JPH053599A - Condenser microphone and its production method - Google Patents

Condenser microphone and its production method

Info

Publication number
JPH053599A
JPH053599A JP17892791A JP17892791A JPH053599A JP H053599 A JPH053599 A JP H053599A JP 17892791 A JP17892791 A JP 17892791A JP 17892791 A JP17892791 A JP 17892791A JP H053599 A JPH053599 A JP H053599A
Authority
JP
Japan
Prior art keywords
annular
metal diaphragm
back electrode
main body
spacer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17892791A
Other languages
Japanese (ja)
Other versions
JP2952617B2 (en
Inventor
Takashi Hashizume
隆 橋詰
Masahiko Sakai
正彦 酒井
Susumu Fukushima
晋 福島
Keiji Mikami
圭司 三神
Tadashi Ikeda
忠司 池田
Hiroshi Yamamoto
拓 山本
Masanao Ohashi
正尚 大橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ono Sokki Co Ltd
Original Assignee
Ono Sokki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ono Sokki Co Ltd filed Critical Ono Sokki Co Ltd
Priority to JP17892791A priority Critical patent/JP2952617B2/en
Publication of JPH053599A publication Critical patent/JPH053599A/en
Application granted granted Critical
Publication of JP2952617B2 publication Critical patent/JP2952617B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

PURPOSE:To offer the condenser microphone preventing the tension drop of metal diaphragm and equipped with high parallel with the leading surface of the back pole. CONSTITUTION:Here is the process for producing the condenser microphone. (1) A toroidal main body 1 and a cylindrical back pole 3 are arranged concentrically. A toroidal insulator 2 is formed by a thermoplastic resin or thermosetting resin to be concentrically integrated through the back pole of the cylinder and the insulator. (2) The plane process is performed on the leading surface of the toroidal main body and the back pole to be the same plane precisely to form a reference surface. (3) A toroidal spacer 5 makes the prescribed width. (4) The toroidal spacer is put on the leading surface of the toroidal main body, further the metal diaphragm 4 is put on the upper surface of the toroidal spacer while adding the tension in the direction of the radiation. (5) The metal diaphragm 4, the toroidal spacer and the toroidal main body are welded and adhered integrally.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、コンデンサマイクロ
ホン及びその製造方法、特にコンデンサマイクロホンに
おける振動膜の取付け構造及び取付け方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a condenser microphone and a method of manufacturing the same, and more particularly to a vibrating membrane mounting structure and method for a condenser microphone.

【0002】[0002]

【従来の技術】従来の技術における金属ダイヤフラムを
備えたコンデンサマイクロホンにおいては、図2に示す
ように、金属ダイヤフラム4の周縁部を保持した環状固
定リング21が突上げリング22の外周面に螺合されてお
り、突上げリング22の中空部には、中心部に背極3の基
端が固着されている絶縁材の背極取付板23が、突上げリ
ング22の内周面に形成された段部24に環状スペーサ5を
介して軸線方向に位置決めされて、嵌着固定されてい
る。
2. Description of the Related Art In a conventional condenser microphone having a metal diaphragm, as shown in FIG. 2, an annular fixing ring 21 holding the peripheral edge of the metal diaphragm 4 is screwed onto the outer peripheral surface of a push-up ring 22. In the hollow portion of the push-up ring 22, a back pole mounting plate 23 made of an insulating material, to which the base end of the back pole 3 is fixed, is formed on the inner peripheral surface of the push-up ring 22. The stepped portion 24 is positioned in the axial direction through the annular spacer 5 and fitted and fixed.

【0003】背極3の先端面は、突上げリング22の先端
縁を含む平面より内部に引込んでおり、両面間の間隙
は、20乃至25μm 位の微小間隙である。環状固定リ
ング21と突上げリング22との相対回転による両者間の軸
線方向の相対変位により突上げリング22の先端縁を支点
として金属ダイヤフラム4に適宜の張力が与えられてい
る。
The tip surface of the back electrode 3 is drawn inward from the plane including the tip edge of the push-up ring 22, and the gap between both surfaces is a minute gap of about 20 to 25 μm. Appropriate tension is applied to the metal diaphragm 4 with the tip edge of the push-up ring 22 as a fulcrum by the relative displacement in the axial direction between the annular fixed ring 21 and the push-up ring 22 due to the relative rotation therebetween.

【0004】そして、上記のコンデンサマイクロホンの
組立てにおいては、突上げリング22と背極3付き背極取
付板23とがスペーサ7なしで仮組立てられ、突上げリン
グ22の先端縁と背極3の先端面とに同一平面に平面出し
加工が行われてから、突上げリング22と背極3付き背極
取付板23とは一旦分解されてから、前記微小間隙の厚さ
のスペーサ7が突上げリング22の段部24と背極取付板23
との間にスペーサ7が嵌挿されて再組立てされ、金属ダ
イヤフラムの裏面と背極の先端面とが前記微小間隙を維
持して平行にされている。
In the above-mentioned assembly of the condenser microphone, the push-up ring 22 and the back pole attaching plate 23 with the back pole 3 are temporarily assembled without the spacer 7, and the tip edge of the push-up ring 22 and the back pole 3 are assembled. After the flattening process is performed on the same plane as the tip end surface, the push-up ring 22 and the back electrode mounting plate 23 with the back electrode 3 are once disassembled, and then the spacer 7 having the thickness of the minute gap is pushed up. Step 24 of ring 22 and back pole mounting plate 23
The spacer 7 is inserted and reassembled between the two, and the back surface of the metal diaphragm and the front end surface of the back electrode are parallel to each other while maintaining the minute gap.

