, electrothermal converter or other heating element, or a combination thereof. It is also effective to perform stable recording by adding means for performing a preliminary ejection mode for performing ejection different from the means and recording.

Further, the recording mode of the recording apparatus is not limited to the mode in which only the mainstream color such as black is recorded, and either the recording head may be integrally formed or a plurality of combinations may be used. However, the present invention is extremely effective for an apparatus provided with at least one of a multicolor of different colors or a full color by mixing colors.

In the present invention, the most effective one for each of the above-mentioned inks is to execute the above-mentioned film boiling method.

In addition, as a form of the ink jet recording apparatus of the present invention, in addition to one used as an image output terminal of information processing equipment such as a computer, a copying apparatus combined with a reader or the like, and a facsimile apparatus having a transmitting / receiving function. It may take the form of.

[0097]

As described above, according to the present invention, a semiconductor element such as a memory element is provided on a printed circuit board (PCB) on the surface side for joining with a base plate, and the thickness of the semiconductor element is within the thickness of the base plate. Since the recording head substrates can be horizontally stacked in a storage unit such as a magazine by storing the storage space in the storage space, the space efficiency is improved and the work supply for automatic assembly is facilitated.

Further, according to the present invention, after the semiconductor chip is soldered to the printed circuit board and the printed circuit board with the semiconductor chip is washed, the solder scraps and the flux adversely affect the flow path, the liquid chamber and the orifice. Things can be avoided. Therefore, it is possible to supply a highly reliable recording head substrate with stable ejection.

Further, according to the present invention, since the ink supply path of the recording head unit is arranged on the side opposite to the side on which the semiconductor element is provided, even if ink leaks or the like, the ink is not transferred to the semiconductor element. It has no effect.

Further, since the chip-shaped semiconductor element and the semiconductor element formed on the substrate are also covered with their peripheries, there is no fear of damage to the element.

Further, in the structure for protecting the semiconductor element and the like by joining the recording head unit and the ink tank, it is possible to provide a simple protection structure without having a separate member.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a recording head for explaining an embodiment of the invention.

FIG. 2 is an explanatory diagram showing a manufacturing process of the recording head substrate according to the embodiment of the invention.

FIG. 3 is a perspective view showing an example of the external configuration of a head cartridge that can be mounted on the carriage of the inkjet recording apparatus according to the embodiment of the present invention.

FIG. 4 is an exploded perspective view thereof.

FIG. 5 is a plan view for explaining the bonding relationship between the base plate and the PCB in the head unit of the head cartridge.

FIG. 6 is a partially cutaway perspective view showing an external configuration example of a head unit.

FIG. 7 is a perspective view showing an external configuration example of an ink tank unit.

FIG. 8 is a schematic perspective view for explaining an operation when the head unit is attached to the ink tank unit.

FIG. 9 is a schematic front view for explaining the mounting state of the head cartridge according to the embodiment on the carriage.

FIG. 10 is a schematic front view of a head cartridge according to another embodiment for explaining a mounting state of the head cartridge on a carriage.

FIG. 11 is a schematic diagram of a recording apparatus in which the head cartridge of the present invention can be mounted.

FIG. 12 is an explanatory diagram showing the manufacturing process of the recording head substrate of the related art.

[Explanation of Codes] 111 Base Plate 112 Heater Board 115 Printed Circuit Board 128 Semiconductor Chip (ROM) 111A Cutting Part 113 Top Plate

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location 9012-2C B41J 3/04 103 B

Claims (5)

[Claims] 1. An ink jet recording head having an ejection port for ejecting ink, an ink flow path communicating with the ejection port, and an energy generating element for applying energy for ejecting the ink to the ink in the ink flow path. In the unit, the recording head unit has a storage element having conditions relating to driving of the energy generating element, and the storage element is substantially included in the recording head unit. Inkjet recording head unit. 2. An ink jet recording head having an ejection port for ejecting ink, an ink channel communicating with the ejection port, and an energy generating element for applying energy for ejecting the ink to the ink in the ink channel. In the unit, a first substrate provided with a cutout portion, a groove portion, or a through hole; a second substrate provided with the energy generating element and provided at a predetermined position on the first substrate; A semiconductor device is provided, and a third substrate electrically connected to the second substrate is provided, and the first substrate and the third substrate are joined to each other, and the cutout portion and the groove portion are provided. Alternatively, the inkjet recording head unit is characterized in that the semiconductor element is disposed at a position of a through hole. 3. An ink jet recording head cartridge having an ink jet recording head unit for ejecting ink for recording and an ink tank for supplying ink to the recording head, wherein the recording head has an ejection port for ejecting ink. An ink flow path communicating with the ejection port, an energy generating element for generating energy for ejecting ink, and a storage element having conditions relating to driving of the energy generating element, An ink jet recording head cartridge, characterized in that the memory element is covered by a head unit and the ink tank. 4. A recording apparatus for recording by ejecting ink, wherein the recording apparatus supplies an ejection port for ejecting ink, an ink flow path communicating with the ejection port, and energy for ejecting the ink. An energy generating element that acts on the ink in the ink flow path, and a storage element that has conditions relating to the driving of the energy generating element, and the storage element drives the recording head cartridge and the energy generating element. A recording apparatus comprising: a signal supply unit that supplies a signal. 5. A method of manufacturing a recording head for ejecting ink to perform recording, wherein the recording head bonds a first substrate and a second substrate provided with a heating element for ejecting ink. Bonding a semiconductor element to a third substrate which is an electric circuit board, cleaning the third substrate bonded to the semiconductor element, and bonding the first substrate and the third substrate to each other. A method for manufacturing a characteristic recording head.