JPH0535522B2 - - Google Patents
Info
- Publication number
- JPH0535522B2 JPH0535522B2 JP60135152A JP13515285A JPH0535522B2 JP H0535522 B2 JPH0535522 B2 JP H0535522B2 JP 60135152 A JP60135152 A JP 60135152A JP 13515285 A JP13515285 A JP 13515285A JP H0535522 B2 JPH0535522 B2 JP H0535522B2
- Authority
- JP
- Japan
- Prior art keywords
- ballast
- thermally conductive
- mounting surface
- heat
- discharge lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011231 conductive filler Substances 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000012948 isocyanate Substances 0.000 claims description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 3
- 150000002513 isocyanates Chemical class 0.000 claims description 3
- 239000002075 main ingredient Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical group 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 11
- 230000000694 effects Effects 0.000 description 7
- 238000012856 packing Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- -1 hydrogen compound Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Housings And Mounting Of Transformers (AREA)
Description
〔産業上の利用分野〕
この発明は照明器具等に用いられる放電灯用安
定器の取付装置に関するものである。
〔従来の技術〕
第２図は例えば実開昭55−162931号公報に示さ
れた従来の放電灯用安定器の取付装置を示す断面
図である。図において、１はその内部に図示しな
い安定器本体を収納するケース（あるいは外板
体）、２はこのケース１の照明器具本体への取付
面、３は安定器等を収納設置する器具本体、４は
この器具本体３の安定器取付面、５は防振用ゴム
パツキング６を介してケース１を器具本体３の安
定器取付面４に取付けるための取付ネジ、７は防
振用ゴムパツキング６により、ケース１の取付面
２と器具本体３の安定器取付面４との間に形成さ
れる空間部、８はこの空間部７に設置される波形
状のアルミニウム等からなる放熱板であり、その
各々の山部が取付面２と安定器取付面４とに接す
るよう配設されている。
このように従来の器具本体３への安定器の取付
は、安定器本体を音源とする騒音を低減する目的
で、安定器取付面４に防振用ゴムパツキング６を
介してケース１を取付けていた。すなわち、器具
本体３への振動伝達をこのゴムパツキング６で吸
収しようとする構造である。ところが、このよう
な構造ではケース１の器具への取付面２と安定器
取付面４との間に空間部７が生じるため安定器の
放熱が悪くなる。その結果、安定器の温度上昇値
が高くなり、これを安定器自身で解決しようとす
れば必然的に安定器が大形化してしまう問題があ
り、そのための解決策として上記のように空間部
７に波形状の放熱板８を配設して放熱効果を持た
せ、安定器の温度上昇を抑える構成をとつてい
た。
〔発明が解決しようとする問題点〕
以上のように従来の安定器の取付装置は、空間
部７に放熱板８を設けて安定器の放熱を図つてい
たが、ケース１の取付面２および安定器取付面４
と放熱板８との接触面積は比較的少なく、また空
間部７は依然として存在するために、ケース１か
ら器具本体３への熱伝導にもおのずと限界があ
り、その放熱効果は十分であるとはいえなかつ
た。また、安定器本体から発生する騒音源として
の振動が取付面２より放熱板８を介して安定器取
付面４に伝搬されてしまうため、防振用ゴムパツ
キング６の効果が半減し、騒音低減も不十分なも
のであつた。
この発明は上記の問題に鑑みなされたもので、
安定器の温度上昇を大幅に抑制できると共に騒音
の低減も図れる放電灯用安定器の取付装置を得る
ことを目的とする。
〔問題点を解決するための手段〕
この発明に係る放電灯用安定器の取付装置は、
安定器のケースと器具本体の安定器取付面との間
に熱伝導性ラバーを密着するよう挿設したもので
ある。
〔作用〕
この発明の放電灯用安定器の取付装置において
は、ケースと安定器取付面との間に熱伝導性ラバ
ーが密着して設けられているため、安定器から器
具本体への熱伝導が良好で、かつ安定器の振動が
該レバーで吸収されて騒音の低減が図れる。
〔実施例〕
第１図はこの発明の一実施例による放電灯用安
定器の取付装置を示す断面図である。図中、９は
ケース１の取付面２と器具本体３の安定器取付面
４との間に挿設された熱伝導性ラバーで、取付面
２および安定器取付面４に密着するよう配設され
ている。
この熱伝導性ラバー９は、熱変形温度が室温か
ら130℃迄の範囲にあり、かつ狭い温度範囲で熱
変形量の大きい熱硬化樹脂100重量部と、熱伝導
性フイラー50〜1500重量部とからなる可変形熱放
散材組成物であることを特徴とするラバーであ
る。そしてこの熱変形量の大きな熱硬化性樹脂と
は、ポリヒドロキシブタジエン重合体の水素化合
物を主剤とし、分子内に1.5個以上のイソシアネ
ート基を有する多官能イソシアネートを硬化剤と
して用いる樹脂であり、また熱伝導性フイラーに
は金属酸化物を使用してなるものである。かかる
組成物よりなる熱伝導性ラバー９は、室温で弾性
に富みしかも130℃以下の温度で加熱することに
よつて弾性率が極端に低くなる特徴を有してお
り、第３図はその温度に対する弾性率の変化を示
したものである。従つて以上の特徴を有するラバ
ーであるため、発熱体などへ装着する場合に加熱
することによつて非常に小さな圧力で発熱体と密
着し、かつ発熱体の表面がどのような形状をして
いても密着させることができるという性質を有し
ている。この実施例では熱伝導性ラバー９として
三菱電機株式会社製のもの（市販品名：TFラバ
ー）を使用した。
そして第１図において他の各構成は第２図に示
した従来装置と同様であるため対応する部分に同
一符号を付してその説明を省略する。
このように構成された放電灯用安定器の取付装
置は、熱伝導性ラバー９が取付面２および安定器
取付面４に密着するよう挿設されているため、安
定器本体の発熱が熱伝導性ラバー９を介して器具
本体３に良好に伝達され、その温度上昇を大幅に