【0005】又、金属ダイヤフラム4のピンホール対策
として、金属ダイヤフラム4の表面には、スパッタリン
グによりクオーツ薄膜が被覆されており、背気室はベン
トホール25で外部と通じている。
Further, as a measure against the pinhole of the metal diaphragm 4, the surface of the metal diaphragm 4 is coated with a quartz thin film by sputtering, and the back air chamber communicates with the outside through a vent hole 25.

【0006】[0006]

【発明が解決しようとする課題】上記の従来の技術にお
ける金属ダイヤフラムを備えたコンデンサマイクロホン
においては、次のような問題点がある。 (1)突上げリング22の先端縁を支点として金属ダイヤ
フラム4に適宜の張力が与えられているので、金属ダイ
ヤフラム4は、突上げリング22の先端縁に接触する部分
において応力集中が生じ、それがクリープによる金属ダ
イヤフラム4の張力抜けの原因になる。 (2)突上げリング22の外周面に螺合されている環状固
定リング21で金属ダイヤフラム4の周縁部を保持して引
張る形式になるので、金属ダイヤフラム4に皺が生じ易
い。 (3)背極3の先端面と突上げリング22の先端縁を含む
平面との微小間隙を形成するのに、突上げリング22の先
端縁と背極3の先端面とに同一平面に平面出し加工が行
われた後、突上げリング22と背極3付き背極取付板23と
は一旦分解されてから、スペーサ7が嵌挿されて再組立
てされるので、背極3の先端面と突上げリング22の先端
縁を含む平面との高精度の平行度が保証されない。 (4)背極3の先端面と突上げリング22の先端縁を含む
平面との微小間隙の大きさは、突上げリング22の固定段
部24を基準にして、スペーサ7により決められている。
従って、固定段部24・先端縁間の突上げリング22の熱膨
張が背極3の熱膨張と正確に等しくするのが極めて困難
であるから、固定段部24・先端縁間の突上げリング22の
熱膨張により、背極3の先端面と突上げリング22の先端
縁を含む平面との微小間隙は変化してマイクロホンの特
性が変化してしまう。 (5)金属ダイヤフラムのピンホールに対する方策であ
るクオーツ薄膜の被覆は、撥水性が悪く、急激な温度変
化における金属ダイヤフラムの結露の発生に阻止でき
ず、その結果、ダイヤフラム裏面に結露の発生があると
大きなノイズとして出力に現われ、又、比重が大きいの
で、金属ダイヤフラムの振動機能を低下させる。 この発明は、上記の従来の技術における諸欠点を解消す
るものである。
The condenser microphone provided with the metal diaphragm according to the above conventional technique has the following problems. (1) Since appropriate tension is applied to the metal diaphragm 4 with the tip edge of the push-up ring 22 as a fulcrum, stress concentration occurs in the metal diaphragm 4 at a portion in contact with the tip edge of the push-up ring 22. Causes the tension loss of the metal diaphragm 4 due to creep. (2) Since the annular fixing ring 21 screwed onto the outer peripheral surface of the push-up ring 22 holds and pulls the peripheral edge of the metal diaphragm 4, the metal diaphragm 4 is likely to be wrinkled. (3) To form a minute gap between the tip surface of the back pole 3 and the plane including the tip edge of the push-up ring 22, the tip edge of the push-up ring 22 and the tip surface of the back pole 3 are flush with each other. After the projecting process is performed, the push-up ring 22 and the back electrode mounting plate 23 with the back electrode 3 are once disassembled, and then the spacer 7 is inserted and reassembled. Highly precise parallelism with the plane including the leading edge of the push-up ring 22 is not guaranteed. (4) The size of the minute gap between the tip surface of the back electrode 3 and the plane including the tip edge of the push-up ring 22 is determined by the spacer 7 with reference to the fixed step portion 24 of the push-up ring 22. .
Therefore, it is extremely difficult to make the thermal expansion of the push-up ring 22 between the fixed step portion 24 and the leading edge exactly equal to the thermal expansion of the back electrode 3, so that the push-up ring between the fixed step portion 24 and the leading edge. Due to the thermal expansion of 22, the minute gap between the tip surface of the back electrode 3 and the plane including the tip edge of the push-up ring 22 changes, and the characteristics of the microphone change. (5) The coating of the quartz thin film, which is a measure against the pinhole of the metal diaphragm, has poor water repellency and cannot prevent dew condensation on the metal diaphragm due to a rapid temperature change, and as a result, dew condensation occurs on the back surface of the diaphragm. Appears as a large noise in the output, and since the specific gravity is large, the vibration function of the metal diaphragm is deteriorated. The present invention solves the above-mentioned drawbacks of the prior art.

