JPH0536296Y2 - - Google Patents

Info

Publication number

JPH0536296Y2

JPH0536296Y2 JP10715986U JP10715986U JPH0536296Y2 JP H0536296 Y2 JPH0536296 Y2 JP H0536296Y2 JP 10715986 U JP10715986 U JP 10715986U JP 10715986 U JP10715986 U JP 10715986U JP H0536296 Y2 JPH0536296 Y2 JP H0536296Y2

Authority

JP

Japan

Prior art keywords

integrated circuit

hybrid integrated

circuit board

protrusions

external leads

Prior art date

1986-07-11

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired - Lifetime

Links

• Espacenet
• Global Dossier
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• 238000007789 sealing Methods 0.000 description 7
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
• 229910052782 aluminium Inorganic materials 0.000 description 2
• 239000000919 ceramic Substances 0.000 description 2
• 230000000694 effects Effects 0.000 description 2
• 230000010354 integration Effects 0.000 description 2
• 239000011295 pitch Substances 0.000 description 2
• 239000000758 substrate Substances 0.000 description 2
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 238000005452 bending Methods 0.000 description 1
• 239000003822 epoxy resin Substances 0.000 description 1
• 230000006870 function Effects 0.000 description 1
• 238000003780 insertion Methods 0.000 description 1
• 230000037431 insertion Effects 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 238000004806 packaging method and process Methods 0.000 description 1
• 238000012856 packing Methods 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1
• 230000001105 regulatory effect Effects 0.000 description 1
• 230000004044 response Effects 0.000 description 1