抑制できる。しかもこの熱伝導性ラバー９は、発
明者の実験によれば非常に防振効果が大きいこと
が判明し、従つて、安定器本体より発生する振動
も吸収されて騒音も低減する。
ここで、三菱電機株式会社製ラピツドスタート
形蛍光灯用40W2灯直列タイプの安定器を用い、
第１図に示す実施例の安定器の取付装置と、第２
図の従来例による取付装置との安定器温度上昇値
および騒音レベルの比較を同一条件にて行つた結
果を表に示す。この表からも明らかなように、実
施例による安定器の取付装置は従来例と比べてそ
の温度上昇値および騒音レベルが著しく改善され
ている。
[Industrial Application Field] The present invention relates to a mounting device for a discharge lamp ballast used in lighting equipment and the like. [Prior Art] FIG. 2 is a sectional view showing a conventional mounting device for a discharge lamp ballast, which is disclosed in, for example, Japanese Utility Model Application Publication No. 55-162931. In the figure, 1 is a case (or outer panel) that stores a ballast main body (not shown) inside, 2 is a mounting surface of this case 1 to the lighting equipment main body, 3 is an equipment main body that houses and installs a ballast, etc. 4 is the ballast mounting surface of this device main body 3, 5 is a mounting screw for attaching the case 1 to the ballast mounting surface 4 of the device main body 3 via the anti-vibration rubber packing 6, 7 is the anti-vibration rubber packing 6, A space 8 formed between the mounting surface 2 of the case 1 and the ballast mounting surface 4 of the appliance body 3 is a heat dissipation plate made of corrugated aluminum or the like installed in this space 7. The ridges are arranged so as to be in contact with the mounting surface 2 and the ballast mounting surface 4. In this way, in the conventional mounting of the ballast to the device body 3, the case 1 was attached to the ballast mounting surface 4 via the anti-vibration rubber packing 6 for the purpose of reducing noise coming from the ballast body as a sound source. . That is, the structure is such that the rubber packing 6 absorbs vibrations transmitted to the instrument body 3. However, in such a structure, a space 7 is created between the fixture mounting surface 2 of the case 1 and the ballast mounting surface 4, resulting in poor heat dissipation from the ballast. As a result, the temperature rise value of the ballast increases, and if you try to solve this problem with the ballast itself, you will inevitably have to increase the size of the ballast. A corrugated heat dissipation plate 8 is disposed on the ballast 7 to provide a heat dissipation effect, thereby suppressing the rise in temperature of the ballast. [Problems to be Solved by the Invention] As described above, in the conventional ballast mounting device, the heat dissipation plate 8 is provided in the space 7 to dissipate heat from the ballast. and ballast mounting surface 4
Since the contact area between the case 1 and the heat dissipation plate 8 is relatively small, and the space 7 still exists, there is a natural limit to the heat conduction from the case 1 to the appliance body 3, and the heat dissipation effect is not sufficient. I couldn't say it. In addition, since the vibration as a noise source generated from the ballast body is propagated from the mounting surface 2 to the ballast mounting surface 4 via the heat sink 8, the effect of the vibration-proof rubber packing 6 is halved, and noise reduction is also reduced. It was inadequate. This invention was made in view of the above problems.