【0007】[0007]

【課題を解決するための手段】この発明のコンデンサマ
イクロホンは、環状本体、環状本体内に絶縁体を介して
取付られ、先端面が環状本体の先端面と同一平面上にあ
る背極、放射方向に張力が与えられている状態で環状本
体の先端面との間に介在する所定の厚さの環状スペーサ
と共に周縁部が環状本体と一体的に溶着されている金属
ダイヤフラムから構成されている。場合によっては、金
属ダイヤフラムには、撥水性の高分子材料の薄膜がコー
ティングされている。
A condenser microphone according to the present invention is mounted on an annular main body, an insulator inside the annular main body, and an end surface thereof is flush with the distal end surface of the annular main body. It is composed of a metal diaphragm whose peripheral portion is integrally welded to the annular main body together with an annular spacer having a predetermined thickness interposed between the annular main body and the tip surface of the annular main body under tension. In some cases, the metal diaphragm is coated with a thin film of water repellent polymeric material.

【0008】上記のコンデンサマイクロホンは、次の工
程で製造される。 (1)環状本体と背極とを絶縁体を介して一体化する。
好適な一体化方法は、環状本体内に背極を配置して、環
状本体の内周面と背極の外周面との間で環状絶縁体を熱
可塑性樹脂、又は熱硬化性樹脂により一体成形して環状
本体と背極とを絶縁体を介して一体化するのである。 (2)環状本体の先端面と背極の先端面とに対し精密に
同一平面になるように平面出し加工を行い、基準面を形
成する。 (3)環状スペーサを所定の厚さに仕上げる。 (4)環状スペーサを環状本体の先端面に載置し、更に
金属ダイヤフラムに放射方向に張力を付加した状態で環
状スペーサの上面に載置する。 (5)金属ダイヤフラム、環状スペーサ及び環状本体を
一体となるように溶接する。
The above condenser microphone is manufactured in the following steps. (1) The annular body and the back electrode are integrated with each other through an insulator.
A preferable integration method is to arrange a back electrode in the annular body and integrally mold an annular insulator between the inner peripheral surface of the annular body and the outer peripheral surface of the back electrode with a thermoplastic resin or a thermosetting resin. Then, the annular body and the back electrode are integrated with each other through the insulator. (2) The reference surface is formed by performing flattening processing so that the tip surface of the annular main body and the tip surface of the back electrode are precisely flush with each other. (3) Finish the annular spacer to a predetermined thickness. (4) The annular spacer is placed on the front end surface of the annular body, and is further placed on the upper surface of the annular spacer while tension is applied to the metal diaphragm in the radial direction. (5) Weld the metal diaphragm, the annular spacer, and the annular body so that they are integrated.

【0009】[0009]

【作用】上記のコンデンサマイクロホンにおいては、金
属ダイヤフラムに張力が付与するのに環状スペーサとの
接着部においても応力集中が生じないので、クリープに
よる金属ダイヤフラムの張力抜けが少ない。そして、背
極の先端面と金属ダイヤフラムとの微小間隙を形成する
のに、再組立て工程がないので、背極の先端面と金属ダ
イヤフラムとは、高精度の平行度が保証され、音声に歪
が生じない上、環状本体の先端面を基準面として環状ス
ペーサを介して金属ダイヤフラムが載宜されているの
で、背極と環状本体との熱膨張差の問題は殆どない。
In the above condenser microphone, since tension is applied to the metal diaphragm, stress concentration does not occur even at the bonding portion with the annular spacer, so that the tension loss of the metal diaphragm due to creep is small. Moreover, since there is no reassembly process to form a minute gap between the tip surface of the back electrode and the metal diaphragm, a high degree of parallelism is guaranteed between the tip surface of the back electrode and the metal diaphragm, which causes distortion in the sound. In addition, since the metal diaphragm is mounted via the annular spacer with the front end surface of the annular body as a reference surface, there is almost no problem of difference in thermal expansion between the back electrode and the annular body.

【0010】又、金属ダイヤフラムの表面及び裏面又は
そのいずれか一方に化学蒸着によりコーティングされて
いる撥水性の高分子材料の薄膜は、金属ダイヤフラムの
表面のピンホールを充填すると共に、急激な温度変化の
場合でも、金属ダイヤフラムの表面における結露の発生
を防止する。しかも高分子材料は、比重が低いので、金
属ダイヤフラムの振動機能に影響が少ない。
Further, the thin film of the water-repellent polymer material coated on the front surface and / or the back surface of the metal diaphragm by chemical vapor deposition fills the pinholes on the surface of the metal diaphragm and causes a rapid temperature change. Even in the case, the occurrence of dew condensation on the surface of the metal diaphragm is prevented. Moreover, since the polymer material has a low specific gravity, it has little influence on the vibration function of the metal diaphragm.

【0011】[0011]

