JPH0536606Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] This invention is a process for processing the external shape of a printed circuit board (hereinafter referred to as a board) to be a product from a base material on which a circuit pattern has been formed by etching. It's about machines.

[Conventional technology]

For example, as a board contour processing machine,
A device using the press shaft disclosed in No. 5509 has been put into practical use.

When the substrate is to be separated from the base material, the substrate and the base material are held down by a pressure shaft to restrict the movement of the substrate. On the other hand, the inside of the presser shaft is constantly suctioned by a dust collector to remove chips generated in the machining section.

[The problem that the idea aims to solve]

Therefore, when the substrate to be separated from the base material is small, when the spindle rises after separation and the pressing force by the presser foot becomes weaker, the substrate is sucked into the dust collector, and after processing is completed, it is removed from the dust collector. It is necessary to collect the board, which is inefficient. Further, when the board is sucked into the dust collector, the board may be damaged by hitting the tool, causing problems such as the tool being damaged.

In view of the above-mentioned circumstances, an object of the present invention is to provide a substrate contour processing machine that can reliably recover separated substrates.

[Means to solve the problem]

In order to achieve the above object, the present invention provides a collection device attached to the spindle, connects the capture means of the collection device to the dust collector together with the pressure shaft, and provides an opening/closing means in the connection path. It is characterized by

[Effect]

Before separating the substrate from the base material, the passage between the presser shaft and the dust collector is closed to create atmospheric pressure inside the presser shaft to prevent the substrate from being sucked in. After separating the substrate, the trapping means and dust collector are opening the passageway between the devices and removing the substrate with the capture means;
Collect it at the required location.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

In the figure, 1 is the bed of the contour processing machine. Reference numeral 2 denotes a table that is slidably supported on the bed 1 and driven by a drive means (not shown). Reference numeral 3 denotes a base material, which is placed and fixed on the table 2. 4 is a substrate, which is cut out from the base material 3; A collection box 5 is fixed to one end of the table 2.

Reference numeral 6 denotes a saddle, which is supported by a frame (not shown) erected on the bed 1 so as to be slidable in a direction perpendicular to the table 2, and is driven by a driving means (not shown). A spindle 7 is supported by the saddle 6 so as to be movable up and down, and is driven by a drive means (not shown). A pressure shaft 8 is supported by a cylinder 9 fixed to the spindle 7.

Reference numeral 10 denotes a capturing means, which is supported by a cylinder 11 supported by the saddle 6. The capture means 10 is composed of a main body 11 and a capture plate 12 supported within the main body 11 and having a large number of small holes formed therein.

Reference numeral 13 denotes a dust collector, which is attached to the contour processing machine and connected to the press shaft 8 and the trapping means 10 via a switching valve 14.

With this configuration, the press shaft 8 is communicated with the dust collector by the switching valve 14, and the base material 3 is pressed down by the press shaft 8 for processing.
At this time, the chips generated in the machining section are collected by the dust collector 1.
Sucked into 3.

Immediately before separating the substrate 4 from the base material 3, the switching valve 14 is switched to cut off the pressure shaft 8 and the dust collector 13, and connect the trapping means 10 and the dust collector 13 to each other. Then press shaft 8
Atmospheric pressure flows into the inside from the processing section and presser section, resulting in atmospheric pressure. Therefore, even if the spindle 7 rises after the substrate 4 is separated and the pressing force of the press shaft 8 against the substrate 4 decreases, the substrate 4 will not be sucked into the press shaft 8.

When the substrate 4 is separated and the spindle 7 is raised,
The saddle 6 is moved to move the capture means 10 to the separated substrate 4 information.

The cylinder 11 is then actuated to release the capture means 1
0 is lowered to just before contacting the base material 3. Then, the substrate 4 is sucked up and captured by the capturing member 12.

The cylinder 11 is then actuated to release the capture means 1
0 is raised, the table 3 and saddle 6 are moved, and the catching means 10 and collection box 5 are made to face each other.
Then, the switching valve 14 is switched to shut off the trapping means 10 and the dust collector 13, and the pressure shaft 8
and the dust collector 13 are communicated with each other. Then, the inside of the capturing means 10 becomes atmospheric pressure, and the substrate 4 falls into the collection box 5.

In this way, the substrate 4 can be collected into the collection box 5. Further, it is possible to eliminate damage to the substrate 4 and tools caused by the substrate 4 being sucked into the press shaft 8. Further, the work of collecting the substrate 4 from the chips collected in the dust collector 13 can be eliminated, and work efficiency can be improved.

[Effect of idea]

As described above, according to the substrate contour processing machine according to the present invention, substrates can be reliably recovered. Moreover, damage to the board and tools can be prevented. Furthermore, there are effects such as improved workability.

[Brief explanation of the drawing]

FIG. 1 is a block diagram of a substrate contour processing machine according to the present invention, and FIG. 2 is an enlarged view of a capturing means. 1...Bed, 2...Table, 3...Base material,
4... Board, 5... Collection box, 6... Saddle, 7...
...Spindle, 8...Pressure shaft, 10...
...Capturing means, 12...Capturing member, 13...Dust collector, 14...Switching valve.

Claims (1)

[Scope of utility model registration request] In a printed circuit board contour processing machine equipped with a pressure shaft that is slidably supported in the axial direction of the spindle and connected to a dust collector that suctions and removes chips generated during processing, the spindle is attached to the support of the spindle. a cylinder supported in parallel with the cylinder; and a trapping means supported by the cylinder and having a trapping member formed with a plurality of holes smaller than the separated substrate inside, and connected to the dust collector. A collection device is provided, and the passage connecting the pressure shaft and the collection device and the dust collector is closed before the substrate is separated, and the passage connecting the collection device and the dust collector is opened and closed. A printed circuit board external shape processing machine characterized by being provided with a means.