It is an object of the present invention to provide a mounting device for a ballast for a discharge lamp that can significantly suppress the temperature rise of the ballast and also reduce noise. [Means for solving the problem] A mounting device for a discharge lamp ballast according to the present invention includes:
A thermally conductive rubber is inserted between the ballast case and the ballast mounting surface of the device body so that it is in close contact with the ballast case. [Function] In the discharge lamp ballast mounting device of the present invention, since the thermally conductive rubber is provided in close contact between the case and the ballast mounting surface, heat conduction from the ballast to the main body of the device is improved. The vibration of the ballast is absorbed by the lever, reducing noise. [Embodiment] FIG. 1 is a sectional view showing a mounting device for a discharge lamp ballast according to an embodiment of the present invention. In the figure, 9 is a thermally conductive rubber inserted between the mounting surface 2 of the case 1 and the ballast mounting surface 4 of the instrument body 3, and is arranged so as to be in close contact with the mounting surface 2 and the ballast mounting surface 4. has been done. This thermally conductive rubber 9 is made of 100 parts by weight of a thermosetting resin whose thermal deformation temperature ranges from room temperature to 130°C and which has a large amount of thermal deformation in a narrow temperature range, and 50 to 1500 parts by weight of a thermally conductive filler. This rubber is characterized by being a variable heat dissipating material composition consisting of: This thermosetting resin with a large amount of thermal deformation is a resin whose main ingredient is a hydrogen compound of polyhydroxybutadiene polymer and which uses a polyfunctional isocyanate having 1.5 or more isocyanate groups in the molecule as a curing agent, and The thermally conductive filler is made of metal oxide. The thermally conductive rubber 9 made of such a composition has a characteristic that it is highly elastic at room temperature, and its elastic modulus becomes extremely low when heated at a temperature of 130°C or lower. It shows the change in elastic modulus with respect to Therefore, since the rubber has the above-mentioned characteristics, when it is attached to a heating element, it will come into close contact with the heating element with very small pressure when heated, and it will also be able to adhere to the heating element with very little pressure. It has the property of being able to be brought into close contact even when In this example, the thermally conductive rubber 9 manufactured by Mitsubishi Electric Corporation (commercial product name: TF Rubber) was used. In FIG. 1, the other configurations are the same as those of the conventional device shown in FIG. 2, so corresponding parts are given the same reference numerals and explanations thereof will be omitted. In the discharge lamp ballast mounting device configured in this way, the thermally conductive rubber 9 is inserted so as to be in close contact with the mounting surface 2 and the ballast mounting surface 4, so that the heat generated by the ballast body is thermally conducted. The temperature is well transmitted to the instrument main body 3 via the rubber 9, and its temperature rise can be significantly suppressed. Moreover, according to experiments conducted by the inventor, this thermally conductive rubber 9 has been found to have a very large vibration-proofing effect, and therefore also absorbs vibrations generated from the ballast body and reduces noise. Here, we used a 40W 2-lamp series type ballast for rapid start type fluorescent lamps manufactured by Mitsubishi Electric Corporation.