【実施例】この発明の実施例におけるコンデンサマイク
ロホンを図面に従って説明する。なお、以下の説明にお
ける上下関係は、図1における上下関係である。図1に
示すように、コンデンサマイクロホンの上側環状本体1
と環状絶縁体2と円筒形の背極3とが同心的に一体化さ
れている。上側環状本体1の内周面と環状絶縁体2の外
周面とが接し、環状絶縁体2の内周面と背極3の外周面
とが接している。図示の例では、下面に段部31が形成さ
れた円筒形の背極3の小径部が環状絶縁体2の内周面に
接し、段部31が環状絶縁体2の上面に接しており、上側
環状本体1より低い環状絶縁体2の外周面は、上側環状
本体1の下部内周面に接している。
DESCRIPTION OF THE PREFERRED EMBODIMENTS A condenser microphone according to an embodiment of the present invention will be described with reference to the drawings. Note that the vertical relationship in the following description is the vertical relationship in FIG. As shown in FIG. 1, the upper annular body 1 of the condenser microphone
The annular insulator 2 and the cylindrical back electrode 3 are concentrically integrated with each other. The inner peripheral surface of the upper annular body 1 is in contact with the outer peripheral surface of the annular insulator 2, and the inner peripheral surface of the annular insulator 2 is in contact with the outer peripheral surface of the back electrode 3. In the illustrated example, the small diameter portion of the cylindrical back electrode 3 having the step portion 31 formed on the lower surface is in contact with the inner peripheral surface of the annular insulator 2, and the step portion 31 is in contact with the upper surface of the annular insulator 2. The outer peripheral surface of the annular insulator 2 lower than the upper annular body 1 is in contact with the lower inner peripheral surface of the upper annular body 1.

【0012】上側環状本体1の先端面と背極3の先端面
とは同一平面上にあって、上側環状本体1の先端面と適
宜の張力が与えられた状態の金属ダイヤフラム4の周縁
部との間に所定の厚さ(20乃至25μm )の環状スペ
ーサ5が介在して上側環状本体1、環状スペーサ5及び
金属ダイヤフラム4の周縁部が一体化溶着されている。
The tip surface of the upper annular body 1 and the tip surface of the back electrode 3 are on the same plane, and the tip surface of the upper annular body 1 and the peripheral portion of the metal diaphragm 4 in a state where an appropriate tension is applied. An annular spacer 5 having a predetermined thickness (20 to 25 μm) is interposed between the upper annular body 1, the annular spacer 5 and the peripheral portion of the metal diaphragm 4 to be integrally welded.

【0013】かくして、背極3の先端面と金属ダイヤフ
ラム4とは平行であり、且つ背極3の先端面と金属ダイ
ヤフラム4の裏面との間には環状スペーサ5の厚さに応
じた微小間隙が保持されている。
Thus, the tip surface of the back electrode 3 and the metal diaphragm 4 are parallel to each other, and a minute gap corresponding to the thickness of the annular spacer 5 is provided between the tip surface of the back electrode 3 and the back surface of the metal diaphragm 4. Is held.

【0014】更に、絶縁性材料(例えばガラス、セラミ
ックス等)の端子取付板6が下側環状本体7の中間内周
面に微小間隙をもって嵌着され、背極3・環状絶縁体2
との間に背気室が形成されるのであるが、下側環状本体
7の中間内周面には、段部11とそれに隣接した螺条部12
が形成され、端子取付板6は、段部11と螺条部12に螺合
した固定用ねじ環10に適宜の微小間隙をもって挟まれて
固定されている。端子取付板6の外周面の微小間隙は、
螺条部12のねじ面により形成されてもよい。
Further, a terminal mounting plate 6 made of an insulating material (eg, glass, ceramics, etc.) is fitted to the intermediate inner peripheral surface of the lower annular main body 7 with a minute gap, and the back electrode 3 and the annular insulator 2 are attached.
A back air chamber is formed between the stepped portion 11 and the threaded portion 12 adjacent to the stepped portion 11 on the intermediate inner peripheral surface of the lower annular main body 7.
The terminal mounting plate 6 is fixed by being sandwiched by a fixing screw ring 10 screwed into the step portion 11 and the screw portion 12 with an appropriate minute gap. The small gap on the outer peripheral surface of the terminal mounting plate 6 is
It may be formed by the threaded surface of the thread portion 12.

【0015】背気室は、端子取付板6の外周面と環状本
体1の中間内周面(ねじ面)との微小間隙及び端子取付
板6の周縁部上下面と環状本体1の段部11・固定用ねじ
環10との微小間隙を介して外部と連通しており、気圧変
化等で背気室の内外の圧力差に応じて、空気が前記微小
間隙で絞られて流通し、時定数をもって背気室内外の圧
力差がなくなる。即ち、コンデンサマイクロホンに低域
遮断周波数特性が与えられている。
The back air chamber includes a minute gap between the outer peripheral surface of the terminal mounting plate 6 and the intermediate inner peripheral surface (screw surface) of the annular body 1, the upper and lower peripheral surfaces of the terminal mounting plate 6 and the stepped portion 11 of the annular body 1.・ Communicating with the outside through a minute gap with the fixing screw ring 10, air squeezes in the minute gap according to the pressure difference between the inside and outside of the back air chamber due to changes in atmospheric pressure, etc. The pressure difference between the inside and outside of the back air disappears. That is, the condenser microphone is given a low cutoff frequency characteristic.

【0016】なお、背極3には、ダンピング調整のため
に軸線方向に微小径の通気孔32,32‥が貫通し、金属ダ
イヤフラム4・背極3間の間隙空間は、背極3・端子取付
板6間の背気室に連通している。通気孔32は、適宜の位
置に適宜の数を設けることができるので、適切なダンピ
ング調整が容易である。端子取付板6に取付られている
端子8と背極3の下端面とは導線9で接続されており、
端子8は、外部の増幅器と導線で接続される。
The back pole 3 is penetrated by ventilation holes 32, 32 with a small diameter in the axial direction for adjusting the damping, and the gap space between the metal diaphragm 4 and the back pole 3 is the back pole 3 and the terminal. It communicates with the back air chamber between the mounting plates 6. Since the ventilation hole 32 can be provided in an appropriate number at an appropriate position, an appropriate damping adjustment can be easily performed. The terminal 8 attached to the terminal attaching plate 6 and the lower end surface of the back electrode 3 are connected by a conductor 9.
The terminal 8 is connected to an external amplifier by a conductor.

【0017】マイクロホン製作上、上側環状本体1と下
側環状本体7とは、組立時に溶接又は接着されて一体に
なっている。必要に応じ金属ダイヤフラム4の表面・背
極3の上端面は、撥水性の高分子材料(例えばパリレン
(商品名))の薄膜が化学蒸着によりコーティングされ
ている。この薄膜により、金属ダイヤフラム4の表面の
ピンホールは充填されると共に、急激な温度変化の場合
でも、金属ダイヤフラム4の表面における結露の発生が
防止される。
In manufacturing the microphone, the upper annular body 1 and the lower annular body 7 are welded or bonded to each other at the time of assembly to be integrated. If necessary, the surface of the metal diaphragm 4 and the upper end surface of the back electrode 3 are coated with a thin film of a water-repellent polymer material (for example, parylene (trade name)) by chemical vapor deposition. This thin film fills the pinholes on the surface of the metal diaphragm 4, and prevents the occurrence of dew condensation on the surface of the metal diaphragm 4 even in the case of a sudden temperature change.

【0018】上記のコンデンサマイクロホンにおいて、
背極3の上端面にエレクトレット膜を形成すれば、エレ
クトレット型コンデンサマイクロホンが構成される。
又、金属ダイヤフラム4の代りにエレクトレットフイル
ムを用いると、フロントエレクトレット型コンデンサマ
イクロホンが構成される。
In the above condenser microphone,
By forming an electret film on the upper end surface of the back electrode 3, an electret-type condenser microphone is constructed.
If an electret film is used instead of the metal diaphragm 4, a front electret type condenser microphone is constructed.

【0019】上記のコンデンサマイクロホンの製造方法
について述べる。上側環状本体1の下部内周面に上側環
状本体1より低い環状絶縁体2の外周面を接し、環状絶
縁体2の内周面に円筒形の背極3の外周面を接して三者
を接着剤等により一体化する。
A method of manufacturing the above condenser microphone will be described. The lower inner peripheral surface of the upper annular body 1 is in contact with the outer peripheral surface of the annular insulator 2 which is lower than the upper annular body 1, and the inner peripheral surface of the annular insulator 2 is in contact with the outer peripheral surface of the cylindrical back electrode 3 to form the three members. It is integrated with an adhesive or the like.

【0020】図示の構造においては、円筒形の背極3の
下面に段部31を形成し、小径部を環状絶縁体2に嵌合
し、段部31が環状絶縁体2の上面に当接させて接着す
る。特に上側環状本体1と背極3とを同心状態に配置し
て、その間で環状絶縁体2を熱可塑性樹脂、又は熱硬化
性樹脂により一体成形する方法は、上側環状本体1・環
状絶縁体2・背極3の一体化が容易となる。
In the illustrated structure, a step portion 31 is formed on the lower surface of the cylindrical back electrode 3, and a small diameter portion is fitted into the annular insulator 2, and the step portion 31 abuts on the upper surface of the annular insulator 2. Let it adhere. In particular, a method of arranging the upper annular body 1 and the back electrode 3 in a concentric state and integrally molding the annular insulator 2 with a thermoplastic resin or a thermosetting resin between the upper annular body 1 and the annular insulator 2 is described. -The back pole 3 can be easily integrated.

【0021】次いで、上側環状本体1の先端面と背極3
の先端面とに対しラッピング加工等により精密に同一平
面になるように平面出し加工を行い、基準面を形成す
る。それから上側環状本体1の先端面と同形の環状スペ
ーサ5を所定の厚さ(25乃至25μm の平行面にラッ
ピング加工等により精密に仕上げる。その環状スペーサ
5を上側環状本体1の先端面に載置し、更に金属ダイヤ
フラム4に放射方向に張力を付加した状態で金属ダイヤ
フラム4の周縁を保持器で保持し、露結防止のため必要
に応じ、金属ダイヤフラム4の表面に化学蒸着により撥
水性の高分子材料(例えばパリレン(商品名))の薄膜
をコーティングする。
Next, the tip surface of the upper annular body 1 and the back electrode 3
The reference surface is formed by performing flattening processing so as to be precisely on the same plane by lapping processing or the like with respect to the front end surface of. Then, an annular spacer 5 having the same shape as the tip surface of the upper annular body 1 is precisely finished by lapping into a parallel surface having a predetermined thickness (25 to 25 μm. The annular spacer 5 is placed on the tip surface of the upper annular body 1. In addition, the peripheral edge of the metal diaphragm 4 is held by a retainer in a state where tension is applied to the metal diaphragm 4 in the radial direction, and chemical vapor deposition is performed on the surface of the metal diaphragm 4 as necessary to prevent dew condensation. A thin film of a molecular material (for example, Parylene (trade name)) is coated.