The ballast mounting device of the embodiment shown in FIG.
The table shows the results of a comparison of the ballast temperature rise value and noise level with the conventional mounting device shown in the figure under the same conditions. As is clear from this table, the temperature rise value and noise level of the ballast mounting device according to the example are significantly improved compared to the conventional example.
以上説明したように、本発明の放電灯用安定器
の取付装置によれば、熱変形温度が室温から130
℃迄の範囲にあり、且つ狭い温度範囲で熱変形量
の大きい熱硬化性樹脂100重量部と、熱伝導性フ
イラー50〜1500重量部とからなる可変形熱放散材
組成物で形成され、この熱変形量の大きい熱硬化
性樹脂はポリヒドロキシブタジエン重合体の水素
添加物を主剤とし、分子内に1.5個以上のイソシ
アネート基を有する多官能イソシアネートを硬化
剤として用いる樹脂であり、また前記熱伝導性フ
イラーとして金属酸化物を用いてなる熱伝導性ラ
バーを安定器本体収納ケースと器具本体の安定器
取付面との間に密着して挿設したことにより、熱
伝導性ラバーの特性として温度上昇に伴なつて弾
性率が低下することにより、安定器本体と器具本
体との密着性が向上し、その結果安定器から熱伝
導性ラバーを介して器具本体に至る放熱効果が向
上し、また温度が高くなればなる程大きな放熱効
果が期待でき、しかもこれらのことから同一の電
気的容器とすれば安定器を小型化できるなどの効
果を奏すると共に、更に安定器本体の単位体積あ
たりの発熱量が大きくても、当該熱伝導性ラバー
の使用により放熱効果が充分期待し得るので安定
器の幾何学的寸法を小さくしても安定器本体の特
性が熱により損なわれることがほとんどなく、小
型の安定器を長期間に亘つて使用（長寿命化）で
きる。
As explained above, according to the mounting device for a ballast for a discharge lamp of the present invention, the heat deformation temperature ranges from room temperature to 130°C.
It is formed from a variable heat dissipation material composition consisting of 100 parts by weight of a thermosetting resin that has a large amount of thermal deformation in a narrow temperature range and 50 to 1500 parts by weight of a thermally conductive filler. A thermosetting resin with a large amount of thermal deformation is a resin whose main ingredient is a hydrogenated product of polyhydroxybutadiene polymer, and which uses a polyfunctional isocyanate having 1.5 or more isocyanate groups in the molecule as a curing agent. By inserting a thermally conductive rubber made of metal oxide as a filler in close contact between the ballast main body storage case and the ballast mounting surface of the device body, the temperature rise is a characteristic of the thermally conductive rubber. As the modulus of elasticity decreases, the adhesion between the ballast body and the device body improves, resulting in improved heat dissipation from the ballast to the device body via the thermally conductive rubber, and also improves the temperature The higher the ballast, the greater the heat dissipation effect can be expected, and for these reasons, the ballast can be made smaller by using the same electrical container, and the heat output per unit volume of the ballast body can be reduced. Even if the ballast is large, the heat dissipation effect can be expected to be sufficient by using the thermally conductive rubber, so even if the geometric dimensions of the ballast are reduced, the characteristics of the ballast body will hardly be impaired by heat, making it possible to The ballast can be used for a long period of time (long life).