【0022】そしてその金属ダイヤフラム4を環状スペ
ーサ5の上面に載置してから、金属ダイヤフラム4の上
から環状スペーサ5と同一断面形の環状加熱体を押圧し
て、金属ダイヤフラム4、環状スペーサ5及び上側環状
本体1を一体となるように溶接する。それから、環状ス
ペーサ5の外周から外側域の金属ダイヤフラム4を除去
する。
Then, the metal diaphragm 4 is placed on the upper surface of the annular spacer 5, and then the annular heating element having the same cross-section as the annular spacer 5 is pressed from above the metallic diaphragm 4 to press the metallic diaphragm 4 and the annular spacer 5. And the upper annular body 1 is welded to be integrated. Then, the metal diaphragm 4 in the outer region is removed from the outer periphery of the annular spacer 5.

【0023】かくして、適宜の張力が与えられた状態の
金属ダイヤフラムの裏面と背極の先端面とが環状スペー
サ5による正確な20乃至25μm の微小間隙をもって
平行に維持されて、金属ダイヤフラム4、環状スペーサ
5及び上側環状本体1からなるコンデンサマイクロホン
の上部構体組立てられる。
In this way, the back surface of the metal diaphragm and the tip surface of the back electrode, which are appropriately tensioned, are maintained in parallel with each other by the annular spacer 5 with a precise gap of 20 to 25 μm, and the metal diaphragm 4 and the annular member The upper structure of the condenser microphone including the spacer 5 and the upper annular body 1 is assembled.

【0024】次に、下側環状本体7の内周面に端子取付
板6を嵌合し、段部11に当接させ、更に固定用ねじ環10
を螺条部12に螺合して、段部11と共に端子取付板6の周
縁部を適宜の微小隙間をもって挟持する。そして端子取
付板6に取付られている端子8と背極3の下端面とを導
線9で接続し、更に、下側環状本体7の先端面と上側環
状本体1の下端面とを溶着する。かくして、コンデンサ
マイクロホンは組立てられる。
Next, the terminal mounting plate 6 is fitted on the inner peripheral surface of the lower annular main body 7 and brought into contact with the stepped portion 11, and further the fixing screw ring 10 is attached.
Is screwed into the threaded portion 12 to hold the peripheral portion of the terminal mounting plate 6 together with the stepped portion 11 with an appropriate minute gap. Then, the terminal 8 attached to the terminal mounting plate 6 and the lower end surface of the back electrode 3 are connected by the conductive wire 9, and the tip end surface of the lower annular main body 7 and the lower end surface of the upper annular main body 1 are welded together. Thus, the condenser microphone is assembled.

【0025】上記のようにして製作され、図1に示され
たような構成のコンデンサマイクロホンは、金属ダイヤ
フラム4に張力が付与するのに環状スペーサ5との接着
部においても応力集中が生じないので、クリープによる
金属ダイヤフラムの張力抜けが少ない。そして、背極の
先端面と金属ダイヤフラムとの微小間隙を形成するの
に、再組立て工程がないので、背極の先端面と金属ダイ
ヤフラムとは、高精度の平行度が保証される。
In the condenser microphone manufactured as described above and having the structure as shown in FIG. 1, stress is not applied to the metal diaphragm 4 even at the bonding portion with the annular spacer 5, although tension is applied to the metal diaphragm 4. Low tension loss of metal diaphragm due to creep. Since there is no reassembly process to form a minute gap between the tip surface of the back electrode and the metal diaphragm, the tip surface of the back electrode and the metal diaphragm are guaranteed to have a high degree of parallelism.

【0026】[0026]

【発明の効果】この発明によるコンデンサマイクロホン
においては、金属ダイヤフラム4に張力が付与するの
に、従来の技術のような突上げリングを用いないので、
金属ダイヤフラムに応力集中が生じない。従って、クリ
ープによる金属ダイヤフラムの張力抜けが少なく、感度
安定性が優れている。
In the condenser microphone according to the present invention, since a tension ring is applied to the metal diaphragm 4, a push-up ring unlike the prior art is not used,
No stress concentration on the metal diaphragm. Therefore, the tension loss of the metal diaphragm due to creep is small, and the sensitivity stability is excellent.

【0027】そして、従来の技術のような金属ダイヤフ
ラムが突上げリングの先端縁で曲げられ、環状固定リン
グで絞って引張り保持する形式をとらないので、金属ダ
イヤフラムに皺が生じない。
Since the metal diaphragm of the prior art is bent at the leading edge of the push-up ring and is not pulled and held by the annular fixing ring, the metal diaphragm is not wrinkled.

【0028】又、背極の先端面と金属ダイヤフラムとの
微小間隙を形成するのに、従来の技術のような再組立て
工程がないので、背極の先端面と金属ダイヤフラムと
は、高精度の平行度が保証され、音声に歪が生じない
上、環状本体の先端面を基準面として環状スペーサを介
して金属ダイヤフラムが載宜されているので、背極と環
状本体との熱膨張差の問題は殆どない。
Further, since there is no reassembly process as in the prior art for forming a minute gap between the tip surface of the back electrode and the metal diaphragm, the tip surface of the back electrode and the metal diaphragm are highly accurate. Since the parallelism is guaranteed, the sound is not distorted, and the metal diaphragm is mounted via the annular spacer with the tip surface of the annular body as the reference surface, the problem of the difference in thermal expansion between the back pole and the annular body. There is almost no.

【0029】環状本体と円筒形の背極とを絶縁体を介し
て同心的に一体化するのに、環状本体と円筒形の背極と
同心状態に配置して、その間で環状絶縁体を熱可塑性樹
脂、又は熱硬化性樹脂により成形する方法は、一体化が
容易であり、量産性に優れ、生産コストも低減する。
In order to concentrically integrate the annular main body and the cylindrical back pole with an insulator, the annular main body and the cylindrical back pole are arranged concentrically, and the annular insulator is heated between them. The method of molding with a plastic resin or a thermosetting resin facilitates integration, is excellent in mass productivity, and reduces production cost.

【0030】更に金属ダイヤフラムのピンホール対策が
従来技術におけるスパッタリングによる金属ダイヤフラ
ムへのクオーツ被覆でなく、金属ダイヤフラムの表面に
撥水性の高分子材料の薄膜を被覆するので、金属ダイヤ
フラムのピンホール問題を解消すると共に撥水性を得
て、急激な温度変化による金属ダイヤフラムの結露の発
生を防止する。その結果、金属ダイヤフラムの結露によ
る出力ノイズが生じ難い。しかも高分子材料は、比重が
低いので、金属ダイヤフラムの振動機能に影響が少な
い。
Further, as a countermeasure against the pinhole of the metal diaphragm, the surface of the metal diaphragm is coated with a thin film of a water-repellent polymer material, not the quartz coating on the metal diaphragm by sputtering in the prior art, so that the pinhole problem of the metal diaphragm is solved. It also eliminates dew condensation and provides water repellency to prevent condensation on the metal diaphragm due to rapid temperature changes. As a result, output noise due to dew condensation on the metal diaphragm is unlikely to occur. Moreover, since the polymer material has a low specific gravity, it has little influence on the vibration function of the metal diaphragm.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明の実施例におけるコンデンサマイクロ
ホンの構成断面図である。
FIG. 1 is a sectional view showing the configuration of a condenser microphone according to an embodiment of the present invention.

【図2】従来の技術のコンデンサマイクロホンの構成断
面図である。
FIG. 2 is a cross-sectional view of a configuration of a conventional condenser microphone.

【符号の説明】 1 上側環状本体 2 環状絶縁体 3 背極 11,31 段部 32 通気孔 4 金属ダイヤフラム 5 環状スペーサ 6 端子取付板 7 下側環状本体 8 端子 9 導線 10 固定用ねじ環 12 螺条部[Explanation of symbols] 1 Upper annular body 2 ring insulator 3 back pole 11, 31 steps 32 vents 4 metal diaphragm 5 annular spacer 6 terminal mounting plate 7 Lower annular body 8 terminals 9 conductors 10 Fixing screw ring 12 Thread

───────────────────────────────────────────────────── フロントページの続き (72)発明者 三神 圭司 神奈川県横浜市緑区白山1−16−1 株式 会社小野測器テクニカルセンター内 (72)発明者 池田 忠司 神奈川県横浜市緑区白山1−16−1 株式 会社小野測器テクニカルセンター内 (72)発明者 山本 拓 神奈川県横浜市緑区白山1−16−1 株式 会社小野測器テクニカルセンター内 (72)発明者 大橋 正尚 神奈川県横浜市緑区白山1−16−1 株式 会社小野測器テクニカルセンター内   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Keiji Mikami             1-16-1, Shirayama, Midori-ku, Yokohama-shi, Kanagawa Stock             Ono Sokki Technical Center (72) Inventor Tadashi Ikeda             1-16-1, Shirayama, Midori-ku, Yokohama-shi, Kanagawa Stock             Ono Sokki Technical Center (72) Inventor Taku Yamamoto             1-16-1, Shirayama, Midori-ku, Yokohama-shi, Kanagawa Stock             Ono Sokki Technical Center (72) Inventor Masahashi Ohashi             1-16-1, Shirayama, Midori-ku, Yokohama-shi, Kanagawa Stock             Ono Sokki Technical Center