第１図はこの発明の一実施例による放電灯用安
定器の取付装置の断面図、第２図は従来の放電灯
用安定器の取付装置の断面図、第３図はこの発明
に用いる熱伝導性ラバーの温度に対する弾性率の
変化を示す図である。
１……ケース、３……器具本体、４……安定器
取付面、９……熱伝導性ラバー。なお、図中同一
符号は同一または相当部分を示す。
FIG. 1 is a sectional view of a mounting device for a ballast for a discharge lamp according to an embodiment of the present invention, FIG. 2 is a sectional view of a conventional mounting device for a ballast for a discharge lamp, and FIG. FIG. 3 is a diagram showing changes in elastic modulus of conductive rubber with respect to temperature. 1... Case, 3... Instrument body, 4... Ballast mounting surface, 9... Thermal conductive rubber. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
定器取付面との間に熱伝導性ラバーを密着するよ
う挿設してなる放電灯用安定器の取付装置であつ
て、前記熱伝導性ラバーは、熱変形温度が室温か
ら130℃迄の範囲にあり、且つ狭い温度範囲で熱
変形量の大きい熱硬化性樹脂100重量部と、熱伝
導性フイラー50〜1500重量部とからなる可変形熱
放散材組成物で形成され、前記熱変形量の大きい
熱硬化性樹脂は、ポリヒドロキシブタジエン重合
体の水素添加物を主剤とし、分子内に1.5個以上
のイソシアネート基を有する多官能イソシアネー
トを硬化剤として用いる樹脂であり、且つ前記熱
伝導性フイラーは金属酸化物を用いることを特徴
とする放電灯用安定器の取付装置。1. A mounting device for a discharge lamp ballast, comprising a thermally conductive rubber inserted in close contact between a case for storing the ballast body and a ballast mounting surface of the appliance body, wherein the thermally conductive rubber is a variable heat converter consisting of 100 parts by weight of a thermosetting resin whose heat distortion temperature ranges from room temperature to 130°C and which has a large amount of heat distortion in a narrow temperature range, and 50 to 1500 parts by weight of a thermally conductive filler. The thermosetting resin with a large amount of thermal deformation, which is formed from a dispersion material composition, has a hydrogenated polyhydroxybutadiene polymer as a main ingredient, and a polyfunctional isocyanate having 1.5 or more isocyanate groups in the molecule as a curing agent. A mounting device for a ballast for a discharge lamp, characterized in that the heat conductive filler is a resin used as a ballast, and the heat conductive filler is a metal oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60135152A JPS61292806A (en) | 1985-06-20 | 1985-06-20 | Stabilizer mounting apparatus for discharge lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60135152A JPS61292806A (en) | 1985-06-20 | 1985-06-20 | Stabilizer mounting apparatus for discharge lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61292806A JPS61292806A (en) | 1986-12-23 |
| JPH0535522B2 true JPH0535522B2 (en) | 1993-05-26 |
Family
ID=15145032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60135152A Granted JPS61292806A (en) | 1985-06-20 | 1985-06-20 | Stabilizer mounting apparatus for discharge lamp |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61292806A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2643290B2 (en) * | 1988-05-16 | 1997-08-20 | 松下電器産業株式会社 | Display element |
| JPH054192U (en) * | 1991-06-28 | 1993-01-22 | タキロン株式会社 | Luminous display |
| CN1455759A (en) * | 2001-01-26 | 2003-11-12 | 株式会社日本光电科技 | Untraviolet ray liquid processing device |
| JP4948363B2 (en) * | 2007-11-08 | 2012-06-06 | 株式会社日立産機システム | Transformer |
| JP5690572B2 (en) * | 2010-12-14 | 2015-03-25 | 株式会社日本自動車部品総合研究所 | Trance |
| JP5271995B2 (en) | 2010-12-14 | 2013-08-21 | 株式会社日本自動車部品総合研究所 | Trance |
| JP2013125857A (en) * | 2011-12-14 | 2013-06-24 | Denso Corp | Reactor and electric power conversion apparatus |
| JP6619195B2 (en) * | 2015-10-05 | 2019-12-11 | 株式会社タムラ製作所 | Reactor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5212213A (en) * | 1975-07-18 | 1977-01-29 | Kogyo Gijutsuin | Manufacture of high density and high strength silicon nitride ceramics mold articles |
| JPS551376U (en) * | 1979-05-29 | 1980-01-07 |
-
1985
- 1985-06-20 JP JP60135152A patent/JPS61292806A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5212213A (en) * | 1975-07-18 | 1977-01-29 | Kogyo Gijutsuin | Manufacture of high density and high strength silicon nitride ceramics mold articles |
| JPS551376U (en) * | 1979-05-29 | 1980-01-07 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61292806A (en) | 1986-12-23 |
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