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 環状本体、環状本体内に絶縁体を介して
取付られ、先端面が環状本体の先端面と同一平面上にあ
る背極、放射方向に張力が与えられている状態で環状本
体の先端面との間に介在する所定の厚さの環状スペーサ
と共に周縁部が環状本体と一体的に溶着されている金属
ダイヤフラムから構成されているコンデンサマイクロホ
1. An annular main body, a back electrode mounted in the annular main body via an insulator and having a tip end surface flush with the tip end surface of the annular main body, and an annular main body with tension applied in the radial direction. Microphone composed of a metal diaphragm whose peripheral portion is integrally welded to an annular body together with an annular spacer having a predetermined thickness interposed between the distal end surface and the
【請求項2】 金属ダイヤフラムに撥水性の高分子材料
の薄膜がコーティングされている請求項1に記載のコン
デンサマイクロホン。
2. The condenser microphone according to claim 1, wherein the metal diaphragm is coated with a thin film of a water-repellent polymer material.
【請求項3】 次の工程でから構成されたコンデンサマ
イクロホンの製造方法 (1)環状本体と背極とを絶縁体を介して一体化する。 (2)環状本体の先端面と背極の先端面とに対し精密に
同一平面になるように平面出し加工を行い、基準面を形
成する。 (3)環状スペーサを所定の厚さに仕上げる。 (4)環状スペーサを環状本体の先端面に載置し、更に
金属ダイヤフラムに放射方向に張力を付加した状態で環
状スペーサの上面に載置する。 (5)金属ダイヤフラム、環状スペーサ及び環状本体を
一体となるように溶接又は接着する。
3. A method of manufacturing a condenser microphone including the following steps: (1) An annular body and a back electrode are integrated via an insulator. (2) The reference surface is formed by performing flattening processing so that the tip surface of the annular main body and the tip surface of the back electrode are precisely flush with each other. (3) Finish the annular spacer to a predetermined thickness. (4) The annular spacer is placed on the front end surface of the annular body, and is further placed on the upper surface of the annular spacer while tension is applied to the metal diaphragm in the radial direction. (5) The metal diaphragm, the annular spacer, and the annular body are welded or bonded so as to be integrated.
【請求項4】 環状本体内に背極を配置して、環状本体
の内周面と背極の外周面との間で環状絶縁体を熱可塑性
樹脂、又は熱硬化性樹脂により一体成形して環状本体と
背極とを絶縁体を介して一体化する請求項3に記載のコ
ンデンサマイクロホンの製造方法。
4. A back electrode is arranged in an annular body, and an annular insulator is integrally molded with a thermoplastic resin or a thermosetting resin between an inner peripheral surface of the annular body and an outer peripheral surface of the back electrode. The method of manufacturing a condenser microphone according to claim 3, wherein the annular main body and the back electrode are integrated via an insulator.
JP17892791A 1991-06-25 1991-06-25 Condenser microphone and method of manufacturing the same Expired - Lifetime JP2952617B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17892791A JP2952617B2 (en) 1991-06-25 1991-06-25 Condenser microphone and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17892791A JP2952617B2 (en) 1991-06-25 1991-06-25 Condenser microphone and method of manufacturing the same

Publications (2)

Publication Number Publication Date
JPH053599A true JPH053599A (en) 1993-01-08
JP2952617B2 JP2952617B2 (en) 1999-09-27

Family

ID=16057077

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17892791A Expired - Lifetime JP2952617B2 (en) 1991-06-25 1991-06-25 Condenser microphone and method of manufacturing the same

Country Status (1)

Country Link
JP (1) JP2952617B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003125495A (en) * 2001-10-09 2003-04-25 Citizen Electronics Co Ltd Electret capacitor microphone
JP2004222091A (en) * 2003-01-16 2004-08-05 Citizen Electronics Co Ltd Electret condenser microphone
WO2007032580A1 (en) * 2005-09-14 2007-03-22 Bse Co., Ltd Condenser microphone and pakaging method for the same
CN111147997A (en) * 2020-02-24 2020-05-12 无锡韦尔半导体有限公司 Capacitive sensor and method for manufacturing the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003125495A (en) * 2001-10-09 2003-04-25 Citizen Electronics Co Ltd Electret capacitor microphone
JP2004222091A (en) * 2003-01-16 2004-08-05 Citizen Electronics Co Ltd Electret condenser microphone
WO2007032580A1 (en) * 2005-09-14 2007-03-22 Bse Co., Ltd Condenser microphone and pakaging method for the same
CN111147997A (en) * 2020-02-24 2020-05-12 无锡韦尔半导体有限公司 Capacitive sensor and method for manufacturing the same

Also Published As

Publication number Publication date
JP2952617B2 (en) 1999-09-27

Similar Documents

Publication Publication Date Title
US4558249A (en) Stretched piezopolymer transducer with unsupported areas
US6145186A (en) Wafer fabricated electroacoustic transducer
US5570428A (en) Transducer assembly
GB2106353A (en) An electromechanical speaker and a method of assembling an electromechanical speaker
JP4659519B2 (en) Method for manufacturing diaphragm assembly and condenser microphone
US4249043A (en) Electret transducer backplate, electret transducer and method of making an electret transducer
US8238587B2 (en) Electret condenser microphone
US20050276429A1 (en) Electret condenser microphone
JP2952617B2 (en) Condenser microphone and method of manufacturing the same
JP4601436B2 (en) Electrostatic electroacoustic transducer, condenser microphone using the same, and manufacturing method of electrostatic electroacoustic transducer
KR100543784B1 (en) Backplate for electret condenser microphone, method of making the same and the microphone using the same
US9781534B2 (en) Condenser microphone unit and method of manufacturing the same
JPH07227000A (en) Static electroacoustic transducer
JP2995240B2 (en) Condenser microphone
JP2961392B2 (en) Method for manufacturing diaphragm unit in microphone or the like
JP3616467B2 (en) Condenser microphone and manufacturing method thereof
JPH11187494A (en) Electret type microphone and its manufacture
JPH0711447B2 (en) Acceleration sensor
JP2002325298A (en) Diaphragm of capacitor microphone and its manufacturing method
JPS6029280Y2 (en) piezoelectric microphone
JPH07284199A (en) Vibration film and manufacture therefor
JP2957329B2 (en) Condenser microphone
JP3371394B2 (en) Condenser microphone
US20030174850A1 (en) Capacitive transducer
JP5627386B2 (en) Method for manufacturing condenser microphone unit and condenser microphone unit

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 9

Free format text: PAYMENT UNTIL: 20080716

FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 10

Free format text: PAYMENT UNTIL: 20090716

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090716

Year of fee payment: 10

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100716

Year of fee payment: 11